GRM319R11H681JA01D全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

Chip Monolithic Ceramic Capacitor for General

GRM319R11H681KA01_ (1206, R:JIS, 680pF, DC50V)

_: packaging code

Reference Sheet

1.Scope

This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.

ꢀꢀ

2.MURATA Part NO. System

(Ex.)

GRM

31

9

R1

1H

681

K

A01

D

(7)Murata’s

Control Code

(6)Capacitance

Tolerance

(2)T

Dimensions

(3)Temperature

Characteristics

(4)Rated

Voltage

(5)Nominal

Capacitance

(8)Packaging

Code

(1)L/W

Dimensions

3. Type & Dimensions

(Unit:mm)

(1)-1 L

(1)-2 W

1.6±0.15

(2) T

e

g

3.2±0.15

0.85±0.1

0.3 to 0.8

1.5 min.

4.Rated value

(3) Temperature Characteristics

(Public STD Code):R(JIS)

Specifications and Test

Methods

(4)

Rated

Voltage

(6)

(5) Nominal

Capacitance

Tolerance

(Operating

Temp. Range)

Temp. coeff

orꢀCap. Change

Temp. Range

(Ref.Temp.)

-55 to 125 °C

(20 °C)

DC 50 V

680 pF

±10 %

-15 to 15 %

-55 to 125 °C

5.Package

mark

(8) Packaging

Packaging Unit

f180mm Reel

PAPER W8P4

f330mm Reel

PAPER W8P4

D

4000 pcs./Reel

10000 pcs./Reel

J

Product specifications in this catalog are as of Mar.1,2016,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

GRM319R11H681KA01-01

1

■ Specifications and Test Methods

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

No

1

Item

Rated Voltage

Temperature

Compensating Type

Shown in Rated value.

High Dielectric

Constant Type

The rated voltage is defined as the maximum voltage

which may be applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage,

V^P-Por V^O-P, whichever is larger, should be maintained

within the rated voltage range.

2

3

4

Appearance

Dimension

No defects or abnormalities.

Visual inspection.

Within the specified dimensions.

No defects or abnormalities.

Using calipers. (GRM02 size is based on Microscope)

Voltage proof

Measurement Point

Test Voltage

:

Between the terminations

300% of the rated voltage

(Temperature compensating type)

250% of the rated voltage

(High dielectric constant type)

: 1s to 5 s

:

Applied Time

Charge/discharge current : 50mA max.

5

Insulation Resistance(I.R.)

C≦0.047µF:More than 10000MΩ

C＞0.047µF:More than 500Ω·F

C:Nominal Capacitance

Measurement Point ꢀꢀ : Between the terminations

Measurement Voltage : DC Rated Voltage

Charging Time

: 2 min

Charge/discharge current : 50mA max.

Measurement Temperature : Room Temperature

6

7

Capacitance

Shown in Rated value.

(1)Temperature Compensating Type

Q or Dissipation Factor (D.F.)

30pF and over:Q≧1000

W.V.:100Vdc :0.025max.(C<0.068µF)

Capacitance

C≦1000pF

C＞1000pF

Frequency

1.0+/-0.1MHz 0.5 to 5.0Vrms

1.0+/-0.1kHz

Voltage

30pF and below:Q≧400+20C

:0.05max.(C≧0.068µF)

1.0+/-0.2Vrms

C:Nominal Capacitance(pF) W.V.:50/35/25Vdc :0.025max.

W.V.:16/10Vdc :0.035max.

(2)High Dielectric Constant Type

W.V.:6.3/4Vdc :0.05max.(C<3.3µF)

:0.1max. (C≧3.3µF)

Capacitance

C≦10μF

C＞10μF

Frequency

1.0+/-0.1kHz

120+/-24Hz

Voltage

1.0+/-0.2Vrms

0.5+/-0.1Vrms

8

Temperature

No bias

Nominal values of the

temperature coefficient is

shown in Rated value.

B1,B3 : Within +/-10%

ꢀꢀ (-25°C to +85°C)

R1,R7 : Within +/-15%

ꢀꢀ (-55°C to +125°C)

The capacitance change should be measured after 5 min

at each specified temp. stage.

Characteristics

of Capacitance

In case of applying voltage, the capacitance change should be

measured after 1 min with applying voltage in equilibration of

each temp. stage.

But,the Capacitance Change R6 : Within +/-15%

under 20℃ is shown

ꢀ

(-55°C to +85°C)

Capacitance value as a reference is the value in step 3.

in Table A.

C7 : Within +/-22%

ꢀ

(-55°C to +125°C)

(1)Temperature Compensating Type

C8 : Within +/-22%

The capacitance drift is calculated by dividing the differences

between the maximum and minimum measured values in the

step 1,3 and 5 by the cap. value in step 3.

Capacitance Drift *

ꢀ (-55°C to +105°C)

Within +/-0.2% or +/-0.05pF L8 : Within +/-15%

(Whichever is larger.)

*Not apply to 1X/25V

ꢀ (-55°C to +125°C)

Step

Temperature(C)

Reference Temp.+/-2

Min. Operating Temp.+/-3

Reference Temp.+/-2

Max. Operating Temp.+/-3

Reference Temp.+/-2

: Within +15/-40%

1

2

3

4

5

ꢀ

(+125°C to +150°C)

50% of

-

B1 : Within +10/-30%

R1 : Within +15/-40%

(2)High Dielectric Constant Type

the rated

voltage

Applying Voltage(VDC)

No bias

Step

1

Temperature(C)

Reference Temp.+/-2

Min.Operating Temp.+/-3

Reference Temp.+/-2

Max.Operating Temp.+/-3

Reference Temp.+/-2

Min.Operating Temp.+/-3

Reference Temp.+/-2

Max.Operating Temp.+/-3

2

3

4

5

50% of

the rated voltage

(For B1,R1)

6

7

8

· Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature, then measure.

9

Adhesive Strength

of Termination

No removal of the terminations or other defect

should occur.

Solder the capacitor on the test substrate shown in Fig.3.

Type

Applied Force(N)

GRM02

1

2

GRM03

GRM15/GRM18

5

GRM21/GRM31/GRM32

10

Holding Time

:

10+/-1s

Applied Direction : In parallel with the test substrate and vertical with

the capacitor side.

JEMCGS-0001U

2

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

No

Item

Temperature

High Dielectric

Constant Type

Compensating Type

10 Vibration

Appearance No defects or abnormalities.

Capacitance Within the specified initial value.

Q or D.F. Within the specified initial value.

Solder the capacitor on the test substrate shown in Fig.3.

Kind of Vibration

Total amplitude

:

A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

: 1.5mm

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

11 Substrate

Bending test

Appearance No defects or abnormalities.

Capacitance Within +/-5% or +/-0.5pF

Solder the capacitor on the test substrate shown in Fig.1.

Pressurization method : Shown in Fig.2

Within +/-10%

Change

(Whichever is larger)

Flexureꢀ

ꢀꢀꢀ: 1mm

Holding Time

Soldering Method

:

5+/-1s

:

Reflow soldering

12 Solderability

Test Method

Flux

:

Solder bath method

Solution of rojin ethanol 25(wt)%

80℃ to 120℃ for 10s to 30s

Sn-3.0Ag-0.5Cu

95% of the terminations is to be soldered evenly and continuously.

Preheat

:

Solder

Solder Temp.

Immersion time

: 245+/-5℃

: 2+/-0.5s

13 Resistance to

Appearance No defects or abnormalities.

Test Method

Solder

Soldering Heat Capacitance Within +/-2.5% or +/- 0.25pF Within +/-7.5%

:

Solder bath method

Sn-3.0Ag-0.5Cu

270+/-5℃

Change

Q or D.F.

I.R.

(Whichever is larger)

:

Solder Temp.

Immersion time

Exposure Time

Preheat

Within the specified initial value.

: 10+/-0.5s

:

24+/-2h

:

GRM31 size max.: 120℃ to 150℃ for 1 min

GRM32 size ꢀꢀ : 100℃ to 120℃ for 1 min

and 170℃ to 200℃ for 1 min

ꢀ

Voltage proof No defects.

· Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature, then measure.

Test Method

Solder

:

Reflow soldering (hot plate)

Sn-3.0Ag-0.5Cu

: 270+/-5℃

:

Solder Temp.

Reflow Time

Test Substrate

Exposure Time

Preheat

:

10+/-0.5s

:

Glass epoxy PCB

24+/-2h

:

120℃ to 150℃ for 1 min

· Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature, then measure.

14

Appearance No defects or abnormalities.

Solder the capacitor on the test substrate shown in Fig.3.

Temperature

Capacitance Within +/-2.5% or+/- 0.25pF Within +/-7.5%

Sudden Change

Change

Q or D.F.

I.R.

(Whichever is larger)

Perform the five cycles according to the four heat treatments

shown in the following table.

Within the specified initial value.

Step

Temp.(C)

Min.Operating Temp.+0/-3

Room Temp.

Time (min)

30+/-3

2 to 3

1

2

3

4

Voltage proof No defects.

30+/-3

2 to 3

Max.Operating Temp.+3/-0

Room Temp

Exposure Time

: 24+/-2h

· Initial measurement for high dielectric constant type

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature, then measure.

JEMCGS-0001U

3

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

No

15

Item

Temperature

Compensating Type

High Dielectric

Constant Type

Appearance No defects or abnormalities.

Solder the capacitor on the test substrate shown in Fig.3.

High

Temperature

High Humidity

(Steady)

Capacitance Within +/-7.5% or +/-0.75pF Within +/-12.5%

Test Temperature

: 40+/-2℃

Change

(Whichever is larger)

Test Humidity

Test Time

: 90%RH to 95%RH

: 500+/-12h

Q or D.F.

30pF and over:Q≧200

W.V.:100Vdc :0.05max.(C<0.068µF) Applied Voltage

: DC Rated Voltage

30pF and below

ꢀ

:0.075max.(C≧0.068µF)Charge/discharge current : 50mA max.

:Q≧100+10C/3 W.V.:50/35/25Vdc :0.05max.

W.V.:16/10Vdc :0.05max.

Exposure Time

: 24+/-2h

C:Nominal Capacitance(pF) W.V.:6.3/4Vdc :0.075max.(C<3.3µF)

:0.125max.(C≧3.3µF)

I.R.

More than 500MΩ or 25Ω·F (Whichever is smaller)

16

Appearance No defects or abnormalities.

Capacitance Within +/-3% or +/-0.3pF

Solder the capacitor on the test substrate shown in Fig.3.

Durability

Within +/-12.5%

Test Temperature

Test Time

: Max. Operating Temp. +/-3℃

Change

(Whichever is larger)

: 1000+/-12h

Applied Voltage

:

200% of the rated voltage

Q or D.F.

30pF and over:Q≧350

10pF and over

W.V.:100Vdc :0.05max.(C<0.068µF) Charge/discharge current : 50mA max.

:0.075max.(C≧0.068µF) Exposure Time 24+/-2h

W.V.:50/35/25Vdc :0.05max.

:

30pF and below

: Q≧275+5C/2 W.V.:16/10Vdc :0.05max.

･Initial measurement for high dielectric constant type

10pF and below

: Q≧200+10C

W.V.:6.3/4Vdc :0.075max.(C<3.3µF) Apply 200% of the rated DC voltage at the max. operating

:0.125max.(C≧3.3µF) temp. +/-3°C for 1h and then let sit for 24+/-2h at room temperature,

then measure.

C:Nominal Capacitance (pF)

More than 1,000MΩ or 50Ω·F (Whichever is smaller)

I.R.

Table A

Capacitance Change from 20C (%)

-25℃ -10℃

Char.

-55℃

Max.

0.82

1.37

2.56

Min.

-0.45

-0.90

-1.88

Max.

0.49

0.82

1.54

1.32

1.65

2.36

1.70

2.03

2.74

2.30

2.63

3.35

3.07

3.40

4.12

4.94

5.65

-

Min.

-0.27

-0.54

-1.13

0.41

0.14

-0.45

0.72

0.45

-0.14

1.22

0.95

0.36

1.85

1.58

0.99

2.84

2.25

-

Max.

0.33

0.55

1.02

0.88

1.10

1.57

1.13

1.35

1.83

1.54

1.76

2.23

2.05

2.27

2.74

3.29

3.77

-

Min.

-0.18

-0.36

-0.75

0.27

0.09

-0.30

0.48

0.30

-0.09

0.81

0.63

0.24

1.23

1.05

0.66

1.89

1.50

-

2C/0C

3C

4C

2P

3P

4P

2R

3R

4R

2S

3S

4S

2T

-

3T

4T

3U

4U

1X

JEMCGS-0001U

4

Substrate Bending test

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ: Solder resist

(Coat with heat resistant resin for solder)

b

Land

Dimension (mm)

f4.5

Type

a

b

c

GRM02

GRM03

GRM15

GRM18

GRM21

GRM31

GRM32

0.2

0.3

0.4

1.0

1.2

2.2

0.56

0.9

1.5

3.0

4.0

5.0

0.23

0.3

0.5

1.2

1.65

2.0

2.9

a

100

Fig.1

Kind of Solder : Sn-3.0Ag-0.5Cu

Pressurization method

(in mm)

20

・

Pressurization

speed

1.0mm/s

50 min.

Pressurize

R5

Flexure

Capacitance meter

45 45

Fig.2

(in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

Land Dimensions

・

Chip Capacitor

Dimension (mm)

Type

Land

a

b

c

GRM02

GRM03

GRM15

GRM18

GRM21

GRM31

GRM32

0.2

0.3

0.4

1.0

1.2

2.2

0.56

0.9

1.5

3.0

4.0

5.0

0.23

0.3

0.5

1.2

1.65

2.0

2.9

a

Solder Resist

b

Fig.3

JEMCGS-0001U

5

Package

GRM Type

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)

1.1 Minimum Quantity(pcs./reel)

φ180mm reel

Paper Tape

Code:D/E Code:W

φ330mm reel

Plastic Tape Paper Tape Plastic Tape

Type

Code:L

Code:J/ F

Code:K

50000(W4P1)

40000(W4P1)

GRM01

GRM02

2

15000(W8P2)

50000(W8P2)

GRM03

15000(W8P2) 30000(W8P1)

10000(W8P2)

3

5

2

3/X

20000(W8P2)

10000(W8P2)

5(LWT Dimensions Tolerance:±0.05)

10000(W8P2) 20000(W8P1)

50000(W8P2)

40000(W8P2)

5(LWT Dimensions Tolerance:±0.1min.) 10000(W8P2)

GRM15

5 (LW Dimensions Tolerance:±0.1min.

10000(W8P2)

50000(W8P2)

and T Dimensions Tolerance:±0.05)

5(LW Dimensions Tolerance:±0.2

10000(W8P2)

and T Dimensions:0.5 +0/-0.1)

GRM18

GRM21

4000

10000

6

9

A/B

6/9

3000

10000

4000

10000

GRM31 M/X

3000

2000

10000

6000

C

9

A/M

N

C

R/D/E

M

N/R/D

E

S

3000

2000

1000

500

10000

8000

6000

4000

5000

4000

2000

1500

5000

4000

GRM32

GRM43

GRM55

500

M

1000

500

N/C/R/D

E

F

300

1500

1.2 Dimensions of Tape

(1)GRM01/02 (W4P1 CODE:L)

(in:mm)

2.0±0.04

*1,2：1.0±0.02

0.15～0.25

*1

*2

φ0.8±0.04

Ａ

0.05 max.

t

Dimensions(Chip)

Type

GRM01

GRM02

A *3

B *3

t

L

W

T

0.25±0.013 0.125±0.013 0.125±0.013

0.145

0.23

0.26

0.27

0.43

0.46

0.4 max.

0.5 max.

1

2

0.4±0.02

0.4±0.05

0.2±0.02

0.2±0.05

0.2±0.02

0.2±0.05

*3 Nominal value

6

JEMCGP-01796E

Package

GRM Type

ꢀ(2)GRM03/15(W8P2 CODE:D/E/J/F)

*1,2：2.0±0.05

4.0±0.1

*1 *2

(in:mm)

+0.1

-0

φ1.5

Ａ

0.05 max.

t

Dimensions(Chip)

W

Type

A *3

B *3

t

L

T

2

3

0.2 +0.02/-0.04

0.3±0.03

0.6±0.03

0.6±0.05

0.6±0.09

0.3±0.03

0.3±0.05

0.3±0.09

0.37

0.39

0.44

0.67

0.69

0.74

0.5 max.

0.6 max.

GRM03

0.3±0.05

0.3±0.09

0.5±0.05

5

2

X

0.2 +0.02/-0.04

0.25±0.05

1.0±0.05

0.5±0.05

0.65

1.15

3

0.3±0.03

1.0±0.2

1.0±0.05

1.0±0.07

1.0±0.1

0.5±0.2

0.5±0.05

0.5±0.07

0.5±0.1

0.78

0.65

1.29

1.15

0.5±0.05

0.5±0.07

0.5±0.1

0.5±0.15

0.5 +0/-0.1

0.5±0.2

0.8 max.

GRM15

0.70

0.72

1.20

1.25

5

1.0±0.15

0.5±0.15

1.0±0.2

0.5±0.2

0.78

1.29

0.5±0.05

*3 Nominal value

ꢀ(3)GRM033/155(W8P1 CODE:W)

(in:mm)

4.0±0.1

1.0±0.05

+0.1

-0

φ1.5

Ａ

1.0±0.05

t

Dimensions(Chip)

W

Type

A *3

B *3

t

L

T

0.6±0.03

0.6±0.05

0.6±0.09

1.0±0.05

0.3±0.03

0.3±0.05

0.3±0.09

0.5±0.05

0.3±0.03

0.3±0.05

0.3±0.09

0.5±0.05

0.37

0.39

0.44

0.67

0.69

0.74

1.15

0.5 max.

GRM03

GRM15

3

5

0.6 max.

0.8 max.

0.65

*3 Nominal value

JEMCGP-01796E

7

Package

GRM Type

ꢀ(4)GRM18/21/31/32

(in:mm)

4.0±0.1

2.0±0.1

+0.1

-0

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

φ1.5

+0.1

φ1.5

-0

Ａ

t

Dimensions(Chip)

Dimensions

of Tape

Type

A

B

t

L

W

T

1.6±0.1

0.8±0.1

1.05±0.10

1.85±0.10

2.00±0.10

0.5 +0/-0.1

5

0.8 max.

0.5±0.05

0.6 +0/-0.1

0.7±0.1

1.6±0.2

0.8±0.2

1.10±0.10

6

7

GRM18

1.6±0.1

1.6±0.15

1.6±0.2

0.8±0.1

0.8±0.15

0.8±0.2

0.8±0.1

1.05±0.10

1.10±0.10

1.85±0.10

2.00±0.10

8

6

0.8±0.15

0.8±0.2

Paper Tape

0.6±0.1

0.6 +0/-0.15

0.85±0.05

0.85±0.1

1.15 max.

2.0±0.1

1.25±0.1

1.55±0.15

2.30±0.15

0.85 +0.15/-0.1

0.85 +0/-0.2

9

2.0±0.15

2.0±0.2

1.25±0.15

1.25±0.2

GRM21

0.85±0.1

0.85 +0.15/-0.05

1.0 +0/-0.2

1.0±0.2

1.50±0.20

1.45±0.20

1.50±0.20

1.45±0.20

2.30±0.20

2.25±0.20

2.30±0.20

2.25±0.20

1.7 max.

2.0 max.

1.15 max.

2.0±0.1

2.0±0.2

2.0±0.1

2.0±0.15

2.0±0.2

1.25±0.1

1.25±0.2

1.25±0.1

1.25±0.15

1.25±0.2

A

B

Plastic Tape

Paper Tape

1.25±0.1

1.25±0.15

1.25±0.2

1.50±0.20

2.30±0.20

6

9

0.6±0.1

3.2±0.15

3.2±0.2

1.6±0.15

1.6±0.2

2.00±0.20

3.60±0.20

0.85±0.1

B

M

X

C

1.25±0.1

1.15±0.1

1.15±0.15

1.2±0.1

3.2±0.15

1.6±0.15

GRM31

1.7 max.

1.90±0.20

3.50±0.20

Plastic Tape

Paper Tape

3.2±0.2

3.2±0.3

1.6±0.2

1.6±0.3

1.6±0.2

2.5 max.

1.15 max.

1.7 max.

1.6±0.3

2.10±0.20

2.80±0.20

3.60±0.20

9

A

M

N

C

R

D

E

0.85 +0.15/-0.05

1.0 +0/-0.2

1.15±0.1

1.35±0.15

1.6±0.2

GRM32

3.2±0.3

2.5±0.2

2.5 max.

2.80±0.20

3.50±0.20

Plastic Tape

1.8±0.2

3.0 max.

3.7 max.

2.0±0.2

2.5±0.2

JEMCGP-01796E

8

Package

GRM Type

(5)GRM43/55

(in:mm)

8.0±0.1

4.0±0.1

*

+0.1

-0

0.3±0.1

φ1.5

*：2.0±0.1

Ａ

+0.2

-0

φ1.5

t

Dimensions(Chip)

W

Type

A *1

3.6

B *1

t

L

T

M

N

R

1.15±0.1

1.35±0.15

1.8±0.2

2.0±0.2

2.5±0.2

2.8±0.2

1.15±0.1

1.35±0.15

1.6±0.2

1.8±0.2

2.0±0.2

2.5±0.2

3.2±0.2

2.5 max.

GRM43

GRM55

4.5±0.4

3.2±0.3

4.9

6.1

D

E

S

M

N

C

R

D

E

F

3.7 max.

4.7 max.

2.5 max.

5.7±0.4

5.0±0.4

5.2

3.7 max.

4.7 max.

*1 Nominal value

JEMCGP-01796E

9

Package

GRM Type

Fig.1 Package Chips

(in:mm)

Chip

Fig.2 Dimensions of Reel

2.0±0.5

φ21±0.8

ｗ1

W

w₁

GRM01/02

GRM03/15/18/21/31/32

GRM43/55

8.0 max.

16.5 max.

20.5 max.

5±1.5

10±1.5

14±1.5

Fig.3 Taping Diagram

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

Base Tape : As specified in 1.2.

JEMCGP-01796E

10

Package

GRM Type

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.

(The sprocket holes are to the right as the tape is pulled toward the user.)

1.4 Part of the leader and part of the vacant section are attached as follows.

Tail vacant Section

Chip-mounting Unit Leader vacant Section

(in:mm)

Leader Unit

(Top Tape only)

Direction

of Feed

160 min.

190 min.

210 min.

1.5 Accumulate pitch : 10 of sprocket holes pitch = 20±0.3mm(GRM01/02)

40±0.3mm(GRM03 min.)

1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.

1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.

1.8 There are no jointing for top tape and bottom tape.

1.9 There are no fuzz in the cavity.

1.10 Break down force of top tape : 5N min.

Break down force of bottom tape : 5N min. (Only a bottom tape existence )

1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.

There are possibly to change the material and dimension due to some impairment.

1.12 Peeling off force : 0.1N to 0.6N^*in the direction as shown below.

* GRM01/02/03:0.05N～0.5N

Top tape

165～180°

1.13 Label that show the customer parts number, our parts number, our company name, inspection

number and quantity, will be put in outside of reel.

JEMCGP-01796E

11

^!Caution

■Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

ꢀ for the prevention of defects which might directly cause damage to the third party's life, body or property.

ꢀꢀꢀ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment

ꢀꢀꢀ⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment

ꢀꢀꢀ⑧Disaster prevention / crime prevention equipment

⑨Data-processing equipment

ꢀꢀꢀ⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.

■Storage and Operation condition

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

1-1. Store the capacitors in the following conditions:

Room Temperature of +5℃ to +40℃ and a Relative Humidity of 20% to 70%.

(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity

conditions during storage may affect solderability and packaging performance.

Therefore, please maintain the storage temperature and humidity. Use the product within six months,

as prolonged storage may cause oxidation of the terminations (outer electrodes).

(2) Please confirm solderability before using after six months.

ꢀ

Store the capacitors without opening the original bag.

Even if the storage period is short, do not exceed the specified atmospheric conditions.

1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen

sulfide, sulfur dioxide, chlorine, ammonia gas etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and

electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity

conditions

■Rating

1.Temperature Dependent Characteristics

1. The electrical characteristics of the capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature

changes. The following actions are recommended in order to ensure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature.

When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance

tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and

carefully confirm the various characteristics in actual use conditions and the actual system.

[Example of Temperature Caracteristics X7R(R7)]

[Example of Temperature Characteristics X5R(R6)]

Sample: 0.1μF, Rated Voltage 50VDC

Sample: 22μF, Rated Voltage 4VDC

20

15

10

5

20

15

10

5

0

-5

-10

-15

-20

-10

-15

-20

-75

-50

-25

0

25

50

75

100

-75

-50

-25

0

25

50

75

100 125 150

Temperature (ꢀC)

JEMCGC-2701X

12

Caution

!

2.Measurement of Capacitance

1. Measure capacitance with the voltage and frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

3.Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.

Typical Voltage Applied to the DC capacitor

DC Voltage

DC Voltage+AC

AC Voltage

Pulse Voltage

0

E

0

(E：Maximum possible applied voltage.)

1-2. Influence of over voltage

Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown

of the internal dielectric layers .

The time duration until breakdown depends on the applied voltage and the ambient temperature.

4.Type of Applied Voltage and Self-heating Temperature

1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the

continuous application of an AC voltage or pulse voltage.

When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current

or pulse current will flow into the capacitor; therefore check the self-heating condition.

Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits

of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is

used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.

[Example of Temperature Rise (Heat Generation) in Chip

1-1. The load should be contained to the level

Monolithic Ceramic Capacitors in Contrast to Ripple Current]

Sample: R(R1) characteristics 10μF, Rated voltage: DC10V

ꢀ

such that when measuring at atmospheric

ꢀ ꢀtemperature of 25°C, the product's self-heating

Ripple Current

ꢀꢀ remains below 20°C and the surface

temperature of the capacitor in the actual circuit

remains within the maximum operating

temperature.

100

10

100kHz

500kHz

1MHz

1

0

1

2

3

4

5

6

Current (Ar.m.s.)

JEMCGC-2701X

13

Caution

!

5. DC Voltage and AC Voltage Characteristic

1. The capacitance value of a high dielectric constant type

capacitor changes depending on the DC voltage applied.

Please consider the DC voltage characteristics when a

capacitor is selected for use in a DC circuit.

[Example of DC Voltage Characteristics]

Sample: X7R(R7) Characteristics 0.1μF, Rated Voltage 50VDC

20

0

-20

-40

-60

-80

1-1. The capacitance of ceramic capacitors may change

sharply depending on the applied voltage. (See figure)

Please confirm the following in order to secure the

capacitance.

(1) Determine whether the capacitance change caused

by the applied voltage is within the allowed range .

(2) In the DC voltage characteristics, the rate of

capacitance change becomes larger as voltage

increases, even if the applied voltage is below

the rated voltage. When a high dielectric constant

type capacitor is used in a circuit that requires a

tight (narrow) capacitance tolerance (e.g., a time

constant circuit), please carefully consider the

voltage characteristics, and confirm the various

characteristics in the actual operating conditions

-100

0

10

20

30

40

50

DC Voltage (V)

[Example of AC Voltage Characteristics]

Sample: X7R(R7) Characteristics 10μF, Rated Voltage 6.3VDC

30

20

10

0

ꢀ

of the system.

-10

-20

2. The capacitance values of high dielectric

constant type capacitors changes depending

on the AC voltage applied.

-30

-40

-50

-60

Please consider the AC voltage characteristics

when selecting a capacitor to be used in a

AC circuit.

0

0.5

1

1.5

2

AC Voltage (Vr.m.s.)

6. Capacitance Aging

[Example of Change Over Time (Aging characteristics) ]

1. The high dielectric constant type capacitors

have an Aging characteristic in which the capacitance

value decreases with the passage of time.

20

10

0

When you use a high dielectric constant type

capacitors in a circuit that needs a tight (narrow)

capacitance tolerance (e.g., a time-constant circuit),

please carefully consider the characteristics

of these capacitors, such as their aging, voltage,

and temperature characteristics. In addition,

check capacitors using your actual appliances

at the intended environment and operating conditions.

-10

C0G(5C)

-20

X7R(R7)

-30

X5R(R6)

-40

10

100

1000

10000

Time(h)

7.Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.

Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to being dropped may cause damage or

a crack in the dielectric material of the capacitor.

Do not use a dropped capacitor because the quality and reliability

Crack

may be deteriorated.

Floor

3. When printed circuit boards are piled up or handled, the corner

ꢀof another printed circuit board

Mounting printed circuit board

Crack

should not be allowed to hit the capacitor in order to avoid

a crack or other damage to the capacitor.

JEMCGC-2701X

14

Caution

!

■Soldering and Mounting

1.Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing

or bending the printed circuit board.

1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.

ꢀ [Component Direction]

Locate chip horizontal to the

direction in which stress acts.

(Bad Example)

(Good Example)

[Chip Mounting Close to Board Separation Point]

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures

Stress Level

Aꢀ>ꢀD *1

Aꢀ>ꢀB

(1) Turn the mounting direction of the component parallel to the board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the board separation surface.

Aꢀ>ꢀC

C

Perforation

B

D

A

Slit

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

[Mounting Capacitors Near Screw Holes]

When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.

ꢀ

Recommended

Screw Hole

2.Information before Mounting

1. Do not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.

JEMCGC-2701X

15

Caution

!

3.Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept

to a minimum to prevent them from any damage or cracking. Please take into account the following precautions

and recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.

ꢀ [Incorrect]

ꢀ [Correct]

Suction Nozzle

Deflection

Board

Board Guide

Support Pin

2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent

the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,

causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip

when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,

checked and replaced periodically.

JEMCGC-2701X

16

Caution

!

4-1.Reflow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

[Standard Conditions for Reflow Soldering]

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB.

Preheating conditions are shown in table 1. It is required to

keep the temperature differential between the solder and

the components surface (ΔT) as small as possible.

Temperature(℃)

Soldering

Peak Temperature

Gradual

Cooling

220℃

ΔT

190℃

170℃

150℃

Preheating

2. Solderability of tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of

tin is used. Please confirm the solderability of tin plated

termination chips before use.

Time

60-120 seconds 30-60 seconds

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT)

between the component and the solvent within the range

shown in the table 1.

[Allowable Reflow Soldering Temperature and Time]

280

270

Table 1

Temperature Differential

Series

ChipꢀDimension(L/W)ꢀCode

260

250

240

230

220

01/02/03/15/18/21/31

GRM

ΔT≦190℃

ΔT≦130℃

32/43/55

GRM

0

30

60

90

120

Soldering Time(s)

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Recommended Conditions

Peak Temperature

Lead Free Solder

240 to 260℃

Air or N₂

Atmosphere

Lead Free Solder: Sn-3.0Ag-0.5Cu

4. Optimum Solder Amount for Reflow Soldering

4-1. Overly thick application of solder paste results in a excessive solder fillet height.

This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.

4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose

from the PCB.

4-3. Please confirm that solder has been applied smoothly to the termination.

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to the PCB.

JEMCGC-2701X

17

Caution

!

4-2.Flow Soldering

1. Do not apply flow soldering to chips not listed in Table 2.

ꢀꢀꢀꢀꢀ[Standard Conditions for Flow Soldering]

Temperature(℃)

Soldering

Peak

Temperature

Table 2

Soldering

Temperature Differential

Series

GRM

ChipꢀDimension(L/W)ꢀCode

Gradual

Cooling

ΔT

18/21/31

ΔT≦150℃

Preheating

Peak

Temperature

2. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both of the components and the PCB.

Preheating conditions are shown in table 2. It is required to

keep the temperature differential between the solder and

the components surface (ΔT) as low as possible.

Preheating

Time

5 seconds max.

30-90 seconds

[Allowable Flow Soldering Temperature and Time]

280

270

260

3. Excessively long soldering time or high soldering

temperature can result in leaching of the terminations,

causing poor adhesion or a reduction in capacitance value

due to loss of contact between the inner electrodes and terminations.

250

240

230

220

4. When components are immersed in solvent after mounting,

be sure to maintain the temperature differential (ΔT)

between the component and solvent within the range

shown in the table 2.

0

10

20

30

40

Soldering Time(s)

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Recommended Conditions

Lead Free Solder

Preheating Peak Temperature

Soldering Peak Temperature

100 to 120℃

250 to 260℃

Air or N2

Atmosphere

Lead Free Solder: Sn-3.0Ag-0.5Cu

5. Optimum Solder Amount for Flow Soldering

Up to Chip Thickness

5-1. The top of the solder fillet should be lower than the

thickness of the components. If the solder amount is

excessive, the risk of cracking is higher during

board bending or any other stressful condition.

in section

Adhesive

JEMCGC-2701X

18

Caution

!

4-3.Correction of Soldered Portion

When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,

and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending

on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.

Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.

1. Correction with a Soldering Iron

1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.

Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.

1-2. After soldering, do not allow the component/PCB to cool down rapidly.

1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,

there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the

adhesive strength and other problems.

Table 3

ChipꢀDimension

(L/W)ꢀCode

Temperature of

Soldering Iron Tip

Preheating

Temperature

Differential(ΔT)

Series

GRM

Atmosphere

03/15/18/21/31

350℃ max.

150℃ min.

ΔT≦190℃

Air

32/43/55

280℃ max.

150℃ min.

ΔT≦130℃

Lead Free Solder: Sn-3.0Ag-0.5Cu

* Please manage Δ T in the temperature of soldering iron and the preheating temperature.

2. Correction with Spot Heater

Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component

and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,

a spot heater can also prevent concerns of the soldering iron making direct contact with the component.

2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to

thermal shock. To prevent this problem, follow the conditions shown in Table 4.

2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown

in Figure 1.

Table 4

Distance

Hot Air Application angle

5mm or more

45° *Figure 1

Hot Air Temperature Nozzle Outlet 400°C max.

Less than 10 seconds

Application Time

(3216M / 1206 size or smaller)

Less than 30 seconds

(3216M , 3225M : Metric size code)

(3225M / 1210 size or larger)

[Figure 1]

One-hole Nozzle

an Angle of 45ꢀ

3. Optimum solder amount when re-working with a soldering iron

3-1. If the solder amount is excessive, the risk of cracking is higher

ꢀꢀꢀ during board bending or any other stressful condition.

Too little solder amount results in a lack of adhesive strength

on the termination, which may result in chips breaking

loose from the PCB.

SolderAmount

in section

Please confirm that solder has been applied smoothly is

and rising to the end surface of the chip.

3-2. A soldering iron with a tip of ø3mm or smaller should be used.

It is also necessary to keep the soldering iron from touching

the components during the re-work.

3-3. Solder wire with ø0.5mm or smaller is required for soldering.

JEMCGC-2701X

19

Caution

!

5.Washing

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips

or broken solder joints. Take note not to vibrate PCBs.

6.Electrical Test on Printed Circuit Board

1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a

capacitor after mounting on the printed circuit board.

1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.

The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder

joints. Provide support pins on the back side of the PCB to prevent warping or flexing.

Install support pins as close to the test-probe as possible.

1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.

[Not Recommended]

[Recommended]

Support Pin

Peeling

Test-probe

7.Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that

caused bending or twisting the board.

1-1. In cropping the board, the stress as shown may cause the capacitor to crack.

Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.

Avoid this type of stress to a capacitor.

[Bending]

[Twisting]

2. Check the cropping method for the printed circuit board in advance.

2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router

type separator, etc.) to prevent the mechanical stress that can occur to the board.

Board Separation Apparatus

Hand Separation

Nipper Separation

Board Separation Method

(1) Board Separation Jig

2) Disc Separator

Medium

3) Router Type Separator

Level of stress on board

Recommended

High

×

Medium

Low

◯

△*

· Board handling

· Layout of slits

· Board bending direction · Design of V groove

Hand and nipper

separation apply a high

level of stress.

· Board handling

Notes

Board handling

· Layout of capacitors

· Arrangement of blades

· Controlling blade life

Use another method.

* When a board separation jig or disc separator is used, if the following precautions are not observed,

a large board deflection stress will occur and the capacitors may crack.

Use router type separator if at all possible.

JEMCGC-2701X

20

Caution

!

(1) Example of a suitable jig

[In the case of Single-side Mounting]

An outline of the board separation jig is shown as follows.

Recommended example: Stress on the component mounting position can be minimized by holding the

portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.

Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress

being applied to the component mounting position, if the portion away from the jig is held and bent in the

direction opposite the side where the capacitors are mounted.

[Outline of jig]

[Hand Separation]

Recommended

Not recommended

Direction of

load

Direction of load

Load point

Printed Circuit Board

Printed circuit

board

V-groove

Component

Components

Printed circuit

board

Load point

Board Cropping Jig

[In the case of Double-sided Mounting]

Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the

above method. Therefore, implement the following measures to prevent stress from being applied to the components.

ꢀ (Measures)

(1) Consider introducing a router type separator.

ꢀ

ꢀIf it is difficult to introduce a router type separator, implement the following measures.

(Refer to item 1. Mounting Position)

(2) Mount the components parallel to the board separation surface.

(3) When mounting components near the board separation point, add slits in the separation position

near the component.

(4) Keep the mounting position of the components away from the board separation point.

(2) Example of a Disc Separator

An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top

blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.

In the following case, board deflection stress will be applied and cause cracks in the capacitors.

(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,

left-right or front-rear directions

(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned

top-bottom

IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the

V groove with consideration about strength of material of the printed circuit board.

[ Outline of Machine ]

Top Blade

[ Principle of Operation ]

Top Blade

[ Cross-section Diagram ]

Printed Circuit Board

V-groove

Bottom Blade

Printed Circuit Board

[Disc Separator]

Recommended

Top Blade

V-groove

Not recommended

Top-bottom Misalignment Left-right Misalignment

Front-rear Misalignment

Top Blade

Bottom Blade

[V-groove Design]

Example of

Not Recommended

Low-Angle

Recommended

Left-right Misalignment

Depth too Shallow

Depth too Deep

JEMCGC-2701X

21

Caution

!

(3) Example of Router Type Separator

[ Outline Drawing ]

Router

The router type separator performs cutting by a router

rotating at a high speed. Since the board does not

bend in the cutting process, stress on the board can

be suppressed during board separation.

When attaching or removing boards to/from the router type

separator, carefully handle the boards to prevent bending.

8. Assembly

1. Handling

If a board mounted with capacitors is held with one hand, the board may bend.

Firmly hold the edges of the board with both hands when handling.

If a board mounted with capacitors is dropped, cracks may occur in the capacitors.

Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.

2. Attachment of Other Components

2-1. Mounting of Other Components

Pay attention to the following items, when mounting other components on the back side of the board after

capacitors have been mounted on the opposite side.

When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied

to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.

· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.

· Periodically check and adjust the bottom dead point.

Suction Nozzle

2-2. Inserting Components with Leads into Boards

When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the

capacitors or cracks in the solder. Pay attention to the following.

· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.

· Fix the board with support pins or a dedicated jig before insertion.

· Support below the board so that the board does not bend. When using multiple support pins on the board,

periodically confirm that there is no difference in the height of each support pin.

Component with Leads

2-3. Attaching/Removing Sockets

When the board itself is a connector, the board may bend when a socket is attached or removed.

Plan the work so that the board does not bend when a socket is attached or removed.

Socket

2-4. Tightening Screws

The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or

chassis. Pay attention to the following items before performing the work.

· Plan the work to prevent the board from bending.

· Use a torque screwdriver, to prevent over-tightening of the screws.

· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied

to the chips by forcibly flattening the board when tightening the screws.

Screwdriver

JEMCGC-2701X

22

Caution

!

■ Others

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.

1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).

Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will operate is under the specified conditions.

Do not use the equipment under the following environments.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to ozone, ultraviolet rays, or radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)

(5) Any vibrations or mechanical shocks exceeding the specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.

2. Others

2-1. In an Emergency

(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.

If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.

(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused

by the capacitor's high temperature.

2-2. Disposal of waste

When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate

licenses.

2-3. Circuit Design

(1) Addition of Fail Safe Function

Capacitors that are cracked by dropping or bending of the board may cause deterioration of the

insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,

smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,

to prevent secondary accidents.

(2) This series are not safety standard certified products.

2-4. Remarks

Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.

The above notices are for standard applications and conditions. Contact us when the products are used in special

mounting conditions.

Select optimum conditions for operation as they determine the reliability of the product after assembly.

The data herein are given in typical values, not guaranteed ratings.

JEMCGC-2701X

23

Notice

■ Rating

1.Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1. Do not apply temperatures exceeding the maximum operating temperature.

It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.

It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable

factor.

1-2. Consider the self-heating factor of the capacitor

The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.

2.Atmosphere Surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion

of the terminations and the penetration of moisture into the capacitor.

1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject

to moisture condensation.

1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal

ꢀꢀelectrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents

for long periods of time.

3.Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates

at specific frequencies and noise may be generated.

Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.

JEMCGC-2701X

24

Notice

■Soldering and Mounting

1.PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted

directly on the substrate.

They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these stresses and cause chip cracking.

When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility

of excess solder fillet height.

1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress

on a chip is different depending on PCB material and structure.When the thermal expansion coefficient

greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to

the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit

board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.

Pattern Forms

Prohibited

Correct

Chassis

Solder Resist

Solder (ground)

Placing Close to Chassis

Electrode Pattern

Lead Wire

in section

Solder Resist

Placing of Chip

Components

and Leaded

Components

in section

Soldering Iron

Lead Wire

Placing of Leaded

Components

after Chip Component

Solder Resist

in section

Solder Resist

Lateral Mounting

JEMCGC-2701X

25

Notice

2. Land Dimensions

Chip Capacitor

2-1. Chip capacitors can be cracked due to the stress

of PCB bending , etc. if the land area is larger than

needed and has an excess amount of solder.

Please refer to the land dimensions in table 1

for flow soldering, table 2 for reflow soldering.

Land

Please confirm the suitable land dimension by

evaluating of the actual SET / PCB.

b

a

Solder Resist

Table 1 Flow Soldering Method

ChipꢀDimension

(L/W)ꢀCode

Series

GRM

Chip(L×W)

a

b

c

18

1.6×0.8

2.0×1.25

3.2×1.6

0.6 to 1.0

1.0 to 1.2

2.2 to 2.6

0.8 to 0.9

0.9 to 1.0

1.0 to 1.1

0.6 to 0.8

0.8 to 1.1

1.0 to 1.4

21

31

Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.

(in mm)

Table 2 Reflow Soldering Method

Chip(L×W)

(Dimensions

Tolerance)

ChipꢀDimension

(L/W)ꢀCode

Series

GRM

a

b

c

01

0.25×0.125

0.10 to 0.11

0.07 to 0.12

0.125 to 0.145

GRM

02

03

0.4×0.2

0.6×0.3

0.16 to 0.2

0.2 to 0.3

0.3 to 0.5

0.4 to 0.6

0.6 to 0.8

0.7 to 0.9

1.2

0.12 to 0.18

0.2 to 0.35

0.35 to 0.45

0.4 to 0.5

0.6 to 0.7

0.7 to 0.8

0.6

0.2 to 0.23

0.2 to 0.4

0.4 to 0.6

0.5 to 0.7

0.6 to 0.8

0.8 to 1.0

1.25

1.0×0.5

(within ±0.10)

1.0×0.5

（±0.15/±0.20）

1.6×0.8

(within ±0.10)

1.6×0.8

(±0.15/±0.20)

2.0×1.25

(within ±0.10)

2.0×1.25

(±0.15)

2.0×1.25

GRM

15

18

GRM

21

31

1.2

0.6 to 0.8

0.9 to 1.2

1.0 to 1.3

1.0 to 1.2

1.2 to 1.4

1.4 to 1.6

1.2 to 1.4

1.5 to 1.7

1.7 to 1.9

1.8 to 2.3

2.3 to 3.0

3.5 to 4.8

1.0 to 1.4

1.8 to 2.0

1.9 to 2.1

2.0 to 2.4

3.0 to 3.5

4.0 to 4.6

(±0.20)

3.2×1.6

(within±0.20)

3.2×1.6

(±0.30)

GRM

32

43

55

3.2×2.5

4.5×3.2

5.7×5.0

(in mm)

JEMCGC-2701X

26

Notice

3. Board Design

When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size

and material of the board.

Relationship with amount of strain to the board thickness, length, width, etc.]

3PL

2Ewh²

Relationshipbetweenloadandstrain

ε=

ε：Strain on center of board (μst)

L：Distance between supporting points (mm)

w ：Board width (mm)

P

Y

h ：Board thickness (mm)

E ：Elastic modulus of board (N/m²=Pa)

Y ：Deflection (mm)

P ：Load (N)

h

w

L

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,the amount of strain also increases.

→Reduce the distance between the supporting points.

· As the elastic modulus (E) decreases, the amount of strain increases.

→Increase the elastic modulus.

· As the board width (w) decreases, the amount of strain increases.

→Increase the width of the board.

· As the board thickness (h) decreases, the amount of strain increases.

→Increase the thickness of the board.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.

2.Adhesive Application

1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering.

The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain the correct bonding

strength. The chip's electrode thickness and land thickness must also be taken into consideration.

Chip Capacitor

a=20 to 70μm

b=30 to 35μm

c=50to105μm

a

b

c

Adhesive

Land

Board

2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of

5000Pa • s (500ps) min. (at 25℃)

3. Adhesive Coverage

Size (L×W) (in mm) Adhesive Coverage*

1.6 × 0.8

2.0 × 1.25

3.2 × 1.6

0.05mg min.

0.1mg min.

0.15mg min.

*Nominal Value

3.Adhesive Curing

1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes

deterioration in the insulation resistance between the terminations due to moisture absorption.

Control curing temperature and time in order to prevent insufficient hardening.

4.Flux (for Flow soldering)

1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability,

so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.)

2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is

sufficient cleaning. Use flux with a halide content of 0.1% max.

3. Do not use strong acidic flux.

4. Do not use water-soluble flux.*

(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)

JEMCGC-2701X

27

Notice

5.Flow Soldering

［As a Single Chip］

Set temperature and time to ensure that leaching of the

terminations does not exceed 25% of the chip end

area as a single chip (full length of the edge A-B-C-D

A

B

D

shown at right) and 25% of the length A-B shown as

mounted on substrate.

Termination

C

［As Mounted on Substrate］

B

A

6.Reflow soldering

The halogen system substance and organic acid are included in solder paste, and a chip corrodes

ꢀ by this kind of solder paste.

Do not use strong acid flux.

Do not use water-soluble flux.*

(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)

7.Washing

1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,

and select the solvent for cleaning.

2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of

electrical characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the performance

of the capacitors.

8.Coating

1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.

The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.

The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor

may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration

of insulation resistance or dielectric breakdown.

Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.

A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic.

Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance

of a capacitor. An epoxy resin can be used as a less hygroscopic resin.

3．The halogen system substance and organic acid are included in coating material, and a chip corrodes

ꢀꢀby the kind of Coating material. Do not use strong acid type.

JEMCGC-2701X

28

Notice

■ Others

1.Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.

(1) Climatic condition

ꢀ･ low air temperature : -40℃

･ change of temperature air/air : -25℃/+25℃

･ low air pressure : 30 kPa

･ change of air pressure : 6 kPa/min.

(2) Mechanical condition

Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed

on to the inner packaging.

1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.

(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur

in the ceramic body of the capacitor.

(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface

of the capacitor, the capacitor may crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.

A capacitor dropped accidentally during processing may be damaged.

2.Characteristics Evaluation in the Actual System

1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification

values in a finished product before using.

2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic

capacitors, the capacitance may change depending on the operating conditions in the actual system.

Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,

which will affect the capacitance value of the capacitor.

3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in

the actual system. Evaluate the surge resistance in the actual system as required.

JEMCGC-2701X

29

NOTE

!

1.Please make sure that your product has been evaluated in view of your specifications with our

product being mounted to your product.

2.Your are requested not to use our product deviating from this product specification.

3.We consider it not appropriate to include any terms and conditions with regard to the business

transaction in the product specifications, drawings or other technical documents. Therefore,

if your technical documents as above include such terms and conditions such as warranty clause,

product liability clause, or intellectual property infringement liability clause, they will be deemed to

be invalid.

JEMCGC-2701X

30

型号:	GRM319R60J106KE01D
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Obsolete
IHS 制造商：	MURATA MANUFACTURING CO LTD
零件包装代码：	1206
包装说明：	CHIP, ROHS COMPLIANT
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8532.24.00.20
风险等级：	7.85
电容：	10 µF
电容器类型：	CERAMIC CAPACITOR
介电材料：	CERAMIC
高度：	0.85 mm
JESD-609代码：	e3
长度：	3.2 mm
安装特点：	SURFACE MOUNT
多层：	Yes
负容差：	10%
端子数量：	2
最高工作温度：	85 °C
最低工作温度：	-55 °C
封装形状：	RECTANGULAR PACKAGE
封装形式：	SMT
包装方法：	TR, PAPER, 7 INCH
正容差：	10%
额定（直流）电压（URdc）：	6.3 V
尺寸代码：	1206
表面贴装：	YES
温度特性代码：	X5R
温度系数：	15% ppm/ °C
端子面层：	Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状：	WRAPAROUND
宽度：	1.6 mm

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