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产品型号HFE4225-022的Datasheet PDF文件预览

HFE4225

Next Generation High Power LEDs, Plastic ST Package

FEATURES

•

Industry standard ST¨ fiber connector

850 nm GaAIAs LED

Fiber Dip package style

High reliability construction

Straight plastic barrel and housing

Wave solderable

FIBER305.TIF

DESCRIPTION

OUTLINE DIMENSIONS in inches (mm)

Next Generation LEDs are designed for use in IEEE

802.3 Ethernet and IEEE 802.5J Token Ring applications

such as repeaters, bridges, hubs, routers, switches and

gateways. The devices are GaAIAs 850 nm LEDs which

are designed to efficiently couple optical power into

different fiber sizes ranging from

50/125 micron to 200/240 micron. They typically couple

-12.0 dBm into 62.5/125 micron cable at 60 mA peak.

The LED component is eletrically isolated from the

connector barrel. The mechanical construction uses a

high reliability ST Fiber-Dip fiber optic connector/housing

designed to be easily mounted on printed circuit boards

without the need for additional hardware. This component

is specifically designed to provide performance and

flexibility to the designer and should be driven with a 50%

duty cycle at 60 mA to 100 mA peak forward current for

the electrical input signal.

Next Generation LEDs have been updated and improved

from existing Fiber Optic LEDs. The Next Generation

LEDs provide an improved lensing scheme which makes

the fiber optic coupling more repeatable. The LEDs are

manufactured with an automated process that eliminates

variable introduced by a manual process. The Next

Generation LEDs are pin for pin compatible with existing

Fiber Dip LEDs.

FIBER309.DIM

Pinout

1. Common

2. Anode

5. Common

6. Anode

3. Cathode

4. Common

7. Anode

8. Common

Pin 1, 4, 5 & 8 are common.

Honeywell reserves the right to make

changes in order to improve design and

supply the best products possible.

HFE4225

Next Generation High Power LEDs, Plastic ST Package

ELECTRO-OPTICAL CHARACTERISTICS(Tà = -40 to +85¡C unless otherwise specified)

[À]

TYP

PARAMETER

SYMBOL MIN

MAX UNITS

TEST CONDITIONS

Fiber Coupled Power [Á] (HFE4225-X22)

Peak, Tà=25¡C

Peak over temp.

PÞÙ

dBm

I¸=100 mA Peak 50/125µm

fiber, NA = 0.20

-17.3 -13.8 -11.4

-18.9 -10.8

Fiber Coupled Power [Á]

Peak, Tà=25¡C

Peak over temp.

Fiber Coupled Power [Á]

Peak, Tà=25¡C

Peak over temp.

Fiber Coupled Power [Á]

Peak, Tà=25¡C

Peak over temp.

Fiber Coupled Power [Á] (HFE4225-X23)

Peak, Tà=25¡C

Peak over temp.

PÞÙ

dBm

I¸ = 60 mA Peak 50/125 µm

fiber, NA = 0.20

-18.8 -15.8 -13.8

-19.8

-12.8

I¸ = 100 mA Peak 62.5/125 µm

fiber, NA = 0.275

-13.5 -10.0

-15.1

-7.6

-7.0

I¸ = 60 mA Peak 62.5/125 µm

fiber, NA = 0.275

-15.0 -12.0 -10.0

-16.0

-9.0

I¸ = 60 mA Peak 62.5/125 µm

fiber, NA = 0.275

-15.0 -10.5

-16.0

-9.0

-8.0

Forward Voltage

V¸

êV¸/êT

Báß

1.84

I¸ = 100 mA

I¸ = 60 mA

I¸ = 100 mA

I¸ = 60 mA

Iß = 10 µA

1.48

1.70

-0.18

-0.22

3.8

856

850

4.0

-0.017

-0.006

4.0

2.09

Forward Voltage Temperature

Coefficient

Reverse Voltage

mV/¡C

dB/¡C

¡C/W

1.8

810

Peak Wavelength

æÎ

895

885

I¸ = 100 mA DC

I¸ = 60 mA DC

I¸ = 100 mA DC

I¸ = 60 mA DC

I¸ = 60 mA peak, No Prebias

I¸ = 100 mA

Spectral Bandwidth (FWHM)

Response Time

PÞ Temperature Coefficient

tß/t¸

êPÞ/êT

rØ

6.3

I¸ = 60 mA

Series Resistance

Device Capacitance

Thermal Resistance

Notes

260

Vß = 0 V, f = 1 MHz

Heat sinked

1. Typical specifications are for operations at TÙ= 25¡C.

2. PÞÙ is measured using a 10 meter mode stripped cable which is intended to accurately represent a working system.

ABSOLUTE MAXIMUM RATINGS

Storage temperature

Case operating temperature

Lead solder temperature

Reverse voltage

-55 to +85¡C

-40 to +85¡C

269¡C, 10 s

1.8 V

Continuous forward current

(heat sinked)

100 mA

Stresses greater than those listed under "Absolute Maximum

Ratings" may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods of time may affect

reliability.

Honeywell reserves the right to make

changes in order to improve design and

supply the best products possible.

HFE4225

Next Generation High Power LEDs, Plastic ST Package

ORDER GUIDE

WARNING

Under certain application conditions, the infrared optical output

of this device may exceed Class 1 eye safety limits, as defined

by IEC 825-1 (1993-11). Do not use magnification (such as a

microscope or other focusing equipment) when viewing the

device's output.

Description

Catalog Listing

Straight plastic barrel and housing, HFE4225-022

standard power

Straight plastic barrel and housing, HFE4225-422

crimped leads, standard power

CAUTION

The inherent design of this component causes

it to be sensitive to electrostatic discharge

(ESD). To prevent ESD-induced damage

and/or degradation to equipment, take normal

ESD precautions when handling this product.

Straight plastic barrel and housing, HFE4225-023

extended power

Straight plastic barrel and housing, HFE4225-423

crimped leads, extended power

Fig. 1

Typical Optical Power Output vs Forward

Fig. 2

Typical Spectral Output vs Wavelength

FIBER021.GRA

FIBER105.GRA

Current

Fig. 3

Typical Optical Power Output vs Case

FIBER025.GRA

Temperature

All Performance Curves Show Typical Values

Honeywell reserves the right to make

changes in order to improve design and

supply the best products possible.

型号:	HFE4225-022
生命周期：	Active
包装说明：	DIP
Reach Compliance Code：	unknown
风险等级：	5.79
主体宽度：	12.7 mm
主体高度：	10.16 mm
主体长度或直径：	27.74 mm
连接类型：	ST CONNECTOR
最长下降时间：	4 ns
光纤设备类型：	LED EMITTER
光纤类型：	50/125, 62.5/125, 200/240, MMF
安装特点：	THROUGH HOLE MOUNT
信道数量：	1
最高工作温度：	85 °C
最低工作温度：	-40 °C
最大工作波长：	895 nm
最小工作波长：	810 nm
标称工作波长：	856 nm
封装形式：	DIP
上升时间：	4 ns
光谱宽度：	55 nm
电源电流：	100 mA
最大供电电压：	2.09 V
最小供电电压：	1.48 V
标称供电电压：	1.84 V
表面贴装：	NO
Base Number Matches：	1

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