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  • HIN237CBZ
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产品型号HIN237CBZ的概述

芯片HIN237CBZ的概述 HIN237CBZ是一款高性能的数字隔离器,它主要用于高速数据传输和高电压隔离的应用场合。这种芯片在工业控制、仪器仪表、电力系统以及汽车电子等领域广泛应用,凭借其卓越的性能和可靠性,受到了电子工程师的青睐。该芯片的设计主要针对需要电气隔离的应用场景,可以有效防止潜在的高电压对数字信号的影响。 芯片HIN237CBZ的详细参数 HIN237CBZ核心参数包括但不限于以下几个方面: - 工作电压范围:通常在4.5V到5.5V之间,适应多种工作环境。 - 工作频率:最大数据速率可达到10Mbps,支持高速数据通信。 - 输入输出逻辑兼容性:兼容TTL和CMOS逻辑电平,使之可在多种电路环境中使用。 - 通道数:该芯片通常设有两通道构成的隔离设计,每通道均可独立工作。 - 绝缘电压:提供高达2500Vrms的隔离,确保安全性,适合高电压应用。 - 工作温度范围:在...

产品型号HIN237CBZ的Datasheet PDF文件预览

HIN232, HIN236, HIN237,HIN238,  
HIN239, HIN240, HIN241  
®
Data Sheet  
September 2004  
FN3138.14  
+5V Powered RS-232  
Features  
Transmitters/Receivers  
• Meets All RS-232E and V.28 Specifications  
The HIN232-HIN241 family of RS-232 transmitters/receivers  
interface circuits meet all ElA RS-232E and V.28 specifications,  
and are particularly suited for those applications where ±12V is  
not available. They require a single +5V power supply (except  
HIN239) and feature onboard charge pump voltage converters  
which generate +10V and -10V supplies from the 5V supply.  
The family of devices offer a wide variety of RS-232  
• Requires Only Single +5V Power Supply  
- (+5V and +12V - HIN239)  
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps  
• Onboard Voltage Doubler/Inverter  
• Low Power Consumption  
• Low Power Shutdown Function  
transmitter/receiver combinations to accommodate various  
applications (see Selection Table).  
• Three-State TTL/CMOS Receiver Outputs  
The drivers feature true TTL/CMOS input compatibility, slew-  
rate-limited output, and 300power-off source impedance.  
The receivers can handle up to ±30V, and have a 3kto 7kΩ  
input impedance. The receivers also feature hysteresis to  
greatly improve noise rejection.  
• Multiple Drivers  
- ±10V Output Swing for 5V lnput  
- 300Power-Off Source Impedance  
- Output Current Limiting  
- TTL/CMOS Compatible  
- 30V/µs Maximum Slew Rate  
• Multiple Receivers  
- ±30V Input Voltage Range  
- 3kto 7kInput Impedance  
- 0.5V Hysteresis to Improve Noise Rejection  
• Pb-free available  
Applications  
• Any System Requiring RS-232 Communication Ports  
- Computer - Portable, Mainframe, Laptop  
- Peripheral - Printers and Terminals  
- Instrumentation  
- Modems  
Selection Table  
NUMBER OF  
RS-232  
DRIVERS  
NUMBER OF  
RS-232  
RECEIVERS  
LOW POWER  
SHUTDOWN/TTL  
THREE-STATE  
PART  
NUMBER  
POWER SUPPLY  
VOLTAGE  
EXTERNAL  
COMPONENTS  
NUMBER OF  
LEADS  
HIN232  
+5V  
2
4
5
4
3
5
4
2
3
3
4
5
5
5
4 Capacitors  
4 Capacitors  
4 Capacitors  
4 Capacitors  
2 Capacitors  
4 Capacitors  
4 Capacitors  
No/No  
Yes/Yes  
No/No  
16  
24  
24  
24  
24  
44  
28  
HIN236  
HIN237  
HIN238  
HIN239  
HIN240  
HIN241  
+5V  
+5V  
+5V  
No/No  
+5V and +7.5V to 13.2V  
No/Yes  
Yes/Yes  
Yes/Yes  
+5V  
+5V  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright © Intersil Americas Inc. 2004. All Rights Reserved.  
1
All other trademarks mentioned are the property of their respective owners.  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Pin Descriptions  
PIN  
FUNCTION  
V
Power Supply Input 5V ±10%.  
CC  
V+  
V-  
Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V.  
Internally generated negative supply (-10V nominal).  
GND  
C1+  
C1-  
C2+  
C2-  
Ground lead. Connect to 0V.  
External capacitor (+ terminal) is connected to this lead.  
External capacitor (- terminal) is connected to this lead.  
External capacitor (+ terminal) is connected to this lead.  
External capacitor (- terminal) is connected to this lead.  
T
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kpull-up resistor to VCC is connected to each lead.  
Transmitter Outputs. These are RS-232 levels (nominally ±10V).  
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kpull-down resistor to GND is connected to each input.  
Receiver Outputs. These are TTL/CMOS levels.  
IN  
T
OUT  
R
IN  
R
OUT  
EN  
SD  
NC  
Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed in  
a high impedance state.  
Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the  
transmitters are shut off.  
No Connect. No connections are made to these leads.  
2
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Ordering Information (Continued)  
Ordering Information  
PART  
NUMBER  
TEMP.  
RANGE ( C)  
PART  
NUMBER  
TEMP.  
RANGE ( C)  
o
o
PACKAGE  
PKG. DWG. #  
PACKAGE  
16 Ld SOIC  
PKG. DWG. #  
HIN241CAZ  
(See Note)  
0 to 70  
28 Ld SSOP  
(Pb-free)  
M28.209  
HIN232CB  
0 to 70  
M16.3  
HIN232CB-T  
0 to 70  
Tape and Reel  
HIN241CB  
0 to 70  
0 to 70  
0 to 70  
28 Ld SOIC  
M28.3  
M28.3  
HIN232CBZ  
(See Note)  
0 to 70  
16 Ld SOIC  
(Pb-free)  
M16.3  
HIN241CB-T  
Tape and Reel  
HIN241CBZ  
(See Note)  
28 Ld SOIC  
(Pb-free)  
HIN232CBZ-T  
(See Note)  
0 to 70  
Tape and Reel (Pb-free)  
HIN241CBZ-T  
(See Note)  
0 to 70  
Tape and Reel (Pb-free)  
HIN232CP  
0 to 70  
0 to 70  
16 Ld PDIP  
E16.3  
E16.3  
HIN232CPZ  
(See Note)  
16 Ld PDIP  
(Pb-free)  
HIN241IB  
-40 to 85  
-40 to 85  
28 Ld SOIC  
M28.3  
M28.3  
HIN241IBZ  
(See Note)  
28 Ld SOIC  
(Pb-free)  
HIN232IB  
-40 to 85  
-40 to 85  
-40 to 85  
16 Ld SOIC  
M16.3  
M16.3  
HIN232IB-T  
Tape and Reel  
NOTE: Intersil Pb-free products employ special Pb-free material  
sets; molding compounds/die attach materials and 100% matte tin  
plate termination finish, which is compatible with both SnPb and  
Pb-free soldering operations. Intersil Pb-free products are MSL  
classified at Pb-free peak reflow temperatures that meet or exceed  
the Pb-free requirements of IPC/JEDEC J Std-020B.  
HIN232IBZ  
(See Note)  
16 Ld SOIC  
(Pb-free)  
HIN232IBZ-T  
(See Note)  
-40 to 85  
Tape and Reel (Pb-free)  
HIN232IP  
-40 to 85  
-40 to 85  
16 Ld PDIP  
E16.3  
E16.3  
HIN232IPZ  
(See Note)  
16 Ld PDIP  
(Pb-free)  
HIN236CB  
0 to 70  
0 to 70  
24 Ld SOIC  
M24.3  
M24.3  
HIN236CBZ  
(See Note)  
24 Ld SOIC  
(Pb-free)  
HIN237CB  
0 to 70  
0 to 70  
0 to 70  
24 Ld SOIC  
M24.3  
M24.3  
HIN237CB-T  
Tape and Reel  
HIN237CBZ  
(See Note)  
24 Ld SOIC  
(Pb-free)  
HIN237CBZ-T  
(See Note)  
0 to 70  
Tape and Reel (Pb-free)  
HIN238CB  
0 to 70  
0 to 70  
0 to 70  
24 Ld SOIC  
M24.3  
M24.3  
HIN238CB-T  
Tape and Reel  
HIN238CBZ  
(See Note)  
24 Ld SOIC  
(Pb-free)  
HIN238CBZ-T  
(See Note)  
0 to 70  
Tape and Reel (Pb-free)  
HIN238CP  
HIN238IB  
0 to 70  
-40 to 85  
-40 to 85  
24 Ld PDIP  
24 Ld SOIC  
E24.3  
M24.3  
M24.3  
HIN238IBZ  
(See Note)  
24 Ld SOIC  
(Pb-free)  
HIN239CB  
0 to 70  
0 to 70  
0 to 70  
24 Ld SOIC  
M24.3  
M24.3  
HIN239CB-T  
Tape and Reel  
HIN239CBZ  
(See Note)  
24 Ld SOIC  
(Pb-free)  
HIN239CBZ-T  
(See Note)  
0 to 70  
Tape and Reel (Pb-free)  
HIN239CP  
0 to 70  
0 to 70  
24 Ld PDIP  
E24.3  
E24.3  
HIN239CPZ  
(See Note)  
24 Ld PDIP  
(Pb-free)  
HIN240CN  
HIN241CA  
0 to 70  
0 to 70  
44 Ld MQFP  
28 Ld SSOP  
Q44.10X10  
M28.209  
3
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Pinouts  
HIN232 (PDIP, SOIC)  
HIN236 (SOIC)  
TOP VIEW  
TOP VIEW  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
T3  
T1  
T2  
T4  
OUT  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
C1+  
V+  
V
CC  
OUT  
OUT  
OUT  
R2  
IN  
GND  
T1  
3
R2  
OUT  
C1-  
C2+  
C2-  
V-  
OUT  
4
R1  
SD  
EN  
IN  
R1  
R1  
T1  
IN  
5
R1  
OUT  
OUT  
6
T2  
IN  
T4  
IN  
IN  
11  
10  
9
IN  
IN  
7
T3  
T1  
IN  
T2  
T2  
R2  
OUT  
8
R3  
GND  
OUT  
R2  
IN  
OUT  
9
16 R3  
V
IN  
CC  
10  
11  
12  
15  
14  
13  
V-  
C1+  
V+  
C2-  
C2+  
C1-  
+5V  
+5V  
9
+
1µF  
1µF  
10  
+
12  
1µF  
V
16  
+
+
C1+  
CC  
11  
V+  
V-  
1µF  
1µF  
+5V TO 10V  
VOLTAGE DOUBLER  
C1-  
V
CC  
13  
+
14  
1
C2+  
NOTE 1  
C1+  
+10V TO -10V  
VOLTAGE INVERTER  
+
+
15  
2
+
+
2
+5V TO 10V  
NOTE 1  
NOTE 1  
V+  
3
4
C2-  
VOLTAGE DOUBLER  
C1-  
+5V  
T1  
400kΩ  
C2+  
7
T1  
T1  
+10V TO -10V  
VOLTAGE INVERTER  
OUT  
OUT  
IN  
6
V-  
5
C2-  
NOTE 1  
T1  
+5V  
+5V  
+5V  
T2  
400kΩ  
400kΩ  
400kΩ  
6
3
1
T2  
T2  
IN  
+5V  
T1  
14  
400kΩ  
11  
T3  
T4  
T1  
IN  
OUT  
18  
T3  
T4  
T3  
T4  
OUT  
OUT  
IN  
+5V  
T2  
400kΩ  
10  
12  
7
T2  
R1  
T2  
IN  
19  
5
24  
4
OUT  
IN  
13  
R1  
R1  
IN  
OUT  
R1  
IN  
OUT  
5kΩ  
5kΩ  
R1  
5kΩ  
5kΩ  
R1  
22  
23  
R2  
R2  
R3  
IN  
OUT  
9
8
R2  
R2  
IN  
OUT  
R2  
R3  
R2  
17  
20  
16  
21  
R3  
SD  
IN  
OUT  
EN  
5kΩ  
15  
NOTE:  
8
1. Either 0.1µF or 1µF capacitors may be used. The V+ capacitor  
may be terminated to V  
or to GND.  
CC  
4
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Pinouts (Continued)  
HIN237 (SOIC)  
HIN238 (PDIP, SOIC)  
TOP VIEW  
TOP VIEW  
T2  
T1  
T3  
T3  
T1  
T2  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
1
2
3
4
5
6
7
8
9
24 T4  
1
2
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
R3  
R3  
T4  
23 R2  
OUT  
IN  
IN  
R2  
R2  
T5  
3
22  
21  
20  
19  
18  
17  
16  
IN  
OUT  
OUT  
R2  
R1  
4
OUT  
IN  
IN  
IN  
T1  
IN  
T4  
T3  
T2  
R1  
T5  
T4  
T3  
5
OUT  
IN  
OUT  
OUT  
IN  
R1  
T2  
IN  
6
OUT  
R1  
IN  
T1  
IN  
7
IN  
IN  
R4  
R4  
V-  
R3  
R3  
GND  
8
GND  
OUT  
IN  
OUT  
IN  
V
V
9
CC  
CC  
C1+  
V+  
C1+ 10  
V+ 11  
15 V-  
10  
11  
12  
C2-  
14 C2-  
13 C2+  
C1-  
C2+  
C1- 12  
+5V  
9
+5V  
9
1µF  
1µF  
1µF  
10  
10  
+
12  
V
V
+
CC  
C1+  
+
+
CC  
C1+  
+
12  
11  
11  
V+  
1µF  
1µF  
V+  
V-  
1µF  
1µF  
+5V TO 10V  
VOLTAGE DOUBLER  
+5V TO 10V  
VOLTAGE DOUBLER  
C1-  
C1-  
13  
+
14  
13  
+
14  
C2+  
C2+  
+10V TO -10V  
VOLTAGE INVERTER  
+10V TO -10V  
VOLTAGE INVERTER  
15  
V-  
15  
2
C2-  
1µF  
C2-  
+
+5V  
+5V  
T1  
T1  
T2  
2
3
400kΩ  
7
400kΩ  
5
T1  
T1  
IN  
T1  
OUT  
T1  
IN  
OUT  
OUT  
+5V  
T2  
+5V  
+5V  
+5V  
400kΩ  
6
400kΩ  
18  
19  
1
T2  
T2  
IN  
T2  
OUT  
T2  
IN  
+5V  
+5V  
+5V  
T3  
T4  
T5  
T3  
T4  
400kΩ  
400kΩ  
400kΩ  
18  
19  
1
400kΩ  
400kΩ  
24  
T3  
T4  
T5  
T3  
IN  
T3  
T4  
OUT  
OUT  
OUT  
T3  
IN  
OUT  
OUT  
24  
21  
6
20  
7
T4  
IN  
T4  
IN  
R1  
R1  
21  
5
20  
4
IN  
OUT  
T5  
IN  
5kΩ  
R1  
R1  
R1  
IN  
OUT  
4
22  
17  
3
5kΩ  
5kΩ  
R2  
R3  
R4  
R2  
R3  
R4  
R1  
IN  
IN  
IN  
OUT  
OUT  
OUT  
5kΩ  
5kΩ  
5kΩ  
R2  
R3  
R4  
22  
17  
23  
16  
R2  
R2  
IN  
OUT  
23  
16  
R2  
R3  
R3  
R3  
IN  
OUT  
5kΩ  
8
8
5
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Pinouts (Continued)  
HIN239 (PDIP, SOIC)  
HIN240 (MQFP)  
TOP VIEW  
R1  
T1  
T2  
1
2
24  
23  
22  
OUT  
IN  
IN  
R1  
IN  
R2  
3
GND  
OUT  
IN  
44 43 42 41 40 39 38 37 36 35 34  
NC  
1
NC  
NC  
NC  
V-  
33  
32  
31  
30  
29  
V
21 R2  
20 T2  
4
CC  
T5  
2
3
4
5
6
7
8
9
IN  
5
V+  
C1+  
C1-  
V-  
OUT  
OUT  
R3  
OUT  
6
19 T1  
R3  
18  
R3  
IN  
OUT  
OUT  
OUT  
7
T4  
T3  
T1  
T2  
IN  
C2-  
C2+  
C1-  
V+  
8
17 R3  
16 T3  
OUT  
28  
27  
26  
25  
24  
23  
R5  
IN  
9
IN  
OUT  
NC  
R5  
10  
11  
12  
15  
14  
NC  
EN  
OUT  
OUT  
C1+  
NC  
NC  
R4  
R2  
10  
11  
IN  
R4  
13 T3  
OUT  
IN  
NC  
12 13 14 15 16 17 18 19 20 21 22  
+5V  
+7.5V TO +13.2V (NOTE)  
19  
+5V  
25  
+
27  
1µF  
V
CC  
C1+  
4
+
26  
30  
V+  
V-  
1µF  
6
7
+5V TO 10V  
VOLTAGE DOUBLER  
V
CC  
C1+  
C1-  
C1-  
+
5
V+  
1µF  
28  
+
29  
+10V TO -10V  
VOLTAGE INVERTER  
C2+  
8
+10V TO -10V  
VOLTAGE INVERTER  
(NOTE)  
V-  
1µF  
1µF  
C2-  
1µF  
T1  
+
+5V  
+5V  
T1  
T1  
7
19  
400kΩ  
400kΩ  
15  
24  
23  
T1  
T1  
IN  
T1  
IN  
OUT  
OUT  
+5V  
+5V  
+5V  
+5V  
T2  
+5V  
T2  
T3  
400kΩ  
400kΩ  
400kΩ  
400kΩ  
14  
37  
38  
8
6
5
400kΩ  
400kΩ  
20  
T2  
T2  
IN  
OUT  
T2  
T2  
IN  
OUT  
T3  
T4  
T5  
+5V  
16  
1
13  
T3  
T4  
T5  
T3  
IN  
OUT  
OUT  
OUT  
T3  
T3  
IN  
OUT  
2
R1  
IN  
R1  
OUT  
T4  
IN  
5kΩ  
R1  
2
41  
17  
T5  
IN  
22  
17  
11  
21  
18  
12  
9
R2  
R3  
R4  
R5  
R2  
16  
IN  
IN  
IN  
OUT  
R1  
R2  
R3  
R4  
R5  
R1  
IN  
OUT  
5kΩ  
5kΩ  
5kΩ  
5kΩ  
R2  
R3  
R4  
R5  
5kΩ  
R1  
13  
3
10  
4
R3  
OUT  
R2  
IN  
IN  
IN  
IN  
OUT  
OUT  
OUT  
5kΩ  
5kΩ  
5kΩ  
5kΩ  
R2  
R3  
R4  
R5  
R4  
R3  
R4  
R5  
OUT  
39  
40  
10  
14  
R5  
IN  
OUT  
36  
42  
35  
43  
EN  
OUT  
EN  
3
SD  
18  
NOTE: For V+ > 11V, use C 0.1µF.  
1
6
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Pinouts (Continued)  
HIN241 (SOIC, SSOP)  
TOP VIEW  
T3  
T1  
T2  
1
2
3
4
5
6
7
8
9
28 T4  
OUT  
OUT  
OUT  
OUT  
27 R3  
26 R3  
IN  
OUT  
25 SD  
24 EN  
R2  
IN  
R2  
OUT  
T2  
T1  
23 R4  
22 R4  
IN  
IN  
IN  
OUT  
IN  
R1  
21 T4  
20  
OUT  
R1  
IN  
T3  
IN  
GND 10  
11  
19 R5  
18 R5  
17 V-  
OUT  
IN  
V
CC  
C1+ 12  
V+ 13  
16 C2-  
15 C2+  
C1- 14  
+5V  
11  
1µF  
1µF  
12  
V
+
+
CC  
C1+  
13  
+
V+  
V-  
1µF  
1µF  
+5V TO 10V  
VOLTAGE DOUBLER  
14  
15  
C1-  
C2+  
+
16  
+10V TO -10V  
VOLTAGE INVERTER  
17  
C2-  
+5V  
T1  
2
3
1
400kΩ  
7
6
T1  
T1  
IN  
OUT  
OUT  
+5V  
+5V  
+5V  
T2  
T3  
T4  
400kΩ  
400kΩ  
400kΩ  
T2  
T3  
T4  
T2  
IN  
20  
T3  
IN  
OUT  
OUT  
21  
8
28  
9
T4  
IN  
R1  
R1  
IN  
OUT  
5kΩ  
R1  
5
26  
22  
4
R2  
R3  
R4  
R5  
R2  
R3  
R4  
R5  
IN  
IN  
IN  
OUT  
OUT  
OUT  
5kΩ  
5kΩ  
5kΩ  
5kΩ  
R2  
R3  
R4  
R5  
27  
23  
19  
24  
18  
25  
IN  
OUT  
EN  
SD  
10  
7
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Absolute Maximum Ratings  
Thermal Information  
o
V
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V  
< 6V  
Thermal Resistance (Typical, Note 3)  
θ
( C/W)  
CC  
V+ to Ground (Note 2) . . . . . . . . . . . . . . . (V  
CC  
-0.3V) < V+ < 13.2V  
JA  
CC  
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .  
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .  
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .  
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .  
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .  
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .  
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .  
90  
70  
100  
75  
70  
95  
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)  
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V  
Input Voltages  
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V < (V+ +0.3V)  
IN  
IN  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V  
IN  
Output Voltages  
80  
o
T
R
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V  
. . . . . . . . . . . . . . . . . (GND -0.3V) < V  
< (V+ +0.3V)  
< (V+ +0.3V)  
OUT  
TXOUT  
RXOUT  
Maximum Junction Temperature (Plastic Package) . . . . . . . .150 C  
o
o
OUT  
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300 C  
o
Short Circuit Duration  
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous  
OUT  
(SOIC, SSOP, MQFP - Lead Tips Only)  
OUT  
Operating Conditions  
Temperature Range  
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C  
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C  
o
o
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
2. Only HIN239. For V+ > 11V, C1 must be 0.1µF.  
3. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
JA  
Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range  
CC  
A
PARAMETER  
SUPPLY CURRENTS  
Power Supply Current, I  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
No Load,  
o
HIN232  
-
-
-
-
5
10  
15  
1
mA  
mA  
mA  
mA  
CC  
T = 25 C  
A
HIN236-HIN238, HIN240-HIN241  
7
HIN239  
HIN239  
0.4  
5.0  
V+ Power Supply Current, I  
No Load,  
o
15  
CC  
o
No Load, T = 25 C  
T = 25 C  
A
A
o
Shutdown Supply Current, I (SD)  
CC  
T = 25 C  
-
1
10  
µA  
A
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS  
Input Logic Low, V  
T
T
, EN, Shutdown  
-
-
-
0.8  
-
V
V
lL  
IN  
IN  
Input Logic High, V  
2.0  
2.4  
-
lH  
EN, Shutdown  
= 0V  
-
-
V
Transmitter Input Pullup Current, I  
T
15  
0.1  
4.6  
200  
0.4  
-
µA  
V
P
IN  
TTL/CMOS Receiver Output Voltage Low, V  
I
I
= 1.6mA  
= -1.0mA  
-
OL  
OUT  
OUT  
TTL/CMOS Receiver Output Voltage High, V  
3.5  
V
OH  
RECEIVER INPUTS  
RS-232 Input Voltage Range V  
-30  
3.0  
0.8  
-
-
+30  
7.0  
-
V
kΩ  
V
IN  
Receiver Input Impedance R  
V
V
V
= ±3V  
5.0  
1.2  
1.7  
0.5  
IN  
IN  
o
Receiver Input Low Threshold, V (H-L)  
= 5V, T = 25 C  
A
lN  
Receiver Input High Threshold, V (L-H)  
CC  
CC  
o
= 5V, T = 25 C  
2.4  
1.0  
V
IN  
A
Receiver Input Hysteresis V  
0.2  
V
HYST  
8
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range (Continued)  
CC  
A
PARAMETER  
TIMING CHARACTERISTICS  
Baud Rate (1 Transmitter Switching)  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
R
= 3kΩ  
120  
-
-
-
kbps  
ns  
L
Output Enable Time, t  
HIN236, HIN239, HIN240, HIN241  
HIN236, HIN239, HIN240, HIN241  
-
-
-
-
-
400  
250  
0.5  
-
EN  
Output Disable Time, t  
-
ns  
DIS  
Propagation Delay, t  
RS-232 to TTL  
= 10pF, R = 3k, T = 25 C (Note 4)  
-
µs  
PD  
o
Instantaneous Slew Rate SR  
C
30  
-
V/µs  
V/µs  
L
L
A
Transition Region Slew Rate, SR  
R = 3k, C = 2500pF Measured from +3V to -3V or  
3
T
L
L
-3V to +3V, 1 Transmitter Switching  
TRANSMITTER OUTPUTS  
Output Voltage Swing, T  
OUT  
Transmitter Outputs, 3kto Ground  
±5  
300  
-
±9  
-
±10  
V
Output Resistance, T  
OUT  
V
= V+ = V- = 0V, V  
OUT  
= ±2V  
-
-
CC  
RS-232 Output Short Circuit Current, I  
T
shorted to GND  
±10  
mA  
SC  
OUT  
NOTE:  
4. Guaranteed by design.  
VOLTAGE DOUBLER  
+
VOLTAGE INVERTER  
+
S5  
S1  
S3  
S2  
C2  
C1  
V+ = 2V  
S6  
CC  
V
GND  
CC  
+
-
+
-
+
-
+
C4  
-
C3  
C2  
C1  
V
GND  
CC  
V- = -(V+)  
GND  
-
C1-  
S4  
C2  
S7  
S8  
RC  
OSCILLATOR  
FIGURE 1. CHARGE PUMP  
to 5.5V. The output impedance of the voltage doubler section  
(V+) is approximately 200, and the output impedance of the  
voltage inverter section (V-) is approximately 450. A typical  
application uses 1µF capacitors for C1-C4, however, the value  
is not critical. Increasing the values of C1 and C2 will lower the  
output impedance of the voltage doubler and inverter,  
increasing the values of the reservoir capacitors, C3 and C4,  
lowers the ripple on the V+ and V- supplies.  
Detailed Description  
The HIN232 thru HIN241 family of RS-232  
transmitters/receivers are powered by a single +5V power  
supply (except HIN239), feature low power consumption, and  
meet all ElA RS-232C and V.28 specifications. The circuit is  
divided into three sections: The charge pump, transmitter, and  
receiver.  
Charge Pump  
During shutdown mode (HIN236, HIN240 and HIN241),  
SHUTDOWN control line set to logic “1”, the charge pump is  
An equivalent circuit of the charge pump is illustrated in  
Figure 1. The charge pump contains two sections: the voltage  
doubler and the voltage inverter. Each section is driven by a  
two phase, internally generated clock to generate +10V and  
-10V. The nominal clock frequency is 16kHz. During phase  
turned off, V+ is pulled down to V , V- is pulled up to GND,  
CC  
and the supply current is reduced to less than 10µA. The  
transmitter outputs are disabled and the receiver outputs are  
placed in the high impedance state.  
one of the clock, capacitor C1 is charged to V . During  
CC  
phase two, the voltage on C1 is added to V , producing a  
CC  
signal across C3 equal to twice V . During phase one, C2 is  
CC  
also charged to 2V , and then during phase two, it is  
CC  
inverted with respect to ground to produce a signal across C4  
equal to -2V . The charge pump accepts input voltages up  
CC  
9
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Transmitters  
Receivers  
The transmitters are TTL/CMOS compatible inverters which  
translate the inputs to RS-232 outputs. The input logic threshold  
The receiver inputs accept up to ±30V while presenting the  
required 3kto 7kinput impedance even if the power is off  
is about 26% of V , or 1.3V for V  
= 5V. A logic 1 at the  
(V = 0V). The receivers have a typical input threshold of  
CC CC  
CC  
input results in a voltage of between -5V and V- at the output,  
and a logic 0 results in a voltage between +5V and (V+ -0.6V).  
Each transmitter input has an internal 400kpullup resistor so  
any unused input can be left unconnected and its output  
remains in its low state. The output voltage swing meets the  
RS-232C specifications of ±5V minimum with the worst case  
conditions of: all transmitters driving 3kminimum load  
1.3V which is within the ±3V limits, known as the transition  
region, of the RS-232 specifications. The receiver output is  
0V to V . The output will be low whenever the input is  
CC  
greater than 2.4V and high whenever the input is floating or  
driven between +0.8V and -30V. The receivers feature 0.5V  
hysteresis to improve noise rejection. The receiver Enable  
line EN, when set to logic “1”, (HIN236, 239, 240, and 241)  
disables the receiver outputs, placing them in the high  
impedance mode. The receiver outputs are also placed in  
the high impedance state when in shutdown mode.  
impedance, V  
= 4.5V, and maximum allowable operating  
CC  
temperature. The transmitters have an internally limited output  
slew rate which is less than 30V/µs. The outputs are short  
circuit protected and can be shorted to ground indefinitely. The  
powered down output impedance is a minimum of 300with  
V
CC  
±2V applied to the outputs and V  
= 0V.  
CC  
R
XIN  
R
OUT  
-30V < R  
< +30V  
XIN  
GND < V  
< V  
CC  
5kΩ  
ROUT  
V+  
GND  
V
T
CC  
400kΩ  
300Ω  
FIGURE 3. RECEIVER  
XIN  
XIN  
T
OUT  
GND < T  
< V  
CC  
V- < V  
TOUT  
< V+  
V-  
FIGURE 2. TRANSMITTER  
T
IN  
OR  
R
IN  
T
OUT  
OR  
V
OL  
V
OL  
R
OUT  
t
t
PLH  
PHL  
t
t
PHL + PLH  
2
Average Propagation Delay =  
FIGURE 4. PROPAGATION DELAY DEFINITION  
10  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Typical Performance Curves  
o
T
= 25 C  
A
12  
10  
8
TRANSMITTER OUTPUTS  
OPEN CIRCUIT  
12  
1µF  
10  
8
0.47µF  
V+ (V  
CC  
= 5V)  
0.10µF  
6
V+ (V  
= 4.5V)  
6
CC  
V- (V  
CC  
= 4.5V)  
4
4
V- (V  
= 5V)  
CC  
2
2
0
0
3.0  
4.0  
4.5  
5.0  
5.5  
6.0  
5
10  
15  
|I  
20  
| (mA)  
25  
30  
35  
0
3.5  
V
LOAD  
CC  
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)  
FIGURE 5. V- SUPPLY VOLTAGE vs V , VARYING  
CC  
CAPACITORS  
Test Circuits (HIN232)  
+4.5V TO  
+5.5V INPUT  
C1+  
V+  
1
2
3
4
5
6
7
8
16  
15  
14  
V
CC  
GND  
T1  
-
+
1µF  
C3  
V
C1+  
V+  
1
2
3
4
5
6
7
8
16  
CC  
C1-  
C2+  
C2-  
OUT  
+
3kΩ  
1µF  
C1  
GND 15  
R1 13  
IN  
-
T1  
C1-  
C2+  
C2-  
V-  
14  
13  
12  
11  
T1 OUTPUT  
OUT  
R1  
12  
11  
10  
9
OUT  
R1  
IN  
RS-232 ±30V INPUT  
TTL/CMOS OUTPUT  
TTL/CMOS INPUT  
TTL/CMOS INPUT  
TTL/CMOS OUTPUT  
+
1µF  
C2  
T1  
IN  
V-  
-
R1  
OUT  
T2  
T2  
IN  
-
+
OUT  
T1  
IN  
R2  
R2  
IN  
OUT  
1µF C4  
T2  
T2 10  
IN  
3kΩ  
OUT  
R2  
9
R2  
IN  
R
= V /1T2  
IN  
OUT  
OUT  
OUT  
T1  
T2  
OUTPUT  
OUT  
V
= ±2V  
A
IN  
RS-232  
±30V INPUT  
FIGURE 8. POWER-OFF SOURCE RESISTANCE  
CONFIGURATION  
FIGURE 7. GENERAL TEST CIRCUIT  
11  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Applications  
+5V  
-
The HIN2XX may be used for all RS-232 data terminal and  
communication links. It is particularly useful in applications  
where ±12V power supplies are not available for  
conventional RS-232 interface circuits. The applications  
presented represent typical interface configurations.  
+
16  
DTR (20) DATA  
TERMINAL READY  
1
+
C1  
1µF  
2
3
4
DSRS (24) DATA  
SIGNALING RATE  
SELECT  
-
HIN232  
6
+
-
+
C2  
1µF  
RS-232  
INPUTS AND OUTPUTS  
5
-
A simple duplex RS-232 port with CTS/RTS handshaking is  
illustrated in Figure 9. Fixed output signals such as DTR  
(data terminal ready) and DSRS (data signaling rate select)  
is generated by driving them through a 5kresistor  
connected to V+.  
T1  
11  
14  
TD  
TD (2) TRANSMIT DATA  
T2  
10  
12  
7
RTS (4) REQUEST TO SEND  
RD (3) RECEIVE DATA  
TTL/CMOS RTS  
INPUTS AND  
13  
RD  
OUTPUTS  
R2  
R1  
9
8
CTS  
CTS (5) CLEAR TO SEND  
In applications requiring four RS-232 inputs and outputs  
(Figure 10), note that each circuit requires two charge pump  
capacitors (C1 and C2) but can share common reservoir  
capacitors (C3 and C4). The benefit of sharing common  
reservoir capacitors is the elimination of two capacitors and  
the reduction of the charge pump source impedance which  
effectively increases the output swing of the transmitters.  
15  
SIGNAL GROUND (7)  
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS  
HANDSHAKING  
1
4
+
+
C1  
C2  
HIN232  
T1  
5
1µF  
3
1µF  
-
-
11  
14  
TD  
RTS  
RD  
TD (2) TRANSMIT DATA  
RTS (4) REQUEST TO SEND  
RD (3) RECEIVE DATA  
T2  
10  
12  
7
TTL/CMOS  
INPUTS AND  
OUTPUTS  
13  
R2  
R1  
9
8
CTS  
CTS (5) CLEAR TO SEND  
15  
16  
6
6
2
2
C4  
C3  
+5V  
-
-
V- V+  
RS-232  
INPUTS AND OUTPUTS  
2µF  
2µF  
16  
4
HIN232  
T1  
1
+
+
C1  
1µF  
C2  
1µF  
5
3
-
-
11  
14  
DTR  
DSRS  
DCD  
R1  
DTR (20) DATA TERMINAL READY  
DSRS (24) DATA SIGNALING RATE SELECT  
DCD (8) DATA CARRIER DETECT  
R1 (22) RING INDICATOR  
T2  
10  
12  
7
TTL/CMOS  
INPUTS AND  
OUTPUTS  
13  
R2  
R1  
9
8
15  
SIGNAL GROUND (7)  
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS  
12  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Die Characteristics  
DIE DIMENSIONS  
PASSIVATION  
160 mils x 140 mils  
Type: Nitride over Silox  
Nitride Thickness: 8kÅ  
Silox Thickness: 7kÅ  
METALLIZATION  
Type: Al  
Thickness: 10kÅ ±1kÅ  
TRANSISTOR COUNT  
238  
SUBSTRATE POTENTIAL  
PROCESS  
V+  
CMOS Metal Gate  
Metallization Mask Layout  
HIN240  
T2  
OUT  
T1  
T3  
T4  
R3  
R3  
OUT  
T5  
IN  
OUT  
OUT  
OUT  
IN  
R2  
IN  
SHUTDOWN  
R2  
OUT  
EN  
T2  
T1  
IN  
IN  
T5  
OUT  
R4  
R1  
IN  
OUT  
R4  
R1  
OUT  
IN  
T4  
T3  
IN  
GND  
IN  
R5  
OUT  
V
CC  
R5  
IN  
C1+  
V+  
C1-  
C2+  
C2-  
V-  
13  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Dual-In-Line Plastic Packages (PDIP)  
E16.3 (JEDEC MS-001-BB ISSUE D)  
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE  
E1  
INDEX  
AREA  
INCHES  
MILLIMETERS  
1
2
3
N/2  
SYMBOL  
MIN  
MAX  
0.210  
-
MIN  
-
MAX  
5.33  
-
NOTES  
-B-  
A
A1  
A2  
B
-
4
-A-  
0.015  
0.115  
0.014  
0.045  
0.008  
0.735  
0.005  
0.300  
0.240  
0.39  
2.93  
0.356  
1.15  
0.204  
18.66  
0.13  
7.62  
6.10  
4
D
E
BASE  
PLANE  
0.195  
0.022  
0.070  
0.014  
0.775  
-
4.95  
0.558  
1.77  
0.355  
19.68  
-
-
A2  
A
-C-  
-
SEATING  
PLANE  
B1  
C
8, 10  
L
C
L
-
D1  
B1  
eA  
A1  
A
D1  
e
D
5
eC  
C
B
D1  
E
5
eB  
0.010 (0.25) M  
C
B S  
0.325  
0.280  
8.25  
7.11  
6
NOTES:  
E1  
e
5
1. Controlling Dimensions: INCH. In case of conflict between English and  
Metric dimensions, the inch dimensions control.  
0.100 BSC  
0.300 BSC  
2.54 BSC  
7.62 BSC  
-
e
A
6
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication No. 95.  
e
-
0.430  
0.150  
-
10.92  
3.81  
7
B
L
0.115  
2.93  
4
9
4. Dimensions A, A1 and L are measured with the package seated in JE-  
N
16  
16  
DEC seating plane gauge GS-3.  
Rev. 0 12/93  
5. D, D1, and E1 dimensions do not include mold flash or protrusions.  
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).  
e
6. E and  
are measured with the leads constrained to be perpendic-  
A
-C-  
ular to datum  
.
7. e and e are measured at the lead tips with the leads unconstrained.  
B
C
e
must be zero or greater.  
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar  
protrusions shall not exceed 0.010 inch (0.25mm).  
9. N is the maximum number of terminal positions.  
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,  
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).  
14  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Dual-In-Line Plastic Packages (PDIP)  
E24.3 (JEDEC MS-001-AF ISSUE D)  
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC  
PACKAGE  
N
E1  
INDEX  
AREA  
1
2
3
N/2  
INCHES  
MILLIMETERS  
-B-  
SYMBOL  
MIN  
MAX  
0.210  
-
MIN  
-
MAX  
5.33  
-
NOTES  
-A-  
A
A1  
A2  
B
-
4
D
E
0.015  
0.115  
0.014  
0.045  
0.008  
1.230  
0.005  
0.300  
0.240  
0.39  
2.93  
0.356  
1.15  
0.204  
31.24  
0.13  
7.62  
6.10  
4
BASE  
PLANE  
A2  
A
0.195  
0.022  
0.070  
0.014  
1.280  
-
4.95  
0.558  
1.77  
0.355  
32.51  
-
-
-C-  
SEATING  
PLANE  
-
L
C
L
B1  
C
8
D1  
B1  
eA  
A1  
A
D1  
-
e
eC  
C
B
D
5
eB  
0.010 (0.25) M  
C
B S  
D1  
E
5
0.325  
0.280  
8.25  
7.11  
6
NOTES:  
1. Controlling Dimensions: INCH. In case of conflict between English and  
Metric dimensions, the inch dimensions control.  
E1  
e
5
0.100 BSC  
0.300 BSC  
2.54 BSC  
7.62 BSC  
-
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
e
e
6
A
B
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication No. 95.  
-
0.430  
0.150  
-
10.92  
3.81  
7
4. Dimensions A, A1 and L are measured with the package seated in  
L
0.115  
2.93  
4
9
JEDEC seating plane gauge GS-3.  
N
24  
24  
5. D, D1, and E1 dimensions do not include mold flash or protrusions.  
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).  
Rev. 0 12/93  
e
6. E and  
are measured with the leads constrained to be perpendic-  
A
-C-  
ular to datum  
.
7. e and e are measured at the lead tips with the leads unconstrained.  
B
C
e
must be zero or greater.  
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar  
protrusions shall not exceed 0.010 inch (0.25mm).  
9. N is the maximum number of terminal positions.  
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,  
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).  
15  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Small Outline Plastic Packages (SOIC)  
M16.3 (JEDEC MS-013-AA ISSUE C)  
N
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
INCHES  
MILLIMETERS  
E
SYMBOL  
MIN  
MAX  
MIN  
2.35  
0.10  
0.33  
0.23  
MAX  
2.65  
0.30  
0.51  
0.32  
10.50  
7.60  
NOTES  
-B-  
A
A1  
B
C
D
E
e
0.0926  
0.0040  
0.013  
0.1043  
0.0118  
0.0200  
0.0125  
-
-
1
2
3
L
9
SEATING PLANE  
A
0.0091  
0.3977  
0.2914  
-
-A-  
o
0.4133 10.10  
3
h x 45  
D
0.2992  
7.40  
4
-C-  
0.050 BSC  
1.27 BSC  
-
α
µ
H
h
0.394  
0.010  
0.016  
0.419  
0.029  
0.050  
10.00  
0.25  
0.40  
10.65  
0.75  
1.27  
-
e
A1  
C
5
B
0.10(0.004)  
L
6
0.25(0.010) M  
C A M B S  
N
α
16  
16  
7
o
o
o
o
0
8
0
8
-
NOTES:  
Rev. 0 12/93  
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Interlead  
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above  
the seating plane, shall not exceed a maximum value of 0.61mm (0.024  
inch)  
10. Controlling dimension: MILLIMETER. Converted inch dimensions are  
not necessarily exact.  
16  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Small Outline Plastic Packages (SOIC)  
M24.3 (JEDEC MS-013-AD ISSUE C)  
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
INCHES  
MILLIMETERS  
E
SYMBOL  
MIN  
MAX  
MIN  
2.35  
0.10  
0.33  
0.23  
MAX  
2.65  
0.30  
0.51  
0.32  
15.60  
7.60  
NOTES  
-B-  
A
A1  
B
C
D
E
e
0.0926  
0.0040  
0.013  
0.1043  
0.0118  
0.020  
-
-
1
2
3
L
9
SEATING PLANE  
A
0.0091  
0.5985  
0.2914  
0.0125  
-
-A-  
o
0.6141 15.20  
3
h x 45  
D
0.2992  
7.40  
4
-C-  
0.05 BSC  
1.27 BSC  
-
α
µ
H
h
0.394  
0.010  
0.016  
0.419  
0.029  
0.050  
10.00  
0.25  
0.40  
10.65  
0.75  
1.27  
-
e
A1  
C
5
B
0.10(0.004)  
L
6
0.25(0.010) M  
C A M B S  
N
α
24  
24  
7
o
o
o
o
0
8
0
8
-
NOTES:  
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
Rev. 0 12/93  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm  
(0.006 inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per  
side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch)  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
17  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Small Outline Plastic Packages (SOIC)  
M28.3 (JEDEC MS-013-AE ISSUE C)  
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
INCHES  
MILLIMETERS  
E
SYMBOL  
MIN  
MAX  
MIN  
2.35  
0.10  
0.33  
0.23  
MAX  
2.65  
0.30  
0.51  
0.32  
18.10  
7.60  
NOTES  
-B-  
A
A1  
B
C
D
E
e
0.0926  
0.0040  
0.013  
0.1043  
0.0118  
0.0200  
0.0125  
-
-
1
2
3
L
9
SEATING PLANE  
A
0.0091  
0.6969  
0.2914  
-
0.7125 17.70  
3
-A-  
o
h x 45  
D
0.2992  
7.40  
4
0.05 BSC  
1.27 BSC  
-
-C-  
α
µ
H
h
0.394  
0.01  
0.419  
0.029  
0.050  
10.00  
0.25  
0.40  
10.65  
0.75  
1.27  
-
e
A1  
C
5
B
0.10(0.004)  
L
0.016  
6
0.25(0.010) M  
C A M B S  
N
α
28  
28  
7
o
o
o
o
0
8
0
8
-
NOTES:  
Rev. 0 12/93  
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2  
of Publication Number 95.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs. Mold flash, protrusion and gate burrs shall not exceed  
0.15mm (0.006 inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. In-  
terlead flash and protrusions shall not exceed 0.25mm (0.010  
inch) per side.  
5. The chamfer on the body is optional. If it is not present, a visual  
index feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch)  
10. Controlling dimension: MILLIMETER. Converted inch dimen-  
sions are not necessarily exact.  
18  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Shrink Small Outline Plastic Packages (SSOP)  
M28.209 (JEDEC MO-150-AH ISSUE B)  
N
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE  
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
INCHES  
MILLIMETERS  
E
GAUGE  
PLANE  
SYMBOL  
MIN  
MAX  
0.078  
-
MIN  
-
MAX  
2.00  
-
NOTES  
-B-  
A
A1  
A2  
B
-
-
0.002  
0.065  
0.009  
0.004  
0.390  
0.197  
0.05  
1.65  
0.22  
0.09  
9.90  
5.00  
-
1
2
3
0.072  
0.014  
0.009  
0.413  
0.220  
1.85  
0.38  
0.25  
10.50  
5.60  
-
L
0.25  
0.010  
SEATING PLANE  
A
9
-A-  
C
D
E
-
D
3
-C-  
4
α
µ
e
0.026 BSC  
0.65 BSC  
-
A2  
e
A1  
C
H
L
0.292  
0.022  
0.322  
0.037  
7.40  
0.55  
8.20  
0.95  
-
B
0.10(0.004)  
6
0.25(0.010) M  
C
A M B S  
N
α
28  
28  
7
o
o
o
o
NOTES:  
0
8
0
8
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2  
of Publication Number 95.  
Rev. 1 3/95  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs. Mold flash, protrusion and gate burrs shall not exceed  
0.20mm (0.0078 inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch)  
per side.  
5. The chamfer on the body is optional. If it is not present, a visual in-  
dex feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “B” does not include dambar protrusion. Allowable dam-  
bar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”  
dimension at maximum material condition.  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
19  
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241  
Metric Plastic Quad Flatpack Packages (MQFP)  
D
Q44.10x10 (JEDEC MS-022AB ISSUE B)  
D1  
44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE  
-D-  
INCHES  
MILLIMETERS  
SYMBOL  
MIN  
MAX  
MIN  
-
MAX  
2.45  
NOTES  
A
A1  
A2  
b
-
0.096  
0.010  
0.083  
0.018  
0.016  
0.524  
0.399  
0.523  
0.398  
0.040  
-
0.004  
0.077  
0.012  
0.012  
0.515  
0.389  
0.516  
0.390  
0.029  
0.10  
1.95  
0.30  
0.30  
13.08  
9.88  
13.10  
9.90  
0.73  
0.25  
-
2.10  
-
-A-  
-B-  
0.45  
6
E
E1  
b1  
D
0.40  
-
13.32  
10.12  
13.30  
10.10  
1.03  
3
D1  
E
4, 5  
3
E1  
L
4, 5  
e
-
N
44  
0.032 BSC  
44  
0.80 BSC  
7
PIN 1  
e
-
SEATING  
PLANE  
Rev. 2 4/99  
-H-  
A
NOTES:  
1. Controlling dimension: MILLIMETER. Converted inch  
dimensions are not necessarily exact.  
0.076  
0.003  
o
o
-C-  
12 -16  
2. All dimensions and tolerances per ANSI Y14.5M-1982.  
3. Dimensions D and E to be determined at seating plane -C- .  
0.40  
0.016  
o
0.20  
0.008  
MIN  
M
C
A-B S D S  
4. Dimensions D1 and E1 to be determined at datum plane  
-H- .  
0
MIN  
b
A2  
o
A1  
o
o
b1  
0 -7  
5. Dimensions D1 and E1 do not include mold protrusion.  
Allowable protrusion is 0.25mm (0.010 inch) per side.  
0.13/0.17  
0.005/0.007  
6. Dimension b does not include dambar protrusion. Allowable  
dambar protrusion shall be 0.08mm (0.003 inch) total.  
o
12 -16  
L
7. “N” is the number of terminal positions.  
BASE METAL  
WITH PLATING  
0.13/0.23  
0.005/0.009  
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/quality/iso.asp.  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.  
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-  
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No  
license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site www.intersil.com  
20  
配单直通车
HIN237CBZ产品参数
型号:HIN237CBZ
Brand Name:Intersil
是否Rohs认证: 符合
生命周期:Obsolete
IHS 制造商:INTERSIL CORP
零件包装代码:SOIC
包装说明:ROHS COMPLIANT, PLASTIC, MS-013AD, SOIC-24
针数:24
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:1 week
风险等级:5.07
Is Samacsys:N
差分输出:NO
驱动器位数:5
输入特性:SCHMITT TRIGGER
接口集成电路类型:LINE TRANSCEIVER
接口标准:V.28; EIA-232-E
JESD-30 代码:R-PDSO-G24
JESD-609代码:e3
长度:15.4 mm
湿度敏感等级:3
功能数量:3
端子数量:24
最高工作温度:70 °C
最低工作温度:
最小输出摆幅:10 V
最大输出低电流:0.0016 A
封装主体材料:PLASTIC/EPOXY
封装代码:SOP
封装等效代码:SOP24,.4
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260
电源:5 V
认证状态:Not Qualified
最大接收延迟:
接收器位数:3
座面最大高度:2.65 mm
子类别:Line Driver or Receivers
最大压摆率:15 mA
最大供电电压:5.5 V
最小供电电压:4.5 V
标称供电电压:5 V
表面贴装:YES
技术:CMOS
温度等级:COMMERCIAL
端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING
端子节距:1.27 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:30
宽度:7.5 mm
Base Number Matches:1
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