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产品型号HD74LS32P的概述

HD74LS32P 芯片概述 HD74LS32P是一种多功能的逻辑芯片，属于74系列逻辑门集成电路。此芯片主要用于数字电路中，提供四个独立的两输入或门逻辑功能。作为一个典型的低功耗元件，HD74LS32P被广泛应用于各种电子设备中，包括计算机硬件、家用电器以及通信设备等，凭借其可靠性和高效性，成为电子设计中的重要组成部分。芯片详细参数 HD74LS32P的主要参数如下： - 逻辑功能：两输入或门 (OR gate) - 输入电压范围：通常为0V到5V - 输出电压：高电平时为3.4V或更高，低电平时为0.5V或更低 - 最大输出电流：每个输出端口可承受的最大电流为20mA - 工作温度范围：-40℃到125℃ - 逻辑电源电压(Vcc)：4.75V到5.25V - 功耗：典型功耗为1W（在常规工作状态下） - 输入阻抗：百万欧姆级别 - 传输延迟：典型传输延迟为10ns到20ns...

产品型号HD74LS32P的Datasheet PDF文件预览

HD74LS32

Quadruple 2-input Positive OR Gate

REJ03D0405–0200

Rev.2.00

Feb.18.2005

Features

•

Ordering Information

Package Code

(Previous Code)

Package

Abbreviation

Taping Abbreviation

(Quantity)

Part Name

Package Type

DILP-14 pin

PRDP0014AB-B

(DP-14AV)

HD74LS32P

HD74LS32FPEL

—

PRSP0014DF-B

(FP-14DAV)

SOP-14 pin (JEITA)

EL (2,000 pcs/reel)

Note: Please consult the sales office for the above package availability.

Pin Arrangement

V_CC

GND

(Top view)

Rev.2.00, Feb.18.2005, page 1 of 4

HD74LS32

Circuit Schematic (1/4)

V_CC

20k 20k

11k

Inputs

Output

4.5k

1.5k

GND

Absolute Maximum Ratings

Item

Supply voltage

Symbol

Ratings

Unit

V_CC

V_IN

Input voltage

Power dissipation

Storage temperature

P_T

400

°C

Tstg

–65 to +150

Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.

Recommended Operating Conditions

Item

Symbol

V_CC

Min

4.75

—

Typ

5.00

—

Max

5.25

–400

Unit

Supply voltage

Output current

I_OH

µA

°C

I_OL

—

Operating temperature

Topr

–20

Rev.2.00, Feb.18.2005, page 2 of 4

HD74LS32

Electrical Characteristics

(Ta = –20 to +75 °C)

Item

Symbol

V_IH

min.

2.0

—

typ.*

—

max.

—

Unit

Condition

Input voltage

V_IL

—

0.8

—

V_OH

2.7

—

V_CC= 4.75 V, V_IH= 2 V, I_OH= –400 µA

Output voltage

Input current

—

0.5

0.4

I_OL= 8 mA

V_OL

V_CC= 4.75 V, V_IL= 0.8 V

I_OL= 4 mA

—

I_IH

I_IL

I_I

—

µA

V_CC= 5.25 V, V_I= 2.7 V

V_CC= 5.25 V, V_I= 0.4 V

V_CC= 5.25 V, V_I= 7 V

—

–0.4

0.1

—

Short-circuit output

current

I_OS

–20

—

–100

V_CC= 5.25 V

I_CCH

I_CCL

V_IK

—

3.1

4.9

—

6.2

9.8

V_CC= 5.25 V

Supply current

V_CC= 5.25 V

Input clamp voltage

–1.5

V_CC= 4.75 V, I_IN= –18 mA

Note: * V_CC= 5 V, Ta = 25°C

Switching Characteristics

(V_CC= 5 V, Ta = 25°C)

Item

Symbol

t_PLH

min.

typ.

max.

Unit

Condition

—

Propagation delay time

C_L= 15 pF, R_L= 2 kΩ

t_PHL

Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D0005-

0100)".

Rev.2.00, Feb.18.2005, page 3 of 4

HD74LS32

Package Dimensions

JEITA Package Code

P-DIP14-6.3x19.2-2.54

RENESAS Code

PRDP0014AB-B

Previous Code

DP-14AV

MASS[Typ.]

0.97g

b ₃

Dimension in Millimeters

Reference

Symbol

Min

Nom

7.62

19.2

6.3

Max

e ₁

20.32

7.4

5.06

A ₁

b _p

b ₃

0.51

0.40

0.48

1.30

0.25

0.56

b _p

0.19

0.31

e₁

15°

2.29

2.54

2.79

2.39

( Ni/Pd/Au plating )

JEITA Package Code

P-SOP14-5.5x10.06-1.27

RENESAS Code

PRSP0014DF-B

Previous Code

FP-14DAV

MASS[Typ.]

0.23g

NOTE)

1. DIMENSIONS"*1 (Nom)"AND"*2"

DO NOT INCLUDE MOLD FLASH.

2. DIMENSION"*3"DOES NOT

INCLUDE TRIM OFFSET.

b_p

Index mark

Dimension in Millimeters

Reference

Symbol

Min

Nom

10.06

5.50

Max

10.5

Terminal cross section

( Ni/Pd/Au plating )

A ₂

A ₁

0.00

0.34

0.15

0.10

0.40

0.20

2.20

0.46

b_p

L₁

b _p

b ₁

0.25

H _E

8°

7.50

7.80

1.27

8.00

0.12

0.15

1.42

0.90

Detail F

0.50

0.70

1.15

Rev.2.00, Feb.18.2005, page 4 of 4

Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Keep safety first in your circuit designs!

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,

(ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's

application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.

2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,

diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of

publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is

therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product

information before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor

home page (http://www.renesas.com).

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evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes

no responsibility for any damage, liability or other loss resulting from the information contained herein.

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is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a

product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater

use.

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cannot be imported into a country other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.

8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.

RENESAS SALES OFFICES

http://www.renesas.com

Refer to "http://www.renesas.com/en/network" for the latest and detailed information.

Renesas Technology America, Inc.

450 Holger Way, San Jose, CA 95134-1368, U.S.A

Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501

Renesas Technology Europe Limited

Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.

Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900

Renesas Technology Hong Kong Ltd.

7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong

Tel: <852> 2265-6688, Fax: <852> 2730-6071

Renesas Technology Taiwan Co., Ltd.

10th Floor, No.99, Fushing North Road, Taipei, Taiwan

Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999

Renesas Technology (Shanghai) Co., Ltd.

Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China

Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952

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1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632

Tel: <65> 6213-0200, Fax: <65> 6278-8001

Colophon .2.0

HD74LS32P相关文章

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HD74LS32P产品参数

型号:	HD74LS32P
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Obsolete
IHS 制造商：	RENESAS ELECTRONICS CORP
零件包装代码：	DIP
包装说明：	6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-14
针数：	14
Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01
风险等级：	5.18
Is Samacsys：	N
系列：	LS
JESD-30 代码：	R-PDIP-T14
长度：	19.2 mm
逻辑集成电路类型：	OR GATE
最大I（ol）：	0.008 A
湿度敏感等级：	1
功能数量：	4
输入次数：	2
端子数量：	14
最高工作温度：	75 °C
最低工作温度：	-20 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	DIP
封装等效代码：	DIP14,.3
封装形状：	RECTANGULAR
封装形式：	IN-LINE
峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	5 V
最大电源电流（ICC）：	9.8 mA
Prop。Delay @ Nom-Sup：	22 ns
传播延迟（tpd）：	22 ns
认证状态：	Not Qualified
施密特触发器：	NO
座面最大高度：	5.06 mm
子类别：	Gates
最大供电电压 (Vsup)：	5.25 V
最小供电电压 (Vsup)：	4.75 V
标称供电电压 (Vsup)：	5 V
表面贴装：	NO
技术：	TTL
温度等级：	COMMERCIAL EXTENDED
端子形式：	THROUGH-HOLE
端子节距：	2.54 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	7.62 mm
Base Number Matches：	1

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