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  • HD3SS212ZXHR图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • HD3SS212ZXHR 现货库存
  • 数量12500 
  • 厂家
  • 封装NFBGA-48 
  • 批号2023+ 
  • 绝对原装正品全新深圳进口现货,优质渠道供应商!
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  • 深圳市嘉胜威科技有限公司

     该会员已使用本站7年以上
  • HD3SS212ZQER 现货库存
  • 数量28801 
  • 厂家TI 
  • 封装BGA48 
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  • HD3SS212ZQER图
  • 深圳市正纳电子有限公司

     该会员已使用本站2年以上
  • HD3SS212ZQER 现货库存
  • 数量10000 
  • 厂家TI/德州仪器 
  • 封装JRBGA-48 
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  • 只做原装 欢迎询价???
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  • HD3SS212ZXHR图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • HD3SS212ZXHR 现货库存
  • 数量2500 
  • 厂家TI 
  • 封装NFBGA (ZXH) 
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  • HD3SS212ZQET图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • HD3SS212ZQET
  • 数量98500 
  • 厂家TI 
  • 封装QFN 
  • 批号23+ 
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  • HD3SS212ZXHR图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • HD3SS212ZXHR
  • 数量85000 
  • 厂家
  • 封装NFBGA-48 
  • 批号23+ 
  • 真实库存全新原装正品!代理此型号
  • QQ:2881495753QQ:2881495753 复制
  • 0755-23605827 QQ:2881495753
  • HD3SS212ZQER图
  • 深圳市龙腾新业科技有限公司

     该会员已使用本站17年以上
  • HD3SS212ZQER
  • 数量10000 
  • 厂家TI/德州仪器 
  • 封装48-BGA Microstar Jun 
  • 批号23+ 
  • 进口原装现货
  • QQ:562765057QQ:562765057 复制
    QQ:370820820QQ:370820820 复制
  • 0755-84509636 QQ:562765057QQ:370820820
  • HD3SS212ZQER图
  • 昂富(深圳)电子科技有限公司

     该会员已使用本站4年以上
  • HD3SS212ZQER
  • 数量72282 
  • 厂家TI/德州仪器 
  • 封装N/A 
  • 批号23+ 
  • 一站式BOM配单,短缺料找现货,怕受骗,就找昂富电子.
  • QQ:GTY82dX7
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  • HD3SS212ZQER图
  • 深圳市和诚半导体有限公司

     该会员已使用本站11年以上
  • HD3SS212ZQER
  • 数量5600 
  • 厂家TI 
  • 封装BGA 
  • 批号23+ 
  • 100%深圳原装现货库存
  • QQ:2276916927QQ:2276916927 复制
    QQ:1977615742QQ:1977615742 复制
  • 18929336553 QQ:2276916927QQ:1977615742
  • HD3SS212ZQER图
  • 深圳市高捷芯城科技有限公司

     该会员已使用本站11年以上
  • HD3SS212ZQER
  • 数量9555 
  • 厂家TI(德州仪器) 
  • 封装BGA-48(5x5) 
  • 批号23+ 
  • 支持大陆交货,美金交易。原装现货库存。
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    QQ:3007947087QQ:3007947087 复制
  • 0755-83062789 QQ:3007977934QQ:3007947087
  • HD3SS212ZQER图
  • 北京耐芯威科技有限公司

     该会员已使用本站13年以上
  • HD3SS212ZQER
  • 数量5000 
  • 厂家Texas Instruments 
  • 封装48-BGA Microstar Junior(5x5) 
  • 批号21+ 
  • 全新原装、现货库存,欢迎询价
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  • 86-010-010-62104931 QQ:2880824479QQ:1344056792
  • HD3SS212ZQER图
  • 北京耐芯威科技有限公司

     该会员已使用本站12年以上
  • HD3SS212ZQER
  • 数量5000 
  • 厂家Texas Instruments 
  • 封装48-BGA Microstar Junior(5x5) 
  • 批号21+ 
  • 全新原装、现货库存,欢迎询价
  • QQ:2880824479QQ:2880824479 复制
    QQ:1344056792QQ:1344056792 复制
  • 96-010-62104931 QQ:2880824479QQ:1344056792
  • HD3SS212ZQET图
  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
  • HD3SS212ZQET
  • 数量5216 
  • 厂家TI 
  • 封装QFN 
  • 批号24+ 
  • 全新原装现货,欢迎询购!
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  • 深圳市西源信息科技有限公司

     该会员已使用本站9年以上
  • HD3SS212ZQER
  • 数量8800 
  • 厂家TI 
  • 封装BGA 
  • 批号最新批号 
  • 原装现货零成本有接受价格就出
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  • 0755-84876394 QQ:3533288158QQ:408391813
  • HD3SS212ZQER图
  • 深圳市集创讯科技有限公司

     该会员已使用本站5年以上
  • HD3SS212ZQER
  • 数量12500 
  • 厂家TI/德州仪器 
  • 封装JRBGA-48 
  • 批号24+ 
  • 原装进口正品现货,假一罚十价格优势
  • QQ:2885393494QQ:2885393494 复制
    QQ:2885393495QQ:2885393495 复制
  • 0755-83244680 QQ:2885393494QQ:2885393495
  • HD3SS212ZQER图
  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • HD3SS212ZQER
  • 数量5000 
  • 厂家Texas Instruments 
  • 封装48-BGA Microstar Junior(5x5) 
  • 批号21+ 
  • 全新原装、现货库存,欢迎询价
  • QQ:2880824479QQ:2880824479 复制
    QQ:1344056792QQ:1344056792 复制
  • 010-62104931 QQ:2880824479QQ:1344056792
  • HD3SS212ZQER图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • HD3SS212ZQER
  • 数量12500 
  • 厂家TI/德州仪器 
  • 封装JRBGA-48 
  • 批号2023+ 
  • 绝对原装正品全新深圳进口现货,优质渠道供应商!
  • QQ:1002316308QQ:1002316308 复制
    QQ:515102657QQ:515102657 复制
  • 美驻深办0755-83777708“进口原装正品专供” QQ:1002316308QQ:515102657
  • HD3SS212ZQER图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • HD3SS212ZQER
  • 数量25736 
  • 厂家TI 
  • 封装QFN 
  • 批号2023+ 
  • 绝对原装正品现货/优势渠道商、原盘原包原盒
  • QQ:364510898QQ:364510898 复制
    QQ:515102657QQ:515102657 复制
  • 0755-83777708“进口原装正品专供” QQ:364510898QQ:515102657
  • HD3SS212ZQET图
  • 深圳市硅诺电子科技有限公司

     该会员已使用本站8年以上
  • HD3SS212ZQET
  • 数量48035 
  • 厂家TI 
  • 封装QFN 
  • 批号17+ 
  • 原厂指定分销商,有意请来电或QQ洽谈
  • QQ:1091796029QQ:1091796029 复制
    QQ:916896414QQ:916896414 复制
  • 0755-82772151 QQ:1091796029QQ:916896414
  • HD3SS212ZQER图
  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • HD3SS212ZQER
  • 数量5000 
  • 厂家Texas Instruments 
  • 封装48-BGA Microstar Junior(5x5) 
  • 批号21+ 
  • 全新原装、现货库存,欢迎询价
  • QQ:2880824479QQ:2880824479 复制
    QQ:1344056792QQ:1344056792 复制
  • 010-62104931 QQ:2880824479QQ:1344056792
  • HD3SS212ZQER图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • HD3SS212ZQER
  • 数量6328 
  • 厂家TI-德州仪器 
  • 封装BGA-48 
  • 批号▉▉:2年内 
  • ▉▉¥22.7元一有问必回一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • HD3SS212图
  • 上海乙幸科技有限公司

  • HD3SS212
  • 数量500000 
  • 厂家TI/德州仪器 
  • 封装原厂封装 
  • 批号23+ 
  • 全新原装正品1假一罚十!
  • QQ:413109498QQ:413109498 复制
  • 0182-17792345 QQ:413109498
  • HD3SS212ZXHR图
  • 深圳市英德州科技有限公司

     该会员已使用本站2年以上
  • HD3SS212ZXHR
  • 数量32500 
  • 厂家TI(德州仪器) 
  • 封装BGA-MicroStarJr.-50(5x5) 
  • 批号1年内 
  • 原厂渠道 长期供应
  • QQ:2355734291QQ:2355734291 复制
  • -0755-88604592 QQ:2355734291
  • HD3SS212ZQER图
  • 深圳市毅创腾电子科技有限公司

     该会员已使用本站16年以上
  • HD3SS212ZQER
  • 数量2390 
  • 厂家TI 
  • 封装BGA 
  • 批号22+ 
  • ★只做原装★正品现货★原盒原标★
  • QQ:2355507162QQ:2355507162 复制
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  • 86-755-83616256 QQ:2355507162QQ:2355507165
  • HD3SS212图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • HD3SS212
  • 数量25170 
  • 厂家TI/德州仪器 
  • 封装接口 
  • 批号23+ 
  • 全新原装正品现货热卖
  • QQ:2885348339QQ:2885348339 复制
    QQ:2885348317QQ:2885348317 复制
  • 0755-82519391 QQ:2885348339QQ:2885348317
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  • 深圳市和谐世家电子有限公司

     该会员已使用本站13年以上
  • HD3SS212ZQER
  • 数量1781 
  • 厂家Texas Instruments 
  • 封装48-BGA Microstar Junior(5x5) 
  • 批号最新批号 
  • 绝对进口原装
  • QQ:1158840606QQ:1158840606 复制
  • 0755+84501032 QQ:1158840606
  • HD3SS212ZQER图
  • 深圳市宏世佳电子科技有限公司

     该会员已使用本站13年以上
  • HD3SS212ZQER
  • 数量3505 
  • 厂家TI 
  • 封装48-VFBGA 
  • 批号2023+ 
  • 全新原厂原装产品、公司现货销售
  • QQ:2881894393QQ:2881894393 复制
    QQ:2881894392QQ:2881894392 复制
  • 0755- QQ:2881894393QQ:2881894392
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  • 深圳市一线半导体有限公司

     该会员已使用本站11年以上
  • HD3SS212ZQER
  • 数量10529 
  • 厂家Texas Instruments 
  • 封装 
  • 批号 
  • 全新原装部分现货其他订货
  • QQ:2881493920QQ:2881493920 复制
    QQ:2881493921QQ:2881493921 复制
  • 0755-88608801多线 QQ:2881493920QQ:2881493921
  • HD3SS212ZQET图
  • 深圳市一线半导体有限公司

     该会员已使用本站15年以上
  • HD3SS212ZQET
  • 数量10175 
  • 厂家Texas Instruments 
  • 封装 
  • 批号 
  • 全新原装部分现货其他订货
  • QQ:2881493920QQ:2881493920 复制
    QQ:2881493921QQ:2881493921 复制
  • 0755-88608801多线 QQ:2881493920QQ:2881493921
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  • 深圳市芯柏然科技有限公司

     该会员已使用本站7年以上
  • HD3SS212ZQER
  • 数量23480 
  • 厂家TI 
  • 封装BGA 
  • 批号21+ 
  • 新到现货、一手货源、当天发货、价格低于市场
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  • 0755-82533534 QQ:287673858
  • HD3SS212ZXHR图
  • 深圳市鹏和科技有限公司

     该会员已使用本站16年以上
  • HD3SS212ZXHR
  • 数量24107 
  • 厂家TI 
  • 封装NFBGA 
  • 批号23+ 
  • 原装正品 代理渠道
  • QQ:604309946QQ:604309946 复制
    QQ:1261585635QQ:1261585635 复制
  • 755-83990319 QQ:604309946QQ:1261585635
  • HD3SS212ZXHR图
  • 深圳市珩瑞科技有限公司

     该会员已使用本站2年以上
  • HD3SS212ZXHR
  • 数量
  • 厂家21+ 
  • 封装12000 
  • 批号 
  • ███全新原装正品,可配单
  • QQ:2938238007QQ:2938238007 复制
    QQ:1840507767QQ:1840507767 复制
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  • 万三科技(深圳)有限公司

     该会员已使用本站2年以上
  • HD3SS212ZXHR
  • 数量660000 
  • 厂家TI(德州仪器) 
  • 封装NFBGA-50 
  • 批号23+ 
  • 支持实单/只做原装
  • QQ:3008961398QQ:3008961398 复制
  • 0755-21006672 QQ:3008961398
  • HD3SS212ZQER图
  • 深圳市正纳电子有限公司

     该会员已使用本站2年以上
  • HD3SS212ZQER
  • 数量10000 
  • 厂家TI/德州仪器 
  • 封装JRBGA-48 
  • 批号22+ 
  • 只做原装 欢迎询价???
  • QQ:2881664480QQ:2881664480 复制
  • 0755-82524192 QQ:2881664480
  • HD3SS212ZQER图
  • 万三科技(深圳)有限公司

     该会员已使用本站2年以上
  • HD3SS212ZQER
  • 数量6500000 
  • 厂家Texas Instruments 
  • 封装原厂原装 
  • 批号22+ 
  • 万三科技 秉承原装 实单可议
  • QQ:3008961396QQ:3008961396 复制
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  • 深圳市特拉特科技有限公司

     该会员已使用本站2年以上
  • HD3SS212ZQER
  • 数量9000 
  • 厂家TI 
  • 封装QFN 
  • 批号22+ 
  • 百分百原装正品 真实公司现货库存 本公司只做原装
  • QQ:709809857QQ:709809857 复制
  • 0755-82531732 QQ:709809857
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  • 深圳市宇川湘科技有限公司

     该会员已使用本站6年以上
  • HD3SS212ZQER
  • 数量23000 
  • 厂家TI 
  • 封装48-BGA 
  • 批号23+ 
  • 原装正品现货,郑重承诺只做原装!
  • QQ:2885348305QQ:2885348305 复制
    QQ:2885348305QQ:2885348305 复制
  • 0755-84534256 QQ:2885348305QQ:2885348305
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  • 深圳市华兴微电子有限公司

     该会员已使用本站16年以上
  • HD3SS212ZQER
  • 数量5000 
  • 厂家TI 
  • 封装N/A 
  • 批号23+ 
  • 只做进口原装QQ询价,专营射频微波十五年。
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  • HD3SS212ZXHR图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • HD3SS212ZXHR
  • 数量2500 
  • 厂家TI 
  • 封装NFBGA (ZXH) 
  • 批号新批次 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:2881512844QQ:2881512844 复制
  • 075584507705 QQ:2881512844
  • HD3SS212ZQER图
  • 深圳市财富鑫电子科技有限公司

     该会员已使用本站4年以上
  • HD3SS212ZQER
  • 数量3800 
  • 厂家Texas Instruments 
  • 封装48-BGA Microstar Junior(5x5) 
  • 批号22+ 
  • 原装现货 ,可看货支持实单
  • QQ:2168183613QQ:2168183613 复制
  • 13714626620 QQ:2168183613
  • HD3SS212ZQER图
  • 深圳市欧瑞芯科技有限公司

     该会员已使用本站11年以上
  • HD3SS212ZQER
  • 数量5800 
  • 厂家TI(德州仪器) 
  • 封装48-VFBGA 
  • 批号23+/24+ 
  • 绝对原装正品,可开13%专票,欢迎采购!!!
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  • 深圳市创思克科技有限公司

     该会员已使用本站2年以上
  • HD3SS212ZXHR
  • 数量5623 
  • 厂家TI 
  • 封装NFBGA (ZXH)48 
  • 批号21+ 
  • 全新原装原厂实力挺实单欢迎来撩
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产品型号HD3SS212的Datasheet PDF文件预览

HD3SS212  
www.ti.com  
SLAS822 A DECEMBER 2011REVISED MARCH 2012  
5.4Gbps DisplayPort 1.2 2-to-1 Differential Switch  
Check for Samples: HD3SS212  
1
FEATURES  
APPLICATIONS  
Compatible with DisplayPort 1.2 Electrical  
Standard  
Motherboard Applications Needing DP and PCI  
Express  
2:1 Switching Supporting Data Rates up to  
5.4Gbps  
Desktop PCs  
Notebook PCs  
Docking  
Supports HPD Switching  
Wide -3dB Differential BW of over 5.4 GHz  
Excellent Dynamic Characteristics (at 2.7GHz)  
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
Crosstalk = –50dB  
Isolation = –22dB  
Insertion Loss = –1.4dB  
Return Loss = –11 dB  
Max Bit-Bit Skew = 4 ps  
Top View  
VDD Operating Range 3.3 V ±10%  
48-Ball ZQE  
u*BGA  
Package  
Small 5 mm x 5 mm x 1 mm, 48-Ball u*BGA  
Package  
5 mm x 5 mm  
Output Enable (OE) Pin Disables Switch to  
Save Power  
G
H
J
Power Consumption  
HD3SS212 <10mW (Standby <30µW when  
OE = L)  
GND  
VDD  
Signal Pin  
Figure 1. HD3SS212 Ball Map  
DESCRIPTION  
The HD3SS212 is a high-speed passive switch capable of switching two full DisplayPort 4 lane ports from one of  
two sources to one target location in an application. For DisplayPort Applications that HD3SS212 also supports  
switching of the Auxiliary (AUX) and Hot Plug Detect (HPD) signals. HPD path is a buffer which requires a 125k  
pull-down resistor on the HPDC line.  
A typical application would be a mother board that includes two GPUs that need to drive one DisplayPort sink.  
The GPU is selected by the Dx_SEL pin. The HD3SS212 is offered in a 48-ball BGA package and specified to  
operate from a single supply voltage of 3.3V over full industrial temperature range of –40°C to 105°C.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2011–2012, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
 
HD3SS212  
SLAS822 A DECEMBER 2011REVISED MARCH 2012  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION  
PART NUMBER  
HD3SS212ZQER  
HD3SS212ZQET  
PART MARKING  
PACKAGE  
HD3SS212  
48-Ball u*BGA (ZQE)  
VDD  
4
4
DAz (p)  
DAz (n)  
SEL = 0  
4
4
(p)  
(n)  
DCz  
DCz  
(z= 0,1,2or3)  
4
4
DBz(p)  
DBz(n)  
SEL = 1  
SEL  
Dx_SEL  
SEL  
HPDA  
HPDB  
SEL = 0  
SEL = 1  
HPDC  
125kW  
SEL  
AUXA(p)  
AUXA(n)  
SEL = 0  
(p)  
AUXC  
AUXC  
(n)  
AUXB(p)  
AUXB(n)  
SEL = 1  
OE  
HD3SS212  
GND  
Figure 2. HD3SS212 Functional Block Diagram  
2
Copyright © 2011–2012, Texas Instruments Incorporated  
 
HD3SS212  
www.ti.com  
SLAS822 A DECEMBER 2011REVISED MARCH 2012  
1
2
3
4
5
6
7
8
9
Dx_SEL  
VDD  
DA0(n)  
DA1(n)  
DA2(n)  
DA3(p)  
DA3(n)  
A
B
C
D
E
F
DC0(n)  
DC0(p)  
NC  
GND  
DA0(p)  
DA1(p)  
DA2(p)  
OE#  
DB0(p)  
GND  
DB0(n)  
DC1(n)  
DC2(n)  
DC3(n)  
DC1(p)  
DC2(p)  
DC3(p)  
GND  
DB1(p)  
DB2(p)  
DB3(p)  
GND  
DB1(n)  
DB2(n)  
DB3(n)  
G
AUXC(n)  
HPDC  
AUXC(p)  
HPDA  
HPDB  
GND  
VDD  
NC  
NC  
AUXB(p)  
AUXB(n)  
GND  
NC  
AUXA(p)  
AUXA(n)  
H
J
NC  
Figure 3. HD3SS212 Ball Map by Signal Name  
PIN FUNCTIONS  
PIN  
PIN NAME  
I/O  
DESCRIPTION  
A1  
Dx_SEL  
Control I  
High Speed Port Selection Control Pins  
B4  
A4  
DA0(p)  
DA0(n)  
Port A, Channel 0, High Speed Positive Signal  
Port A, Channel 0, High Speed Negative Signal  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
B5  
A5  
DA1(p)  
DA1(n)  
Port A, Channel 1, High Speed Positive Signal  
Port A, Channel 1, High Speed Negative Signal  
B6  
A6  
DA2(p)  
DA2(n)  
Port A, Channel 2, High Speed Positive Signal  
Port A, Channel 2, High Speed Negative Signal  
A8  
A9  
DA3(p)  
DA3(n)  
Port A, Channel 3, High Speed Positive Signal  
Port A, Channel 3, High Speed Negative Signal  
B8  
B9  
DB0(p)  
DB0(n)  
Port B, Channel 0, High Speed Positive Signal  
Port B, Channel 0, High Speed Negative Signal  
D8  
D9  
DB1(p)  
DB1(n)  
Port B, Channel 1, High Speed Positive Signal  
Port B, Channel 1, High Speed Negative Signal  
E8  
E9  
DB2(p)  
DB2(n)  
Port B, Channel 2, High Speed Positive Signal  
Port B, Channel 2, High Speed Negative Signal  
F8  
F9  
DB3(p)  
DB3(n)  
Port B, Channel 3, High Speed Positive Signal  
Port B, Channel 3, High Speed Negative Signal  
B2  
B1  
DC0(p)  
DC0(n)  
Port C, Channel 0, High Speed Positive Signal  
Port C, Channel 0, High Speed Negative Signal  
D2  
D1  
DC1(p)  
DC1(n)  
Port C, Channel 1, High Speed Positive Signal  
Port C, Channel 1, High Speed Negative Signal  
E2  
E1  
DC2(p)  
DC2(n)  
Port C, Channel 2, High Speed Positive Signal  
Port C, Channel 2, High Speed Negative Signal  
F2  
F1  
DC3(p)  
DC3(n)  
Port C, Channel 3, High Speed Positive Signal  
Port C, Channel 3, High Speed Negative Signal  
H9  
J9  
AUXA(p)  
AUXA(n)  
Port A AUX Positive Signal  
Port A AUX Negative Signal  
Copyright © 2011–2012, Texas Instruments Incorporated  
3
HD3SS212  
SLAS822 A DECEMBER 2011REVISED MARCH 2012  
www.ti.com  
PIN FUNCTIONS (continued)  
PIN  
PIN NAME  
I/O  
DESCRIPTION  
H6  
J6  
AUXB(p)  
AUXB(n)  
Port B AUX Positive Signal  
Port B AUX Negative Signal  
I/O  
H2  
H1  
AUXC(p)  
AUXC(n)  
Port C AUX Positive Signal  
Port C AUX Negative Signal  
I/O  
J2, H3, J1  
B7  
HPDA/B/C  
OE  
I/O  
I
Port A/B/C Hot Plug Detect  
Output Enable  
A2, J4  
VDD  
Supply  
3.3V Positive power supply voltage  
B3, C8, G2,  
G8, H4, H7  
GND  
NC  
Supply  
Negative power supply voltage  
C2, H5, H8,  
J5, J8  
Electrically not connected  
FUNCTIONAL DESCRIPTION  
Refer to Figure 2.  
The HD3SS212 behaves as a two to one using high bandwidth pass gates. The input port is selected using the  
Dx_SEL pin according to Table 1.  
Table 1. Switch Control Logic  
CONTROL LINES  
Dx_SEL  
SWITCHED I/O PINS(1)(2)  
DCz(p) PIN  
z = 0, 1, 2 or 3  
DCz(n) PIN  
z = 0, 1, 2 or 3  
HPDC PIN  
AUXC(p) PIN  
AUXC(n) PIN  
L
DAz(p)  
DBz(p)  
DAz(n)  
DBz(n)  
HPDA  
HPDB  
AUXA(p)  
AUXA(n)  
H
AUXVB(p)  
AUXVB(n)  
(1) OE pin - For nomal operation, drive OE high. Driving the OE pin low will disable the switch to enable power savings.  
(2) The ports which are not selected by the Control Lines will be in High Impedance State.  
ABSOLUTE MAXIMUM RATINGS(1)(2)  
over operating free-air temperature range (unless otherwise noted)  
VALUE / UNIT  
–0.5 V to 4 V  
Supply voltage range(3) VDD  
Differential I/O  
–0.5 V to 4 V  
–0.5 V to VCC +0.5V  
±4,000V  
Voltage range  
Control pin  
Human body model(4)  
Charged-device model(5)  
Electrostatic discharge  
±1000V  
Operating free-air temperature  
Continuous power dissipation  
–40°C to 105°C  
See The Thermal Information Table  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions  
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values, except differential voltages, are with respect to network ground terminal.  
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-B  
(4) Tested in accordance with JEDEC Standard 22, Test Method C101-A  
(5) 5. Tested in accordance with JEDEC Standard 22, Test Method A115-A  
4
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HD3SS212  
www.ti.com  
SLAS822 A DECEMBER 2011REVISED MARCH 2012  
THERMAL INFORMATION  
HD3SS212  
UNITS  
THERMAL METRIC(1)  
48-Ball u*BGHA (ZQE)  
θJA  
Junction-to-ambient thermal resistance  
90.5  
41.9  
θJCtop  
θJB  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
53.9  
1.8  
°C/W  
ψJT  
ψJB  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
53.4  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
RECOMMENDED OPERATING CONDITIONS  
typical values for all parameters are at VCC = 3.3V and TA = 25°C, all temperature limits are specified by design  
PARAMETER  
Supply voltage  
Input high voltage  
Input low voltage  
CONDITIONS  
MIN  
3.0  
TYP  
MAX  
3.6  
UNIT  
VDD  
VIH  
VIL  
3.3  
V
V
V
Control Pins, Signal Pins (Dx_SEL, OE) (HPDC, 5V Tolerant)  
Control Pins, Signal Pins (Dx_SEL, OE, HPDC)  
2.0  
VDD  
0.8  
–0.1  
Differential voltage (Dx,  
AUXx)  
VI/O_Diff  
VI/O_CM  
Switch I/O diff voltage  
0
0
1.8  
2.0  
Vpp  
V
Common voltage (Dx,  
AUXx)  
Switch I/O common mode voltage  
Operating free-air  
temperature  
–40  
105  
°C  
ELECTRICAL CHARACTERISTICS  
under recommended operating conditions  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
DEVICE PARAMETERS  
IIH  
IIL  
Input high current (Dx_SEL)  
Input low current (Dx_SEL)  
VDD = 3.6 V, VIN = VDD  
3
0.01  
2
10 µA  
VDD = 3.6 V, VIN = GND  
1
5
µA  
VDD = 3.3 V, Vi = 2V, OE = 3.3V  
VDD = 0 V, Vi = 2 V, OE = 3.3 V  
Leakage current (Dx_SEL)  
6
10  
2
ILK  
µA  
Leakage current (HPDA)  
Leakage current (HPDB)  
Device shut down current  
VDD = 3.3 V, Vi = 2 V, OE = 3.3 V; Dx_SEL=3.3 V  
VDD = 3.3 V, Vi = 2 V, OE = 3.3 V; Dx_SEL=GND  
VDD = 3.6 V, OE = GND  
0.01  
0.01  
2
Ioff  
5
µA  
VDD = 3.6 V, Dx_SELx = VCC/GND; Outputs  
floating  
IDD  
Supply current  
2.5  
5
mA  
DA, DB, DC HIGH SPEED SIGNAL PATH  
CON  
COFF  
RON  
Outputs ON capacitance  
Outputs OFF capacitance  
Output ON resistance  
Vi = 0 V, Outputs open, Switch ON  
1.5  
1
pF  
pF  
Ω
Vi = 0 V, Outputs open, Switch OFF  
VDD = 3.3 V, VCM = 0.5V - 1.5 V, IO = –40 mA  
6.5  
10  
On resistance match between pairs of the  
same channel  
ΔRON  
VDD = 3.3 V; -0.35V VI 1.2 V; IO = –40 mA  
VDD = 3.3 V; -0.35 V VI 1.2 V  
1.5  
Ω
Ω
On resistance flatness (RON (MAX) – RON  
RFLAT_ON  
1.3  
)
(MAIN)  
AUXx SIGNAL PATH  
CON  
COFF  
RON  
Outputs ON capacitance  
Vi = 0 V, Outputs open, Switch ON  
9
3
7
pF  
pF  
Ω
Outputs OFF capacitance  
Output ON resistance  
Vi = 0 V, Outputs open, Switch OFF  
VDD = 3.3 V, VCM = 0.5 V - 1.5 V, IO = -40 mA  
12  
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HD3SS212  
SLAS822 A DECEMBER 2011REVISED MARCH 2012  
www.ti.com  
ELECTRICAL CHARACTERISTICS (continued)  
under recommended operating conditions  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
DEVICE PARAMETERS (under recommended operating conditions; RL, Rsc = 50 Ω unless otherwise noted  
tPD  
Switch propagation delay  
Rsc and RL = 50 Ω, See Figure 5  
200 ps  
Ton  
Dx_SEL -to-Switch Ton (Data and AUX)  
Dx_SEL -to-Switch Toff (Data and AUX)  
Dx_SEL -to-Switch Ton (HPD)  
Dx_SEL -to-Switch Toff (HPD)  
Inter-pair output skew (CH-CH)  
Intra-pair output skew (bit-bit)  
175  
175  
275  
275  
250  
ns  
Rsc and RL = 50 Ω, See Figure 4  
Toff  
250  
Ton  
350  
ns  
RL = 50 Ω, See Figure 4  
Toff  
350  
TSK(O)  
TSK(b-b)  
50  
ps  
4
Rsc and RL = 1 kΩ, See Figure 5  
1
–17  
–11  
–50  
–22  
1.35 GHz, See TYPICAL PERFORMANCE PLOTS  
2.7 GHz, See TYPICAL PERFORMANCE PLOTS  
2.7 GHz  
RL  
Dx Differential return loss(1)  
dB  
XTALK  
OIRR  
Dx Differential crosstalk(1)  
Dx Differential off-isolation(1)  
2.7 GHz, See TYPICAL PERFORMANCE PLOTS  
f = 1.35 GHz, See TYPICAL PERFORMANCE  
PLOTS  
–0.7  
–1.4  
f = 2.7 GHz, See TYPICAL PERFORMANCE  
PLOTS  
Dx Differential insertion loss(1)  
AUX Differential insertion loss(1)  
dB  
dB  
IL  
f = 5.4 GHz, See TYPICAL PERFORMANCE  
PLOTS  
–1.7  
–1  
f = 360 MHz  
(1) For Return Loss, Crosstalk, Off-Isolation, and Insertion Loss values the data was collected on a Rogers material board with minimum  
length traces on the input and output of the device under test.  
TEST TIMING DIAGRAMS  
50%  
Dx_SEL  
90%  
VOUT  
10%  
Ton  
Toff  
Figure 4. Select to Switch Ton and Toff  
6
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HD3SS212  
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SLAS822 A DECEMBER 2011REVISED MARCH 2012  
Vcc  
50 Ω  
DAx/DBx(p)  
DAx/DBx(n)  
DCx(p)  
50 Ω  
50 Ω  
DCx(n)  
50 Ω  
SEL  
DAx/DBx(p)  
50%  
50%  
DAx/DBx(n)  
DCx(p)  
50%  
50%  
DCx(n)  
DCx(p)  
tP1  
t2  
tP2  
t4  
t1  
t3  
50%  
DCx(n)  
DCy(p)  
tSK(O)  
DCy(n)  
tPD = Max(tp1, tp2)  
tSK(O) = Difference between tPD for any  
two pairs of outputs  
tSK(b-b) = 0.5 X |(t4 – t3) + (t1 – t2)|  
Figure 5. Propagation Delay and Skew  
Copyright © 2011–2012, Texas Instruments Incorporated  
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HD3SS212  
SLAS822 A DECEMBER 2011REVISED MARCH 2012  
www.ti.com  
TYPICAL PERFORMANCE PLOTS  
0
0
-5  
-5  
-10  
-10  
-15  
-20  
-25  
-30  
-15  
-20  
-25  
-30  
1E10 2E10  
1E8  
1E9  
1E8  
1E9  
1E10 2E8  
Frequency - Hz  
Frequency - Hz  
Figure 6. Insertion Loss and -3dB Bandwidth  
Figure 7. Return Loss  
0
-20  
-40  
-60  
-80  
-100  
1E8  
1E9  
Frequency - Hz  
1E10 2E10  
Figure 8. OF Isolation  
8
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HD3SS212  
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SLAS822 A DECEMBER 2011REVISED MARCH 2012  
REVISION HISTORY  
Changes from Original (December 2011) to Revision A  
Page  
Changed Description From: full industrial temperature range of –40°C to 85°C To: full industrial temperature range  
of –40°C to 105°C ................................................................................................................................................................. 1  
Added Operating Temperature to the Abs Max Table .......................................................................................................... 4  
Changed the values of ψJT and ψJB in the Thermal Information table .................................................................................. 5  
Changed the Operating free-air temperature From MAX = 85°C To: 105°C ........................................................................ 5  
Changed the MAX value of Leakage current (Dx_SEL), VDD = 0 V From: 8µA To: 10µA .................................................. 5  
Copyright © 2011–2012, Texas Instruments Incorporated  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
3-Mar-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
HD3SS212ZQER  
HD3SS212ZQET  
ACTIVE  
ACTIVE  
BGA  
MICROSTAR  
JUNIOR  
ZQE  
48  
2500  
Green (RoHS  
& no Sb/Br)  
SNAGCU Level-3-260C-168 HR  
BGA  
MICROSTAR  
JUNIOR  
ZQE  
48  
250  
Green (RoHS  
& no Sb/Br)  
SNAGCU Level-3-260C-168 HR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
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配单直通车
HD3SS212ZQER产品参数
型号:HD3SS212ZQER
Brand Name:Texas Instruments
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
零件包装代码:BGA
包装说明:BGA,
针数:48
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:16 weeks
风险等级:1.72
模拟集成电路 - 其他类型:DIFFERENTIAL MULTIPLEXER
JESD-30 代码:S-PBGA-B48
JESD-609代码:e1
长度:5 mm
湿度敏感等级:3
正常位置:NO
信道数量:2
功能数量:1
端子数量:48
标称断态隔离度:22 dB
通态电阻匹配规范:1.5 Ω
最大通态电阻 (Ron):12 Ω
最高工作温度:85 °C
最低工作温度:-40 °C
输出:COMMON OUTPUT
封装主体材料:PLASTIC/EPOXY
封装代码:BGA
封装形状:SQUARE
封装形式:GRID ARRAY
峰值回流温度(摄氏度):260
座面最大高度:0.74 mm
最大供电电流 (Isup):5 mA
最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V
表面贴装:YES
最长断开时间:350 ns
最长接通时间:350 ns
温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL
端子节距:0.5 mm
端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:5 mm
Base Number Matches:1
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