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    • HIN232CPZ图

    • 深圳市励创源科技有限公司

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    • 数量35600 
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    • 北京元坤伟业科技有限公司

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    产品型号HIN232CPZ的概述

    芯片HIN232CPZ的概述 HIN232CPZ是一款基于RS-232通信标准设计的高性能电路集成芯片。它主要用于串行通信中的信号转换，能够实现TTL（Transistor-Transistor Logic）和RS-232的电压波形之间的转换。该芯片的设计目标是满足工业、通信、计算机和其他多种应用场景中的可靠数据传输需求。HIN232CPZ在提供高性能电气特性的同时，也注重低功耗和小型化设计，使得其在实际应用中表现出色。 HIN232CPZ采用单电源供电设计，通常在 +3V 到 +15V 电压范围内工作，为其在低功耗的电子产品中的广泛应用奠定了基础。该芯片具有多通道的接口能力，支持多种数据传输速率，并且内部集成了多个保护电路，能够抵御过压、欠压以及静电放电等异常情况，确保数据传输的可靠性。 芯片HIN232CPZ的详细参数 在了解HIN232CPZ的基本概念后，有必要对其详细参数进行深...

    产品型号HIN232CPZ的Datasheet PDF文件预览

    HIN232, HIN236, HIN237,HIN238,  
    HIN239, HIN240, HIN241  
    ®
    Data Sheet  
    September 2004  
    FN3138.14  
    +5V Powered RS-232  
    Features  
    Transmitters/Receivers  
    • Meets All RS-232E and V.28 Specifications  
    The HIN232-HIN241 family of RS-232 transmitters/receivers  
    interface circuits meet all ElA RS-232E and V.28 specifications,  
    and are particularly suited for those applications where ±12V is  
    not available. They require a single +5V power supply (except  
    HIN239) and feature onboard charge pump voltage converters  
    which generate +10V and -10V supplies from the 5V supply.  
    The family of devices offer a wide variety of RS-232  
    • Requires Only Single +5V Power Supply  
    - (+5V and +12V - HIN239)  
    • High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps  
    • Onboard Voltage Doubler/Inverter  
    • Low Power Consumption  
    • Low Power Shutdown Function  
    transmitter/receiver combinations to accommodate various  
    applications (see Selection Table).  
    • Three-State TTL/CMOS Receiver Outputs  
    The drivers feature true TTL/CMOS input compatibility, slew-  
    rate-limited output, and 300Ω power-off source impedance.  
    The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ  
    input impedance. The receivers also feature hysteresis to  
    greatly improve noise rejection.  
    • Multiple Drivers  
    - ±10V Output Swing for 5V lnput  
    - 300Ω Power-Off Source Impedance  
    - Output Current Limiting  
    - TTL/CMOS Compatible  
    - 30V/µs Maximum Slew Rate  
    • Multiple Receivers  
    - ±30V Input Voltage Range  
    - 3kΩ to 7kΩ Input Impedance  
    - 0.5V Hysteresis to Improve Noise Rejection  
    • Pb-free available  
    Applications  
    • Any System Requiring RS-232 Communication Ports  
    - Computer - Portable, Mainframe, Laptop  
    - Peripheral - Printers and Terminals  
    - Instrumentation  
    - Modems  
    Selection Table  
    NUMBER OF  
    RS-232  
    DRIVERS  
    NUMBER OF  
    RS-232  
    RECEIVERS  
    LOW POWER  
    SHUTDOWN/TTL  
    THREE-STATE  
    PART  
    NUMBER  
    POWER SUPPLY  
    VOLTAGE  
    EXTERNAL  
    COMPONENTS  
    NUMBER OF  
    LEADS  
    HIN232  
    +5V  
    2
    4
    5
    4
    3
    5
    4
    2
    3
    3
    4
    5
    5
    5
    4 Capacitors  
    4 Capacitors  
    4 Capacitors  
    4 Capacitors  
    2 Capacitors  
    4 Capacitors  
    4 Capacitors  
    No/No  
    Yes/Yes  
    No/No  
    16  
    24  
    24  
    24  
    24  
    44  
    28  
    HIN236  
    HIN237  
    HIN238  
    HIN239  
    HIN240  
    HIN241  
    +5V  
    +5V  
    +5V  
    No/No  
    +5V and +7.5V to 13.2V  
    No/Yes  
    Yes/Yes  
    Yes/Yes  
    +5V  
    +5V  
    CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
    1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
    Copyright © Intersil Americas Inc. 2004. All Rights Reserved.  
    1
    All other trademarks mentioned are the property of their respective owners.  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Pin Descriptions  
    PIN  
    FUNCTION  
    V
    Power Supply Input 5V ±10%.  
    CC  
    V+  
    V-  
    Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V.  
    Internally generated negative supply (-10V nominal).  
    GND  
    C1+  
    C1-  
    C2+  
    C2-  
    Ground lead. Connect to 0V.  
    External capacitor (+ terminal) is connected to this lead.  
    External capacitor (- terminal) is connected to this lead.  
    External capacitor (+ terminal) is connected to this lead.  
    External capacitor (- terminal) is connected to this lead.  
    T
    Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead.  
    Transmitter Outputs. These are RS-232 levels (nominally ±10V).  
    Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.  
    Receiver Outputs. These are TTL/CMOS levels.  
    IN  
    T
    OUT  
    R
    IN  
    R
    OUT  
    EN  
    SD  
    NC  
    Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed in  
    a high impedance state.  
    Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the  
    transmitters are shut off.  
    No Connect. No connections are made to these leads.  
    2
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Ordering Information (Continued)  
    Ordering Information  
    PART  
    NUMBER  
    TEMP.  
    RANGE ( C)  
    PART  
    NUMBER  
    TEMP.  
    RANGE ( C)  
    o
    o
    PACKAGE  
    PKG. DWG. #  
    PACKAGE  
    16 Ld SOIC  
    PKG. DWG. #  
    HIN241CAZ  
    (See Note)  
    0 to 70  
    28 Ld SSOP  
    (Pb-free)  
    M28.209  
    HIN232CB  
    0 to 70  
    M16.3  
    HIN232CB-T  
    0 to 70  
    Tape and Reel  
    HIN241CB  
    0 to 70  
    0 to 70  
    0 to 70  
    28 Ld SOIC  
    M28.3  
    M28.3  
    HIN232CBZ  
    (See Note)  
    0 to 70  
    16 Ld SOIC  
    (Pb-free)  
    M16.3  
    HIN241CB-T  
    Tape and Reel  
    HIN241CBZ  
    (See Note)  
    28 Ld SOIC  
    (Pb-free)  
    HIN232CBZ-T  
    (See Note)  
    0 to 70  
    Tape and Reel (Pb-free)  
    HIN241CBZ-T  
    (See Note)  
    0 to 70  
    Tape and Reel (Pb-free)  
    HIN232CP  
    0 to 70  
    0 to 70  
    16 Ld PDIP  
    E16.3  
    E16.3  
    HIN232CPZ  
    (See Note)  
    16 Ld PDIP  
    (Pb-free)  
    HIN241IB  
    -40 to 85  
    -40 to 85  
    28 Ld SOIC  
    M28.3  
    M28.3  
    HIN241IBZ  
    (See Note)  
    28 Ld SOIC  
    (Pb-free)  
    HIN232IB  
    -40 to 85  
    -40 to 85  
    -40 to 85  
    16 Ld SOIC  
    M16.3  
    M16.3  
    HIN232IB-T  
    Tape and Reel  
    NOTE: Intersil Pb-free products employ special Pb-free material  
    sets; molding compounds/die attach materials and 100% matte tin  
    plate termination finish, which is compatible with both SnPb and  
    Pb-free soldering operations. Intersil Pb-free products are MSL  
    classified at Pb-free peak reflow temperatures that meet or exceed  
    the Pb-free requirements of IPC/JEDEC J Std-020B.  
    HIN232IBZ  
    (See Note)  
    16 Ld SOIC  
    (Pb-free)  
    HIN232IBZ-T  
    (See Note)  
    -40 to 85  
    Tape and Reel (Pb-free)  
    HIN232IP  
    -40 to 85  
    -40 to 85  
    16 Ld PDIP  
    E16.3  
    E16.3  
    HIN232IPZ  
    (See Note)  
    16 Ld PDIP  
    (Pb-free)  
    HIN236CB  
    0 to 70  
    0 to 70  
    24 Ld SOIC  
    M24.3  
    M24.3  
    HIN236CBZ  
    (See Note)  
    24 Ld SOIC  
    (Pb-free)  
    HIN237CB  
    0 to 70  
    0 to 70  
    0 to 70  
    24 Ld SOIC  
    M24.3  
    M24.3  
    HIN237CB-T  
    Tape and Reel  
    HIN237CBZ  
    (See Note)  
    24 Ld SOIC  
    (Pb-free)  
    HIN237CBZ-T  
    (See Note)  
    0 to 70  
    Tape and Reel (Pb-free)  
    HIN238CB  
    0 to 70  
    0 to 70  
    0 to 70  
    24 Ld SOIC  
    M24.3  
    M24.3  
    HIN238CB-T  
    Tape and Reel  
    HIN238CBZ  
    (See Note)  
    24 Ld SOIC  
    (Pb-free)  
    HIN238CBZ-T  
    (See Note)  
    0 to 70  
    Tape and Reel (Pb-free)  
    HIN238CP  
    HIN238IB  
    0 to 70  
    -40 to 85  
    -40 to 85  
    24 Ld PDIP  
    24 Ld SOIC  
    E24.3  
    M24.3  
    M24.3  
    HIN238IBZ  
    (See Note)  
    24 Ld SOIC  
    (Pb-free)  
    HIN239CB  
    0 to 70  
    0 to 70  
    0 to 70  
    24 Ld SOIC  
    M24.3  
    M24.3  
    HIN239CB-T  
    Tape and Reel  
    HIN239CBZ  
    (See Note)  
    24 Ld SOIC  
    (Pb-free)  
    HIN239CBZ-T  
    (See Note)  
    0 to 70  
    Tape and Reel (Pb-free)  
    HIN239CP  
    0 to 70  
    0 to 70  
    24 Ld PDIP  
    E24.3  
    E24.3  
    HIN239CPZ  
    (See Note)  
    24 Ld PDIP  
    (Pb-free)  
    HIN240CN  
    HIN241CA  
    0 to 70  
    0 to 70  
    44 Ld MQFP  
    28 Ld SSOP  
    Q44.10X10  
    M28.209  
    3
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Pinouts  
    HIN232 (PDIP, SOIC)  
    HIN236 (SOIC)  
    TOP VIEW  
    TOP VIEW  
    1
    2
    24  
    23  
    22  
    21  
    20  
    19  
    18  
    17  
    T3  
    T1  
    T2  
    T4  
    OUT  
    1
    2
    3
    4
    5
    6
    7
    8
    16  
    15  
    14  
    13  
    12  
    C1+  
    V+  
    V
    CC  
    OUT  
    OUT  
    OUT  
    R2  
    IN  
    GND  
    T1  
    3
    R2  
    OUT  
    C1-  
    C2+  
    C2-  
    V-  
    OUT  
    4
    R1  
    SD  
    EN  
    IN  
    R1  
    R1  
    T1  
    IN  
    5
    R1  
    OUT  
    OUT  
    6
    T2  
    IN  
    T4  
    IN  
    IN  
    11  
    10  
    9
    IN  
    IN  
    7
    T3  
    T1  
    IN  
    T2  
    T2  
    R2  
    OUT  
    8
    R3  
    GND  
    OUT  
    R2  
    IN  
    OUT  
    9
    16 R3  
    V
    IN  
    CC  
    10  
    11  
    12  
    15  
    14  
    13  
    V-  
    C1+  
    V+  
    C2-  
    C2+  
    C1-  
    +5V  
    +5V  
    9
    +
    1µF  
    1µF  
    10  
    +
    12  
    1µF  
    V
    16  
    +
    +
    C1+  
    CC  
    11  
    V+  
    V-  
    1µF  
    1µF  
    +5V TO 10V  
    VOLTAGE DOUBLER  
    C1-  
    V
    CC  
    13  
    +
    14  
    1
    C2+  
    NOTE 1  
    C1+  
    +10V TO -10V  
    VOLTAGE INVERTER  
    +
    +
    15  
    2
    +
    +
    2
    +5V TO 10V  
    NOTE 1  
    NOTE 1  
    V+  
    3
    4
    C2-  
    VOLTAGE DOUBLER  
    C1-  
    +5V  
    T1  
    400kΩ  
    C2+  
    7
    T1  
    T1  
    +10V TO -10V  
    VOLTAGE INVERTER  
    OUT  
    OUT  
    IN  
    6
    V-  
    5
    C2-  
    NOTE 1  
    T1  
    +5V  
    +5V  
    +5V  
    T2  
    400kΩ  
    400kΩ  
    400kΩ  
    6
    3
    1
    T2  
    T2  
    IN  
    +5V  
    T1  
    14  
    400kΩ  
    11  
    T3  
    T4  
    T1  
    IN  
    OUT  
    18  
    T3  
    T4  
    T3  
    T4  
    OUT  
    OUT  
    IN  
    +5V  
    T2  
    400kΩ  
    10  
    12  
    7
    T2  
    R1  
    T2  
    IN  
    19  
    5
    24  
    4
    OUT  
    IN  
    13  
    R1  
    R1  
    IN  
    OUT  
    R1  
    IN  
    OUT  
    5kΩ  
    5kΩ  
    R1  
    5kΩ  
    5kΩ  
    R1  
    22  
    23  
    R2  
    R2  
    R3  
    IN  
    OUT  
    9
    8
    R2  
    R2  
    IN  
    OUT  
    R2  
    R3  
    R2  
    17  
    20  
    16  
    21  
    R3  
    SD  
    IN  
    OUT  
    EN  
    5kΩ  
    15  
    NOTE:  
    8
    1. Either 0.1µF or 1µF capacitors may be used. The V+ capacitor  
    may be terminated to V  
    or to GND.  
    CC  
    4
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Pinouts (Continued)  
    HIN237 (SOIC)  
    HIN238 (PDIP, SOIC)  
    TOP VIEW  
    TOP VIEW  
    T2  
    T1  
    T3  
    T3  
    T1  
    T2  
    24  
    23  
    22  
    21  
    20  
    19  
    18  
    17  
    16  
    15  
    14  
    13  
    1
    2
    3
    4
    5
    6
    7
    8
    9
    24 T4  
    1
    2
    OUT  
    OUT  
    OUT  
    OUT  
    OUT  
    OUT  
    R3  
    R3  
    T4  
    23 R2  
    OUT  
    IN  
    IN  
    R2  
    R2  
    T5  
    3
    22  
    21  
    20  
    19  
    18  
    17  
    16  
    IN  
    OUT  
    OUT  
    R2  
    R1  
    4
    OUT  
    IN  
    IN  
    IN  
    T1  
    IN  
    T4  
    T3  
    T2  
    R1  
    T5  
    T4  
    T3  
    5
    OUT  
    IN  
    OUT  
    OUT  
    IN  
    R1  
    T2  
    IN  
    6
    OUT  
    R1  
    IN  
    T1  
    IN  
    7
    IN  
    IN  
    R4  
    R4  
    V-  
    R3  
    R3  
    GND  
    8
    GND  
    OUT  
    IN  
    OUT  
    IN  
    V
    V
    9
    CC  
    CC  
    C1+  
    V+  
    C1+ 10  
    V+ 11  
    15 V-  
    10  
    11  
    12  
    C2-  
    14 C2-  
    13 C2+  
    C1-  
    C2+  
    C1- 12  
    +5V  
    9
    +5V  
    9
    1µF  
    1µF  
    1µF  
    10  
    10  
    +
    12  
    V
    V
    +
    CC  
    C1+  
    +
    +
    CC  
    C1+  
    +
    12  
    11  
    11  
    V+  
    1µF  
    1µF  
    V+  
    V-  
    1µF  
    1µF  
    +5V TO 10V  
    VOLTAGE DOUBLER  
    +5V TO 10V  
    VOLTAGE DOUBLER  
    C1-  
    C1-  
    13  
    +
    14  
    13  
    +
    14  
    C2+  
    C2+  
    +10V TO -10V  
    VOLTAGE INVERTER  
    +10V TO -10V  
    VOLTAGE INVERTER  
    15  
    V-  
    15  
    2
    C2-  
    1µF  
    C2-  
    +
    +5V  
    +5V  
    T1  
    T1  
    T2  
    2
    3
    400kΩ  
    7
    400kΩ  
    5
    T1  
    T1  
    IN  
    T1  
    OUT  
    T1  
    IN  
    OUT  
    OUT  
    +5V  
    T2  
    +5V  
    +5V  
    +5V  
    400kΩ  
    6
    400kΩ  
    18  
    19  
    1
    T2  
    T2  
    IN  
    T2  
    OUT  
    T2  
    IN  
    +5V  
    +5V  
    +5V  
    T3  
    T4  
    T5  
    T3  
    T4  
    400kΩ  
    400kΩ  
    400kΩ  
    18  
    19  
    1
    400kΩ  
    400kΩ  
    24  
    T3  
    T4  
    T5  
    T3  
    IN  
    T3  
    T4  
    OUT  
    OUT  
    OUT  
    T3  
    IN  
    OUT  
    OUT  
    24  
    21  
    6
    20  
    7
    T4  
    IN  
    T4  
    IN  
    R1  
    R1  
    21  
    5
    20  
    4
    IN  
    OUT  
    T5  
    IN  
    5kΩ  
    R1  
    R1  
    R1  
    IN  
    OUT  
    4
    22  
    17  
    3
    5kΩ  
    5kΩ  
    R2  
    R3  
    R4  
    R2  
    R3  
    R4  
    R1  
    IN  
    IN  
    IN  
    OUT  
    OUT  
    OUT  
    5kΩ  
    5kΩ  
    5kΩ  
    R2  
    R3  
    R4  
    22  
    17  
    23  
    16  
    R2  
    R2  
    IN  
    OUT  
    23  
    16  
    R2  
    R3  
    R3  
    R3  
    IN  
    OUT  
    5kΩ  
    8
    8
    5
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Pinouts (Continued)  
    HIN239 (PDIP, SOIC)  
    HIN240 (MQFP)  
    TOP VIEW  
    R1  
    T1  
    T2  
    1
    2
    24  
    23  
    22  
    OUT  
    IN  
    IN  
    R1  
    IN  
    R2  
    3
    GND  
    OUT  
    IN  
    44 43 42 41 40 39 38 37 36 35 34  
    NC  
    1
    NC  
    NC  
    NC  
    V-  
    33  
    32  
    31  
    30  
    29  
    V
    21 R2  
    20 T2  
    4
    CC  
    T5  
    2
    3
    4
    5
    6
    7
    8
    9
    IN  
    5
    V+  
    C1+  
    C1-  
    V-  
    OUT  
    OUT  
    R3  
    OUT  
    6
    19 T1  
    R3  
    18  
    R3  
    IN  
    OUT  
    OUT  
    OUT  
    7
    T4  
    T3  
    T1  
    T2  
    IN  
    C2-  
    C2+  
    C1-  
    V+  
    8
    17 R3  
    16 T3  
    OUT  
    28  
    27  
    26  
    25  
    24  
    23  
    R5  
    IN  
    9
    IN  
    OUT  
    NC  
    R5  
    10  
    11  
    12  
    15  
    14  
    NC  
    EN  
    OUT  
    OUT  
    C1+  
    NC  
    NC  
    R4  
    R2  
    10  
    11  
    IN  
    R4  
    13 T3  
    OUT  
    IN  
    NC  
    12 13 14 15 16 17 18 19 20 21 22  
    +5V  
    +7.5V TO +13.2V (NOTE)  
    19  
    +5V  
    25  
    +
    27  
    1µF  
    V
    CC  
    C1+  
    4
    +
    26  
    30  
    V+  
    V-  
    1µF  
    6
    7
    +5V TO 10V  
    VOLTAGE DOUBLER  
    V
    CC  
    C1+  
    C1-  
    C1-  
    +
    5
    V+  
    1µF  
    28  
    +
    29  
    +10V TO -10V  
    VOLTAGE INVERTER  
    C2+  
    8
    +10V TO -10V  
    VOLTAGE INVERTER  
    (NOTE)  
    V-  
    1µF  
    1µF  
    C2-  
    1µF  
    T1  
    +
    +5V  
    +5V  
    T1  
    T1  
    7
    19  
    400kΩ  
    400kΩ  
    15  
    24  
    23  
    T1  
    T1  
    IN  
    T1  
    IN  
    OUT  
    OUT  
    +5V  
    +5V  
    +5V  
    +5V  
    T2  
    +5V  
    T2  
    T3  
    400kΩ  
    400kΩ  
    400kΩ  
    400kΩ  
    14  
    37  
    38  
    8
    6
    5
    400kΩ  
    400kΩ  
    20  
    T2  
    T2  
    IN  
    OUT  
    T2  
    T2  
    IN  
    OUT  
    T3  
    T4  
    T5  
    +5V  
    16  
    1
    13  
    T3  
    T4  
    T5  
    T3  
    IN  
    OUT  
    OUT  
    OUT  
    T3  
    T3  
    IN  
    OUT  
    2
    R1  
    IN  
    R1  
    OUT  
    T4  
    IN  
    5kΩ  
    R1  
    2
    41  
    17  
    T5  
    IN  
    22  
    17  
    11  
    21  
    18  
    12  
    9
    R2  
    R3  
    R4  
    R5  
    R2  
    16  
    IN  
    IN  
    IN  
    OUT  
    R1  
    R2  
    R3  
    R4  
    R5  
    R1  
    IN  
    OUT  
    5kΩ  
    5kΩ  
    5kΩ  
    5kΩ  
    R2  
    R3  
    R4  
    R5  
    5kΩ  
    R1  
    13  
    3
    10  
    4
    R3  
    OUT  
    R2  
    IN  
    IN  
    IN  
    IN  
    OUT  
    OUT  
    OUT  
    5kΩ  
    5kΩ  
    5kΩ  
    5kΩ  
    R2  
    R3  
    R4  
    R5  
    R4  
    R3  
    R4  
    R5  
    OUT  
    39  
    40  
    10  
    14  
    R5  
    IN  
    OUT  
    36  
    42  
    35  
    43  
    EN  
    OUT  
    EN  
    3
    SD  
    18  
    NOTE: For V+ > 11V, use C ≤ 0.1µF.  
    1
    6
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Pinouts (Continued)  
    HIN241 (SOIC, SSOP)  
    TOP VIEW  
    T3  
    T1  
    T2  
    1
    2
    3
    4
    5
    6
    7
    8
    9
    28 T4  
    OUT  
    OUT  
    OUT  
    OUT  
    27 R3  
    26 R3  
    IN  
    OUT  
    25 SD  
    24 EN  
    R2  
    IN  
    R2  
    OUT  
    T2  
    T1  
    23 R4  
    22 R4  
    IN  
    IN  
    IN  
    OUT  
    IN  
    R1  
    21 T4  
    20  
    OUT  
    R1  
    IN  
    T3  
    IN  
    GND 10  
    11  
    19 R5  
    18 R5  
    17 V-  
    OUT  
    IN  
    V
    CC  
    C1+ 12  
    V+ 13  
    16 C2-  
    15 C2+  
    C1- 14  
    +5V  
    11  
    1µF  
    1µF  
    12  
    V
    +
    +
    CC  
    C1+  
    13  
    +
    V+  
    V-  
    1µF  
    1µF  
    +5V TO 10V  
    VOLTAGE DOUBLER  
    14  
    15  
    C1-  
    C2+  
    +
    16  
    +10V TO -10V  
    VOLTAGE INVERTER  
    17  
    C2-  
    +5V  
    T1  
    2
    3
    1
    400kΩ  
    7
    6
    T1  
    T1  
    IN  
    OUT  
    OUT  
    +5V  
    +5V  
    +5V  
    T2  
    T3  
    T4  
    400kΩ  
    400kΩ  
    400kΩ  
    T2  
    T3  
    T4  
    T2  
    IN  
    20  
    T3  
    IN  
    OUT  
    OUT  
    21  
    8
    28  
    9
    T4  
    IN  
    R1  
    R1  
    IN  
    OUT  
    5kΩ  
    R1  
    5
    26  
    22  
    4
    R2  
    R3  
    R4  
    R5  
    R2  
    R3  
    R4  
    R5  
    IN  
    IN  
    IN  
    OUT  
    OUT  
    OUT  
    5kΩ  
    5kΩ  
    5kΩ  
    5kΩ  
    R2  
    R3  
    R4  
    R5  
    27  
    23  
    19  
    24  
    18  
    25  
    IN  
    OUT  
    EN  
    SD  
    10  
    7
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Absolute Maximum Ratings  
    Thermal Information  
    o
    V
    to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V  
    < 6V  
    Thermal Resistance (Typical, Note 3)  
    θ
    ( C/W)  
    CC  
    V+ to Ground (Note 2) . . . . . . . . . . . . . . . (V  
    CC  
    -0.3V) < V+ < 13.2V  
    JA  
    CC  
    16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .  
    24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .  
    16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .  
    24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .  
    28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .  
    28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .  
    44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .  
    90  
    70  
    100  
    75  
    70  
    95  
    V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)  
    V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V  
    Input Voltages  
    T
    R
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V < (V+ +0.3V)  
    IN  
    IN  
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V  
    IN  
    Output Voltages  
    80  
    o
    T
    R
    . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V  
    . . . . . . . . . . . . . . . . . (GND -0.3V) < V  
    < (V+ +0.3V)  
    < (V+ +0.3V)  
    OUT  
    TXOUT  
    RXOUT  
    Maximum Junction Temperature (Plastic Package) . . . . . . . .150 C  
    o
    o
    OUT  
    Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C  
    Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300 C  
    o
    Short Circuit Duration  
    T
    R
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous  
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous  
    OUT  
    (SOIC, SSOP, MQFP - Lead Tips Only)  
    OUT  
    Operating Conditions  
    Temperature Range  
    HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C  
    HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C  
    o
    o
    o
    o
    CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
    device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
    NOTE:  
    2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF.  
    3. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
    JA  
    Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range  
    CC  
    A
    PARAMETER  
    SUPPLY CURRENTS  
    Power Supply Current, I  
    TEST CONDITIONS  
    MIN  
    TYP  
    MAX  
    UNITS  
    No Load,  
    o
    HIN232  
    -
    -
    -
    -
    5
    10  
    15  
    1
    mA  
    mA  
    mA  
    mA  
    CC  
    T = 25 C  
    A
    HIN236-HIN238, HIN240-HIN241  
    7
    HIN239  
    HIN239  
    0.4  
    5.0  
    V+ Power Supply Current, I  
    No Load,  
    o
    15  
    CC  
    o
    No Load, T = 25 C  
    T = 25 C  
    A
    A
    o
    Shutdown Supply Current, I (SD)  
    CC  
    T = 25 C  
    -
    1
    10  
    µA  
    A
    LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS  
    Input Logic Low, V  
    T
    T
    , EN, Shutdown  
    -
    -
    -
    0.8  
    -
    V
    V
    lL  
    IN  
    IN  
    Input Logic High, V  
    2.0  
    2.4  
    -
    lH  
    EN, Shutdown  
    = 0V  
    -
    -
    V
    Transmitter Input Pullup Current, I  
    T
    15  
    0.1  
    4.6  
    200  
    0.4  
    -
    µA  
    V
    P
    IN  
    TTL/CMOS Receiver Output Voltage Low, V  
    I
    I
    = 1.6mA  
    = -1.0mA  
    -
    OL  
    OUT  
    OUT  
    TTL/CMOS Receiver Output Voltage High, V  
    3.5  
    V
    OH  
    RECEIVER INPUTS  
    RS-232 Input Voltage Range V  
    -30  
    3.0  
    0.8  
    -
    -
    +30  
    7.0  
    -
    V
    kΩ  
    V
    IN  
    Receiver Input Impedance R  
    V
    V
    V
    = ±3V  
    5.0  
    1.2  
    1.7  
    0.5  
    IN  
    IN  
    o
    Receiver Input Low Threshold, V (H-L)  
    = 5V, T = 25 C  
    A
    lN  
    Receiver Input High Threshold, V (L-H)  
    CC  
    CC  
    o
    = 5V, T = 25 C  
    2.4  
    1.0  
    V
    IN  
    A
    Receiver Input Hysteresis V  
    0.2  
    V
    HYST  
    8
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range (Continued)  
    CC  
    A
    PARAMETER  
    TIMING CHARACTERISTICS  
    Baud Rate (1 Transmitter Switching)  
    TEST CONDITIONS  
    MIN  
    TYP  
    MAX  
    UNITS  
    R
    = 3kΩ  
    120  
    -
    -
    -
    kbps  
    ns  
    L
    Output Enable Time, t  
    HIN236, HIN239, HIN240, HIN241  
    HIN236, HIN239, HIN240, HIN241  
    -
    -
    -
    -
    -
    400  
    250  
    0.5  
    -
    EN  
    Output Disable Time, t  
    -
    ns  
    DIS  
    Propagation Delay, t  
    RS-232 to TTL  
    = 10pF, R = 3kΩ, T = 25 C (Note 4)  
    -
    µs  
    PD  
    o
    Instantaneous Slew Rate SR  
    C
    30  
    -
    V/µs  
    V/µs  
    L
    L
    A
    Transition Region Slew Rate, SR  
    R = 3kΩ, C = 2500pF Measured from +3V to -3V or  
    3
    T
    L
    L
    -3V to +3V, 1 Transmitter Switching  
    TRANSMITTER OUTPUTS  
    Output Voltage Swing, T  
    OUT  
    Transmitter Outputs, 3kΩ to Ground  
    ±5  
    300  
    -
    ±9  
    -
    ±10  
    V
    Ω
    Output Resistance, T  
    OUT  
    V
    = V+ = V- = 0V, V  
    OUT  
    = ±2V  
    -
    -
    CC  
    RS-232 Output Short Circuit Current, I  
    T
    shorted to GND  
    ±10  
    mA  
    SC  
    OUT  
    NOTE:  
    4. Guaranteed by design.  
    VOLTAGE DOUBLER  
    +
    VOLTAGE INVERTER  
    +
    S5  
    S1  
    S3  
    S2  
    C2  
    C1  
    V+ = 2V  
    S6  
    CC  
    V
    GND  
    CC  
    +
    -
    +
    -
    +
    -
    +
    C4  
    -
    C3  
    C2  
    C1  
    V
    GND  
    CC  
    V- = -(V+)  
    GND  
    -
    C1-  
    S4  
    C2  
    S7  
    S8  
    RC  
    OSCILLATOR  
    FIGURE 1. CHARGE PUMP  
    to 5.5V. The output impedance of the voltage doubler section  
    (V+) is approximately 200Ω, and the output impedance of the  
    voltage inverter section (V-) is approximately 450Ω. A typical  
    application uses 1µF capacitors for C1-C4, however, the value  
    is not critical. Increasing the values of C1 and C2 will lower the  
    output impedance of the voltage doubler and inverter,  
    increasing the values of the reservoir capacitors, C3 and C4,  
    lowers the ripple on the V+ and V- supplies.  
    Detailed Description  
    The HIN232 thru HIN241 family of RS-232  
    transmitters/receivers are powered by a single +5V power  
    supply (except HIN239), feature low power consumption, and  
    meet all ElA RS-232C and V.28 specifications. The circuit is  
    divided into three sections: The charge pump, transmitter, and  
    receiver.  
    Charge Pump  
    During shutdown mode (HIN236, HIN240 and HIN241),  
    SHUTDOWN control line set to logic “1”, the charge pump is  
    An equivalent circuit of the charge pump is illustrated in  
    Figure 1. The charge pump contains two sections: the voltage  
    doubler and the voltage inverter. Each section is driven by a  
    two phase, internally generated clock to generate +10V and  
    -10V. The nominal clock frequency is 16kHz. During phase  
    turned off, V+ is pulled down to V , V- is pulled up to GND,  
    CC  
    and the supply current is reduced to less than 10µA. The  
    transmitter outputs are disabled and the receiver outputs are  
    placed in the high impedance state.  
    one of the clock, capacitor C1 is charged to V . During  
    CC  
    phase two, the voltage on C1 is added to V , producing a  
    CC  
    signal across C3 equal to twice V . During phase one, C2 is  
    CC  
    also charged to 2V , and then during phase two, it is  
    CC  
    inverted with respect to ground to produce a signal across C4  
    equal to -2V . The charge pump accepts input voltages up  
    CC  
    9
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Transmitters  
    Receivers  
    The transmitters are TTL/CMOS compatible inverters which  
    translate the inputs to RS-232 outputs. The input logic threshold  
    The receiver inputs accept up to ±30V while presenting the  
    required 3kΩ to 7kΩ input impedance even if the power is off  
    is about 26% of V , or 1.3V for V  
    = 5V. A logic 1 at the  
    (V = 0V). The receivers have a typical input threshold of  
    CC CC  
    CC  
    input results in a voltage of between -5V and V- at the output,  
    and a logic 0 results in a voltage between +5V and (V+ -0.6V).  
    Each transmitter input has an internal 400kΩ pullup resistor so  
    any unused input can be left unconnected and its output  
    remains in its low state. The output voltage swing meets the  
    RS-232C specifications of ±5V minimum with the worst case  
    conditions of: all transmitters driving 3kΩ minimum load  
    1.3V which is within the ±3V limits, known as the transition  
    region, of the RS-232 specifications. The receiver output is  
    0V to V . The output will be low whenever the input is  
    CC  
    greater than 2.4V and high whenever the input is floating or  
    driven between +0.8V and -30V. The receivers feature 0.5V  
    hysteresis to improve noise rejection. The receiver Enable  
    line EN, when set to logic “1”, (HIN236, 239, 240, and 241)  
    disables the receiver outputs, placing them in the high  
    impedance mode. The receiver outputs are also placed in  
    the high impedance state when in shutdown mode.  
    impedance, V  
    = 4.5V, and maximum allowable operating  
    CC  
    temperature. The transmitters have an internally limited output  
    slew rate which is less than 30V/µs. The outputs are short  
    circuit protected and can be shorted to ground indefinitely. The  
    powered down output impedance is a minimum of 300Ω with  
    V
    CC  
    ±2V applied to the outputs and V  
    = 0V.  
    CC  
    R
    XIN  
    R
    OUT  
    -30V < R  
    < +30V  
    XIN  
    GND < V  
    < V  
    CC  
    5kΩ  
    ROUT  
    V+  
    GND  
    V
    T
    CC  
    400kΩ  
    300Ω  
    FIGURE 3. RECEIVER  
    XIN  
    XIN  
    T
    OUT  
    GND < T  
    < V  
    CC  
    V- < V  
    TOUT  
    < V+  
    V-  
    FIGURE 2. TRANSMITTER  
    T
    IN  
    OR  
    R
    IN  
    T
    OUT  
    OR  
    V
    OL  
    V
    OL  
    R
    OUT  
    t
    t
    PLH  
    PHL  
    t
    t
    PHL + PLH  
    2
    Average Propagation Delay =  
    FIGURE 4. PROPAGATION DELAY DEFINITION  
    10  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Typical Performance Curves  
    o
    T
    = 25 C  
    A
    12  
    10  
    8
    TRANSMITTER OUTPUTS  
    OPEN CIRCUIT  
    12  
    1µF  
    10  
    8
    0.47µF  
    V+ (V  
    CC  
    = 5V)  
    0.10µF  
    6
    V+ (V  
    = 4.5V)  
    6
    CC  
    V- (V  
    CC  
    = 4.5V)  
    4
    4
    V- (V  
    = 5V)  
    CC  
    2
    2
    0
    0
    3.0  
    4.0  
    4.5  
    5.0  
    5.5  
    6.0  
    5
    10  
    15  
    |I  
    20  
    | (mA)  
    25  
    30  
    35  
    0
    3.5  
    V
    LOAD  
    CC  
    FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)  
    FIGURE 5. V- SUPPLY VOLTAGE vs V , VARYING  
    CC  
    CAPACITORS  
    Test Circuits (HIN232)  
    +4.5V TO  
    +5.5V INPUT  
    C1+  
    V+  
    1
    2
    3
    4
    5
    6
    7
    8
    16  
    15  
    14  
    V
    CC  
    GND  
    T1  
    -
    +
    1µF  
    C3  
    V
    C1+  
    V+  
    1
    2
    3
    4
    5
    6
    7
    8
    16  
    CC  
    C1-  
    C2+  
    C2-  
    OUT  
    +
    3kΩ  
    1µF  
    C1  
    GND 15  
    R1 13  
    IN  
    -
    T1  
    C1-  
    C2+  
    C2-  
    V-  
    14  
    13  
    12  
    11  
    T1 OUTPUT  
    OUT  
    R1  
    12  
    11  
    10  
    9
    OUT  
    R1  
    IN  
    RS-232 ±30V INPUT  
    TTL/CMOS OUTPUT  
    TTL/CMOS INPUT  
    TTL/CMOS INPUT  
    TTL/CMOS OUTPUT  
    +
    1µF  
    C2  
    T1  
    IN  
    V-  
    -
    R1  
    OUT  
    T2  
    T2  
    IN  
    -
    +
    OUT  
    T1  
    IN  
    R2  
    R2  
    IN  
    OUT  
    1µF C4  
    T2  
    T2 10  
    IN  
    3kΩ  
    OUT  
    R2  
    9
    R2  
    IN  
    R
    = V /1T2  
    IN  
    OUT  
    OUT  
    OUT  
    T1  
    T2  
    OUTPUT  
    OUT  
    V
    = ±2V  
    A
    IN  
    RS-232  
    ±30V INPUT  
    FIGURE 8. POWER-OFF SOURCE RESISTANCE  
    CONFIGURATION  
    FIGURE 7. GENERAL TEST CIRCUIT  
    11  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Applications  
    +5V  
    -
    The HIN2XX may be used for all RS-232 data terminal and  
    communication links. It is particularly useful in applications  
    where ±12V power supplies are not available for  
    conventional RS-232 interface circuits. The applications  
    presented represent typical interface configurations.  
    +
    16  
    DTR (20) DATA  
    TERMINAL READY  
    1
    +
    C1  
    1µF  
    2
    3
    4
    DSRS (24) DATA  
    SIGNALING RATE  
    SELECT  
    -
    HIN232  
    6
    +
    -
    +
    C2  
    1µF  
    RS-232  
    INPUTS AND OUTPUTS  
    5
    -
    A simple duplex RS-232 port with CTS/RTS handshaking is  
    illustrated in Figure 9. Fixed output signals such as DTR  
    (data terminal ready) and DSRS (data signaling rate select)  
    is generated by driving them through a 5kΩ resistor  
    connected to V+.  
    T1  
    11  
    14  
    TD  
    TD (2) TRANSMIT DATA  
    T2  
    10  
    12  
    7
    RTS (4) REQUEST TO SEND  
    RD (3) RECEIVE DATA  
    TTL/CMOS RTS  
    INPUTS AND  
    13  
    RD  
    OUTPUTS  
    R2  
    R1  
    9
    8
    CTS  
    CTS (5) CLEAR TO SEND  
    In applications requiring four RS-232 inputs and outputs  
    (Figure 10), note that each circuit requires two charge pump  
    capacitors (C1 and C2) but can share common reservoir  
    capacitors (C3 and C4). The benefit of sharing common  
    reservoir capacitors is the elimination of two capacitors and  
    the reduction of the charge pump source impedance which  
    effectively increases the output swing of the transmitters.  
    15  
    SIGNAL GROUND (7)  
    FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS  
    HANDSHAKING  
    1
    4
    +
    +
    C1  
    C2  
    HIN232  
    T1  
    5
    1µF  
    3
    1µF  
    -
    -
    11  
    14  
    TD  
    RTS  
    RD  
    TD (2) TRANSMIT DATA  
    RTS (4) REQUEST TO SEND  
    RD (3) RECEIVE DATA  
    T2  
    10  
    12  
    7
    TTL/CMOS  
    INPUTS AND  
    OUTPUTS  
    13  
    R2  
    R1  
    9
    8
    CTS  
    CTS (5) CLEAR TO SEND  
    15  
    16  
    6
    6
    2
    2
    C4  
    C3  
    +5V  
    -
    -
    V- V+  
    RS-232  
    INPUTS AND OUTPUTS  
    2µF  
    2µF  
    16  
    4
    HIN232  
    T1  
    1
    +
    +
    C1  
    1µF  
    C2  
    1µF  
    5
    3
    -
    -
    11  
    14  
    DTR  
    DSRS  
    DCD  
    R1  
    DTR (20) DATA TERMINAL READY  
    DSRS (24) DATA SIGNALING RATE SELECT  
    DCD (8) DATA CARRIER DETECT  
    R1 (22) RING INDICATOR  
    T2  
    10  
    12  
    7
    TTL/CMOS  
    INPUTS AND  
    OUTPUTS  
    13  
    R2  
    R1  
    9
    8
    15  
    SIGNAL GROUND (7)  
    FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS  
    12  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Die Characteristics  
    DIE DIMENSIONS  
    PASSIVATION  
    160 mils x 140 mils  
    Type: Nitride over Silox  
    Nitride Thickness: 8kÅ  
    Silox Thickness: 7kÅ  
    METALLIZATION  
    Type: Al  
    Thickness: 10kÅ ±1kÅ  
    TRANSISTOR COUNT  
    238  
    SUBSTRATE POTENTIAL  
    PROCESS  
    V+  
    CMOS Metal Gate  
    Metallization Mask Layout  
    HIN240  
    T2  
    OUT  
    T1  
    T3  
    T4  
    R3  
    R3  
    OUT  
    T5  
    IN  
    OUT  
    OUT  
    OUT  
    IN  
    R2  
    IN  
    SHUTDOWN  
    R2  
    OUT  
    EN  
    T2  
    T1  
    IN  
    IN  
    T5  
    OUT  
    R4  
    R1  
    IN  
    OUT  
    R4  
    R1  
    OUT  
    IN  
    T4  
    T3  
    IN  
    GND  
    IN  
    R5  
    OUT  
    V
    CC  
    R5  
    IN  
    C1+  
    V+  
    C1-  
    C2+  
    C2-  
    V-  
    13  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Dual-In-Line Plastic Packages (PDIP)  
    E16.3 (JEDEC MS-001-BB ISSUE D)  
    N
    16 LEAD DUAL-IN-LINE PLASTIC PACKAGE  
    E1  
    INDEX  
    AREA  
    INCHES  
    MILLIMETERS  
    1
    2
    3
    N/2  
    SYMBOL  
    MIN  
    MAX  
    0.210  
    -
    MIN  
    -
    MAX  
    5.33  
    -
    NOTES  
    -B-  
    A
    A1  
    A2  
    B
    -
    4
    -A-  
    0.015  
    0.115  
    0.014  
    0.045  
    0.008  
    0.735  
    0.005  
    0.300  
    0.240  
    0.39  
    2.93  
    0.356  
    1.15  
    0.204  
    18.66  
    0.13  
    7.62  
    6.10  
    4
    D
    E
    BASE  
    PLANE  
    0.195  
    0.022  
    0.070  
    0.014  
    0.775  
    -
    4.95  
    0.558  
    1.77  
    0.355  
    19.68  
    -
    -
    A2  
    A
    -C-  
    -
    SEATING  
    PLANE  
    B1  
    C
    8, 10  
    L
    C
    L
    -
    D1  
    B1  
    eA  
    A1  
    A
    D1  
    e
    D
    5
    eC  
    C
    B
    D1  
    E
    5
    eB  
    0.010 (0.25) M  
    C
    B S  
    0.325  
    0.280  
    8.25  
    7.11  
    6
    NOTES:  
    E1  
    e
    5
    1. Controlling Dimensions: INCH. In case of conflict between English and  
    Metric dimensions, the inch dimensions control.  
    0.100 BSC  
    0.300 BSC  
    2.54 BSC  
    7.62 BSC  
    -
    e
    A
    6
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
    Publication No. 95.  
    e
    -
    0.430  
    0.150  
    -
    10.92  
    3.81  
    7
    B
    L
    0.115  
    2.93  
    4
    9
    4. Dimensions A, A1 and L are measured with the package seated in JE-  
    N
    16  
    16  
    DEC seating plane gauge GS-3.  
    Rev. 0 12/93  
    5. D, D1, and E1 dimensions do not include mold flash or protrusions.  
    Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).  
    e
    6. E and  
    are measured with the leads constrained to be perpendic-  
    A
    -C-  
    ular to datum  
    .
    7. e and e are measured at the lead tips with the leads unconstrained.  
    B
    C
    e
    must be zero or greater.  
    C
    8. B1 maximum dimensions do not include dambar protrusions. Dambar  
    protrusions shall not exceed 0.010 inch (0.25mm).  
    9. N is the maximum number of terminal positions.  
    10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,  
    E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).  
    14  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Dual-In-Line Plastic Packages (PDIP)  
    E24.3 (JEDEC MS-001-AF ISSUE D)  
    24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC  
    PACKAGE  
    N
    E1  
    INDEX  
    AREA  
    1
    2
    3
    N/2  
    INCHES  
    MILLIMETERS  
    -B-  
    SYMBOL  
    MIN  
    MAX  
    0.210  
    -
    MIN  
    -
    MAX  
    5.33  
    -
    NOTES  
    -A-  
    A
    A1  
    A2  
    B
    -
    4
    D
    E
    0.015  
    0.115  
    0.014  
    0.045  
    0.008  
    1.230  
    0.005  
    0.300  
    0.240  
    0.39  
    2.93  
    0.356  
    1.15  
    0.204  
    31.24  
    0.13  
    7.62  
    6.10  
    4
    BASE  
    PLANE  
    A2  
    A
    0.195  
    0.022  
    0.070  
    0.014  
    1.280  
    -
    4.95  
    0.558  
    1.77  
    0.355  
    32.51  
    -
    -
    -C-  
    SEATING  
    PLANE  
    -
    L
    C
    L
    B1  
    C
    8
    D1  
    B1  
    eA  
    A1  
    A
    D1  
    -
    e
    eC  
    C
    B
    D
    5
    eB  
    0.010 (0.25) M  
    C
    B S  
    D1  
    E
    5
    0.325  
    0.280  
    8.25  
    7.11  
    6
    NOTES:  
    1. Controlling Dimensions: INCH. In case of conflict between English and  
    Metric dimensions, the inch dimensions control.  
    E1  
    e
    5
    0.100 BSC  
    0.300 BSC  
    2.54 BSC  
    7.62 BSC  
    -
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    e
    e
    6
    A
    B
    3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
    Publication No. 95.  
    -
    0.430  
    0.150  
    -
    10.92  
    3.81  
    7
    4. Dimensions A, A1 and L are measured with the package seated in  
    L
    0.115  
    2.93  
    4
    9
    JEDEC seating plane gauge GS-3.  
    N
    24  
    24  
    5. D, D1, and E1 dimensions do not include mold flash or protrusions.  
    Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).  
    Rev. 0 12/93  
    e
    6. E and  
    are measured with the leads constrained to be perpendic-  
    A
    -C-  
    ular to datum  
    .
    7. e and e are measured at the lead tips with the leads unconstrained.  
    B
    C
    e
    must be zero or greater.  
    C
    8. B1 maximum dimensions do not include dambar protrusions. Dambar  
    protrusions shall not exceed 0.010 inch (0.25mm).  
    9. N is the maximum number of terminal positions.  
    10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,  
    E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).  
    15  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Small Outline Plastic Packages (SOIC)  
    M16.3 (JEDEC MS-013-AA ISSUE C)  
    N
    16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
    INDEX  
    AREA  
    0.25(0.010)  
    M
    B M  
    H
    INCHES  
    MILLIMETERS  
    E
    SYMBOL  
    MIN  
    MAX  
    MIN  
    2.35  
    0.10  
    0.33  
    0.23  
    MAX  
    2.65  
    0.30  
    0.51  
    0.32  
    10.50  
    7.60  
    NOTES  
    -B-  
    A
    A1  
    B
    C
    D
    E
    e
    0.0926  
    0.0040  
    0.013  
    0.1043  
    0.0118  
    0.0200  
    0.0125  
    -
    -
    1
    2
    3
    L
    9
    SEATING PLANE  
    A
    0.0091  
    0.3977  
    0.2914  
    -
    -A-  
    o
    0.4133 10.10  
    3
    h x 45  
    D
    0.2992  
    7.40  
    4
    -C-  
    0.050 BSC  
    1.27 BSC  
    -
    α
    µ
    H
    h
    0.394  
    0.010  
    0.016  
    0.419  
    0.029  
    0.050  
    10.00  
    0.25  
    0.40  
    10.65  
    0.75  
    1.27  
    -
    e
    A1  
    C
    5
    B
    0.10(0.004)  
    L
    6
    0.25(0.010) M  
    C A M B S  
    N
    α
    16  
    16  
    7
    o
    o
    o
    o
    0
    8
    0
    8
    -
    NOTES:  
    Rev. 0 12/93  
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
    Publication Number 95.  
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
    Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
    inch) per side.  
    4. Dimension “E” does not include interlead flash or protrusions. Interlead  
    flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.  
    5. The chamfer on the body is optional. If it is not present, a visual index  
    feature must be located within the crosshatched area.  
    6. “L” is the length of terminal for soldering to a substrate.  
    7. “N” is the number of terminal positions.  
    8. Terminal numbers are shown for reference only.  
    9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above  
    the seating plane, shall not exceed a maximum value of 0.61mm (0.024  
    inch)  
    10. Controlling dimension: MILLIMETER. Converted inch dimensions are  
    not necessarily exact.  
    16  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Small Outline Plastic Packages (SOIC)  
    M24.3 (JEDEC MS-013-AD ISSUE C)  
    N
    24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
    INDEX  
    AREA  
    0.25(0.010)  
    M
    B M  
    H
    INCHES  
    MILLIMETERS  
    E
    SYMBOL  
    MIN  
    MAX  
    MIN  
    2.35  
    0.10  
    0.33  
    0.23  
    MAX  
    2.65  
    0.30  
    0.51  
    0.32  
    15.60  
    7.60  
    NOTES  
    -B-  
    A
    A1  
    B
    C
    D
    E
    e
    0.0926  
    0.0040  
    0.013  
    0.1043  
    0.0118  
    0.020  
    -
    -
    1
    2
    3
    L
    9
    SEATING PLANE  
    A
    0.0091  
    0.5985  
    0.2914  
    0.0125  
    -
    -A-  
    o
    0.6141 15.20  
    3
    h x 45  
    D
    0.2992  
    7.40  
    4
    -C-  
    0.05 BSC  
    1.27 BSC  
    -
    α
    µ
    H
    h
    0.394  
    0.010  
    0.016  
    0.419  
    0.029  
    0.050  
    10.00  
    0.25  
    0.40  
    10.65  
    0.75  
    1.27  
    -
    e
    A1  
    C
    5
    B
    0.10(0.004)  
    L
    6
    0.25(0.010) M  
    C A M B S  
    N
    α
    24  
    24  
    7
    o
    o
    o
    o
    0
    8
    0
    8
    -
    NOTES:  
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
    Publication Number 95.  
    Rev. 0 12/93  
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
    Mold flash, protrusion and gate burrs shall not exceed 0.15mm  
    (0.006 inch) per side.  
    4. Dimension “E” does not include interlead flash or protrusions. Inter-  
    lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per  
    side.  
    5. The chamfer on the body is optional. If it is not present, a visual index  
    feature must be located within the crosshatched area.  
    6. “L” is the length of terminal for soldering to a substrate.  
    7. “N” is the number of terminal positions.  
    8. Terminal numbers are shown for reference only.  
    9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
    above the seating plane, shall not exceed a maximum value of  
    0.61mm (0.024 inch)  
    10. Controlling dimension: MILLIMETER. Converted inch dimensions  
    are not necessarily exact.  
    17  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Small Outline Plastic Packages (SOIC)  
    M28.3 (JEDEC MS-013-AE ISSUE C)  
    N
    28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
    INDEX  
    AREA  
    0.25(0.010)  
    M
    B M  
    H
    INCHES  
    MILLIMETERS  
    E
    SYMBOL  
    MIN  
    MAX  
    MIN  
    2.35  
    0.10  
    0.33  
    0.23  
    MAX  
    2.65  
    0.30  
    0.51  
    0.32  
    18.10  
    7.60  
    NOTES  
    -B-  
    A
    A1  
    B
    C
    D
    E
    e
    0.0926  
    0.0040  
    0.013  
    0.1043  
    0.0118  
    0.0200  
    0.0125  
    -
    -
    1
    2
    3
    L
    9
    SEATING PLANE  
    A
    0.0091  
    0.6969  
    0.2914  
    -
    0.7125 17.70  
    3
    -A-  
    o
    h x 45  
    D
    0.2992  
    7.40  
    4
    0.05 BSC  
    1.27 BSC  
    -
    -C-  
    α
    µ
    H
    h
    0.394  
    0.01  
    0.419  
    0.029  
    0.050  
    10.00  
    0.25  
    0.40  
    10.65  
    0.75  
    1.27  
    -
    e
    A1  
    C
    5
    B
    0.10(0.004)  
    L
    0.016  
    6
    0.25(0.010) M  
    C A M B S  
    N
    α
    28  
    28  
    7
    o
    o
    o
    o
    0
    8
    0
    8
    -
    NOTES:  
    Rev. 0 12/93  
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2  
    of Publication Number 95.  
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    3. Dimension “D” does not include mold flash, protrusions or gate  
    burrs. Mold flash, protrusion and gate burrs shall not exceed  
    0.15mm (0.006 inch) per side.  
    4. Dimension “E” does not include interlead flash or protrusions. In-  
    terlead flash and protrusions shall not exceed 0.25mm (0.010  
    inch) per side.  
    5. The chamfer on the body is optional. If it is not present, a visual  
    index feature must be located within the crosshatched area.  
    6. “L” is the length of terminal for soldering to a substrate.  
    7. “N” is the number of terminal positions.  
    8. Terminal numbers are shown for reference only.  
    9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
    above the seating plane, shall not exceed a maximum value of  
    0.61mm (0.024 inch)  
    10. Controlling dimension: MILLIMETER. Converted inch dimen-  
    sions are not necessarily exact.  
    18  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Shrink Small Outline Plastic Packages (SSOP)  
    M28.209 (JEDEC MO-150-AH ISSUE B)  
    N
    28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE  
    INDEX  
    AREA  
    0.25(0.010)  
    M
    B M  
    H
    INCHES  
    MILLIMETERS  
    E
    GAUGE  
    PLANE  
    SYMBOL  
    MIN  
    MAX  
    0.078  
    -
    MIN  
    -
    MAX  
    2.00  
    -
    NOTES  
    -B-  
    A
    A1  
    A2  
    B
    -
    -
    0.002  
    0.065  
    0.009  
    0.004  
    0.390  
    0.197  
    0.05  
    1.65  
    0.22  
    0.09  
    9.90  
    5.00  
    -
    1
    2
    3
    0.072  
    0.014  
    0.009  
    0.413  
    0.220  
    1.85  
    0.38  
    0.25  
    10.50  
    5.60  
    -
    L
    0.25  
    0.010  
    SEATING PLANE  
    A
    9
    -A-  
    C
    D
    E
    -
    D
    3
    -C-  
    4
    α
    µ
    e
    0.026 BSC  
    0.65 BSC  
    -
    A2  
    e
    A1  
    C
    H
    L
    0.292  
    0.022  
    0.322  
    0.037  
    7.40  
    0.55  
    8.20  
    0.95  
    -
    B
    0.10(0.004)  
    6
    0.25(0.010) M  
    C
    A M B S  
    N
    α
    28  
    28  
    7
    o
    o
    o
    o
    NOTES:  
    0
    8
    0
    8
    -
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2  
    of Publication Number 95.  
    Rev. 1 3/95  
    2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
    3. Dimension “D” does not include mold flash, protrusions or gate  
    burrs. Mold flash, protrusion and gate burrs shall not exceed  
    0.20mm (0.0078 inch) per side.  
    4. Dimension “E” does not include interlead flash or protrusions. Inter-  
    lead flash and protrusions shall not exceed 0.20mm (0.0078 inch)  
    per side.  
    5. The chamfer on the body is optional. If it is not present, a visual in-  
    dex feature must be located within the crosshatched area.  
    6. “L” is the length of terminal for soldering to a substrate.  
    7. “N” is the number of terminal positions.  
    8. Terminal numbers are shown for reference only.  
    9. Dimension “B” does not include dambar protrusion. Allowable dam-  
    bar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”  
    dimension at maximum material condition.  
    10. Controlling dimension: MILLIMETER. Converted inch dimensions  
    are not necessarily exact.  
    19  
    HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
    Metric Plastic Quad Flatpack Packages (MQFP)  
    D
    Q44.10x10 (JEDEC MS-022AB ISSUE B)  
    D1  
    44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE  
    -D-  
    INCHES  
    MILLIMETERS  
    SYMBOL  
    MIN  
    MAX  
    MIN  
    -
    MAX  
    2.45  
    NOTES  
    A
    A1  
    A2  
    b
    -
    0.096  
    0.010  
    0.083  
    0.018  
    0.016  
    0.524  
    0.399  
    0.523  
    0.398  
    0.040  
    -
    0.004  
    0.077  
    0.012  
    0.012  
    0.515  
    0.389  
    0.516  
    0.390  
    0.029  
    0.10  
    1.95  
    0.30  
    0.30  
    13.08  
    9.88  
    13.10  
    9.90  
    0.73  
    0.25  
    -
    2.10  
    -
    -A-  
    -B-  
    0.45  
    6
    E
    E1  
    b1  
    D
    0.40  
    -
    13.32  
    10.12  
    13.30  
    10.10  
    1.03  
    3
    D1  
    E
    4, 5  
    3
    E1  
    L
    4, 5  
    e
    -
    N
    44  
    0.032 BSC  
    44  
    0.80 BSC  
    7
    PIN 1  
    e
    -
    SEATING  
    PLANE  
    Rev. 2 4/99  
    -H-  
    A
    NOTES:  
    1. Controlling dimension: MILLIMETER. Converted inch  
    dimensions are not necessarily exact.  
    0.076  
    0.003  
    o
    o
    -C-  
    12 -16  
    2. All dimensions and tolerances per ANSI Y14.5M-1982.  
    3. Dimensions D and E to be determined at seating plane -C- .  
    0.40  
    0.016  
    o
    0.20  
    0.008  
    MIN  
    M
    C
    A-B S D S  
    4. Dimensions D1 and E1 to be determined at datum plane  
    -H- .  
    0
    MIN  
    b
    A2  
    o
    A1  
    o
    o
    b1  
    0 -7  
    5. Dimensions D1 and E1 do not include mold protrusion.  
    Allowable protrusion is 0.25mm (0.010 inch) per side.  
    0.13/0.17  
    0.005/0.007  
    6. Dimension b does not include dambar protrusion. Allowable  
    dambar protrusion shall be 0.08mm (0.003 inch) total.  
    o
    12 -16  
    L
    7. “N” is the number of terminal positions.  
    BASE METAL  
    WITH PLATING  
    0.13/0.23  
    0.005/0.009  
    All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
    Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/quality/iso.asp.  
    Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.  
    Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-  
    ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No  
    license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
    For information regarding Intersil Corporation and its products, see web site www.intersil.com  
    20  
    配单直通车
    HIN232CPZ产品参数
    型号:HIN232CPZ
    Brand Name：Intersil
    生命周期：Unknown
    IHS 制造商：INTERSIL CORP
    零件包装代码：PDIP, SOIC
    包装说明：DIP, DIP16,.3
    针数：16, 16
    Reach Compliance Code：compliant
    ECCN代码：EAR99
    HTS代码：8542.39.00.01
    Factory Lead Time：8 weeks
    风险等级：7.13
    Is Samacsys：N
    差分输出：NO
    驱动器位数：2
    输入特性：SCHMITT TRIGGER
    接口集成电路类型：LINE TRANSCEIVER
    接口标准：V.28; EIA-232-E
    JESD-30 代码：R-PDIP-T16
    JESD-609代码：e3
    长度：19.17 mm
    功能数量：2
    端子数量：16
    最高工作温度：70 °C
    最低工作温度：
    最小输出摆幅：10 V
    最大输出低电流：0.0016 A
    封装主体材料：PLASTIC/EPOXY
    封装代码：DIP
    封装等效代码：DIP16,.3
    封装形状：RECTANGULAR
    封装形式：IN-LINE
    峰值回流温度（摄氏度）：NOT APPLICABLE
    电源：5 V
    认证状态：Not Qualified
    最大接收延迟：
    接收器位数：2
    座面最大高度：5.33 mm
    子类别：Line Driver or Receivers
    最大压摆率：10 mA
    最大供电电压：5.5 V
    最小供电电压：4.5 V
    标称供电电压：5 V
    表面贴装：NO
    技术：CMOS
    温度等级：COMMERCIAL
    端子面层：Matte Tin (Sn) - annealed
    端子形式：THROUGH-HOLE
    端子节距：2.54 mm
    端子位置：DUAL
    处于峰值回流温度下的最长时间：NOT APPLICABLE
    宽度：7.62 mm
    Base Number Matches：1
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