FDC6323L各脚功能电路原理芯片引脚定义引脚图及功能IC贸易商-中国IC网-芯三七

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产品型号FDC6323L的概述

芯片FDC6323L的概述 FDC6323L是一款功能强大的高精度、低功耗的电流监测芯片，广泛应用于电流检测、功率管理和监控系统。其设计目的是为了满足现代电子设备对测量精度和响应速度的不断提高要求。凭借其卓越的性能，该芯片在工业与消费电子领域找到了众多应用，包括电动汽车、智能家居设备、手机以及其他要求高精度电流测量的智能设备。该芯片的核心功能是通过监测电流信号，实时反映电流变化，为系统提供必要的反馈信息，从而实现高效的能量管理。这对于用户来说，不仅提高了设备的安全性，也有效延长了电池寿命。芯片FDC6323L的详细参数 FDC6323L的主要技术参数包括： - 电源电压范围： 2.0V至5.5V - 电流测量范围：可以测量高达±30A的电流 - 分辨率： 12位分辨率 - 增益设置：可编程增益放大器，有多种增益选择 - 带宽： 200kHz的带宽 - PWM输出范围：高达1M...

产品型号FDC6323L的Datasheet PDF文件预览

March 1999

FDC6323L

Integrated Load Switch

General Description

Features

V_DROP=0.2V @ V_IN=5V, I_L=1A, V_ON/OFF= 1.5V to 8V

These Integrated Load Switches are produced using

Fairchild's proprietary, high cell density, DMOS

technology. This very high density process is

especially tailored to minimize on-state resistance and

provide superior switching performance. These

devices are particularly suited for low voltage high

side load switch application where low conduction loss

and ease of driving are needed.

V_DROP=0.3V @ V_IN=3.3V, I_L=1A, V_ON/OFF= 1.5V to 8V.

High density cell design for extremely low on-resistance.

V_ON/OFFZener protection for ESD ruggedness.

>6KV Human Body Model.

SuperSOT^TM-6 package design using copper lead frame

for superior thermal and electrical capabilities.

SuperSOT^TM-6

SuperSOT^TM-8

SOT-23

SOIC-16

SO-8

SOT-223

EQUIVALENT CIRCUIT

Vout,C1

V in,R1

Q 2

V_DROP

O U T

O N / O FF

Q 1

O N / O FF

R1,C1

SuperSOT ^TM-6

See Application Circuit

Absolute Maximum Ratings T_A= 25°C unless otherwise noted

Symbol

Parameter

FDC6323L

3 - 8

Units

V_IN

Input Voltage Range

V_ON/OFF

I_L

On/Off Voltage Range

1.5 - 8

1.5

Load Current @ V_DROP=0.5V - Continuous (Note 1)

- Pulsed

(Note 1 & 3)

(Note 2a)

2.5

P_D

Maximum Power Dissipation

Operating and Storage Temperature Range

0.7

°C

T_J,T_STG

ESD

-55 to 150

Electrostatic Discharge Rating MIL-STD-883D Human Body

Model (100pf/1500Ohm)

THERMAL CHARACTERISTICS

R_qJA

R_qJC

Thermal Resistance, Junction-to-Ambient (Note 2a)

Thermal Resistance, Junction-to-Case

180

°C/W

(Note 2)

FDC6323L Rev.F

Electrical Characteristics (T_A= 25°C unless otherwise noted)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

OFF CHARACTERISTICS

I_FL

I_RL

Forward Leakage Current

Reverse Leakage Current

V_IN= 8 V, V_ON/OFF= 0 V

V_IN= -8 V, V_ON/OFF= 0 V

µA

-1

ON CHARACTERISTICS (Note 3)

V_IN

Input Voltage

V_ON/OFF

V_DROP

On/Off Voltage

1.5

Conduction Voltage Drop @ 1A

V_IN= 5 V, V_ON/OFF= 3.3 V

0.145

0.178

0.2

0.3

V_IN= 3.3 V, V_ON/OFF= 3.3 V

I_L

Load Current

V_DROP= 0.2 V, V_IN= 5 V, V_ON/OFF= 3.3 V

V_DROP= 0.3 V, V_IN= 3.3 V, V_ON/OFF= 3.3 V

Notes:

1. V_IN=8V, V_ON/OFF=8V, V_DROP=0.5V, T_A=25^oC

2. R_q_JAis the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R_q_JCis guaranteed

by design while R_q_CAis determined by the user's board design.

T_J- T_A

+R_qCA(t)

P_D(t) =

= I²(t) ´ R

DS(ON)@T_J

(t)

Typical R_q_JAfor single device operation using the board layouts shown below on FR-4 PCB in a still air environment:

a. 180^oC/W when mounted on a 2oz minimum copper pad.

Scale 1 : 1 on letter size paper

3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%

FDC6323L Rev.F

Typical Electrical Characteristics (T_A= 25 ^OC unless otherwise noted )

0.5

0.4

0.3

0.2

0.1

0.5

0.4

0.3

0.2

0.1

= 125°C

= 25°C

= 3.3V

ON/OFF

= 5V

= 1.5 - 8V

ON/OFF

PW =300us, D 2%

(A)

Figure 2. V_DROPVersus I_Lat V_IN=3.3V.

Figure 1. V_DROPVersus I_Lat V_IN=5V.

0.4

= 1A

= 3.3V

= 1.5 - 8V

ON/OFF

PW =300us, D 2%

0.35

0.3

0.8

0.6

0.4

0.2

PW =300us, D 2%

= 125°C

0.25

0.2

= 25°C

0.15

0.1

(V)

,(A)

Figure 4. R_(ON)Versus I_Lat V_IN=3.3V.

Figure 3. V_DROPVersus V_INat I_L=1A.

= 1A

= 1.5 - 8V

ON/OFF

0.8

0.6

0.4

0.2

PW =300us, D 2%

= 125°C

= 25°C

,(V)

Figure 5. On Resistance Variation with

Input Voltage.

FDC6323L Rev.F

Typical Electrical Characteristics (T_A= 25 ^OC unless otherwise noted )

Vin = 3.3V

IL = 1A

Von/off = 3.3V

td(off)

R1 = 20K

Ci = 10

Co = 1

td(off)

Vin = 5V

IL = 1A

Von/off = 3.3V

R1 = 20K

Ci = 10

Co = 1

td(on)

R2 (K

)

R2 (K

)

Figure 6. Switching Variation with

R2 at Vin=5V and R1=20KOhm.

Figure 7. Switching Variation with R2

at Vin=3.3V and R1=20KOhm.

250

200

150

100

Vin = 2.5V

IL = 1A

Von/off = 3.3V

IL = 1A

Von/off = 3.3V

Vin = 5V

R1 = 20K

Ci = 10

Co = 1

3.3V

2.5V

td(off)

td(on)

R2 (K

)

R2 (K

)

Figure 9. % of Current Overshoot

Variation with Vin and R2.

Figure 8. Switching Variation with R2

at Vin=2.5V and R1=20KOhm.

t_on

t_off

500

400

300

200

100

t_d(off)

IL = 1A

Von/off = 3.3V

R1 = 20KW

t _d(on)

t_f

t_r

90%

Ci = 10

Vin = 2.5V

3.3V

Co = 1

V_OUT

10%

90%

INVERTED

V_IN

50%

10%

100

R2 (K

)

PULSE WIDTH

Figure 10. Vdrop Variation with Vin and R2.

Figure 11. Switching Waveforms.

FDC6323L Rev.F

Typical Electrical Characteristics (T_A= 25 ^OC unless otherwise noted )

0.3

0.1

= 5V

SINGLE PULSE

R_qJA= See Note 2a

T_A= 25°C

0.03

0.01

0.1

0.2

0.5

20 30

(V)

DROP

Figure 12. Safe Operating Area.

D = 0.5

0.5

(t) = r(t) * R

qJA

= See Note 2a

0.2

0.1

qJA

0.1

P(pk)

0.05

t₁

0.02

0.01

t₂

0.02

0.01

T - T = P * R

(t)

qJA

Single Pulse

Duty Cycle, D = t ₁/ t

0.005

0.00001

0.0001

0.001

0.01

0.1

t , TIME (sec)

100

300

Figure 13. Transient Thermal Response Curve.

Note: Thermal characterization performed on the conditions described in Note 2a.

Transient thermal response will change depends on the circuit board design.

FDC6323L Rev.F

FDC6323L Load Switch Application

General Description

APPLICATION CIRCUIT

This device is particularly suited for compact

computer peripheral switching applications

where 8V input and 1A output current capability

are needed. This load switch integrates a small

N-Channel Power MOSFET (Q1) which drives a

large P-Channel Power MOSFET (Q2) in one

tiny SuperSOT^TM-6 package.

O U T

O N / O FF

A load switch is usually configured for high side

switching so that the load can be isolated from

the active power source. A P-Channel Power

MOSFET, because it does not require its drive

voltage above the input voltage, is usually more

cost effective than using an N-Channel device in

this particular application. A large P-Channel

Power MOSFET minimizes voltage drop. By

using a small N-Channel device the driving

stage is simplified.

LOAD

Component Values

Typical 10k - 1MW

Typical 0 - 100kW (optional)

Typical 1000pF (optional)

Design Notes

R1 is needed to turn off Q2.

R2 can be used to soft start the switch in case the output capacitance Co is small.

R2 should be at least 10 times smaller than R1 to guarantee Q1 turns on.

By using R1 and R2 a certain amount of current is lost from the input. This bias current loss is given by

the equation

Vin

I_{BIAS_LOSS}

when the switch is ON. I_{BIAS_LOSS}can be minimized by selecting a large

R 1 +R2

value for R1.

R2 and C_RSSof Q2 make ramp for slow turn on. If excessive overshoot current occurs due to fast turn on,

additional capacitance C1 can be added externally to slow down the turn on.

FDC6323L Rev.F

SuperSOT^TM-6 Tape and Reel Data and Package Dimensions

SSOT-6 Packaging

Configuration: Figure 1.0

Customize Label

Antistatic Cover Tape

Conductive Embossed

Carrier Tape

F63TNR

Label

631

Pin 1

SSOT-6 Packaging Information

Standard

(no flow code)

Packaging Option

D87Z

Packaging type

TNR

10,000

13”

SSOT-6 Unit Orientation

Qty per Reel/Tube/Bag

Reel Size

3,000

7” Dia

Box Dimension (mm)

Max qty per Box

184x187x47 343x343x64

9,000

0.0158

0.1440

20,000

0.0158

0.4700

343mm x 342mm x 64mm

F63TNR Label

Weight per unit (gm)

Weight per Reel (kg)

Intermediate box for D87ZOption

Note/Comments

F63TNR

Label

F63TNR Label sample

LOT: CBVK741B019

F63TNR

Label

QTY: 3000

SPEC:

184mm x

184mm x 47mm

Pizza Box for

Standard Option

FSID: FDC633N

D/C1: D9842

D/C2:

QTY1:

QTY2:

SPEC REV:

CPN:

QARV:

(F63TNR)2

Trailer

SSOT-6 Tape Leader

Configuration: Figure 2.0

Carrier Tape

Components

Cover Tape

Trailer Tape

160mm minimum

Leader Tape

390mm minimum

1998 Fairchild Semiconductor Corporation

December 1998, Rev. B

SuperSOT^TM-6 Tape and Reel Data and Package Dimensions, continued

SSOT-6 Embossed Carrier Tape

Configuration: Figure 3.0

User Direction of Feed

Dimensions are in millimeter

Pkg type

SSOT-6

(8mm)

3.23

+/-0.10

3.18

+/-0.10

8.0

+/-0.3

1.55

+/-0.05

1.00

+/-0.125

1.75

+/-0.10

6.25

min

3.50

+/-0.05

4.0

+/-0.1

4.0

+/-0.1

1.37

+/-0.10

0.255

+/-0.150

5.2

+/-0.3

0.06

+/-0.02

Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481

rotational and lateral movement requirements (see sketches A, B, and C).

0.5mm

maximum

20 deg maximum

Typical

component

cavity

center line

0.5mm

maximum

20 deg maximum component rotation

Typical

component

center line

Sketch A (Side or Front Sectional View)

Component Rotation

Sketch C (Top View)

Component lateral movement

Sketch B (Top View)

Component Rotation

SSOT-6 Reel Configuration: Figure 4.0

W1 Measured at Hub

Dim A

Max

Dim A

max

See detail AA

Dim N

7” Diameter Option

B Min

Dim C

See detail AA

Dim D

min

13” Diameter Option

W2 max Measured at Hub

DETAIL AA

Dim W2

Dimensions are in inches and millimeters

Reel

Option

Tape Size

8mm

Dim A

Dim B

Dim C

Dim D

Dim N

Dim W1

Dim W3 (LSL-USL)

7.00

177.8

0.059

1.5

512 +0.020/-0.008

13 +0.5/-0.2

0.795

20.2

2.165

0.331 +0.059/-0.000

8.4 +1.5/0

0.567

14.4

0.311 – 0.429

7.9 – 10.9

7” Dia

13.00

330

0.059

1.5

512 +0.020/-0.008

13 +0.5/-0.2

0.795

20.2

4.00

100

0.331 +0.059/-0.000

8.4 +1.5/0

0.567

14.4

0.311 – 0.429

7.9 – 10.9

8mm

13” Dia

December 1998, Rev. B

SuperSOT^TM-6 Tape and Reel Data and Package Dimensions, continued

SuperSOT -6 (FS PKG Code 31, 33)

1 : 1

Scale 1:1 on letter size paper

Dimensions shown below are in:

inches [millimeters]

Part Weight per unit (gram): 0.0158

1998 Fairchild Semiconductor Corporation

September 1998, Rev. A

TRADEMARKS

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is

not intended to be an exhaustive list of all such trademarks.

ACEx™

CoolFET™

ISOPLANAR™

MICROWIRE™

POP™

PowerTrench™

QS™

CROSSVOLT™

E²CMOS^TM

FACT™

FACT Quiet Series™

Quiet Series™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

TinyLogic™

FAST^®

FASTr™

GTO™

HiSeC™

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER

NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD

DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT

OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT

RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or

systems which, (a) are intended for surgical implant into

the body, or (b) support or sustain life, or (c) whose

failure to perform when properly used in accordance

with instructions for use provided in the labeling, can be

reasonably expected to result in significant injury to the

user.

2. A critical component is any component of a life

support device or system whose failure to perform can

be reasonably expected to cause the failure of the life

support device or system, or to affect its safety or

effectiveness.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification

Product Status

Definition

Advance Information

Formative or

In Design

This datasheet contains the design specifications for

product development. Specifications may change in

any manner without notice.

Preliminary

First Production

This datasheet contains preliminary data, and

supplementary data will be published at a later date.

Fairchild Semiconductor reserves the right to make

changes at any time without notice in order to improve

design.

No Identification Needed

Obsolete

Full Production

This datasheet contains final specifications. Fairchild

Semiconductor reserves the right to make changes at

any time without notice in order to improve design.

Not In Production

This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.

The datasheet is printed for reference information only.

FDC6323L相关产品

FDC6323L(T+R)FDC6323L-LF FDC6323L-NL FDC6323L-TP FDC6323L/323 FDC6323L_NL FDC6324 FDC6324C FDC6324L FDC6324L-LF FDC6324L-NL FDC6324L-TP FDC6324L_NL FDC6324L_Q FDC6325 FDC6325L

FDC6323L相关文章

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FDC6323L产品参数

型号:	FDC6323L
Brand Name：	Fairchild Semiconductor
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Transferred
IHS 制造商：	FAIRCHILD SEMICONDUCTOR CORP
零件包装代码：	SSOT
包装说明：	LSSOP, TSOP6,.11,37
针数：	6
制造商包装代码：	6LD, SUPERSOT6, JEDEC MO-193, 1.6MM WIDE
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8541.29.00.95
风险等级：	3.39
Samacsys Confidence：	4
Samacsys Status：	Released
Samacsys PartID：	304829
Samacsys Pin Count：	6
Samacsys Part Category：	Integrated Circuit
Samacsys Package Category：	SOT23 (6-Pin)
Samacsys Footprint Name：	MA06A
Samacsys Released Date：	2016-04-12 11:17:33
Is Samacsys：	N
内置保护：	TRANSIENT
驱动器位数：	1
接口集成电路类型：	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码：	R-PDSO-G6
JESD-609代码：	e3
长度：	2.9 mm
湿度敏感等级：	1
功能数量：	1
端子数量：	6
输出电流流向：	SOURCE
最大输出电流：	1.5 A
标称输出峰值电流：	1 A
封装主体材料：	PLASTIC/EPOXY
封装代码：	LSSOP
封装等效代码：	TSOP6,.11,37
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	3/8 V
认证状态：	Not Qualified
座面最大高度：	1.22 mm
子类别：	Peripheral Drivers
表面贴装：	YES
技术：	NMOS
端子面层：	Matte Tin (Sn)
端子形式：	GULL WING
端子节距：	0.95 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	1.6 mm
Base Number Matches：	1

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