HIN213ECAZ-T全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

HIN202E, HIN206E, HIN207E, HIN208E,

HIN211E, HIN213E, HIN232E

®

Data Sheet

November 4, 2005

FN4315.16

±15kV, ESD-Protected, +5V Powered,

RS-232 Trans mitters /Receivers

Features

• Pb-Free Plus Anneal Available (RoHS Compliant)

• High Speed ISDN Compatible . . . . . . . . . . . . . 230kbits/s

• ESD Protection for RS-232 I/O Pins to ±15kV (IEC61000)

• Meets All RS-232E and V.28 Specifications

The HIN202E, HIN206E, HIN207E, HIN208E, HIN211E,

HIN213E, HIN232E family of RS-232 transmitters/receivers

interface circuits meet all ElA high-speed RS-232E and V.28

specifications, and are particularly suited for those

applications where ±12V is not available. A redesigned

transmitter circuit improves data rate and slew rate, which

makes this suitable for ISDN and high speed modems. The

transmitter outputs and receiver inputs are protected to

±15kV ESD (Electrostatic Discharge). They require a single

+5V power supply and feature onboard charge pump voltage

converters which generate +10V and -10V supplies from the

5V supply. The family of devices offers a wide variety of

high-speed RS-232 transmitter/receiver combinations to

accommodate various applications (see Selection Table).

• Requires Only 0.1µF or Greater External Capacitors

• Two Receivers Active in Shutdown Mode (HIN213E)

• Requires Only Single +5V Power Supply

• Onboard Voltage Doubler/Inverter

• Low Power Consumption (Typ) . . . . . . . . . . . . . . . . . 5mA

• Low Power Shutdown Function (Typ) . . . . . . . . . . . . .1µA

• Three-State TTL/CMOS Receiver Outputs

The HIN206E, HIN211E and HIN213E feature a low power

shutdown mode to conserve energy in battery powered

applications. In addition, the HIN213E provides two active

receivers in shutdown mode allowing for easy “wakeup”

capability.

• Multiple Drivers

- ±10V Output Swing for +5V Input

- 300Ω Power-Off Source Impedance

- Output Current Limiting

- TTL/CMOS Compatible

The drivers feature true TTL/CMOS input compatibility, slew

rate-limited output, and 300Ω power-off source impedance.

The receivers can handle up to ±30V input, and have a 3kΩ

to 7kΩ input impedance. The receivers also feature

hysteresis to greatly improve noise rejection.

• Multiple Receivers

- ±30V Input Voltage Range

- 3kΩ to 7kΩ Input Impedance

- 0.5V Hysteresis to Improve Noise Rejection

Applications

• Any System Requiring High-Speed RS-232

Communications Port

- Computer - Portable, Mainframe, Laptop

- Peripheral - Printers and Terminals

- Instrumentation, UPS

- Modems, ISDN Terminal Adaptors

Selection Table

NUMBER OF

0.1µF

EXTERNAL

CAPACITORS

NUMBER OF

RECEIVERS

ACTIVE IN

NUMBER OF

RS-232

DRIVERS

NUMBER OF

RS-232

RECEIVERS

LOW POWER

SHUTDOWN/TTL

THREE-STATE

PART

NUMBER

POWER SUPPLY

VOLTAGE

SHUTDOWN

HIN202E

HIN206E

HIN207E

HIN208E

HIN211E

HIN213E

HIN232E

+5V

2

4

5

4

2

3

4

5

2

4 Capacitors

No/No

Yes/Yes

No/No

0

2

0

No/No

Yes/Yes

No/No

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.

1

All other trademarks mentioned are the property of their respective owners.

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Ordering Information

Ordering Information (Continued)

TEMP.

RANGE

(°C)

TEMP.

RANGE

(°C)

PART

MARKING

PKG.

DWG. #

PART

MARKING

PKG.

DWG. #

PART NO.

HIN202ECB

PACKAGE

PART NO.

PACKAGE

HIN202ECB

0 to 70 16 Ld SOIC (W) M16.3

HIN206EIAZA-T HIN206EIAZ 24 Ld SSOP Tape and

M24.209

(Note)

Reel (Pb-free)

HIN202ECB-T

HIN202ECB 16 Ld SOIC (W) Tape and M16.3

Reel

HIN207ECA-T

HIN207ECA 24 Ld SSOP Tape and

Reel

HIN202ECBZ

(Note)

202ECBZ

0 to 70 16 Ld SOIC (W) M16.3

(Pb-free)

HIN207ECAZ

(Note)

HIN207ECAZ 0 to 70 24 Ld SSOP

(Pb-free)

HIN202ECBZ-T 202ECBZ

(Note)

16 Ld SOIC (W) Tape and M16.3

Reel (Pb-free)

HIN207ECAZ-T HIN207ECAZ 24 Ld SSOP Tape and

(Note)

Reel (Pb-free)

HIN202ECBN

HIN202ECBN 0 to 70 16 Ld SOIC (N) M16.15

HIN207ECB

HIN207ECB-T

HIN207ECB

0 to 70 24 Ld SOIC

M24.3

HIN202ECBN-T HIN202ECBN 16 Ld SOIC (N) Tape and M16.15

Reel

HIN207ECB 24 Ld SOIC Tape and

Reel

HIN202ECBNZ 202ECBNZ

(Note)

0 to 70 16 Ld SOIC (N) M16.15

(Pb-free)

HIN207ECBZ

(Note)

HIN207ECBZ 0 to 70 24 Ld SOIC

M24.3

(Pb-free)

HIN202ECBNZ-T 202ECBNZ

(Note)

16 Ld SOIC (N) Tape and M16.15

Reel (Pb-free)

HIN207ECBZ-T HIN207ECBZ 24 Ld SOIC Tape and

(Note)

Reel (Pb-free)

HIN202ECP

202ECPZ

0 to 70 16 Ld PDIP

E16.3

HIN207EIA

-40 to 85 24 Ld SSOP

M24.209

HIN202ECPZ

(Note)

0 to 70 16 Ld PDIP*

(Pb-free)

HIN207EIAZ

(Note)

HIN207EIAZ -40 to 85 24 Ld SSOP

(Pb-free)

HIN202EIB

-40 to 85 16 Ld SOIC (W) M16.3

HIN207EIAZ-T

(Note)

HIN207EIAZ 24 Ld SSOP Tape and

Reel (Pb-free)

M24.209

HIN202EIB-T

16 Ld SOIC (W) Tape and M16.3

Reel

HIN207EIB

-40 to 85 24 Ld SOIC

M24.3

HIN202EIBZ

(Note)

202EIBZ

-40 to 85 16 Ld SOIC (W) M16.3

(Pb-free)

HIN207EIB-T

24 Ld SOIC Tape and

Reel

HIN202EIBZ-T

(Note)

16 Ld SOIC (W) Tape and M16.3

Reel (Pb-free)

HIN207EIBZ

(Note)

HIN207EIBZ -40 to 85 24 Ld SOIC

(Pb-free)

M24.3

HIN202EIBN

HIN202EIBN -40 to 85 16 Ld SOIC (N) M16.15

HIN207EIBZ-T

(Note)

HIN207EIBZ 24 Ld SOIC Tape and

Reel (Pb-free)

HIN202EIBN-T HIN202EIBN 16 Ld SOIC (N) Tape and M16.15

Reel

HIN208ECA

0 to 70 24 Ld SSOP

M24.209

HIN202EIBNZ

202EIBNZ

-40 to 85 16 Ld SOIC (N) M16.15

(Pb-free)

(Note)

HIN208ECA-T

HIN208ECA 24 Ld SSOP Tape and

Reel

HIN202EIBNZ-T 202EIBNZ

(Note)

16 Ld SOIC (N) Tape and M16.15

Reel (Pb-free)

HIN208ECAZ

(Note)

HIN208ECAZ 0 to 70 24 Ld SSOP

(Pb-free)

M24.209

HIN206ECB

0 to 70 24 Ld SOIC

M24.3

HIN208ECAZ-T HIN208ECAZ 24 Ld SSOP Tape and

(Note) Reel (Pb-free)

HIN206ECB-T

HIN206ECB 24 Ld SOIC Tape and

Reel

HIN208ECAZA-T HIN208ECAZ 24 Ld SSOP Tape and

(Note)

HIN206ECBZ

(Note)

HIN206ECBZ 0 to 70 24 Ld SOIC

(Pb-free)

M24.3

Reel (Pb-free)

HIN208ECB

HIN208ECB-T

HIN208ECB

0 to 70 24 Ld SOIC

M24.3

HIN206ECBZ-T HIN206ECBZ 24 Ld SOIC Tape and

(Note)

Reel (Pb-free)

HIN208ECB 24 Ld SOIC Tape and

Reel

HIN206EIA

-40 to 85 24 Ld SSOP

M24.209

HIN208ECBZ

(Note)

HIN208ECBZ 0 to 70 24 Ld SOIC

(Pb-free)

M24.3

HIN206EIAZ

(Note)

HIN206EIAZ -40 to 85 24 Ld SSOP

(Pb-free)

HIN208ECBZ-T HIN208ECBZ 24 Ld SOIC Tape and

(Note)

HIN206EIAZ-T

(Note)

HIN206EIAZ 24 Ld SSOP Tape and

Reel (Pb-free)

M24.209

Reel (Pb-free)

HIN208EIA

HIN208EIA-T

HIN208EIA

-40 to 85 24 Ld SSOP

M24.209

HIN206EIAZA

(Note)

HIN206EIAZ -40 to 85 24 Ld SSOP

(Pb-free)

24 Ld SSOP Tape and

Reel

FN4315.16

2

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Ordering Information (Continued)

TEMP.

RANGE

(°C)

TEMP.

RANGE

(°C)

PART

MARKING

PKG.

DWG. #

PART

MARKING

PKG.

DWG. #

PART NO.

PACKAGE

PART NO.

HIN232ECA

PACKAGE

HIN208EIAZ

(Note)

HIN208EIAZ -40 to 85 24 Ld SSOP

(Pb-free)

M24.209

HIN232ECA

0 to 70 16 Ld SSOP

M16.209

HIN232ECA-T

HIN232ECA 16 Ld SSOP Tape and

Reel

HIN208EIAZ-T

(Note)

HIN208EIAZ 24 Ld SSOP Tape and

Reel (Pb-free)

M24.209

HIN232ECAZ-T HIN232ECAZ 16 Ld SSOP Tape and

M16.209

HIN208EIB

-40 to 85 24 Ld SOIC

M24.3

(Note)

Reel (Pb-free)

HIN208EIBZ

(Note)

HIN208EIBZ -40 to 85 24 Ld SOIC

(Pb-free)

HIN232ECB

HIN232ECB-T

HIN232ECB

0 to 70 16 Ld SOIC (W) M16.3

HIN232ECB 16 Ld SOIC (W) Tape and M16.3

Reel

HIN211ECA

0 to 70 28 Ld SSOP

M28.209

HIN211ECA-T

HIN211ECA 28 Ld SSOP Tape and

Reel

HIN232ECBN

HIN232ECBN 0 to 70 16 Ld SOIC (N) M16.15

HIN232ECBN-T HIN232ECBN 16 Ld SOIC (N) Tape and M16.15

Reel

HIN211ECAZ

(Note)

HIN211ECAZ 0 to 70 28 Ld SSOP

(Pb-free)

M28.209

HIN232ECBNZ 232ECBNZ

(Note)

0 to 70 16 Ld SOIC (N) M16.15

(Pb-free)

HIN211ECAZ-T HIN211ECAZ 28 Ld SSOP Tape and

(Note)

Reel (Pb-free)

HIN232ECBNZ-T 232ECBNZ

(Note)

16 Ld SOIC (N) Tape and M16.15

Reel (Pb-free)

HIN211ECB

0 to 70 28 Ld SOIC

M28.3

HIN211ECBZ

(Note)

HIN211ECBZ 0 to 70 28 Ld SOIC

(Pb-free)

HIN232ECBZ

(Note)

232ECBZ

0 to 70 16 Ld SOIC (W) M16.3

(Pb-free)

HIN211ECBZ-T HIN211ECBZ 28 Ld SOIC Tape and

M28.3

HIN232ECBZ-T 232ECBZ

(Note)

16 Ld SOIC (W) Tape and M16.3

Reel (Pb-free)

(Note)

Reel (Pb-free)

HIN211EIA

HIN211EIA-T

HIN211EIA

-40 to 85 28 Ld SSOP

M28.209

HIN232ECP

0 to 70 16 Ld PDIP

E16.3

28 Ld SSOP Tape and

Reel

HIN232ECPZ

(Note)

HIN232ECPZ 0 to 70 16 Ld PDIP*

(Pb-free)

HIN211EIAZ

(Note)

HIN211EIAZ -40 to 85 28 Ld SSOP

(Pb-free)

M28.209

HIN232EIBN

HIN232EIBN -40 to 85 16 Ld SOIC (N) M16.15

HIN232EIBN-T HIN232EIBN 16 Ld SOIC (N) Tape and M16.15

Reel

HIN211EIAZ-T

(Note)

HIN211EIAZ 28 Ld SSOP Tape and

Reel (Pb-free)

HIN232EIBNZ

(Note)

232EIBNZ

-40 to 85 16 Ld SOIC (N) M16.15

(Pb-free)

HIN211EIB

-40 to 85 28 Ld SOIC

M28.3

HIN211EIBZ

(Note)

HIN211EIBZ -40 to 85 28 Ld SOIC

(Pb-free)

HIN232EIBNZ-T 232EIBNZ

(Note)

16 Ld SOIC (N) Tape and M16.15

Reel (Pb-free)

HIN213ECA

0 to 70 28 Ld SSOP

M28.209

HIN232EIV

-40 to 85 16 Ld TSSOP M16.173

HIN213ECA-T

HIN213ECA 28 Ld SSOP Tape and

Reel

HIN232EIV-T

16 Ld TSSOP Tape and M16.173

Reel

HIN213ECAZ

(Note)

HIN213ECAZ 0 to 70 28 Ld SSOP

(Pb-free)

M28.209

HIN232EIVZ

(Note)

232EIVZ

-40 to 85 16 Ld TSSOP M16.173

(Pb-free)

HIN213ECAZ-T HIN213ECAZ 28 Ld SSOP Tape and

(Note)

HIN232EIVZ-T

(Note)

16 Ld TSSOP Tape and M16.173

Reel (Pb-free)

HIN213EIA

HIN213EIA-T

HIN213EIA

-40 to 85 28 Ld SSOP

M28.209

*Pb-free PDIPs can be used for through hole wave solder processing

only. They are not intended for use in Reflow solder processing

applications.

28 Ld SSOP Tape and

Reel

NOTE: Intersil Pb-free plus anneal products employ special Pb-free

material sets; molding compounds/die attach materials and 100%

matte tin plate termination finish, which are RoHS compliant and

compatible with both SnPb and Pb-free soldering operations. Intersil

Pb-free products are MSL classified at Pb-free peak reflow

temperatures that meet or exceed the Pb-free requirements of

IPC/JEDEC J STD-020.

HIN213EIAZ

(Note)

HIN213EIAZ -40 to 85 28 Ld SSOP

(Pb-free)

M28.209

HIN213EIAZ-T

(Note)

HIN213EIAZ 28 Ld SSOP Tape and

Reel (Pb-free)

HIN213EIB

-40 to 85 28 Ld SOIC

M28.3

HIN213EIBZ

(Note)

HIN213EIBZ -40 to 85 28 Ld SOIC

(Pb-free)

FN4315.16

3

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Pinouts

HIN202E (PDIP, SOIC)

HIN206E (SOIC, SSOP)

TOP VIEW

1

2

24

23

22

21

20

19

18

17

T3

T1

T2

T4

OUT

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

C1+

V+

V

CC

OUT

R2

IN

GND

T1

3

R2

OUT

C1-

C2+

C2-

V-

OUT

4

R1

SD

EN

IN

R1

T1

IN

5

R1

OUT

6

T2

T1

T4

T3

IN

7

T2

R2

OUT

8

R3

GND

OUT

R2

OUT

IN

9

16 R3

V

IN

CC

10

11

12

15

14

13

V-

C1+

V+

C2-

C2+

C1-

+5V

9

+5V

16

0.1µF

10

+

12

V

+

CC

C1+

11

V+

V-

0.1µF

+5V TO 10V

VOLTAGE DOUBLER

V

1

CC

C1-

0.1µF

C1+

+

13

+

14

+

2

+5V TO 10V

VOLTAGE INVERTER

0.1µF

C2+

V+

V-

3

4

+10V TO -10V

VOLTAGE INVERTER

15

2

C1-

C2-

0.1µF

C2+

+5V

+10V TO -10V

VOLTAGE INVERTER

T1

T2

6

400kΩ

5

7

T1

IN

C2-

OUT

0.1µF

+5V

T1

400kΩ

6

3

1

14

T2

400kΩ

T2

IN

11

OUT

T1

IN

OUT

+5V

T3

T4

400kΩ

18

+5V

T2

T3

T4

T3

IN

OUT

400kΩ

10

12

7

T2

R1

T2

IN

OUT

+5V

19

5

24

4

T4

IN

13

R1

IN

OUT

R1

IN

OUT

5kΩ

R1

5kΩ

R1

9

8

R2

IN

OUT

22

23

R2

R3

IN

OUT

R2

GND

17

20

16

21

15

R3

IN

OUT

EN

5kΩ

R3

SD

GND

8

FN4315.16

November 4, 2005

4

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Pinouts (Continued)

HIN207E (SOIC, SSOP)

HIN208E (SOIC, SSOP)

TOP VIEW

T2

T1

T3

1

2

24

23

22

21

20

19

18

17

16

15

14

13

OUT

T3

T1

T2

1

2

3

4

5

6

7

8

9

24 T4

OUT

R3

T4

IN

23 R2

IN

R2

3

IN

OUT

R2

T5

22

21

20

19

18

17

16

OUT

R2

4

OUT

IN

R1

IN

T1

IN

T4

T3

T2

5

OUT

IN

R1

T5

T4

T3

OUT

IN

R1

6

OUT

T2

IN

R1

IN

7

IN

T1

IN

R4

V-

GND

8

OUT

IN

R3

GND

OUT

IN

V

9

CC

V

CC

C1+

V+

10

11

12

C1+ 10

V+ 11

15 V-

C2-

14 C2-

13 C2+

C1-

C2+

C1- 12

+5V

9

0.1µF

10

+

12

V

+

CC

C1+

0.1µF

10

11

V

+

CC

C1+

V+

V-

0.1µF

+5V TO 10V

VOLTAGE DOUBLER

+

11

V+

0.1µF

C1-

+5V TO 10V

VOLTAGE DOUBLER

12

13

+

14

C1-

C2+

13

+10V TO -10V

VOLTAGE INVERTER

15

2

C2+

+

+10V TO -10V

VOLTAGE INVERTER

15

2

V-

C2-

0.1µF

14

C2-

0.1µF

+5V

T1

T2

400kΩ

5

+5V

T1

IN

OUT

400kΩ

7

T1

IN

OUT

+5V

400kΩ

18

19

1

+5V

T2

IN

OUT

400kΩ

6

3

T2

IN

OUT

T3

T4

400kΩ

24

+5V

T3

T4

T5

T3

T4

T3

IN

OUT

400kΩ

18

19

1

T3

T4

T5

T3

IN

OUT

21

6

20

7

T4

IN

24

T4

IN

R1

IN

OUT

21

5

20

4

5kΩ

R1

T5

IN

4

22

17

3

R1

IN

R2

R3

R4

OUT

R2

R3

R4

IN

OUT

5kΩ

R1

5kΩ

R2

R3

22

17

23

16

23

16

R2

R3

IN

OUT

R2

R3

IN

OUT

5kΩ

R4

R3

GND

8

FN4315.16

November 4, 2005

5

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Pinouts (Continued)

HIN211E (SOIC, SSOP)

HIN213E (SOIC, SSOP)

TOP VIEW

T3

T1

T2

1

2

3

4

5

6

7

8

9

28 T4

OUT

T3

T1

T2

1

2

3

4

5

6

7

8

9

28 T4

OUT

27 R3

26 R3

27 R3

IN

26 R3

OUT

25 SD

24 EN

23 R4

R2

IN

25 SD

24 EN

23 R4

R2

IN

R2

OUT

T2

IN

T2

IN

T1

IN

22 R4

21 T4

T1

IN

22 R4

21 T4

OUT

R1

OUT

IN

OUT

IN

R1

IN

20

T3

R1

IN

20

T3

GND 10

11

19 R5

18 R5

17 V-

GND 10

11

19 R5

18 R5

17 V-

OUT

IN

OUT

IN

V

CC

C1+ 12

V+ 13

C1+ 12

V+ 13

16 C2-

15 C2+

16 C2-

15 C2+

C1- 14

NOTE: R4 and R5 active in shutdown.

+5V

11

+5V

11

0.1µF

12

+

14

V

CC

+

CC

C1+

+

13

V+

V-

V+

V-

0.1µF

+5V TO 10V

VOLTAGE DOUBLER

+5V TO 10V

VOLTAGE DOUBLER

14

C1-

15

+

16

C2+

+

+10V TO -10V

VOLTAGE INVERTER

+10V TO -10V

VOLTAGE INVERTER

17

2

17

2

16

C2-

0.1µF

+5V

T1

400kΩ

7

T1

IN

T1

IN

OUT

+5V

T2

T3

T4

+5V

T2

T3

T4

400kΩ

6

3

1

6

3

1

T2

T3

T4

T2

T3

T4

T2

IN

T2

IN

OUT

20

T3

IN

T3

IN

OUT

21

8

28

9

21

8

28

9

T4

IN

T4

IN

R1

OUT

IN

OUT

5kΩ

R1

5

26

22

4

5

26

22

4

R2

R3

R4

R5

R2

R3

R4

R5

R2

R3

R4

R5

R2

R3

R4

R5

IN

OUT

5kΩ

R2

R3

R4

R2

R3

R4

27

23

27

23

19

24

18

25

19

24

18

25

IN

OUT

EN

OUT

EN

R5

SD

GND

10

FN4315.16

November 4, 2005

6

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Pinouts (Continued)

HIN232E (PDIP, SOIC, SSOP, TSSOP)

TOP VIEW

+5V

16

V

1

2

3

4

5

6

7

8

16

15

14

13

12

1

CC

C1+

V+

V

CC

0.1µF

C1+

+

2

+5V TO 10V

VOLTAGE INVERTER

0.1µF

GND

T1

V+

V-

3

4

C1-

C2+

C2-

V-

OUT

C2+

R1

T1

IN

+10V TO -10V

VOLTAGE INVERTER

6

5

C2-

0.1µF

OUT

11

10

9

IN

+5V

T1

14

400kΩ

11

T2

R2

OUT

T1

IN

OUT

R2

IN

OUT

+5V

T2

400kΩ

10

12

7

T2

R1

T2

IN

OUT

13

R1

IN

OUT

5kΩ

R1

9

8

R2

IN

R2

GND

15

Pin Des criptions

FUNCTION

V

Power Supply Input 5V ±10%, (5V ±5% HIN207E).

Internally generated positive supply (+10V nominal).

Internally generated negative supply (-10V nominal).

Ground Lead. Connect to 0V.

CC

V+

V-

GND

C1+

C1-

External capacitor (+ terminal) is connected to this lead.

External capacitor (- terminal) is connected to this lead.

External capacitor (+ terminal) is connected to this lead.

External capacitor (- terminal) is connected to this lead.

C2+

C2-

T

Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to V is connected to each lead.

IN

CC

T

Transmitter Outputs. These are RS-232 levels (nominally ±10V).

OUT

R

Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.

Receiver Outputs. These are TTL/CMOS levels.

IN

R

OUT

EN, EN

SD, SD

Receiver Enable Input. With EN = 5V (HIN213E EN=0V), the receiver outputs are placed in a high impedance state.

Shutdown Input. With SD = 5V (HIN213E SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance

state (except R4 and R5 of HIN213E) and the transmitters are shut off.

NC

No Connect. No connections are made to these leads.

FN4315.16

7

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Absolute Maximum Ratings

Thermal Information

V

to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V

< 6V

-0.3V) < V+ < 12V

Thermal Resistance (Typical, Note 1)

θ_JA(°C/W)

CC

V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . .(V

CC

16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . .

16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .

16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .

16 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . .

16 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . .

24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .

24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .

28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .

28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .

Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C

Maximum Storage Temperature Range . . . . . . . . . .-65°C to 150°C

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C

(SOIC and SSOP - Lead Tips Only)

110

100

155

145

90

75

135

70

V- to Ground . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)

Input Voltages

T

R

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V < (V+ +0.3V)

IN

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V

IN

Output Voltages

T

R

. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V

. . . . . . . . . . . . . . . . . (GND -0.3V) < V

< (V+ +0.3V)

OUT

TXOUT

RXOUT

OUT

Short Circuit Duration

100

T

R

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous

OUT

ESD Classification . . . . . . . . . . . . . . . . . . . . See Specification Table

Operating Conditions

*Pb-free PDIPs can be used for through hole wave solder

processing only. They are not intended for use in Reflow solder

processing applications.

Temperature Range

HIN2XXECX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C

HIN2XXEIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

1. θ is measured with the component mounted on an evaluation PC board in free air.

JA

Electrical Specifications Test Conditions: V = +5V ±10%, (V = +5V ±5% HIN207E); C1-C4 = 0.1µF; T = Operating Temperature

CC

A

Range

PARAMETER

SUPPLY CURRENTS

Power Supply Current, I

TEST CONDITIONS

MIN

TYP

MAX

UNITS

No Load,

HIN202E

-

8

15

20

mA

CC

T

= 25°C

A

HIN206E - HIN208E, HIN211E,

HIN213E

11

HIN232E

-

5

1

10

50

mA

µA

Shutdown Supply Current, I (SD)

CC

T

= 25°C

HIN206E, HIN211E

HIN213E

A

15

LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS

Input Logic Low, V

T

, EN, SD, EN, SD

-

2.0

2.4

-

0.8

-

V

lL

IN

Input Logic High, V

-

lH

IN

EN, SD, EN, SD

= 0V

-

V

Transmitter Input Pullup Current, I

T

15

0.1

4.6

0.5

200

0.4

-

µA

V

P

IN

TTL/CMOS Receiver Output Voltage Low, V

I

= 1.6mA (HIN202E, HIN232E, I

= 3.2mA)

OUT

-

OL

OUT

TTL/CMOS Receiver Output Voltage High, V

TTL/CMOS Receiver Output Leakage

RECEIVER INPUTS

= -1mA

3.5

-

V

OH

EN = V , EN = 0, 0V < R

CC OUT

< V

±10

µA

CC

RS-232 Input Voltage Range, V

-30

-

+30

7.0

-

V

kΩ

V

IN

Receiver Input Impedance, R

T

= 25°C, V = ±3V

3.0

5.0

1.2

1.5

1.7

1.5

0.5

IN

A IN

Receiver Input Low Threshold, V (H-L)

V

= 5V,

Active Mode

-

IN

CC

= 25°C

T

A

Shutdown Mode HIN213E R4 and R5

Active Mode

-

V

Receiver Input High Threshold, V (L-H)

IN

V

= 5V,

2.4

1.0

V

CC

= 25°C

T

A

Shutdown Mode HIN213E R4 and R5

-

V

Receiver Input Hysteresis, V

V

= 5V, No Hysteresis in Shutdown Mode

CC

0.2

V

HYST

FN4315.16

8

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Electrical Specifications Test Conditions: V = +5V ±10%, (V = +5V ±5% HIN207E); C1-C4 = 0.1µF; T = Operating Temperature

CC

A

Range (Continued)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

TIMING CHARACTERISTICS

Output Enable Time, t

HIN206E, HIN211E, HIN213E

-

600

200

4.0

0.5

20

-

ns

EN

Output Disable Time, t

HIN206E, HIN211E, HIN213E

HIN213E SD = 0V, R4, R5

-

DIS

Transmitter, Receiver Propagation Delay, t

-

40

10

45

µs

PD

HIN213E SD = V , R1 - R5

CC

-

µs

All except HIN213E

-

µs

Transition Region Slew Rate, SR

R

= 3kΩ, C = 1000pF Measured from +3V to -3V

3

V/µs

T

L

or -3V to +3V, 1 Transmitter Switching (Note 2)

TRANSMITTER OUTPUTS

Output Voltage Swing, T

Transmitter Outputs, 3kΩ to Ground

±5

300

-

±9

-

±10

V

Ω

OUT

Output Resistance, T

V

= V+ = V- = 0V, V

= ±2V

OUT

-

OUT

CC

RS-232 Output Short Circuit Current, I

ESD PERFORMANCE

RS-232 Pins

T

Shorted to GND

±10

mA

SC

OUT

Human Body Model

-

±15

±8

-

kV

(T

, R )

OUT IN

IEC61000-4-2 Contact Discharge

IEC61000-4-2 Air Gap (Note 3)

Human Body Model

±15

±2

All Other Pins

NOTES:

2. Guaranteed by design.

3. Meets Level 4.

Tes t Circuits (HIN232E)

+4.5V TO

+5.5V INPUT

C1+

1

2

3

16

V

CC

V+

15

14

GND

-

+

0.1µF

C3

C1-

T1

OUT

V

C1+

V+

1

2

3

4

5

6

7

8

16

CC

4 C2+

5 C2-

R1 13

IN

+

0.1µF

3kΩ

GND 15

R1

12

11

10

9

C1

-

OUT

T1

C1-

C2+

C2-

V-

14

13

12

11

T1 OUTPUT

OUT

T1

IN

6 V-

T2

R1

IN

RS-232 ±30V INPUT

TTL/CMOS OUTPUT

TTL/CMOS INPUT

+

0.1µF

T2

IN

7

8

OUT

C2

-

R1

OUT

R2

-

R2

OUT

+

IN

T1

IN

0.1µF C4

T2

TTL/CMOS INPUT

T2 10

IN

OUT

3kΩ

R

= V /I T2

IN

OUT

V

OUT

R2

9

TTL/CMOS OUTPUT

R2

OUT

IN

T1

OUT

T2

OUTPUT

= ±2V

A

IN

RS-232

±30V INPUT

FIGURE 1. GENERAL TEST CIRCUIT

FIGURE 2. POWER-OFF SOURCE RESISTANCE

CONFIGURATION

FN4315.16

9

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

VOLTAGE DOUBLER

VOLTAGE INVERTER

S5

S1

S2

C2+

C1+

V+ = 2V

S6

CC

V

GND

CC

+

C3

C2

C4

C1

-

V

GND

CC

GND

V- = - (V+)

C1-

S4

S3

C2-

S7

S8

RC

OSCILLATOR

FIGURE 3. CHARGE PUMP

and (V+ -0.6V). Each transmitter input has an internal 400kΩ

pullup resistor so any unused input can be left unconnected

and its output remains in its low state. The output voltage

swing meets the RS-232C specifications of ±5V minimum

with the worst case conditions of: all transmitters driving 3kΩ

Detailed Des cription

The HIN2XXE family of high-speed RS-232

transmitters/receivers are powered by a single +5V power

supply, feature low power consumption, and meet all ElA

RS232C and V.28 specifications. The circuit is divided into

three sections: the charge pump, transmitter, and receiver.

minimum load impedance, V

= 4.5V, and maximum

CC

allowable operating temperature. The transmitters have an

internally limited output slew rate which is less than 30V/µs.

The outputs are short circuit protected and can be shorted to

ground indefinitely. The powered down output impedance is

a minimum of 300Ω with ±2V applied to the outputs and

Charge Pump

An equivalent circuit of the charge pump is illustrated in

Figure 3. The charge pump contains two sections: the

voltage doubler and the voltage inverter. Each section is

driven by a two phase, internally generated clock to

generate +10V and -10V. The nominal clock frequency is

125kHz. During phase one of the clock, capacitor C1 is

V

= 0V.

CC

Receivers

The receiver inputs accept up to ±30V while presenting the

required 3kΩ to 7kΩ input impedance even if the power is off

charged to V . During phase two, the voltage on C1 is

CC

added to V , producing a signal across C3 equal to twice

CC

(V

= 0V). The receivers have a typical input threshold of

CC

V

. During phase two, C2 is also charged to 2V , and

CC

then during phase one, it is inverted with respect to ground

CC

1.3V which is within the ±3V limits, known as the transition

region, of the RS-232 specifications. The receiver output is

to produce a signal across C4 equal to -2V . The charge

pump accepts input voltages up to 5.5V. The output

impedance of the voltage doubler section (V+) is

approximately 200Ω, and the output impedance of the

voltage inverter section (V-) is approximately 450Ω. A typical

application uses 0.1µF capacitors for C1-C4, however, the

value is not critical. Increasing the values of C1 and C2 will

lower the output impedance of the voltage doubler and

inverter, increasing the values of the reservoir capacitors, C3

and C4, lowers the ripple on the V+ and V- supplies.

CC

0V to V . The output will be low whenever the input is

CC

greater than 2.4V and high whenever the input is floating or

driven between +0.8V and -30V. The receivers feature 0.5V

hysteresis (except during shutdown) to improve noise

rejection. The receiver Enable line EN, (EN on HIN213E)

when unasserted, disables the receiver outputs, placing

them in the high impedance mode. The receiver outputs are

also placed in the high impedance state when in shutdown

mode (except HIN213E R4 and R5).

During shutdown mode (HIN206E, HIN211E and HIN213E)

V+

the charge pump is turned off, V+ is pulled down to V , V-

CC

V

CC

is pulled up to GND, and the supply current is reduced to

less than 10µA. The transmitter outputs are disabled and the

receiver outputs (except for HIN213E, R4 and R5) are

placed in the high impedance state.

400kΩ

300Ω

T

XIN

T

OUT

GND < T

< V

CC

V- < V

< V+

TOUT

V-

Trans mitters

The transmitters are TTL/CMOS compatible inverters which

translate the inputs to RS-232 outputs. The input logic

FIGURE 4. TRANSMITTER

threshold is about 26% of V , or 1.3V for V

= 5V. A logic

CC CC

1 at the input results in a voltage of between -5V and V- at

the output, and a logic 0 results in a voltage between +5V

FN4315.16

November 4, 2005

10

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Application Information

V

CC

The HIN2XXE may be used for all RS-232 data terminal and

communication links. It is particularly useful in applications

where ±12V power supplies are not available for

R

XIN

R

OUT

-30V < R

< +30V

XIN

GND < V

< V

CC

5kΩ

ROUT

GND

conventional RS-232 interface circuits. The applications

presented represent typical interface configurations.

FIGURE 5. RECEIVER

A simple duplex RS-232 port with CTS/RTS handshaking is

illustrated in Figure 7. Fixed output signals such as DTR

(data terminal ready) and DSRS (data signaling rate select)

is generated by driving them through a 5kΩ resistor

connected to V+.

T

IN

OR

In applications requiring four RS-232 inputs and outputs

(Figure 8), note that each circuit requires two charge pump

capacitors (C1 and C2) but can share common reservoir

capacitors (C3 and C4). The benefit of sharing common

reservoir capacitors is the elimination of two capacitors and

the reduction of the charge pump source impedance which

effectively increases the output swing of the transmitters.

R

IN

T

OUT

OR

V

OL

R

OUT

t

PLH

PHL

t

PHL + PLH

2

AVERAGE PROPAGATION DELAY =

FIGURE 6. PROPAGATION DELAY DEFINITION

+5V

-

HIN213E Operation in Shutdown

+

16

CTR (20) DATA

TERMINAL READY

1

The HIN213E features two receivers, R4 and R5, which

remain active in shutdown mode. During normal operation

the receivers propagation delay is typically 0.5µs. This

propagation delay may increase slightly during shutdown.

When entering shut down mode, receivers R4 and R5 are

+

C1

0.1µF

3

4

DSRS (24) DATA

SIGNALING RATE

SELECT

-

HIN232E

6

+

-

+

C2

0.1µF

RS-232

INPUTS AND OUTPUTS

5

-

T1

T2

11

14

not valid for 80µs after SD = V . When exiting shutdown

TD

TD (2) TRANSMIT DATA

IL

mode, all receiver outputs will be invalid until the charge

pump circuitry reaches normal operating voltage. This is

typically less than 2ms when using 0.1µF capacitors.

10

12

7

RTS (4) REQUEST TO SEND

RD (3) RECEIVE DATA

INPUTS RTS

OUTPUTS

13

RD

TTL/CMOS

R2

R1

9

8

CTS

CTS (5) CLEAR TO SEND

15

SIGNAL GROUND (7)

FIGURE 7. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS

HANDSHAKING

FN4315.16

November 4, 2005

11

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

1

4

+

C1

0.1µF

C2

0.1µF

HIN232E

5

3

-

T1

T2

11

14

TD

RTS

RD

TD (2) TRANSMIT DATA

RTS (4) REQUEST TO SEND

RD (3) RECEIVE DATA

10

12

7

INPUTS

OUTPUTS

TTL/CMOS

13

R2

R1

9

8

CTS

CTS (5) CLEAR TO SEND

15

V

16

CC

6

2

C4

C3

+5V

-

V- V+

RS-232

INPUTS AND OUTPUTS

0.2µF

V

16

4

CC

HIN232E

1

+

C1

C2

5

0.1µF

3

0.1µF

-

T1

T2

11

14

DTR

DSRS

DCD

R1

DTR (20) DATA TERMINAL READY

DSRS (24) DATA SIGNALING RATE SELECT

DCD (8) DATA CARRIER DETECT

R1 (22) RING INDICATOR

10

12

7

INPUTS

OUTPUTS

TTL/CMOS

13

R2

R1

9

8

15

SIGNAL GROUND (7)

FIGURE 8. COMBINING TWO HIN232Es FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS

Typical Performance Curves

12

10

8

12

10

8

0.1µF

V+ (V

CC

= 5V)

6

V+ (V

= 4V)

= 5V)

CC

V- (V

= 4V)

CC

4

T

= 25°C

A

2

V- (V

CC

TRANSMITTER OUTPUTS

OPEN CIRCUIT

0

3.0

3.5

4.0

4.5

5.0

5.5

6.0

0

5

10

15

|I

20

25

30

35

V

| (mA)

CC

LOAD

FIGURE 9. V- SUPPLY VOLTAGE vs V

FIGURE 10. V+, V- OUTPUT VOLTAGE vs LOAD

CC

FN4315.16

12

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Die Characteris tics

METALLIZATION:

PASSIVATION:

Type: Al

Thickness: 10kÅ ±1kÅ

Type: Nitride over Silox

Nitride Thickness: 8kÅ

Silox Thickness: 7kÅ

SUBSTRATE POTENTIAL

TRANSISTOR COUNT:

GND

185

PROCESS:

CMOS Metal Gate

Metallization Mas k Layout

HIN232E

V-

C2-

C2+

C1-

PIN 6

PIN 5

PIN 4

PIN 3

PIN 2 V+

PIN 1 C1+

T2

PIN 7

PIN 8

OUT

R2

IN

T3

PIN 9

OUT

PIN 17 V

CC

R2

PIN 10

OUT

PIN 11

T2

PIN 12

T1

PIN 13

PIN 14

R1

PIN 15

T1

OUT

PIN 16

GND

R1

IN

OUT

IN

FN4315.16

13

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Dual-In-Line Plas tic Packages (PDIP)

E16.3 (JEDEC MS-001-BB ISSUE D)

N

16 LEAD DUAL-IN-LINE PLASTIC PACKAGE

E1

INDEX

AREA

INCHES

MILLIMETERS

1 2

3

N/2

SYMBOL

MIN

MAX

0.210

-

MIN

-

MAX

5.33

-

NOTES

-B-

A

A1

A2

B

-

4

-A-

0.015

0.115

0.014

0.045

0.008

0.735

0.005

0.300

0.240

0.39

2.93

0.356

1.15

0.204

18.66

0.13

7.62

6.10

4

D

E

BASE

PLANE

0.195

0.022

0.070

0.014

0.775

-

4.95

0.558

1.77

0.355

19.68

-

A2

A

-C-

-

SEATING

PLANE

B1

C

8, 10

L

C

L

-

D1

B1

e_A

A1

A

D1

e

D

5

e_C

C

B

D1

E

5

e_B

0.010 (0.25) M

C

B S

0.325

0.280

8.25

7.11

6

NOTES:

E1

e

5

1. Controlling Dimensions: INCH. In case of conflict between English and

Metric dimensions, the inch dimensions control.

0.100 BSC

0.300 BSC

2.54 BSC

7.62 BSC

-

e

A

6

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication No. 95.

e

-

0.430

0.150

-

10.92

3.81

7

B

L

0.115

2.93

4

9

4. Dimensions A, A1 and L are measured with the package seated in JE-

N

16

DEC seating plane gauge GS-3.

Rev. 0 12/93

5. D, D1, and E1 dimensions do not include mold flash or protrusions.

Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).

e

6. E and

are measured with the leads constrained to be perpendic-

A

-C-

ular to datum

.

7. e and e are measured at the lead tips with the leads unconstrained.

B

C

e

must be zero or greater.

C

8. B1 maximum dimensions do not include dambar protrusions. Dambar

protrusions shall not exceed 0.010 inch (0.25mm).

9. N is the maximum number of terminal positions.

10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,

E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).

FN4315.16

14

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Small Outline Plastic Packages (SOIC)

M16.15 (JEDEC MS-012-AC ISSUE C)

N

16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

M

B M

H

INCHES

MILLIMETERS

E

SYMBOL

MIN

MAX

0.0688

0.0098

0.020

MIN

1.35

0.10

0.33

0.19

9.80

3.80

MAX

1.75

NOTES

-B-

A

A1

B

C

D

E

e

0.0532

0.0040

0.013

-

1

2

3

0.25

-

L

0.51

9

SEATING PLANE

A

0.0075

0.3859

0.1497

0.0098

0.3937

0.1574

0.25

-

-A-

10.00

4.00

3

h x 45°

D

4

-C-

0.050 BSC

1.27 BSC

-

α

H

h

0.2284

0.0099

0.016

0.2440

0.0196

0.050

5.80

0.25

0.40

6.20

0.50

1.27

-

e

A1

C

5

B

0.10(0.004)

L

6

0.25(0.010) M

C

A M B S

N

α

16

7

0°

8°

0°

8°

-

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Rev. 1 6/05

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above

the seating plane, shall not exceed a maximum value of 0.61mm

(0.024 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions are

not necessarily exact.

FN4315.16

15

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Thin Shrink Small Outline Plas tic Packages (TSSOP)

M16.173

N

16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

M

B M

E

INCHES

MIN

MILLIMETERS

E1

-B-

GAUGE

PLANE

SYMBOL

MAX

0.043

0.006

0.037

0.012

0.008

0.201

0.177

MIN

-

MAX

1.10

0.15

0.95

0.30

0.20

5.10

4.50

NOTES

A

A1

A2

b

-

0.002

0.033

0.0075

0.0035

0.193

0.169

0.05

0.85

0.19

0.09

4.90

4.30

-

1

2

3

-

L

0.25

0.010

0.05(0.002)

SEATING PLANE

A

9

-A-

c

-

D

3

-C-

E1

e

4

α

0.026 BSC

0.65 BSC

-

A2

e

A1

c

E

0.246

0.020

0.256

0.028

6.25

0.50

6.50

0.70

-

b

0.10(0.004)

L

6

0.10(0.004) M

C

A M B S

N

16

7

o

0

8

0

8

-

α

NOTES:

Rev. 1 2/02

1. These package dimensions are within allowable dimensions of

JEDEC MO-153-AB, Issue E.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions.

Interlead flash and protrusions shall not exceed 0.15mm (0.006

inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable

dambar protrusion shall be 0.08mm (0.003 inch) total in excess

of “b” dimension at maximum material condition. Minimum space

between protrusion and adjacent lead is 0.07mm (0.0027 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimen-

sions are not necessarily exact. (Angles in degrees)

FN4315.16

16

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Small Outline Plastic Packages (SSOP)

M16.209 (JEDEC MO-150-AC ISSUE B)

N

16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

M

B M

H

INCHES

MILLIMETERS

E

GAUGE

PLANE

SYMBOL

MIN

-

MAX

0.078

-

MIN

-

MAX

2.00

-

NOTES

-B-

A

A1

A2

B

-

0.002

0.065

0.009

0.004

0.233

0.197

0.05

1.65

0.22

0.09

5.90

5.00

-

1

2

3

0.072

0.014

0.009

0.255

0.220

1.85

0.38

0.25

6.50

5.60

-

L

0.25

SEATING PLANE

A

9

0.010

A2

-A-

C

D

E

-

D

3

-C-

4

α

e

0.026 BSC

0.65 BSC

-

e

A1

C

H

L

0.292

0.022

0.322

0.037

7.40

0.55

8.20

0.95

-

B

0.10(0.004)

6

0.25(0.010) M

C

A M B S

N

α

16

7

0°

8°

0°

8°

-

NOTES:

Rev. 3 6/05

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “B” does not include dambar protrusion. Allowable dambar

protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-

sion at maximum material condition.

10. Controlling dimension: MILLIMETER. Converted inch dimensions are

not necessarily exact.

FN4315.16

17

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Small Outline Plastic Packages (SOIC)

M16.3 (JEDEC MS-013-AA ISSUE C)

N

16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

M

B M

H

INCHES

MILLIMETERS

E

SYMBOL

MIN

MAX

MIN

2.35

0.10

0.33

0.23

10.10

7.40

MAX

2.65

NOTES

-B-

A

A1

B

C

D

E

e

0.0926

0.0040

0.013

0.1043

0.0118

0.0200

0.0125

0.4133

0.2992

-

0.30

-

1

2

3

L

0.51

9

SEATING PLANE

A

0.0091

0.3977

0.2914

0.32

-

-A-

10.50

7.60

3

h x 45°

D

4

-C-

0.050 BSC

1.27 BSC

-

α

H

h

0.394

0.010

0.016

0.419

0.029

0.050

10.00

0.25

0.40

10.65

0.75

1.27

-

e

A1

C

5

B

0.10(0.004)

L

6

0.25(0.010) M

C

A M B S

N

α

16

7

0°

8°

0°

8°

-

NOTES:

Rev. 1 6/05

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above

the seating plane, shall not exceed a maximum value of 0.61mm (0.024

inch)

10. Controlling dimension: MILLIMETER. Converted inch dimensions are

not necessarily exact.

FN4315.16

18

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Shrink Small Outline Plas tic Packages (SSOP)

M24.209 (JEDEC MO-150-AG ISSUE B)

N

24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

M

B M

H

INCHES

MILLIMETERS

E

GAUGE

PLANE

SYMBOL

MIN

MAX

MIN

-

MAX

2.00

-

NOTES

-B-

A

A1

A2

B

-

0.078

-

0.002

0.065

0.009

0.004

0.312

0.197

-

0.05

1.65

0.22

0.09

7.90

5.00

1

2

3

0.072

0.014

0.009

0.334

0.220

1.85

0.38

0.25

8.50

5.60

-

L

0.25

0.010

SEATING PLANE

A

9

-

-A-

C

D

E

D

3

4

-

-C-

α

µ

e

0.026 BSC

0.65 BSC

A2

e

A1

C

H

L

0.292

0.322

0.037

7.40

0.55

8.20

0.95

-

B

0.10(0.004)

0.022

6

7

-

0.25(0.010) M

C A M B S

N

α

24

o

0

8

0

8

NOTES:

Rev. 1 3/95

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.20mm

(0.0078 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “B” does not include dambar protrusion. Allowable dambar

protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-

sion at maximum material condition.

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

FN4315.16

19

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Small Outline Plas tic Packages (SOIC)

M24.3 (JEDEC MS-013-AD ISSUE C)

N

24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

M

B M

H

INCHES

MILLIMETERS

E

SYMBOL

MIN

MAX

MIN

2.35

0.10

0.33

0.23

MAX

2.65

0.30

0.51

0.32

15.60

7.60

NOTES

-B-

A

A1

B

C

D

E

e

0.0926

0.0040

0.013

0.1043

0.0118

0.020

-

1

2

3

L

9

SEATING PLANE

A

0.0091

0.5985

0.2914

0.0125

-

-A-

o

0.6141 15.20

3

h x 45

D

0.2992

7.40

4

-C-

0.05 BSC

1.27 BSC

-

α

µ

H

h

0.394

0.010

0.016

0.419

0.029

0.050

10.00

0.25

0.40

10.65

0.75

1.27

-

e

A1

C

5

B

0.10(0.004)

L

6

0.25(0.010) M

C A M B S

N

α

24

7

o

0

8

0

8

-

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

Rev. 0 12/93

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm

(0.006 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch)

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

FN4315.16

20

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Shrink Small Outline Plastic Packages (SSOP)

M28.209 (JEDEC MO-150-AH ISSUE B)

N

28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

M

B M

H

INCHES

MILLIMETERS

E

GAUGE

PLANE

SYMBOL

MIN

-

MAX

0.078

-

MIN

-

MAX

2.00

-

NOTES

-B-

A

A1

A2

B

-

0.002

0.065

0.009

0.004

0.390

0.197

0.05

1.65

0.22

0.09

9.90

5.00

-

1

2

3

0.072

0.014

0.009

0.413

0.220

1.85

0.38

0.25

10.50

5.60

-

L

0.25

SEATING PLANE

A

9

0.010

A2

-A-

C

D

E

-

D

3

-C-

4

α

e

0.026 BSC

0.65 BSC

-

e

A1

C

H

L

0.292

0.022

0.322

0.037

7.40

0.55

8.20

0.95

-

B

0.10(0.004)

6

0.25(0.010) M

C

A M B S

N

α

28

7

NOTES:

0°

8°

0°

8°

-

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2

Rev. 2 6/05

of Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.20mm (0.0078 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions.

Interlead flash and protrusions shall not exceed 0.20mm (0.0078

inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “B” does not include dambar protrusion. Allowable

dambar protrusion shall be 0.13mm (0.005 inch) total in excess of

“B” dimension at maximum material condition.

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

FN4315.16

21

November 4, 2005

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

Small Outline Plas tic Packages (SOIC)

M28.3 (JEDEC MS-013-AE ISSUE C)

N

28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

INDEX

AREA

0.25(0.010)

M

B M

H

INCHES

MILLIMETERS

E

SYMBOL

MIN

MAX

MIN

2.35

0.10

0.33

0.23

MAX

2.65

0.30

0.51

0.32

18.10

7.60

NOTES

-B-

A

A1

B

C

D

E

e

0.0926

0.0040

0.013

0.1043

0.0118

0.0200

0.0125

-

1

2

3

L

9

SEATING PLANE

A

0.0091

0.6969

0.2914

-

0.7125 17.70

3

-A-

o

h x 45

D

0.2992

7.40

4

0.05 BSC

1.27 BSC

-

-C-

α

µ

H

h

0.394

0.01

0.419

0.029

0.050

10.00

0.25

0.40

10.65

0.75

1.27

-

e

A1

C

5

B

0.10(0.004)

L

0.016

6

0.25(0.010) M

C A M B S

N

α

28

7

o

0

8

0

8

-

NOTES:

Rev. 0 12/93

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2

of Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. In-

terlead flash and protrusions shall not exceed 0.25mm (0.010

inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch)

10. Controlling dimension: MILLIMETER. Converted inch dimen-

sions are not necessarily exact.

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN4315.16

22

November 4, 2005

型号:	HIN213ECAZ-T
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Contact Manufacturer
零件包装代码：	SSOP
包装说明：	SSOP,
针数：	28
Reach Compliance Code：	unknown
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	5.11
差分输出：	NO
驱动器位数：	4
输入特性：	SCHMITT TRIGGER
接口集成电路类型：	LINE TRANSCEIVER
接口标准：	EIA-232-E; V.28
JESD-30 代码：	R-PDSO-G28
JESD-609代码：	e3
长度：	10.2 mm
湿度敏感等级：	3
功能数量：	4
端子数量：	28
最高工作温度：	70 °C
最低工作温度：
封装主体材料：	PLASTIC/EPOXY
封装代码：	SSOP
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）：	260
最大接收延迟：	40000 ns
接收器位数：	5
座面最大高度：	2 mm
最大供电电压：	5.5 V
最小供电电压：	4.5 V
标称供电电压：	5 V
表面贴装：	YES
技术：	CMOS
温度等级：	COMMERCIAL
端子面层：	MATTE TIN
端子形式：	GULL WING
端子节距：	0.65 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	40
最大传输延迟：	40000 ns
宽度：	5.3 mm
Base Number Matches：	1

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