SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
COG AND TEMPERATURE COMPENSATING TYPES –
GRM36/39/40/42-6/42-2/43-2/44-1 Series
SPECIFICATION
GENERAL
ELECTRICAL
TEST
Temperature Coefficient
Temperature Range
–55° to +125°C
–55° to +125°C
–55° to +85°C
–55° to +85°C
–55° to +85°C
–55° to +85°C
–55° to +85°C
–55° to +85°C
Capacitance & Q
(Frequency & Voltage):
≤1000pF 1MHz 100Hz @ 1.0 .2 Vrms
C0G = 0
C0H = 0
P2H = N150
30 ppm*
60 ppm
60 ppm
>1000pF 1kHz 100Hz @ 1.0 .2 Vrms
≤30pF: 400 + (20xC (pF))
Q Limits
>30pF: 1000 minimum
R2H = N220 60 ppm
S2H = N330 60 ppm
T2H = N470 60 ppm
U2J = N750 120 ppm
SL = N1000 to P350
100,000 megohms or 1000 megohms – mfd
(whichever is less) with rated voltage applied
for 2 minutes max with 50mA limiting current
Insulation Resistance
(I.R.)
250% of rated voltage for 5 seconds with series
resistor limiting charging current to 50mA max.;
200% for 500V
Dielectric Strength
(Flash)
*TC Tolerance for COG
Refer to EIA-RS198E for other limitations
Aging
Negligible
MECHANICAL
TEST
TEST METHOD
POST TEST LIMITS
≤0603 1.0 lbs.
≥0805 2.2 lbs.
No evidence of termination peeling
Terminal
Adhesion
Glass Epoxy Board
10
Mounting
Capacitor
2n
Load
1mm deflection (Glass epoxy board)
No mechanical damage
R340
Deflection
Capacitance meter
Deflection
Cap., DF, IR meet initial limits
Unit: mm
45
45
Supporter
MIL-STD-202
Method 208F
Contact factory for
test limits
Solderability
ENVIRONMENTAL
TEST
TEST METHOD
POST TEST LIMITS
MIL-STD-202, Method 107, Condition A
Appearance: No visual damage
ꢀC: = 2.0% or 0.5pF (whichever is greater)
Q: >30pF = 1,000 min., ≤ 30pF = 400 + [20 x C(pF)]
I.R.: = 100,000Mꢁ min. or 1,000Mꢁ•ꢂF (whichever is less)
Thermal
Shock
(Air to Air)
Post thermal Shock measurement shall be taken after 24 hours
stabilization.
Appearance: No defects
Maintain the capacitor at 40 2°C and 90 to 95% humidity for
500 12 hours. Remove and let sit for 24 2 hours at room
temperature, then measure.
Capacitance: Within 5% or .0.5pF (whichever is greater)
Q/D.F.: 30pF and over: Q≥350; 10pf to 30pf: Q≥275+5/2C
Q/D.F.: 10pf and below: Q≥200 10C
Humidity,
Steady State
I.R.: 1,000Mꢁ or 50Mꢁ F (whichever is less)
C: Nominal Capacitance (pF)
Appearance: No defects
Apply the rated voltage at 40 2°C and 90 to 95% humidity for
Humidity Load 500 12 hours. Remove and let sit for 24 2 hours at room
Capacitance: Within 7.5% or .0.75pF (whichever is greater)
Q/D.F.: 30pF and over: Q≥200;
temperature, then measure. The charge/discharge current is
less than 50mA.
Q/D.F.: 30pf and below: Q≥100 10/3C
I.R.: 500Mꢁ or 25Mꢁ F (whichever is less)
C: Nominal Capacitance (pF)
.
Apply 200% of rated voltage for 1000 12 hours at
maximum operating temperature; 150% for 500V.
Life Test
Appearance: No defects
Capacitance: 3% or .3pF (whichever is greater)
Q: >30pF = 500 min., ≤30pF = 200 + [10 x C(pF)]
I.R.: 1,000Mꢁ or 50Mꢁ F (whichever is less)
Flash: 250% rated voltage
Upon completion of above test wait 24 hours prior
to performing post testing.
STORAGE LIFE
Chip component terminations should
1. All chip components, including
tape and reel, should be kept in
3. The solderability of the chip
components should be rechecked
in the event that they are not used
in six months.
generally be protected from moisture.
In addition, they should also be
protected from materials containing
chlorine, sulfur compounds or any
harmful gases that could cause
degradation of the solder.
an area where the temperature
is between 5°C and 40°C and
where the humidity is 20% to 70%.
4. Peel strength and shelf life of tape
are guaranteed for 1 year when
stored under afore said conditions.
2. The chip components should be
used within six months.
8
CG01-J
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