HCNW138现货热卖使用介绍供应商报价哪里找芯片批发报价-中国IC网-芯三七

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产品型号HCNW138的概述

HCNW138芯片概述 HCNW138是一个高度集成的光耦合器芯片，主要用于隔离信号传输以及保护电路的安全性。它能够在不直接连接的条件下实现信号的传递，广泛应用于数据通信、电力电子及工业自动化等多个领域。该芯片内部集成了发光二极管和光电晶体管，可以有效地进行电气隔离，使得输入信号和输出信号之间不会有直接的电气联系，这在高电压和大电流的环境下尤为重要。光耦合器的关键优点在于其能够抑制共模干扰、实现信号的安全传递并提高系统抗干扰能力。HCNW138以其高性能、优质的隔离效果和可扩展性，成为了众多电子产品中的首选方案。 HCNW138的详细参数 HCNW138的规格参数是理解它应用能力的关键。以下是HCNW138的一些主要技术参数： 1. 工作电压：宽工作电压范围，可在+4.5V至+20V之间操作，适应多种电源环境。 2. 输入电流：输入光电流范围通常在1mA到20mA之间，这使得HCNW...

产品型号HCNW138的Datasheet PDF文件预览

Low Input Current, High Gain

Optocouplers

Technical Data

6N139

HCPL-0701

HCNW139

6N138

HCPL-0700

HCNW138

Features

• High Current Transfer Ratio

– 2000% Typical (4500%

Typical for HCNW139/138)

• Low Input Current

Requirements – 0.5 mA

• TTL Compatible Output –

0.1 V V_OLTypical

• Performance Guaranteed

over Temperature 0°C

to 70°C

• Base Access Allows Gain

Bandwidth Adjustment

Applications

Description

• Ground Isolate Most Logic

Families – TTL/TTL, CMOS/

TTL, CMOS/CMOS, LSTTL/

TTL, CMOS/LSTTL

• Low Input Current Line

Receiver

• High Voltage Insulation

(HCNW139/138)

• EIA RS-232C Line Receiver

• Telephone Ring Detector

• 117 V ac Line Voltage Status

Indicator – Low Input Power

Dissipation

• Low Power Systems –

Ground Isolation

These high gain series couplers

use a Light Emitting Diode and an

integrated high gain photodetec-

tor to provide extremely high

current transfer ratio between

input and output. Separate pins

for the photodiode and output

stage result in TTL compatible

saturation voltages and high

speed operation. Where desired

the V_CCand V_Oterminals may be

tied together to achieve conven-

tional photodarlington operation.

A base access terminal allows a

gain bandwidth adjustment to be

made.

• High Output Current –

60 mA

• Safety Approval

UL Recognized – 2500 V rms

for 1 Minute and 5000 V rms*

for 1 Minute per UL 1577

CSA Approved

Functional Diagram

VDE 0884 Approved with

ANODE

CATHODE

V_IORM= 1414 V peak for

HCNW139 and HCNW138

BSI Certified (HCNW139 and

HCNW138)

• Available in 8-Pin DIP or

SOIC-8 Footprint or

Widebody Package

TRUTH TABLE

LED

OFF

LOW

HIGH

GND

•MIL-STD-1772 Version

Available (HCPL-5700/1)

*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.

A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to

prevent damage and/or degradation which may be induced by ESD.

The 6N139, HCPL-0701, and

CNW139 are for use in CMOS,

LSTTL or other low power appli-

cations. A 400% minimum current

transfer ratio is guaranteed over

0 to 70°C operating range for only

0.5 mA of LED current.

(1 TTL Unit load ). A 300%

minimum CTR enables operation

with 1 TTL Load using a 2.2 kΩ

pull-up resistor.

The SOIC-8 does not require

“through holes” in a PCB. This

package occupies approximately

one-third the footprint area of the

standard dual-in-line package.

The lead profile is designed to be

compatible with standard surface

mount processes.

Selection for lower input current

down to 250 µA is available upon

request.

The 6N138, HCPL-0700, and

HCNW138 are designed for use

mainly in TTL applications.

Current Transfer Ratio (CTR) is

300% minimum over 0 to 70°C

for an LED current of 1.6 mA

The HCPL-0701 and HCPL-0700

are surface mount devices

packaged in an industry standard

SOIC-8 footprint.

The HCNW139 and HCNW138

are packaged in a widebody

encapsulation that provides creep-

age and clearance dimensions

suitable for safety approval by

regulatory agencies worldwide.

Selection Guide

Widebody

Package

8-Pin DIP

Hermetic

(300 Mil)

Small Outline SO-8

(400 mil)

Single and

Dual

Single

Dual

Minimum

Input ON

Current

(I_F)

Absolute

Maxi-

mum

Dual

Single

Channel

Package

Channel Channel

Package Package

Channel

Package

HCPL-

Single

Channel

Package

Channel

Packages

HCPL-

Minimum

CTR

HCPL-

2731^[1]

2730^[1]

4731^[1]

HCPL-

V_CC

6N139

6N138

0701

0731

0730

HCNW139

HCNW138

0.5 mA

1.6 mA

40 µA

400%

300%

800%

300%

18 V

7 V

0700

HCPL-4701^[1]

070A^[1]

073A^[1]

18 V

20 V

0.5 mA

5701^[1]

5700^[1]

5731^[1]

5730^[1]

Note:

1. Technical data are on separate HP publications.

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

6N139#XXX

020 = 5000 V rms/1 Minute UL Rating Option*

300 = Gull Wing Surface Mount Option†

500 = Tape and Reel Packaging Option

Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for

information.

*For 6N139 and 6N138 only.

†Gull wing surface mount option applies to through hole parts only.

Schematic

ANODE

–

CATHODE

GND

SHIELD

Package Outline Drawings

8-Pin DIP Package (6N139/6N138)**

7.62 ± 0.25

(0.300 ± 0.010)

9.65 ± 0.25

(0.380 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

TYPE NUMBER

OPTION CODE*

DATE CODE

HP XXXXZ

YYWW

U R

RECOGNITION

1.78 (0.070) MAX.

1.19 (0.047) MAX.

+ 0.076

- 0.051

0.254

5° TYP.

+ 0.003)

- 0.002)

(0.010

4.70 (0.185) MAX.

0.51 (0.020) MIN.

2.92 (0.115) MIN.

1.080 ± 0.320

0.65 (0.025) MAX.

(0.043 ± 0.013)

DIMENSIONS IN MILLIMETERS AND (INCHES).

2.54 ± 0.25

(0.100 ± 0.010)

*MARKING CODE LETTER FOR OPTION NUMBERS

"L" = OPTION 020

OPTION NUMBERS 300 AND 500 NOT MARKED.

**JEDEC Registered Data.

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)

PAD LOCATION (FOR REFERENCE ONLY)

9.65 ± 0.25

(0.380 ± 0.010)

1.016 (0.040)

1.194 (0.047)

4.826

(0.190)

TYP.

6.350 ± 0.25

(0.250 ± 0.010)

9.398 (0.370)

9.906 (0.390)

0.381 (0.015)

0.635 (0.025)

1.194 (0.047)

1.778 (0.070)

9.65 ± 0.25

(0.380 ± 0.010)

1.780

(0.070)

MAX.

1.19

(0.047)

MAX.

7.62 ± 0.25

(0.300 ± 0.010)

+ 0.076

- 0.051

0.254

4.19

+ 0.003)

- 0.002)

MAX.

(0.165)

(0.010

1.080 ± 0.320

(0.043 ± 0.013)

0.635 ± 0.25

(0.025 ± 0.010)

12° NOM.

0.635 ± 0.130

(0.025 ± 0.005)

2.54

(0.100)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

Small Outline SO-8 Package (HCPL-0701/HCPL-0700)

5.994 ± 0.203

(0.236 ± 0.008)

XXX

3.937 ± 0.127

(0.155 ± 0.005)

YWW

TYPE NUMBER

(LAST 3 DIGITS)

DATE CODE

PIN ONE

0.406 ± 0.076

(0.016 ± 0.003)

1.270

(0.050)

BSG

0.432

(0.017)

7°

5.080 ± 0.127

(0.200 ± 0.005)

45° X

3.175 ± 0.127

(0.125 ± 0.005)

0 ~ 7°

0.228 ± 0.025

(0.009 ± 0.001)

1.524

(0.060)

0.203 ± 0.102

(0.008 ± 0.004)

TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)

5.207 ± 0.254 (0.205 ± 0.010)

0.305

(0.012)

MIN.

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.

8-Pin Widebody DIP Package (HCNW139/HCNW138)

11.00

(0.433)

11.15 ± 0.15

(0.442 ± 0.006)

MAX.

9.00 ± 0.15

(0.354 ± 0.006)

TYPE NUMBER

DATE CODE

HCNWXXXX

YYWW

10.16 (0.400)

TYP.

1.55

(0.061)

MAX.

7° TYP.

+ 0.076

- 0.0051

0.254

+ 0.003)

- 0.002)

(0.010

5.10

(0.201)

MAX.

3.10 (0.122)

3.90 (0.154)

0.51 (0.021) MIN.

2.54 (0.100)

TYP.

1.78 ± 0.15

(0.070 ± 0.006)

0.40 (0.016)

0.56 (0.022)

DIMENSIONS IN MILLIMETERS (INCHES).

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)

11.15 ± 0.15

(0.442 ± 0.006)

PAD LOCATION (FOR REFERENCE ONLY)

6.15

TYP.

(0.242)

9.00 ± 0.15

(0.354 ± 0.006)

12.30 ± 0.30

(0.484 ± 0.012)

0.9

(0.035)

1.3

(0.051)

12.30 ± 0.30

(0.484 ± 0.012)

1.55

(0.061)

MAX.

11.00

MAX.

(0.433)

4.00

MAX.

(0.158)

1.78 ± 0.15

(0.070 ± 0.006)

1.00 ± 0.15

(0.039 ± 0.006)

0.75 ± 0.25

(0.030 ± 0.010)

+ 0.076

- 0.0051

2.54

(0.100)

BSC

0.254

+ 0.003)

- 0.002)

(0.010

DIMENSIONS IN MILLIMETERS (INCHES).

7° NOM.

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

Solder Reflow Temperature Profile (HCPL-07XX and Gull Wing Surface Mount

Option 300 Parts)

260

240

∆T = 145°C, 1°C/SEC

220

∆T = 115°C, 0.3°C/SEC

200

180

160

140

120

100

∆T = 100°C, 1.5°C/SEC

TIME – MINUTES

Note: Use of nonchlorine activated fluxes is highly recommended.

Regulatory Information

BSI

CSA

The 6N139/138, HCNW139/138,

and HCPL-0701/0700 have been

approved by the following

organizations:

Certification according to

BS415:1994,

(BS EN60065:1994);

BS EN60950:1992

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

(BS7002:1992) and

EN41003:1993 for Class II

applications (HCNW139/

HCNW138 only.)

VDE

Approved according to VDE 0884/

06.92 (HCNW139/138 only).

Recognized under UL 1577,

Component Recognition

Program, File E55361.

Insulation and Safety Related Specifications

8-Pin DIP

Widebody

(300 Mil) SO-8 (400 Mil)

Parameter

Symbol

Value

Units

Conditions

Minimum External

Air Gap (External

Clearance)

L(101)

7.1

4.9

9.6

Measured from input terminals

to output terminals, shortest

distance through air.

Minimum External

Tracking (External

Creepage)

Minimum Internal

Plastic Gap

L(102)

7.4

4.8

10.0

1.0

Measured from input terminals

to output terminals, shortest

distance path along body.

Through insulation distance,

conductor to conductor, usually

the direct distance between the

photoemitter and photodetector

inside the optocoupler cavity.

0.08

(Internal Clearance)

Minimum Internal

Tracking (Internal

Creepage)

Tracking Resistance

(Comparative

Tracking Index)

Isolation Group

200

IIIa

200

IIIa

4.0

200

IIIa

Measured from input terminals

to output terminals, along

internal cavity.

CTI

Volts DIN IEC 112/VDE 0303 Part 1

Material Group

(DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

VDE 0884 Insulation Related Characteristics (HCNW139 and HCNW138)

Description

Symbol Characteristic Units

Installation Classification per DIN VDE 0110/1.89, Table 1

for rated mains voltage ≤ 600 V rms

I-IV

I-III

for rated mains voltage ≤ 1000 V rms

Climatic Classification

55/100/21

Pollution Degree (DIN VDE 0110/1.89)

Maximum Working Insulation Voltage

IORM

1414

V peak

Input to Output Test Voltage, Method b*

V_PR= 1.875 x V_IORM, 100% Production Test with t_P= 1 sec,

Partial Discharge < 5 pC

V_PR

2652

2121

8000

Input to Output Test Voltage, Method a*

V_PR= 1.5 x V_IORM, Type and Sample Test,

t_P= 60 sec, Partial Discharge < 5 pC

V peak

Highest Allowable Overvoltage*

(Transient Overvoltage, t_ini= 10 sec)

IOTM

Safety Limiting Values

(Maximum values allowed in the event of a failure,

also see Figure 11, Thermal Derating curve.)

Case Temperature

Current (Input Current I_F, P_S= 0)

Output Power

T_S

I_S,INPUT

P_S,OUTPUT

175

400

700

°C

Insulation Resistance at T_S, V = 500 V

R_S

> 10⁹

Ω

*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884) for a

detailed description.

Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in

application.

Absolute Maximum Ratings* (No Derating Required up to 85°C)

Parameter

Storage Temperature

Operating Temperature**

Symbol

Min.

-55

-40

Max.

125

Units

°C

T_S

T_A

Average Forward Input Current

Peak Forward Input Current

I_F(AVG)

I_FPK

(50% Duty Cycle, 1 ms Pulse Width)

Peak Transient Input Current

(<1 µs Pulse Width, 300 pps)

Reverse Input Voltage

I_F(TRAN)

V_R

1.0

HCNW139/138

Input Power Dissipation

Output Current (Pin 6)

Emitter Base Reverse Voltage (Pin 5-7)

P_I

I_O

V_EB

0.5

Supply Voltage and Output Voltage

(6N139, HCPL-0701, HCNW139)

V_CC

-0.5

Supply Voltage and Output Voltage

(6N138, HCPL-0700, HCNW138)

Output Power Dissipation

P_O

P_T

100

135

Total Power Dissipation

Lead Solder Temperature (for Through Hole Devices)

HCNW139/138

260°C for 10 sec., 1.6 mm below seating plane

260°C for 10 sec., up to seating plane

See Package Outline Drawings section

Reflow Temperature Profile

(for SOIC-8 and Option #300)

*JEDEC Registered Data for 6N139 and 6N138.

**0°C to 70°C on JEDEC Registration.

Recommended Operating Conditions

Parameter

Power Supply Voltage

Symbol

V_CC

Min.

4.5

0.5

Max.

Units

Forward Input Current (ON)

Forward Input Voltage (OFF)

Operating Temperature

I_F(ON)

V_F(OFF)

T_A

12.0

0.8

°C

Electrical Specifications

0°C ≤ T ≤ 70°C, 4.5 V ≤ V_CC≤ 18 V, 0.5 mA ≤ I_F(ON)≤ 12 mA, 0 V ≤ V_F(OFF)≤ 0.8 V, unless otherwise

specified. All Typicals at T_A= 25°C. See Note 7.

Parameter

Current Transfer

Ratio

Sym.

CTR

Device

6N139

Min. Typ.** Max. Units

400* 2000 5000 %

Test Conditions

I_F= 0.5 mA

Fig. Note

V_CC= 4.5 2, 3 1, 2,

V_O= 0.4 V 4

HCPL-0701

HCNW139 400 4500

6N139

HCPL-0701

500* 1600 2600

I_F= 1.6 mA

HCNW139 500 3000

300 1600

I_F= 5.0 mA

I_F= 12 mA

I_F= 1.6 mA

200 850

6N138

HCPL-0700

HCNW138

6N139

300* 1600 2600

1500

0.1

Logic Low Output V_OL

Voltage

0.4

I_F= 0.5 mA,

I_O= 2 mA

V_CC= 4.5

HCPL-0701

HCNW139

I_F= 1.6 mA,

I_O= 8 mA

I_F= 5.0 mA,

I_O= 15 mA

I_F= 12 mA,

I_O= 24 mA

I_F= 1.6 mA,

I_O= 4.8 mA

0.2

0.1

6N138

HCPL-0700

HCNW138

6N139

Logic High

Output Current

I_OH

0.05 100 µA

V_O=V_CC= 18 V I_F= 0 mA

HCPL-0701

HCNW139

6N138

0.1 250

V_O= V = 7 V

HCPL-0700

HCNW138

Logic Low Supply I_CCL6N138/139

0.4

0.5

1.5

mA I_F= 1.6 mA, V_O= Open,

V_CC= 18 V

4, 8

Current

HCPL-0701/

0700

HCNW139

HCNW138

I_CCH6N138/139

HCPL-0701/

0700

Logic High

Supply Current

0.01 10

µA

I_F= 0 mA, V_O= Open,

V_CC= 18 V

HCNW139

1.25 1.40 1.7*

1.75

HCNW138

6N138

6N139

Input Forward

Voltage

V_F

T = 25°C I_F= 1.6 mA

HCPL-0701

HCPL-0700

HCNW139

HCNW138

1.0 1.45 1.85

T = 25°C

0.95

5.0*

3.0

1.95

Input Reverse

Breakdown

Voltage

BVR

I_R= 10 µA, T_A= 25°C

I_R= 100 µA, T_A= 25°C

HCNW139

HCNW138

Temperature

Coefficient of

Forward Voltage

Input

∆V_F

-1.8

mV/°C I_F= 1.6 mA

∆T

C_IN

pF f = 1 MHz, V_F= 0 V

Capacitance

HCNW139

HCNW138

*JEDEC Registered Data for 6N139 and 6N138.

**All typical values at T_A= 25°C and V_CC= 5 V, unless otherwise noted.

Switching Specifications (AC)

Over recommended operating conditions (T = 0 to 70°C), V_CC= 5 V, unless otherwise specified.

Parameter

Propagation Delay

Time to Logic Low at

Output

Sym.

t_PHL

Device

6N139

HCPL-0701

HCNW139

6N139

HCPL-0701

Min. Typ.** Max. Units Test Conditions Fig. Note

25*

µs

T_A= 25°C

5, 6, 2, 4

7, 9,

I_F= 0.5 mA,

Rl = 4.7 kΩ

T_A= 25°C

0.2

µs

I_F= 12 mA,

Rl = 270 Ω

HCNW139

6N138

1.1

10*

1.6

µs

T_A= 25°C

HCPL-0700

HCNW138

I_F= 1.6 mA,

Rl = 2.2 kΩ

HCNW138

Propagation Delay

Time to Logic High

at Output

t_PLH

6N139

60*

µs

T_A= 25°C

I_F= 0.5 mA,

Rl = 4.7 kΩ

5, 6, 2, 4

7, 9,

HCPL-0701

HCNW139

6N139

HCPL-0701

115

T_A= 25°C

I_F= 12 mA,

Rl = 270 Ω

HCNW139

6N138

HCPL-0700

HCNW138

1.1

35*

T_A= 25°C

I_F= 1.6 mA,

Rl = 2.2 kΩ

6N138

HCPL-0700

HCNW139

Common Mode

Transient Immunity

at Logic High Output

|CM_H|

|CM_L|

1000 10000

V/µs I_F= 0 mA,

T_A= 25°C

Rl = 2.2 kΩ

|V_CM| = 10 Vp-p

V/µs I_F= 1.6 mA,

T_A= 25°C

5, 6

Common Mode

Transient Immunity

at Logic Low Output

Rl = 2.2 kΩ

|V_CM| = 10 Vp-p

*JEDEC Registered Data for 6N139 and 6N138.

**All typical values at T_A= 25°C and V_CC= 5 V, unless otherwise noted.

Package Characteristics

Parameter

Sym. Min. Typ.** Max. Units

Test Conditions

Fig. Note

Input-Output Momentary

Withstand Voltage†

ISO

2500

V rms RH < 50%, t = 1 min.,

3, 8

T = 25°C

Option 020

HCNW139

HCNW138

5000

3, 9

Resistance (Input-Output)

R_I-O

C_I-O

10¹²

0.6

Ω

V_I-O= 500 Vdc

RH < 45%

f = 1 MHz

Capacitance (Input-Output)

**All typicals at T_A= 25°C, unless otherwise noted.

†The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output

continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable),

your equipment level safety specification or HP Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.”

Notes:

8. In accordance with UL 1577, each

optocoupler is proof tested by applying

an insulation test voltage 3000 V rms

for 1 second (leakage detection current

limit, I_I-O< 5 µA). This test is per-

formed before the 100% production test

shown in the VDE 0884 Insulation

Related Characteristics Table, if

able (positive) dV_CM/dt of the common

mode pulse, V_CM, to assure that the

output will remain in a Logic High state

(i.e., V_O> 2.0 V). Common mode

transient immunity in a Logic Low level

is the maximum tolerable (negative)

dV_CM/dt of the common mode pulse,

V_CM, to assure that the output will

remain in a Logic Low state (i.e.,

V_O< 0.8 V).

6. In applications where dV/dt may exceed

50,000 V/µs (such as static discharge) a

series resistor, R_CC, should be included

to protect the detector IC from

destructively high surge currents. The

recommended value is R_CC= 220 Ω.

7. Use of a 0.1 µF bypass capacitor

connected between pins 8 and 5

1. DC CURRENT TRANSFER RATI0

(CTR) is defined as the ratio of output

collector current, I_O, to the forward

LED input current, I_F, times 100%.

2. Pin 7 Open.

3. Device considered a two-terminal

device. Pins 1, 2, 3, and 4 shorted

together and Pins 5, 6, 7, and 8 shorted

together.

4. Use of a resistor between pin 5 and 7

will decrease gain and delay time.

Significant reduction in overall gain can

occur when using resistor values below

47 kΩ. For more information, please

contact your local HP Components

representative.

applicable.

9. In accordance with UL 1577, each

optocoupler is proof tested by applying

an insulation test voltage > 6000 V rms

for 1 second (leakage detection current

limit, I_I-O< 5 µA). This test is per-

formed before the 100% production test

for partial discharge (method b) shown

in the VDE 0884 Insulation Related

Characteristics Table, if applicable.

5. Common mode transient immunity in a

Logic High level is the maximum toler-

adjacent to the device is recommended.

5.0 mA

4.5 mA

4.0 mA

85°C

2000

1600

1200

800

100

70°C

25°C

70°C

-40°C

= 85° C

1.0

= 70° C

= 25° C

= 0° C

0.5 mA

= 5 V

= 0.4 V

0.1

400

= 5 V

= 25° C

= -40° C

0.01

1.0

– OUTPUT VOLTAGE – V

2.0

0.1

1.0

0.1

– INPUT DIODE FORWARD CURRENT – mA

– FORWARD CURRENT – mA

Figure 1. 6N138/6N139 DC Transfer

Characteristics.

Figure 2. Current Transfer Ratio vs.

Forward Current 6N138/6N139.

Figure 3. 6N138/6N139 Output

Current vs. Input Diode Forward

Current.

1000

= 0.5 mA

= 1.6 mA

= 2.2 kΩ

R = 4.7 kΩ

1/f = 50 µs

–

100

1/f = 50 µs

PLH

= 85°C

1.0

= 70°C

0.1

= 25°C

= 0°C

PHL

0.01

0.001

PHL

= -40°C

1.1

1.2

1.3

1.4

1.5

1.6

-60

-40

-20

20 40

60 80 100

-60 -40 -20

20 40 60 80 100

– FORWARD VOLTAGE – V

– TEMPERATURE – °C

Figure 4. Input Diode Forward

Current vs. Forward Voltage.

Figure 5. Propagation Delay vs.

Temperature.

Figure 6. Propagation Delay vs.

Temperature.

1.6

= 12 mA

100

= 1.6 mA

= 270 kΩ

= 25° C

1/f = 50 µs

PLH

1.5

1.4

1.3

1.2

– ADJUSTED FOR V

= 2 V

PHL

0.1

1.0

-60

-40

-20

20 40

60 80 100

-60 -40 -20

20 40 60 80 100

– LOAD RESISTANCE – kΩ

– TEMPERATURE – °C

Figure 7. Propagation Delay vs.

Temperature.

Figure 8. Forward Voltage vs.

Temperature.

Figure 9. Nonsaturated Rise and Fall

Times vs. Load Resistance.

WIDEBODY

(mW)

1000

0.8

0.7

0.6

0.5

0.4

0.3

0.2

900

800

700

600

500

400

300

200

(mA)

= 18 V

= 5 V

0.1

100

50 75 100 125 150 175

10 12 14 16

– CASE TEMPERATURE – °C

– FORWARD CURRENT

Figure 10. Logic Low Supply Current

vs. Forward Current.

Figure 11. Thermal Derating Curve,

Dependence of Safety Limiting Value

with Case Temperature per VDE 0884.

PULSE

GEN.

+5 V

= 50 Ω

= 5 ns

5 V

10% DUTY CYCLE

I/f < 100 µs

(SATURATED

RESPONSE)

1.5 V

0.1 µF

MONITOR

PHL

PLH

= 15 pF*

5 V

* INCLUDES PROBE AND

FIXTURE CAPACITANCE

90%

10%

90%

10%

(NON-SATURATED

RESPONSE)

Figure 12. Switching Test Circuit.

(SEE NOTE 6)

t , t = 16 ns

+5 V

10 V

0 V

90% 90%

10%

5 V

SWITCH AT A: I = 0 mA

–

SWITCH AT B: I = 1.6 mA

PULSE GEN.

Figure 13. Test Circuit for Transient Immunity and Typical Waveforms.

www.hp.com/go/isolator

For technical assistance or the location of

your nearest Hewlett-Packard sales office,

distributor or representative call:

Americas/Canada: 1-800-235-0312 or

408-654-8675

Far East/Australasia: Call your local HP

sales office.

Japan: (81 3) 3335-8152

Europe: Call your local HP sales office.

Data subject to change.

Obsoletes 5965-3599E

Printed in U.S.A.

5968-1085E (7/98)

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HCNW138产品参数

型号:	HCNW138
是否Rohs认证：	不符合
生命周期：	Transferred
IHS 制造商：	HEWLETT PACKARD CO
包装说明：	400 MIL, WIDE BODY PKG
Reach Compliance Code：	unknown
HTS代码：	8541.40.80.00
风险等级：	5.47
Is Samacsys：	N
其他特性：	TTL COMPATIBLE, UL RECOGNIZED, VDE APPROVED
配置：	SINGLE
标称数据速率：	0.1 MBps
最大正向电流：	0.02 A
最大绝缘电压：	5000 V
JESD-609代码：	e0
元件数量：	1
最大通态电流：	0.06 A
最高工作温度：	70 °C
最低工作温度：
光电设备类型：	LOGIC IC OUTPUT OPTOCOUPLER
最小供电电压：	4.5 V
端子面层：	Tin/Lead (Sn/Pb)
Base Number Matches：	1

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