欢迎访问ic37.com |
会员登录 免费注册
发布采购
所在地: 型号: 精确
  • 批量询价
  •  
  • 供应商
  • 型号
  • 数量
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
更多
  • HI6555 V300图
  • 集好芯城

     该会员已使用本站13年以上
  • HI6555 V300
  • 数量15477 
  • 厂家HAISI 
  • 封装BGA 
  • 批号最新批次 
  • 原厂原装公司现货
  • QQ:3008092965QQ:3008092965 复制
    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • HI6555图
  • 深圳市毅创腾电子科技有限公司

     该会员已使用本站16年以上
  • HI6555
  • 数量3000 
  • 厂家HISILICON/海思 
  • 封装BGA 
  • 批号22+ 
  • ★只做原装★正品现货★原盒原标★
  • QQ:2355507162QQ:2355507162 复制
    QQ:2355507165QQ:2355507165 复制
  • 86-755-83616256 QQ:2355507162QQ:2355507165
  • HI6555GFCV110图
  • 深圳市特拉特科技有限公司

     该会员已使用本站2年以上
  • HI6555GFCV110
  • 数量18000 
  • 厂家HISILICON/海思 
  • 封装BGA 
  • 批号22+ 
  • 原装正品,品质保证,值得你信赖
  • QQ:709809857QQ:709809857 复制
  • 0755-82531732 QQ:709809857
  • HI6555图
  • 深圳市瑞天芯科技有限公司

     该会员已使用本站7年以上
  • HI6555
  • 数量20000 
  • 厂家HISILICON/海思 
  • 封装BGA 
  • 批号22+ 
  • 深圳现货库存,保证原装正品
  • QQ:1940213521QQ:1940213521 复制
  • 15973558688 QQ:1940213521

产品型号HI667A的Datasheet PDF文件预览

Spec. No. : HE9007-A  
Issued Date : 1998.01.25  
Revised Date : 2000.11.01  
Page No. : 1/2  
HI-SINCERITY  
MICROELECTRONICS CORP.  
HI667A  
PNP EPITAXIAL PLANAR TRANSISTOR  
Description  
The HI667A is designed for low frequency power amplifier.  
(Ta=25°C)  
Absolute Maximum Ratings  
Maximum Temperatures  
Storage Temperature............................................................................................ -55 ~ +150 °C  
Junction Temperature .................................................................................................... +150 °C  
Maximum Power Dissipation  
Total Power Dissipation (Tc=25°C) .................................................................................... 20 W  
Maximum Voltages and Currents  
BVCBO Collector to Base Voltage................................................................................... -120 V  
BVCEO Collector to Emitter Voltage................................................................................ -100 V  
BVEBO Emitter to Base Voltage.......................................................................................... -5 V  
IC Collector Current............................................................................................................. -1 A  
(Ta=25°C)  
Characteristics  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Test Conditions  
BVCBO  
BVCEO  
BVEBO  
ICBO  
*VCE(sat)  
*VBE(on)  
*hFE1  
*hFE2  
fT  
-120  
-100  
-5  
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
uA  
V
V
IC=-100uA  
IC=-1mA  
IC=-10uA  
-10  
-1  
-1.5  
200  
-
VCB=-100V  
IC=-500mA, IB=-50mA  
VCE=-5V, IC=-150mA  
VCE=-5V, IC=-150mA  
VCE=-5V, IC=-500mA  
VCE=-5V, IC=-150mA  
VCB=-10V, f=1MHz, IE=0  
-
60  
30  
-
-
140  
12  
-
-
MHz  
pF  
Cob  
-
*Pulse Test : Pulse Width 380us, Duty Cycle2%  
Classification Of hFE1  
Rank  
B
C
Range  
60-120  
100-200  
HSMC Product Specification  
Spec. No. : HE9007-A  
Issued Date : 1998.01.25  
Revised Date : 2000.11.01  
Page No. : 2/2  
HI-SINCERITY  
MICROELECTRONICS CORP.  
TO-251 Dimension  
Marking :  
A
B
C
HSMC Logo  
Part Number  
Date Code  
Product Series  
D
H
Rank  
Ink Mark  
F
G
Style : Pin 1.Base 2.Collector 3.Emitter  
3
I
K
E
2
1
J
3-Lead TO-251 Plastic Package  
HSMC Package Code : I  
*:Typical  
Inches  
Min. Max.  
Millimeters  
Inches  
Millimeters  
Min. Max.  
DIM  
DIM  
Min.  
Max.  
0.55  
1.50  
0.60  
2.40  
6.80  
7.20  
Min.  
0.2559  
Max.  
-
A
B
C
D
E
F
0.0177 0.0217  
0.0354 0.0591  
0.0177 0.0236  
0.0866 0.0945  
0.2520 0.2677  
0.2677 0.2835  
0.45  
0.90  
0.45  
2.20  
6.40  
6.80  
G
H
I
J
K
6.50  
-
-
-
-
*0.1811  
0.0354  
0.0315  
-
-
-
*4.60  
0.90  
0.80  
5.50  
0.2047 0.2165  
5.20  
Notes : 1.Dimension and tolerance based on our Spec. dated May. 24,1995.  
2.Controlling dimension : millimeters.  
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.  
Material :  
Lead : 42 Alloy ; solder plating  
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.  
HSMC reserves the right to make changes to its products without notice.  
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory :  
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.  
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454  
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel : 886-3-5983621~5 Fax : 886-3-5982931  
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel : 886-3-5977061 Fax : 886-3-5979220  
HSMC Product Specification  
配单直通车
HI667AC产品参数
型号:HI667AC
生命周期:Obsolete
IHS 制造商:HSMC CORP
包装说明:,
Reach Compliance Code:unknown
风险等级:5.84
最大集电极电流 (IC):1 A
配置:Single
最小直流电流增益 (hFE):100
最高工作温度:150 °C
极性/信道类型:PNP
最大功率耗散 (Abs):20 W
子类别:Other Transistors
表面贴装:NO
  •  
  • 供货商
  • 型号 *
  • 数量*
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
批量询价选中的记录已选中0条,每次最多15条。
 复制成功!