HFBR-2532Z原理图各脚功能电路原理芯片引脚定义引脚图及功能-中国IC网-芯三七

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产品型号HFBR-2532Z的概述

HFBR-2532Z概述 HFBR-2532Z是一种高性能光纤收发器，属于光纤通信领域，主要用于串行数据传输。它的设计目的是在长距离内实现高带宽的数据传输，广泛应用于各种通信设备、数据中心和网络基础设施中。该器件通常用于以太网、光纤通道和其他通信标准，能够提供高效、可靠的信号传输，以满足现代通信技术日益增长的需求。 HFBR-2532Z详细参数 HFBR-2532Z的主要参数包括： - 类型：光纤收发模块 - 传输模式：全双工 - 数据速率：可达155 Mbps - 波长：850 nm（发射），整体接收范围宽广 - 传输距离：最大可支持2 km（依赖于所使用的光纤类型） - 接口类型：通用8pin封装，适用于多种标准接口 - 供电电压：5 V（±0.25 V） - 功耗：典型工作功耗约为20 mW - 外形尺寸：通常封装为小型金属外壳，满足现代电路密度要求 - 工作温度范围：-40 °...

产品型号HFBR-2532Z的Datasheet PDF文件预览

HFBR-0500ETZ Series

Versatile Link

The Versatile Fiber Optic Connection

Data Sheet

Description

Features

 Extended temperature range -40 to +85° C

 RoHS-compliant

The Versatile Link series is a complete family of ﬁber

optic link components for applications requiring a low

cost solution. The HFBR-0500ETZ series includes trans-

mitters, receivers, connectors and cable speciﬁed for

easy design. This series of components is ideal for

solving problems with voltage isolation/insulation,

EMI/RFI immunity or data security. The optical link

design is simpliﬁed by the logic compatible receivers

and complete speciﬁ-cations for each component. The

key optical and electrical parameters of links conﬁgured

with the HFBR-0500ETZ family are fully guaranteed from

-40° to 85° C.

 Low cost ﬁber optic components

 Enhanced digital links: dc-5 MBd

 Link distance up to 43m at 1MBd and 20m at 5MBd

 Low current link: 6 mA peak supply current

 Horizontal and vertical mounting

 Interlocking feature

 High noise immunity

 Easy connectoring: simplex, duplex, and latching

connectors

A wide variety of package conﬁgurations and connectors

provide the designer with numerous mechanical solutions

to meet application requirements. The transmitter and

receiver components have been designed for use in high

volume/low cost assembly processes such as auto inser-

tion and wave soldering.

 Flame retardant

 Transmitters incorporate a 660 nm red LED for easy

visibility

 Compatible with standard TTL circuitry

Applications

 Industrial Drives/Frequency Inverters

Transmitters incorporate a 660 nm LED. Receivers

include a monolithic dc coupled, digital IC receiver

with open collector Schottky output transistor. An

internal pullup resistor is available for use in the

HFBR-25X1ETZ and HFBR-25X2ETZ receivers. A shield has

been integrated into the receiver IC to provide additional,

localized noise immunity.

 Renewable Energies (Wind Turbines, Solar PV farms)

Power electronics

 Reduction of lightning/voltage transient susceptibility

 Motor controller triggering

 Data communications and local area networks

Internal optics have been optimized for use with 1 mm

diameter plastic optical ﬁber. Versatile Link speciﬁcations

incorporate all connector interface losses. Therefore,

optical calculations for common link applications are

simpliﬁed.

 Electromagnetic Compatibility (EMC) for regulated

systems: FCC, VDE, CSA, etc.

 Tempest-secure data processing equipment

 Isolation in test and measurement instruments

 Error free signalling for industrial and manufacturing

equipment

 Automotive communications and control networks

 Noise immune communication in audio and video

equipment

HFBR-0500ETZ Series Part Number Guide

HFBR-X5XXETZ

1 = Transmitter

2 = Receiver

ET = extended temperature range

Z = RoHS compliant

5 = 600 nm Transmitter and

Receiver Products

1 = 5 MBd High Performance Link

2 = 1 MBd High Performance Link

6 = 155 MBd Receiver

2 = Horizontal Package

3 = Vertical Package

4 = 30° Tilted Package

7 = 155 MBd Transmitter

Available option – Horizontal Package

HFBR-x521ETZ

HFBR-x522ETZ

HFBR-x532ETZ

HFBR-x542ETZ

Available option – Vertical Package

HFBR-x531ETZ

Available option – 30° Tilted Package

HFBR-x541ETZ

Link Selection Guide

(Links speciﬁed from -40° to 85° C, for plastic optical ﬁber unless speciﬁed.)

Signal Rate

1 MBd

Distance (m) 25° C

Distance (m)

Transmitter

Receiver

HFBR-15x2ETZ

HFBR-15x1ETZ

HFBR-25x2ETZ

HFBR-25x1ETZ

5 Mbd

Application Literature

Handling

Application Note 1035 (Versatile Link)

Versatile Link components are auto-insertable. When

wave soldering is performed with Versatile Link compo-

nents, the optical port plug should be left in to prevent

contamination of the port. Do not use reﬂow solder

processes (i.e., infrared reﬂow or vapor-phase reﬂow).

Nonhalogenated water soluble ﬂuxes (i.e., 0% chloride),

not rosin based ﬂuxes, are recommended for use with

Versatile Link components.

Package and Handling Information

The compact Versatile Link package is made of a ﬂame

retardant VALOX UL 94 V-0 material (UL ﬁle # E121562)

and uses the same pad layout as a standard, eight pin

dual-in-line package. Vertical and horizontal mountable

parts are available. These low proﬁle Versatile Link pack-

ages are stackable and are enclosed to provide a dust

resistant seal. Snap action simplex, simplex latching,

duplex, and duplex latching connectors are oﬀered with

simplex or duplex cables.

Versatile Link components are moisture sensitive

devices and are shipped in a moisture sealed bag. If the

components are exposed to air for an extended period of

time, they may require a baking step before the solder-

ing process. Refer to the special labeling on the shipping

tube for details.

Package Orientation

Performance and pinouts for the vertical and hori-

zontal packages are identical. To provide additional

attachment support for the vertical Versatile Link

housing, the designer has the option of using a self-

tapping screw through a printed circuit board into a

mounting hole at the bottom of the package. For most

applications this is not necessary.

Recommended Chemicals for Cleaning/Degreasing

Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,

heptane. Other: soap solution, naphtha.

Do not use partially halogenated hydrocarbons such

as 1,1.1 trichloroethane, ketones such as MEK, acetone,

chloroform, ethyl acetate, methylene dichloride, phenol,

methylene chloride, or N-methylpyrolldone. Also, Avago

does not recommend the use of cleaners that use

halogenated hydrocarbons because of their potential

environmental harm.

Package Housing Color

Versatile Link components and simplex connectors are

color coded to eliminate confusion when making connec-

tions. Receivers are blue and transmitters are gray.



VALOX is a registered trademark of the General Electric Corporation.

Mechanical Dimensions

Horizontal Modules

Vertical Modules

2.03

(0.080)

6.86

(0.270)

5.08

(0.200)

10.16

(0.400)

10.16

(0.400)

2.03

(0.080)

5.08

(0.200)

18.8

(0.74)

18.29

(0.720)

6.86

(0.27)

4.19

(0.165)

0.64

(0.025)

7.62

(0.30)

3.81 (0.150) MAX.

3.56 (0.140) MIN.

18.80

(0.740)

1.27

7.62

0.51

(0.020)

(0.050)

(0.300)

2.54

(0.100)

0.64 (0.025) DIA.

1.85

(0.073)

2.77

(0.109)

DIMENSIONS IN MILLIMETERS (INCHES).

30° Tilted Modules

∅0.7

(0.03)

0.4

(0.02)

1.3

(0.05)

1.1

(0.05)

0.5

(0.02)

2.54

(0.100)

7.62

(0.300)

10.1

(0.40)

2.2

(0.09)

8.7

(0.34)

19.3

(0.76)

DIMENSIONS IN MILLIMETERS (INCHES).

Versatile Link Printed Board Layout Dimensions

Horizontal Module

Vertical Module

7.62

(0.300)

2.54

(0.100)

1.01 (0.040) DIA.

TOP VIEW

7.62

(0.300)

PCB EDGE

1.85

(0.073)

MIN.

DIMENSIONS IN MILLIMETERS (INCHES).

30° Tilted Modules

7.62

(0.300)

2.54

(0.100)

0.5

(0.02)

1.01

(0.040)

DIA.

Bottom View

DIMENSIONS IN MILLIMETERS (INCHES).

Interlocked (Stacked) Assemblies (refer to Figure 1)

packages can be disengaged if necessary. Repeated

stacking and unstacking causes no damage to individual

units.

Horizontal packages may be stacked by placing units

with pins facing upward. Initially engage the inter-

locking mechanism by sliding the L bracket body from

above into the L slot body of the lower package. Use

a straight edge, such as a ruler, to bring all stacked

units into uniform alignment. This technique prevents

potential harm that could occur to ﬁngers and hands of

assemblers from the package pins. Stacked horizontal

To stack vertical packages, hold one unit in each hand,

with the pins facing away and the optical ports on the

bottom. Slide the L bracket unit into the L slot unit. The

straight edge used for horizontal package alignment is

not needed.

Stacking Horizontal Modules

Stacking Vertical Modules

Stacking 30° Tilted Modules

Figure 1. Interlocked (stacked) horizontal, vertical or 30° tilted packages

5 MBd Link (HFBR-15X1ETZ/25X1ETZ)

System Performance -40° to 85° C unless otherwise speciﬁed.

Parameter

Data Rate

Symbol

Min.

Typ. Max. Units

Conditions

Ref.

Note 3

High

Performance

5 MBd

MBd BER ≤10^-9, PRBS:2⁷-1

Link Distance

(Standard Cable)

Link Distance

(Improved Cable)

Propagation

Delay

I_Fdc= 60 mA

_Fdc= 60 mA, 25° C

I_Fdc= 60 mA

I_Fdc= 60 mA, 25° C

R_L= 560 , C_L= 30 pF

ﬁber length = 0.5 m

-21.6 ≤P_R≤-9.5 dBm

P_R= -15 dBm

t_PLH

t_PHL

140

Fig. 3, 6

Notes 1, 2

Pulse Width

t_D

Fig. 3, 5

Distortion t_PLH-t_PHL

R_L= 560 , C_L= 30 pF

Notes:

1. The propagation delay for one metre of cable is typically 5 ns.

2. Typical propagation delay is measured at P = -15 dBm.

3. Estimated typical link life expectancy at 40° C exceeds 10 years at 60 mA.

Figure 2. Typical 5 MBd interface circuit

Figure 3. 5 MBd propagation delay test circuit

Figure 4. Propagation delay test waveforms

100

X5X1ETZ -40° C

X5X1ETZ 25° C

X5X1ETZ 85° C

t_PLHX5X1ETZ

t_PHLX5X1ETZ

-27

-24

-21

-18

-15

-12

-9

-6

-27

-24

-21

-18

-15

-12

-9

-6

P_R- INPUT OPTICAL POWER - dBm

Figure 5. Typical link pulse width distortion vs. optical power

Figure 6. Typical link propagation delay vs. optical power

HFBR-15X1ETZ Transmitter

8 GROUND

5 GROUND

Pin #

Function

Anode

ANODE

Cathode

Ground

CATHODE

GROUND

Note: Pins 5 and 8 are for mounting and retaining purposes

only. Do not electrically connect these pins.

Absolute Maximum Ratings

Parameter

Symbol

T_S

Min.

–40

Max.

+85

260

Units

°C

Reference

Storage Temperature

Operating Temperature

Lead Soldering Cycle

T_A

°C

Temp.

Time

°C

Note 1, 4

Note 2, 3

sec

Forward Input Current

Reverse Input Voltage

I_FPK

I_Fdc

V_BR

1000

Notes:

1. 1.6 mm below seating plane.

2. Recommended operating range between 10 and 750 mA.

3. 1 s pulse, 20 s period.

4. Moisture sensitivity level is MSL-3

All HFBR-15XXETZ LED transmitters are classiﬁed as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed

draft scheduled to go into eﬀect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your local Avago sales

representative for more information.

Transmitter Electrical/Optical Characteristics -40° to 85° C unless otherwise speciﬁed.

[5]

Parameter

Transmitter Output

Optical Power

Symbol

P_T

Min.

-16.8

-14.3

Typ.

Max.

-7.1

-8.0

Units

dBm

%/°C

Conditions

I_Fdc= 60 mA

Ref.

Notes 1, 2

I_Fdc= 60 mA, 25° C

Output Optical Power

Temperature Coeﬃcient

Peak Emission

P_T/T

-0.85

660

_PK

Wavelength

Forward Voltage

Temperature Coeﬃcient

Eﬀective Diameter

Reverse Input Breakdown

Voltage

V_F

1.43

5.0

1.67

2.05

I_Fdc= 60 mA

V_F/T

-1.37

mV/°C

Fig. 7

V_BR

11.0

I_Fdc= 10 A,

T_A= 25° C

Diode Capacitance

Rise Time

C_O

t_r

V_F= 0, f = MHz

10% to 90%,

I_F= 60 mA

Note 3

Fall Time

t_f

Notes:

1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector.

2. Optical power, P (dBm) = 10 Log [P(W)/1000 W].

3. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform

analyzer, terminated to a 50  input of a wide bandwidth oscilloscope, is used for this response time measurement.

1.8

1.75

1.7

1.65

1.6

-5

-10

-15

-20

1.55

1.5

-40° C

25° C

85° C

-40° C

25° C

85° C

1.45

1.4

100

I_Fdc- TRANSMITTER DRIVE CURRENT (mA)

Figure 7. Typical forward voltage vs. drive current

Figure 8. Normalized typical output power vs. drive current

HFBR-25X1ETZ Receiver

Pin #

Function

V_O

GROUND

Ground

V_CC

1000 Ω

R_L

V_CC

R_L

Ground

GROUND

V_O

Note: Pins 5 and 8 are for mounting and retaining purposes

only. Do not electrically connect these pins.

GROUND

Absolute Maximum Ratings

Parameter

Symbol

T_S

Min.

–40

Max.

+85

260

Units

° C

sec

Reference

Storage Temperature

Operating Temperature

Lead Soldering Cycle

T_A

Temp.

Time

Note 1, 3

Note 2

Supply Voltage

V_CC

I_OAV

P_OD

V_O

–0.5

Output Collector Current

Output Collector Power Dissipation

Output Voltage

–0.5

–5

Pull-up Voltage

V_P

V_CC

Fan Out (TTL)

Notes:

1. 1.6 mm below seating plane.

2. It is essential that a bypass capacitor 0.1 F be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor

and the pins should not exceed 20 mm.

3. Moisture sensitivity level is MSL-3

Receiver Electrical/Optical Characteristics -40° to 85° C, 4.75 V ≤V ≤5.25 V unless otherwise speciﬁed.

Parameter

Input Optical Power

Level for Logic “0”

Symbol

P_R(L)

Min.

–21.6

Typ.

Max.

–9.5

Units

dBm

Conditions

Ref.

Notes 1,

2, 4

V_OL= 0.5 V

_OL= 8 mA

_OL= 0.5 V

_OL= 8 mA, 25° C

–21.6

–8.7

–43

Input Optical Power

P_R(H)

dBm

V_OL= 5.25 V

Note 1

Level for Logic “1”

I_OH≤250 μA

High Level Output Current

Low Level Output Voltage

I_OH

V_OL

0.4

250

0.5

A

V_O= 18 V, P_R= 0

I_OL= 8 mA,

P_R= P_R(L)MIN

V_CC= 5.25 V,

P_R= 0

Note 3

High Level Supply

Current

Low Level Supply Current

I_CCH

I_CCL

3.5

6.2

6.3

Note 3

V_CC= 5.25 V

P_R= -12.5 dBm

Eﬀective Diameter

Internal Pull-up Resistor

R_L

680

1000

1700



Notes:

1. Optical ﬂux, P (dBm) = 10 Log [P (μW)/1000 μW].

2. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector.

3. R is open.

4. Pulsed LED operation at I > 80 mA will cause increased link t

propagation delay time. This extended t

time contributes to increased pulse

PLH

width distortion of the receiver output signal.

1 MBd Link

(High Performance HFBR-15X2ETZ/25X2ETZ)

System Performance Under recommended operating conditions unless otherwise speciﬁed.

Parameter

Data Rate

Symbol

Min.

Typ. Max. Units

Conditions

Ref.

High

MBd BER ≤10^-9, PRBS:2⁷-1

Performance

1 MBd

Link Distance

(Standard Cable)

Link Distance

(Improved Cable)

Propagation

Delay

_Fdc= 60 mA

Notes 1,

3, 4

I_Fdc= 60 mA, 25° C

I_Fdc= 60 mA

Notes 1,

3, 4

I_Fdc= 60 mA, 25° C

t_PLH

t_PHL

100 250

R_L= 560 , C_L= 30 pF

I = 0.5 metre

Fig. 10, 12

Notes 2, 4

140

P_R= -24 dBm

Pulse Width

t_D

P_R= -24 dBm

Fig. 10, 11

Note 4

Distortion t_PLH-t_PHL

R_L= 560 , C_L= 30 pF

Notes:

1. For I > 80 mA, the duty factor must be such as to keep I ≤80 mA. In addition, for I > 80 mA, the following rules for pulse width apply:

FPK

Fdc

FPK

≤160 mA: Pulse width ≤1 ms

> 160 mA: Pulse width ≤1 S, period ≥20 S.

FPK

2. The propagation delay for one meter of cable is typically 5 ns.

3. Estimated typical link life expectancy at 40° C exceeds 10 years at 60 mA.

4. Pulsed LED operation at I

> 80 mA will cause increased link t

propagation delay time. This extended t

time contributes to increased

FPK

PLH

pulse width distortion of the receiver output signal.

Figure 9. Required 1 MBd interface circuit

The HFBR-25X2ETZ receiver cannot be overdriven when using the required

interface circuit shown in Figure 9

Figure 10. 1 MBd propagation delay test circuit

120

100

X5X2ETZ -40° C

X5X2ETZ 25° C

X5X2ETZ 85° C

t_PLHX5X2ETZ

t_PHLX5X2ETZ

-27

-24

-21

-18

-15

-12

-9

-6

-27

-24

-21

-18

-15

-12

-9

-6

_R- INPUT OPTICAL POWER - dBm

P_R- INPUT OPTICAL POWER - dBm

Figure 11. Typical link pulse width distortion vs. optical power

Figure 12. Typical link propagation delay vs. optical power

Figure 13. Propagation delay test waveforms

HFBR-15X2ETZ Transmitters

Pin #

Function

Anode

8 GROUND

5 GROUND

Cathode

Ground

ANODE

CATHODE

GROUND

Note: Pins 5 and 8 are for mounting and retaining purposes

only. Do not electrically connect these pins.

Absolute Maximum Ratings

Parameter

Symbol

T_S

Min.

–40

Max.

+85

260

Units

° C

Reference

Storage Temperature

Operating Temperature

Lead Soldering Cycle

T_A

° C

Temp.

Time

° C

Note 1, 4

Note 2, 3

sec

Forward Input Current

Reverse Input Voltage

I_FPK

I_Fdc

V_BR

1000

Notes:

1. 1.6 mm below seating plane.

2. Recommended operating range between 10 and 750 mA.

3. 1 s pulse, 20 s period.

4. Moisture sensitivity level is MSL-3

All HFBR15XXETZ LED transmitters are classiﬁed as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed

draft scheduled to go into eﬀect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your Avago sales

representative for more information.

Transmitter Electrical/Optical Characteristics -40° to 85° C unless otherwise speciﬁed.

For forward voltage and output power vs. drive current graphs.

Parameter

Transmitter Output

Optical Power

Symbol

P_T

Min.

–13.9

–11.2

Typ.

Max.

–4.0

–5.1

Units

dBm

Conditions

I_Fdc= 60 mA

_Fdc= 60 mA, 25° C

Ref.

Note 1

Output Optical Power

Temperature Coeﬃcient

Peak Emission Wavelength

Forward Voltage

Temperature Coeﬃcient

Eﬀective Diameter

Reverse Input Breakdown

Voltage

P_T/T

–0.85

%/° C

_PK

V_F

V_F/T

660

1.67

–1.37

mV/° C

1.43

5.0

2.05

I_Fdc= 60 mA

Fig. 09

Note 2

D_T

V_BR

11.0

I_Fdc= 10 μA,

T_A= 25° C

V_F= 0, f = 1 MHz

10% to 90%,

I_F= 60 mA

Diode Capacitance

Rise Time

Fall Time

C_O

t_r

t_f

Note:

1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector.

2. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform

analyzer, terminated to a 50  input of a wide bandwidth oscilloscope, is used for this response time measurement.

HFBR-25X2ETZ Receivers

Pin #

Function

V_O

GROUND

Ground

V_CC

1000 Ω

R_L

V_CC

R_L

GROUND

V_O

Ground

Note: Pins 5 and 8 are for mounting and retaining purposes

only. Do not electrically connect these pins.

GROUND

Absolute Maximum Ratings

Parameter

Symbol

T_S

T_A

Min.

–40

Max.

+85

260

Units

° C

sec

Reference

Storage Temperature

Operating Temperature

Lead Soldering Cycle

Temp.

Time

Note 1, 3

Note 2

Supply Voltage

Output Collector Current

Output Collector Power Dissipation

Output Voltage

Pull-up Voltage

V_CC

I_OAV

P_OD

V_O

V_P

–0.5

–5

V_CC

Fan Out (TTL)

Notes:

1. 1.6 mm below seating plane.

2. It is essential that a bypass capacitor 0.1 F be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor

and the pins should not exceed 20 mm.

3. Moisture sensitivity level is MSL-3

Receiver Electrical/Optical Characteristics -40° to 85° C, 4.75 V ≤V ≤5.25 V unless otherwise speciﬁed.

Parameter

Symbol

Min.

Typ.

Max.

Units

Conditions

Ref.

Receiver Optical Input

Power Level Logic 0

Optical Input Power

Level Logic 1

P_R(L)

–24

-9.5

dBm

V_OL 0.5 V

_OL= 8 mA

V_OH= 5.25 V

_OH= ≤250 μA

Notes 1, 2, 3

P_R(H)

-43

dBm

Note 4

High Level Output Current

Low Level Output Voltage

I_OH

V_OL

0.4

250

0.5

A

V_O= 18 V, P_R= 0

I_OL= 8 mA

Note 5

P_R= P_R(L)MIN

V_CC= 5.25 V,

P_R= 0

V_CC= 5.25 V,

P_R= -12.5 dBm

High Level Supply Current

Low Level Supply Current

I_CCH

I_CCL

3.5

6.2

6.3

Note 5

Eﬀective Diameter

Internal Pull-up Resistor

R_L

680

1000

1700



Notes:

1. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector.

2. Pulsed LED operation at I > 80 mA will cause increased link t

propagation delay time. This extended t

time contributes to increased pulse

PLH

width distortion of the receiver output signal.

3. The LED drive circuit of Figure 11 is required for 1 MBd operation of the HFBR-25X2ETZ.

4. Optical ﬂux, P (dBm) = 10 Log [P(W)/1000 W].

5. R is open.

For product information and a complete list of distributors, please go to our website: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-3283EN - February 23, 2012

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HFBR-2532Z产品参数

型号:	HFBR-2532Z
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	HON HAI PRECISION INDUSTRY CO LTD
Reach Compliance Code：	compliant
风险等级：	5.04
Is Samacsys：	N
主体宽度：	7.62 mm
主体高度：	18.8 mm
光纤设备类型：	RECEIVER
光纤类型：	POF
JESD-609代码：	e3
安装特点：	THROUGH HOLE MOUNT
最高工作温度：	70 °C
最低工作温度：
接收类型：	DIGITAL
最大供电电压：	5.25 V
最小供电电压：	4.75 V
标称供电电压：	5 V
表面贴装：	NO
端子面层：	TIN
Base Number Matches：	1

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