Chip Schottky Barrier Diodes
Formosa MS
FM620-T THRU FM6100-T
Silicon epitaxial planer type
Features
SMC-T
Plastic package has Underwriters Laboratory
FlammabilityClassification 94V-OUtilizing Flame
Retardant EpoxyMolding Compound.
0.276(7.0)
0.260(6.6)
0.012(0.3) Typ.
0.152(3.8)
0.189(4.8)
0.173(4.4)
For surface mounted applications.
0.144(3.6)
Exceeds environmental standards of MIL-S-19500 /
228
0.244(6.2)
0.228(5.8)
Low leakage current.
0.087(2.2)
0.071(1.8)
0.032(0.8) Typ.
0.040(1.0) Typ.
0.040 (1.0) Typ.
Dimensions in inches and (millimeters)
Mechanical data
Case : Molded plastic, JEDEC DO-214AB
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : 0.00585 ounce, 0.195 gram
o
MAXIMUM RATINGS (AT TA=25 C unless otherwise noted)
PARAMETER
CONDITIONS
Symbol
IO
MIN.
TYP.
MAX.
6.0
UNIT
A
Forward rectified current
See Fig.1
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
Forward surge current
150
A
IFSM
o
VR = VRRM TA = 25 C
0.5
50
mA
mA
Reverse current
IR
o
VR = VRRM TA = 125 C
o
Thermal resistance
Junction to ambient
15
C / w
pF
RqJA
CJ
Diode junction capacitance
Storage temperature
f=1MHz and applied 4vDC reverse voltage
380
o
-55
+150
C
TSTG
Operating
*1
*2
*3
*4
VRRM
VRMS
VR
VF
MARKING
temperature
SYMBOLS
CODE
o
( C)
(V)
(V)
(V)
(V)
FM620-T
FM630-T
FM640-T
FM650-T
FM660-T
FM680-T
FM6100-T
SS62
SS63
SS64
SS65
SS66
SS68
S610
20
30
40
50
60
80
14
21
28
35
42
56
70
20
30
40
50
60
80
100
0.55
-55 to +125
*1 Repetitive peak reverse voltage
*2 RMS voltage
0.70
-55 to +150
*3 Continuous reverse voltage
*4 Maximum forward voltage
0.85
100