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产品型号HIP0081AS1的Datasheet PDF文件预览

HIP0080, HIP0081  
September 1998  
File Number 3018.4  
Quad Inverting Power Drivers with Serial  
Diagnostic Interface  
Features  
• Low Side Power MOSFET Output Drivers  
HIP0080, HIP0081The HIP0080/0081 Quad Power Drivers  
contain four individually protected NDMOS power output  
transistor switches to drive inductive and resistive loads  
such as: relays, solenoids, injectors, AC and DC motors,  
heaters and incandescent lamp displays. The 4 Power  
Drivers are low-side switches driven by CMOS logic input  
control stages. Each Output Power Driver is protected  
against over-current, over-temperature and over-voltage.  
An internal drain-to-gate zener diode provides the clamping  
protection for over-voltage. Diagnostic circuits provide  
ground short, supply short, open load and thermal overload  
detection for each of the 4 output stages. Each of the 4  
input drivers and their respective diagnostic filters are  
controlled by one ENABLE input.  
• Output Driver Protection  
- Over-Current Shutdown  
- Over-Temperature Shutdown with Hysteresis  
- Over-Voltage Internal Clamp  
• HIP0081 Output Current Switching Capability:  
- Each Output, I  
. . . . . . . . . . . . . . . . . . . . . . 2.2A DC  
OUT  
- All Outputs ON, Equal I  
- All Outputs ON, Equal I  
. . . . . . . . . . . . . . . . 6A DC  
. . . . . . . . . . 8A PK, 500ms  
OUT  
OUT  
• HIP0080 Output Current Switching Capability:  
- Each Output, I . . . . . . . . . . . . . . . . . . . . . . 1.3A DC  
OUT  
- All Outputs ON, Unequal I  
- All Outputs ON, Unequal I  
. . . . . . . . . . . . . . 3A DC  
. . . . . . . . 4A PK, 500ms  
OUT  
OUT  
HIP0080, HIP0081The inputs are CMOS logic compatible  
and individually control the output drivers with an active  
high state for turn-on. All other control inputs are active  
high with the exception of the Chip Select (CS) which is  
active low. The DATAIN (DI) and DATAOUT (DO) are  
positive logic and the Clock (CLK) input for the Serial  
Interface is active on the rising edge of the CLK pulse. All  
Inputs except the HIP0080 ENABLE have a nominal level  
of hysteresis. IN1, IN2, IN3, IN4 and ENABLE have pull-  
down resistors of approximately 100k. This switches off  
any channel that has an unterminated input.  
• HIP0080 - Low Idle Current Shutdown Mode  
• Regulated Interface for 5V CMOS Logic Inputs  
• Open Drain High Z DATAOUT  
• Fault Mode Output for Shorts, Opens and Over-Temperature  
• 16-Bit Serial Diagnostic Register  
• SPI Bus Compatible Data Readout  
o
• HIP0081 - Low θ Power Package . . . . . . . . . . . . 3 C/W  
JC  
o
o
• -40 C to 125 C Operating Temperature Range  
HIP0080, HIP0081Filters are used on the outputs of the  
fault sensing comparators to avoid the detection of short  
duration transient spikes. The on-chip oscillator is used to  
clock an internal shift register in each filter. If the fault  
condition is longer than a preset number of clock cycles,  
the fault condition is recognized and the respective bit is  
set in the diagnostic register. No filter is used in the  
thermal-overload feedback circuit and the bit is set when  
thermal shutdown occurs.  
Applications  
• Drivers For:  
- Solenoids  
System Use:  
- Automotive  
- Injectors  
- Steppers  
- Motors  
- Relays  
- Appliances  
- Industrial  
- Robotics  
- Power Output  
- Lamps  
- Displays  
HIP0080, HIP0081For normal operating conditions, a  
Reset turns off all outputs when the VCC level drops below  
3.5V. The internal bandgap and bias supply function  
includes a 5V regulated supply for the low voltage signal  
and logic circuits.  
Ordering Information  
TEMP.  
PKG.  
NO.  
o
PART NUMBER  
HIP0081AS1  
HIP0081AS2  
HIP0080AM  
RANGE ( C)  
PACKAGE  
-40 to 125 15 Ld SIP  
-40 to 125 15 Ld SIP  
-40 to 125 28 Ld PLCC  
Z15.05A  
Z15.05B  
N28.45  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999  
1
HIP0080, HIP0081  
Pinouts  
HIP0081 (SIP)  
HIP0080 (PLCC)  
TOP VIEW  
TOP VIEW  
HEAT SINK TAB AT SAME  
POTENTIAL AS PIN 8-GND  
4
3
2
1
28 27 26  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
5
6
25  
24  
23  
22  
21  
20  
19  
7
8
9
10  
11  
12 13 14 15 16 17 18  
Functional Block Diagram  
O.L.  
REF  
1 OF 4 SWITCH/CHANNELS  
V
1
CC  
V
O.L.  
FILTER  
COMP  
OUT1  
V
1
CC  
G.S.  
FILTER  
74V  
COMP  
100kΩ  
V
G.S.  
REF  
IN1  
DR  
EN  
TS  
DR1-CNTL  
POR  
SC  
TEMP.  
SENSE  
S.C.  
FILTER  
COMP  
VREF  
0.01Ω  
GND  
I
SC  
LIMIT  
V
1
CC  
POR  
(PWR-ON-RST)  
CS  
14V  
EN  
CONTROL AND 16-BIT  
DIAGNOSTIC SHIFT  
REGISTER  
CLK  
DATAOUT  
DATAIN  
FCLK  
BANDGAP  
REF. AND BIAS  
VOLTAGE  
DO  
V
CC  
500kHz OSC  
SOURCES  
ENABLE  
(NOTE)  
(FILTER-FCLK)  
LOW IDLE CURRENT  
POWER DOWN SWITCH  
(HIP0080 ONLY)  
100kΩ  
NOTE: HIP0080 - No enable hysteresis.  
2
HIP0080, HIP0081  
Functional Signal Flow Diagram  
1 OF 4 SWITCH/CHANNELS (SEE FUNCTIONAL BLOCK DIAGRAM)  
IN1  
OUT1  
OUT2  
DR1 CNTL  
DR OUT1  
(DRVR)  
(DATAPATH)  
4
4
4
4
IN2  
DATAIN (DI)  
DR2 CNTL  
DR OUT2  
(DRVR)  
(DATAPATH)  
IN3  
IN4  
OUT3  
OUT4  
DR3 CNTL  
DR OUT3  
(DRVR)  
(DATAPATH)  
4
4
4
DR OUT4  
(DRVR)  
DR4 CNTL  
(DATAPATH)  
4
4
4
V
CC  
BANDGAP  
AND BIAS  
POR  
CS  
DATAOUT  
(DO)  
CONTROL  
OSC  
3
SERIAL  
DATAOUT  
(DRIVER)  
CLK  
ENABLE (EN)  
LOW IDLE CURRENT  
POWER DOWN SWITCH  
(HIP0080 ONLY)  
3
HIP0080, HIP0081  
Absolute Maximum Ratings  
Thermal Information  
o
o
Supply Voltage (Logic and Control), V  
. . . . . . . . . . . . -16 to 45V  
Thermal Resistance (Typical, Note 3)  
θ
( C/W)  
θ
( C/W)  
JC  
JA  
CC  
Power MOSFET Drain Voltage, V (Note 1) . . . . . . -0.5 to V  
CLAMP  
Note 4  
Note 4  
HIP0080 . . . . . . . . . . . . . . . . . . . . . . . .  
HIP0080 (on 2 sq. in. PC Board) . . . . .  
HIP0081 . . . . . . . . . . . . . . . . . . . . . . . .  
43  
33  
45  
N/A  
N/A  
3
O
Maximum Output Clamp Energy, E  
Maximum Output Clamp Energy, E  
(HIP0080) . . . . . . . . .  
(HIP0081) . . . . . . . . .  
OK  
OK  
Input Voltage (Logic and Driver Inputs), V . . . . . . . . . . . -0.5 to 7V  
Output Voltage, DATAOUT . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 7V  
HIP0080 Output Current  
HIP0080 Power Dissipation with a 2 sq. in. PC board heat sink:  
At 85 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.95W  
Above 85 C:. . . . . . . . . . . . . . . . . . . Derate Linearly at 30mW/ C  
HIP0081 Power Dissipation with infinite heat sink:  
At 125 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.33W  
Above 125 C . . . . . . . . . . . . . . . . .Derate Linearly at 333 mW/ C  
. . . . -55 C to 150 C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . 300 C  
IN  
o
o
o
Each Output, I  
Each Output, I  
, (Note 2) . . . . . . -1.5A to I  
OUT(SC)  
. . . . . . . . . . . . . . . . . . . . . . . . +1.3A  
OUT(PEAK)  
OUT(DC)  
o
o
o
Total of 4 Outputs ON, Unequal I  
Total of 4 Outputs ON, Unequal I  
HIP0081 Output Current  
. . . . . . . . . . . . . . . . +3A  
. . . . . +4A/500ms (Max)  
OUT  
OUT  
o
o
Maximum Storage Temperature Range, T  
STG  
o
Each Output, I  
Each Output, I  
Total of 4 Outputs, ON, Unequal I  
Total of 4 Outputs ON, Unequal I  
, (Note 2) . . . . . . . . . -2 to I  
OUT(SC)  
. . . . . . . . . . . . . . . . . . . . . . . . +2.2A  
OUT(PEAK)  
OUT(DC)  
Die Characteristics  
. . . . . . . . . . . . . . . +6A  
. . . . . +8A/500ms (Max)  
OUT  
OUT  
HIP0080 Back Side Potential . . . . . . . . . . . . . . Frame, GND Leads  
HIP0081 Back Side Potential . . . . . . . . . Heat Sink Tab, GND Lead  
Operating Conditions  
o
o
Ambient Temperature Range . . . . . . . . . . . . . . . . . -40 C to 125 C  
Junction Temperature Range . . . . . . . . . . . . . . . . . -40 C to 150 C  
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTES:  
1. The MOSFET Output Drain is internally Clamped with a Drain-to-Gate zener diode that turns-on the MOSFET to hold the Drain at the V  
CLAMP  
voltage. Refer to the Electrical Characteristic Tables for the V  
voltage limits.  
CLAMP  
2. Each Output has Over-Current Shutdown protection in the positive current direction. The maximum peak current rating is determined by the  
minimum Over-Current Shutdown as detailed in the Electrical Specification Table. In the event of an Over-Current Shutdown the input drive is  
latched OFF. The output short must be removed and the input toggled OFF and ON to restore the output drive.  
3. Effective Heat Sinking for the HIP0080 PLCC package requires a PC Board solder mount or equivalent. The HIP0080 θ junction-to-air thermal  
JA  
resistance is given for a PC Board with 2 sq. in. of 1 oz. surface mount ground copper extending away from the package. For additional Power  
Dissipation Derating information, see Figure 8 curves.  
4. Refer to Figures 4 and 5 Single Pulse Output Clamp Energy vs. Time Capability of the HIP0080 and HIP0081. The safe margin for single pulse  
energy operation is below the dotted line shown in Figures 4 and 5.  
o
o
Electrical Specifications  
V
= 5.5V to 25V ±5%, T = -40 C to 125 C, Unless Otherwise Specified  
CC  
A
HIP0080  
HIP0081  
TYP MAX UNITS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX MIN  
POWER OUTPUTS  
Output ON Resistance  
(HIP0081)  
r
V
= 10 to 25V, All Outputs ON  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.5  
1.0  
-
ON  
ON  
CC  
I
= I  
OUT2  
= I  
= I = 1A  
OUT4  
OUT1  
OUT3  
V
= 5.5 to 10V, All Outputs ON  
-
-
CC  
I
= I = 0.7A  
= I  
= I  
OUT1 OUT2 OUT3 OUT4  
Output ON Resistance  
(HIP0080)  
r
V
= 10 to 25V, All Outputs ON  
-
1.0  
2.0  
-
-
-
CC  
I
= I = 0.5A  
= I  
= I  
OUT1 OUT2 OUT3 OUT4  
V
= 5.5 to 10V, All Outputs ON  
-
-
CC  
I
= I = 0.4A  
= I  
= I  
OUT1 OUT2 OUT3 OUT4  
HIP0081 Output Off Current  
I
Inputs Low, Each V  
= 60V  
= 60V,  
= 60V,  
= 25V,  
-
-
0.75  
0.75  
1.0  
-
1.0  
1.5  
10  
-
mA  
mA  
µA  
mA  
mA  
OFF  
OUT  
o
o
T
= 25 C to 125 C  
A
Inputs Low, Each V  
-
OUT  
OUT  
o
T
= -40 C  
A
HIP0081 Output Leakage  
Current  
I
Inputs Low, Each V  
= 0V  
-
-
OFFLK  
V
CC  
HIP0080 Output Off  
Current  
I
Inputs Low, Each V  
ENABLE High, T = 25 C to 125 C  
0.75  
0.75  
1.0  
1.5  
OFF  
OUT  
o
o
A
Inputs Low, Each V  
ENABLE High, T = -40 C  
= 25V,  
-
-
OUT  
o
A
4
HIP0080, HIP0081  
o
o
Electrical Specifications  
V
= 5.5V to 25V ±5%, T = -40 C to 125 C, Unless Otherwise Specified (Continued)  
CC A  
HIP0080  
TYP  
HIP0081  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
Inputs Low, Each V = 25V,  
MIN  
MAX MIN  
TYP  
MAX UNITS  
HIP0080 Output Leakage  
Current  
I
-
1.0  
10  
-
-
-
µA  
OFFLK  
OUT  
ENABLE Low  
Over-Voltage Clamp Range  
V
IN Inputs Low (Outputs OFF),  
27  
-
43  
73  
-
89  
V
CLAMP  
I
= 40mA  
OUT  
Current Short Circuit Prot.  
Short Circuit Det. Delay  
I
Note 2  
1.3  
-
3
-
2.2  
-
4.8  
A
OUT(SC)  
t
-
-
6
-
-
6
-
-
µs  
SCDLY  
Output ON-OFF Voltage  
Ramp Rate  
Resistive Load  
10  
-
10  
V/µs  
Turn-On Delay  
t
t
V
V
= 14V, R  
= 14V, R  
= 14Ω  
= 14Ω  
-
-
-
-
8
8
-
-
-
-
8
8
µs  
µs  
PHL  
CC  
LOAD  
LOAD  
Turn-Off Delay  
PLH  
CC  
SUPPLY  
Power Supply Current  
Power Supply Reset Active  
I
-
3
20  
30  
4
-
3
20  
-
30  
4
mA  
V
CC  
o
o
V
I
T
T
= 25 C to T = 125 C  
A
-
-
CC_RST  
A
A
o
= -40 C  
2.7  
-
4
2.7  
-
-
4
V
Shut-Down Current Mode  
INPUTS  
Enable Low  
130  
200  
-
-
µA  
SHTDN  
Low-Level Input Voltage  
High-Level Input Voltage  
Input Hysteresis Threshold  
V
-
-
1
-
-
-
1
-
V
V
IL  
V
3.5  
0.85  
50  
-
-
3.5  
-
-
IH  
V
(N.A. to HIP0080 ENABLE)  
2.25 0.85  
2.25  
200  
V
IN_HYS  
Input Pull-Down  
Resistance  
R
IN1, IN2, IN3, IN4 and ENABLE  
100  
200  
50  
100  
kΩ  
PD  
DATAOUT (Open Drain)  
Leakage Current  
I
V
= 7V, DO OFF (High)  
-
-
10  
0.4  
-
-
-
10  
0.4  
-
µA  
V
DO_LEAK  
DO  
= 1.6mA, DO ON (Low)  
DO  
Logic Low Output Voltage  
Max. Logic Low Current  
Oscillator Frequency  
V
I
-
1.6  
-
-
-
1.6  
-
-
OL  
I
V
= 4.5V, DO ON  
-
500  
-
-
500  
-
mA  
kHz  
MHz  
OH  
DO  
f
-
-
OSC  
Serial Interface Clock Freq.  
f
Note 5  
-
2
-
2
CLK  
DIAGNOSTIC AND PROTECTION  
o
Over-Temperature  
Shutdown Threshold  
150  
165  
15  
-
-
150  
165  
15  
-
-
C
o
Shutdown Temperature Hys-  
teresis  
-
-
-
-
C
Output Short-to-GND  
Threshold  
V
V
V
= 5.5V to 16V  
= 5.5V to 16V  
= 5.5V to 16V  
0.24x  
-
0.24x  
-
V
V
CC  
CC  
CC  
V
V
CC  
CC  
Short-to-GND Hysteresis  
-
0.02x  
-
-
0.02x  
-
V
V
CC  
CC  
-
Open-Load Resistance for  
No-Load Warning  
5
-
-
25  
-
5
-
25  
-
kΩ  
µs  
Filter Delay Time for O.L. or  
Short-to-GND  
12  
12  
NOTE:  
5. The maximum Serial Clock Frequency may be limited by the time constant of the external load network at the DATAOUT pin.  
5
HIP0080, HIP0081  
provides an output which is passed to the DI input of the  
Diagnostic Interface Overview  
following IC and is passed on as an OR’ed bit to the DO  
output of the last IC in the cascade. A fault condition is  
immediately evident without reading all diagnostic data bits.  
However, all bits must be read to determine which chip and  
which diagnostic bit has been set. The Fault Flag is reset  
by the CLK input when the bits are read. When no fault  
condition is detected, it is not necessary to toggle the CLK  
input. When a fault is detected, at least one toggle of the  
clock is needed to reset the parallel diagnostic register  
which clears the register of all detected fault states.  
HIP0080, HIP0081Each Quad Inverting Power Driver IC  
may be used as a single power switching driver, with or  
without the diagnostic interface. Where more than 4 Power  
Driver Switches are required, the HIP0080 or HIP0081  
may be used in a multiple IC cascade connection. In  
cascade operation, the diagnostic data from all chips is  
read as a single serial sequence of fault bits. As shown in  
the Functional Block Diagram each output stage has  
voltage and temperature sensors to detect fault conditions  
while comparators and delay filters process the data. Four  
bits of diagnostic information is provided as fault feedback  
from each of the four output stages. When detected, the  
diagnostic data is put in a parallel diagnostic data register.  
Using the diagnostic control interface to address the  
system (one or more ICs in cascade), the fault data is  
transferred from the parallel diagnostic data register to a  
serial diagnostic data register as a sequence of 16 bits for  
each IC.  
HIP0080, HIP0081The last IC in the string ORs its own 16  
fault bits in the parallel diagnostic register data and sends  
this data bit to an Error Flag register. The Error Flag  
register outputs the presence of a fault in one or more bits  
of the parallel diagnostic data register. As shown in Figure  
2, the Error Flag is the first bit in front of the serial register  
and is input to OR Gate, U7 with the DI input. The DI input  
passes thru AND Gate, U6 when the GATE signal is high  
and output via the amplifier U8 to DO. The output amplifier  
U8 is active only while CS is low. When CS is low, the RS  
Flip-Flop drives the GATE output high. When the GATE is  
high, the cascaded DF bits are jammed from DI to DO. All  
Error Flags in the cascade are cleared (by the CLK input)  
when the serial diagnostic data is clocked out of DO.  
HIP0080, HIP0081All diagnostic data bits may be read  
using the Chip Select (CS) and the Clock (CLK) inputs. The  
CLK input must be low, when CS goes active low. After  
reading the first bit at DO to determine if there is an error  
flag, the following 16 bits of serial diagnostic data may be  
clocked out of DO. Clocking the CLK input synchronously  
shifts the serial register data out of DO while cascaded  
data (from other devices or sources) is shifted into the DI  
input. As data is shifted out of DO, the parallel diagnostic  
data register is cleared on the first rising edge of the CLK  
input, following the CS low. After each 16 clocks, cascaded  
diagnostic data from the next IC in sequence is then shifted  
out of the DO output. Shifting the serial diagnostic data out  
of DO is done as a continuous sequence, reading the data  
from all ICs in cascade while CS remains low. New  
diagnostic data can be stored in the parallel diagnostic data  
registers on each IC while the existing serial diagnostic  
data is read.  
HIP0080, HIP0081The GATE is an internal control signal  
that is forced high when the CLK input is low and CS goes  
low. The GATE will remain high, even when CS is returned  
to a high state, provided the CLK input has not changed  
from a low state. This condition still applies when fault data  
is detected. The DO output is not latched; however, the  
Error Flag is latched when CS goes low and will not be  
updated until the next time CS goes low. The fault data is  
preserved as long as the CLK input does not go high. If the  
CLK is high when CS goes low, the GATE will be disabled  
and no cascade data will be shifted from DI to DO. Under  
normal conditions, the CLK signal goes high to switch the  
GATE low and simultaneously shifts the first of 16  
HIP0080, HIP0081Referring to Figure 1 and Figure 2, there  
are two sources that generate an OR’ed Fault Flag at DO  
when CS goes low. The two fault data sources are (1) the  
on-chip fault detection and (2) the off-chip DI input from  
front end ICs in the cascade. The fault data bit, labeled DF  
(Data Fault) in Figure 2, contains the OR’ed inputs from  
both sources. The DF bit is not part of the 16-bit serial  
diagnostic data sequence. In cascaded operation, the DI  
input for the first of the selected chips should be tied low.  
And, in single IC operation (no cascade), the DI input  
should also be tied low. In cascaded operation, the Error  
Flags are cascaded via the DI inputs.  
diagnostic data bits out of the serial diagnostic data  
register to DO. The CS low input is not latched and must be  
held low while all data is shifted out of DO.  
HIP0080, HIP0081The diagnostic interfaces to the  
HIP0080 and HIP0081 are SPI compatible. The  
microcontroller is programmed to control the read and  
respond action based on the diagnostic readout. Normally  
the CS input is addressed and DO is read. If a fault is  
indicated by the Error Flag, all data is shifted out of DO and  
processed to determine the diagnostic fault condition. The  
Error Flag bit does require a separate input back to the  
microcontroller to initiate the serial data shift. When the  
CLK signal starts, the serial sequence starting with the first  
of the 16 serial diagnostic bits is input to the  
HIP0080, HIP0081The on-chip fault Error Flag goes high if  
any one of the 16 diagnostic data fault bits have been set  
HIGH. This fault Error Flag bit precedes the 16 diagnostic  
data fault bits and is OR’ed with all diagnostic data fault  
bits. The DF bit flags the presence of an Error Flag fault on  
the IC and in any part of the cascaded string, including DI  
data input. As shown in Figure 3 each IC in the cascade  
microcontroller.  
6
HIP0080, HIP0081  
TABLE 1. SERIAL REGISTER DATA SEQUENCE  
Serial Register Data Sequence  
BIT  
FAULT  
HIP0080, HIP0081The fault data follows the Serial Register  
Data Sequence of Table 1 in bit sequence and, in cascade,  
by IC sequence. In each of the 4 power switching output  
channels, the diagnostic sense circuits set 1-bit in the  
parallel diagnostic register for each of the 4 diagnostics  
fault conditions. A total of 16 diagnostics data bits are  
shifted to the serial register when CS goes low. Table 1  
shows the order and sequence of the serial bits as they are  
shifted out of DO. The fault action that sets each of the  
diagnostics bits for each of the 4 switches is described  
below:  
CHANNEL NO.  
NO.  
FAULT FUNCTION  
Over-Temperature  
Short to Supply  
Short to Ground  
Open Load  
SYMBOL  
OT3  
SB3  
Switch  
Channel 3  
9
10  
11  
12  
13  
14  
15  
16  
SG3  
OI3  
Switch  
Channel 4  
Over-Temperature  
Short to Supply  
Short to Ground  
Open Load  
OT4  
SB4  
SG4  
OI4  
HIP0080, HIP0081Bit 1 - indicates a thermal overload  
when the sensed junction temperature of the output is  
greater than 150oC. When over-temperature is sensed, the  
sensor output directly gates-off the drive to the power  
output and the respective fault bit is set in the diagnostic  
register. When the chip is sufficiently cooled, the output is  
gated-on if the input remains ON.  
Serial Peripheral Interface Bus Control  
HIP0080, HIP0081Technically, the HIP0080 and HIP0081  
fault data has only 16 bits. Except for the Error Flag, DF  
data bit shown in Figure 2, the format matches that of a  
normal CPOL = 0, CPHA=1 SPI protocol (polarities, phase,  
etc). The DF bit from the DO output is active only until the  
clock starts. The best way to take advantage of it (if  
desired) is to connect the DO to the SPI bus, and also to a  
port pin, or other logic input. After CS goes low and before  
the SPI clocks starts, the DF bit can be read. If it is a zero,  
then the rest of the data does not have to be read. (The  
data will be all 0's = no errors). If the DF bit = 1, then the  
data must be read to find out which bit(s) is set.  
HIP0080, HIP0081Bit 2 - indicates the fault condition for an  
output-to-supply short (shorted load). A small value of  
resistance (~0.01W) in the source-to-ground line of the  
output stage is used to sense the output short. A  
comparator senses the voltage level and filters the output  
to provide an input to the control stage and to the  
diagnostic register. The control state directly shuts down  
the output when an over-current condition is sensed. Under  
this condition of fault, the input driver is latched off. To  
restore the output drive, the short must be removed and the  
input toggled OFF and then ON. A short to the supply is the  
only error condition that requires an input toggle reset.  
HIP0080, HIP0081Mutiple ICs can be cascaded such that  
an error bit on any IC will daisy chain up to the last DO; this  
allows the microcontroller to "wire-OR" all of the devices  
automatically. Other than bidirectional data IC types,  
different IC types may be cascaded. The HIP0080 or  
HIP0081 should be closest to the microcontroller to use the  
DF bit feature. ICs that do not have an OR’ed means of  
passing fault bit would require all data be clocked to check  
the diagnostic bits.  
HIP0080, HIP0081Bit 3 - indicates the condition of an  
output to ground short. As shown in the Functional Block  
Diagram, each output stage has drain-to-supply (VCC1)  
and drain-to-ground pull-up and pull-down resistors of  
approximately 10kW to sense this condition. When the  
output is off and the sense level is low, an output-to-ground  
short is detected by the comparator. This condition is  
sensed when the output is pulled lower than 0.24xVCC  
(typical).  
Clamp Energy Ratings for the HIP0080  
and HIP0081  
HIP0080, HIP0081Figures 4 and 5 define the Single Pulse  
Energy ratings for the HIP0080 and HIP0081. Refer to  
Application Note AN9416 for further information on Single  
Pulse Energy ratings for inductive load operation and  
Dissipation capability for the 15 pin Power SIP Package.  
The Device Under Test conducts when the zener over  
voltage clamp turns on the output. While drain-to-source  
voltage, VDS and and drain current, ID are monitored, the  
current drive pulse width, tON in seconds is varied to  
determine the Single Pulse Energy capability. The energy  
in Joules is calculated from the following equation:  
HIP0080, HIP0081Bit 4 - indicates the condition of an open  
load on the output. The same divider noted for Bit 3 is used  
to set the output level. If the sense level is at or near the  
mid-range of the voltage supply, V 1 when the output is in  
CC  
the off condition, a no-load condition is detected.  
TABLE 1. SERIAL REGISTER DATA SEQUENCE  
BIT  
FAULT  
CHANNEL NO.  
NO.  
FAULT FUNCTION  
Over-Temperature  
Short to Supply  
Short to Ground  
Open Load  
SYMBOL  
Switch  
Channel 1  
1
2
3
4
5
6
7
8
OT1  
SB1  
SG1  
OI1  
HIP0080, HIP0081Single Pulse Energy = VDS x ID x tON.  
HIP0080, HIP0081Refer to Application Note 9416 for  
further information on Single Pulse Energy ratings for  
inductive load operation and Dissipation capability for the  
15 pin Power SIP Package.  
Switch  
Channel 2  
Over-Temperature  
Short to Supply  
Short to Ground  
Open Load  
OT2  
SB2  
SG2  
OI2  
7
HIP0080, HIP0081  
4 OUTPUTS AND  
4 BITS PER OUTPUT  
4
4
4
4
POR  
CLK  
CS  
16  
16-BIT PARALLEL  
DIAG. DATA REG.  
RESET  
LOGIC  
U3  
(EXT. PULL-UP  
WITH LOAD)  
5V  
1
16  
DI  
16-BIT SERIAL  
DIAG. DATA REG.  
ERROR  
FLAG BIT  
5kΩ  
DO  
U7  
U8*  
R
Q
U2  
U1  
U4  
50pF  
GATE  
S
U5  
U9  
U8*  
FIGURE 1. DIAGNOSTIC INTERFACE LOGIC  
CS  
DI  
DO  
SHIFT  
REGISTER  
CLK  
IC1  
START OF 16 DIAGNOSTIC DATA BITS  
GATE  
GATE  
DI  
DI  
DO  
SHIFT  
REGISTER  
IC2  
DO  
GATE  
DF  
OT1 SB1 SG1 OI1 OT2 SB2.....  
DI  
DO  
SHIFT  
REGISTER  
ERROR FLAG BIT  
IC3  
GATE  
FIGURE 2. DATA AND CLOCK TIMING  
FIGURE 3. CASCADED CHIP OPERATION TO READ  
DIAGNOSTIC DATA  
8
HIP0080, HIP0081  
10000  
HIP0080 SINGLE PULSE  
HIP0081 SINGLE PULSE  
ENERGY vs TIME  
ENERGY vs TIME  
o
o
T
= 25 C  
AMB  
T
= 25 C  
AMB  
NOTE: SAFE OPERATING AREA  
BELOW DOTTED LINE  
NOTE: SAFE OPERATING AREA  
BELOW DOTTED LINE  
10000  
1000  
100  
1000  
100  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
PULSE WIDTH TIME (ms)  
PULSE WIDTH TIME (ms)  
FIGURE 4. SINGLE PULSE ENERGY TEST SHOWING THE  
FAILURE BOUNDARY FOR EACH HIP0080 OUT-  
PUT STRESSED TO POINT OF FAILURE  
FIGURE 5. SINGLE PULSE ENERGY TEST SHOWING THE  
FAILURE BOUNDARY FOR EACH HIP0081 OUT-  
PUT STRESSED TO POINT OF FAILURE  
HIP0080, HIP0081This expression sums the dissipation, Pk  
of each output driver without regard to uniformity of  
dissipation in each MOS channel. The dissipation loss in  
an NMOS channel is given in Equation 2 where the current,  
I, is determined by the output load when the channel is  
turned ON. The channel resistance, rDS(ON) is a function of  
the circuit design, level of gate voltage and the chip  
temperature. Other switching losses may include I R lost in  
the interconnecting metal on the chip and bond wires of the  
package.  
Dissipation In Multiple Outputs  
HIP0080, HIP0081The HIP0080 and HIP0081 Power  
Drivers have multiple MOS Output Drivers and require  
special consideration with regard to maximum current and  
dissipation ratings. While each output has a maximum  
current specification consistent with the device structure,  
all such devices on the chip can not be simultaneously  
rated to the same high level of peak current. The total  
combined current and the dissipation on the chip must be  
adjusted for maximum allowable ratings, given  
2
2
(EQ. 2)  
simultaneous multiple output conditions.  
P
= I × r  
k
DS(ON)  
HIP0080, HIP0081For the HIP0081, the maximum positive  
output current rating is 2.2A when one output is ON. When  
ALL outputs are ON, the rating is reduced to 1.5A because  
the total maximum current is limited to 6A. For any given  
application, all output drivers on a chip may or may not have a  
different level of loading. The discussion here is intended to  
provide relatively simple methods to determine the maximum  
dissipation and current ratings as a general solution and, as a  
special solution, when all switched ON outputs have the same  
current loading.  
HIP0080, HIP0081The temperature rise in the package  
due to the dissipation is the product of the dissipation, PD  
and the thermal resistance, θJC of the package (Junction-  
to-Case). To determine the chip junction temperature, T ,  
J
given the case (heat sink tab) temperature, TC, the linear  
heat flow solution is:  
T
= T + P × θ  
C D JC  
(EQ. 3)  
J
HIP0080, HIP0081or:  
T
= T P × θ  
J D JC  
(EQ. 3A)  
General Solution  
C
HIP0080, HIP0081A general equation for dissipation  
should specify that the total power dissipation in a  
package is the sum of all significant elements of  
dissipation on the chip. However, in Power BiMOS Circuits  
very little dissipation is needed to control the logic and  
predriver circuits on the chip. The overall chip dissipation  
HIP0080, HIP0081Since this solution relates only to the  
package, further consideration must be given to a practical  
heat sink. The equation of linear heat flow assumes that  
the thermal resistance from Junction-to-Ambient (θJA) is  
the sum of the thermal resistance from Junction-to-Case  
and the thermal resistance from Case (heat sink)-to-  
Ambient. The Junction-to-Ambient thermal resistance, θJA  
is the sum of all thermal paths from the chip junction to the  
ambient temperature (TA) environment and can be  
expressed as:  
2
is primarily the sum of the I R dissipation losses in each  
channel where the current, I is the output current and the  
resistance, R is the NMOS channel resistance, r  
of  
DS(ON)  
each output driver. As such, the total dissipation, PD for n  
output drivers is:  
n
θ
= θ + θ  
JA JC CA  
(EQ. 4)  
=
P
k
(EQ. 1)  
D
k = 1  
9
HIP0080, HIP0081  
HIP0080, HIP0081The Junction-to-Ambient equivalent to  
Equation 3, 3A is:  
temperature is known and can be used to determine the  
maximum allowable ambient temperature from Equation 5A  
as follows:  
T
= T + P × θ  
A D JA  
(EQ. 5)  
J
o
o
o
HIP0080, HIP0081TA = 150 C - 1.5W x 30 C/W = 105 C.  
HIP0080, HIP0081or:  
Equal Current Loading Solution  
T
= T P × θ  
J D JA  
(EQ. 5A)  
A
HIP0080, HIP0081Many applications may have equal  
current loading in the output drivers with equal saturated  
turn ON and temperature conditions. As such, a convenient  
method to show rating boundaries is to substitute the  
dissipation Equation 2 into the junction temperature  
Equation 3. For m outputs that are ON and conducting with  
HIP0080, HIP0081Not all Integrated Circuit packages have  
a directly definable case temperature because the heat is  
spread thru the lead frame to a PC Board which is the  
effective heat sink.  
equal currents, where I=I =I .....=I , we have the  
following solution for dissipation:  
1
2
m
Calculation Example 1  
o
HIP0080, HIP0081For the HIP0081, θJC = 3 C/W and the  
worst case junction temperature, as an application design  
solution, should not exceed 150 C. For a given application,  
2
(EQ. 6)  
(EQ. 7)  
P
= m × P = m × I × r  
D
k
DS(ON)  
o
Equation 1 determines the dissipation, PD.  
T
T  
C
J
I = --------------------------------------------------  
HIP0080, HIP0081Assume the package is mounted to a  
m × θ × r  
JC  
DS(ON)  
o
heat sink having a thermal resistance of 6 C/W and, for a  
given application, assume the dissipation is 3W and the  
o
HIP0080, HIP0081The number of output drivers ON and  
conducting (m) may be from 1 to n. (i.e., For all four output  
drivers of the HIP0081 ON, m = 4.) Maximum temperature,  
dissipation and current ratings must be observed. For a  
defined number of conducting Power MOS Output Drivers,  
ambient temperature (T ) is 100 C. From Equation 4, θ is  
A
JA  
o
9 C/W. The solution for junction temperature (T ) by  
C
Equation 3 is:  
o
o
o
HIP0080, HIP0081T = 100 C + 3W x 9 C/W = 127 C.  
J
we can plot the results for m devices showing I vs T .  
C
Calculation Example 2:  
HIP0080, HIP0081Given the HIP0081 as an example,  
Figures 6 and Figure 7 illustrate the boundaries for  
temperature and current. Figure 6 shows the maximum  
current for a single output ON while Figure 7 shows the  
maximum current for all four outputs ON with equal current  
plotted versus Case Temperature, TC. Boundary conditions  
relate to the Absolute Maximum Ratings as defined in the  
Data Sheet.  
o
HIP0080, HIP0081Assume for the HIP0080, θJA = 30 C/W  
mounted on a PC Board with good heat sinking  
characteristics. Again, the worst case junction temperature,  
as an application design solution, should not exceed  
150 C. Assume from the application, based on Equation 1,  
o
the dissipation, PD = 1.5W. The maximum junction  
3.0  
2.5  
2.0  
1.5  
MAX. +I  
OUT(DC)  
CURVE (1): r  
CURVE (2): r  
= 1Ω  
DS(ON)  
(1)  
(2)  
1.0  
0.5  
0.0  
= 0.5Ω  
DS(ON)  
o
THERMAL RESISTANCE, θ = 3 C/W  
JC  
50  
75  
100  
CASE (HEAT SINK TAB) TEMPERATURE ( C)  
125  
150  
o
FIGURE 6. HIP0081 MAXIMUM SINGLE OUTPUT CURRENT vs CASE (TAB) TEMPERATURE  
10  
HIP0080, HIP0081  
2.0  
1.5  
1.0  
0.5  
0.0  
MAX. ALL ON  
CURRENT LIMIT  
(EQUAL CURRENT)  
(3)  
(4)  
CURVE (3):  
CURVE (4):  
r
r
= 1Ω  
DS(ON)  
= 0.5Ω  
DS(ON)  
o
THERMAL RESISTANCE, θ = 3 C/W  
JC  
50  
75  
100  
CASE (HEAT SINK TAB) TEMPERATURE ( C)  
125  
150  
o
FIGURE 7. HIP0081 CURRENT vs CASE (TAB) TEMPERATURE, ALL OUTPUTS ON WITH EQUAL CURRENT  
16  
14  
12  
10  
8
HIP0081 WITH EXT.  
HIP0081 WITH INFINITE  
o
6 C/W HEAT SINK  
HEAT SINK  
o
o
(θ  
= 9 C/W)  
JA  
(θ  
= θ = 3 C/W)  
JC  
JA  
o
HIP0080 WITH θ  
= 33 C/W  
JA  
(PC BOARDS AS HEAT SINK)  
6
4
2
0
-50  
-25  
0
25  
50  
75  
100  
125  
150  
o
AMBIENT TEMPERATURE ( C)  
FIGURE 8. DISSIPATION DERATING CURVES  
11  
HIP0080, HIP0081  
Plastic Leaded Chip Carrier Packages (PLCC)  
0.042 (1.07)  
0.048 (1.22)  
N28.45 (JEDEC MS-018AB ISSUE A)  
0.042 (1.07)  
0.056 (1.42)  
0.004 (0.10)  
C
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE  
PIN (1) IDENTIFIER  
0.025 (0.64)  
0.045 (1.14)  
0.050 (1.27) TP  
INCHES  
MILLIMETERS  
R
C
L
SYMBOL  
MIN  
MAX  
MIN  
4.20  
MAX  
4.57  
NOTES  
A
A1  
D
0.165  
0.090  
0.485  
0.450  
0.191  
0.485  
0.450  
0.191  
0.180  
0.120  
0.495  
0.456  
0.219  
0.495  
0.456  
0.219  
-
2.29  
3.04  
-
-
D2/E2  
D2/E2  
12.32  
11.43  
4.86  
12.57  
11.58  
5.56  
C
L
D1  
D2  
E
3
E1 E  
4, 5  
-
12.32  
11.43  
4.86  
12.57  
11.58  
5.56  
VIEW “A”  
E1  
E2  
N
3
4, 5  
6
0.020 (0.51)  
MIN  
28  
28  
A1  
D1  
D
Rev. 2 11/97  
A
SEATING  
PLANE  
0.020 (0.51) MAX  
3 PLCS  
-C-  
0.026 (0.66)  
0.032 (0.81)  
0.013 (0.33)  
0.021 (0.53)  
0.025 (0.64)  
MIN  
0.045 (1.14)  
MIN  
VIEW “A” TYP.  
NOTES:  
1. Controlling dimension: INCH. Converted millimeter dimensions are  
not necessarily exact.  
2. Dimensions and tolerancing per ANSI Y14.5M-1982.  
3. Dimensions D1 and E1 do not include mold protrusions. Allowable  
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1  
and E1 include mold mismatch and are measured at the extreme  
material condition at the body parting line.  
-C-  
4. To be measured at seating plane  
contact point.  
5. Centerline to be determined where center leads exit plastic body.  
6. “N” is the number of terminal positions.  
12  
HIP0080, HIP0081  
HIP0080, HIP0081  
Single-In-Line Plastic Packages (SIP)  
Z15.05A (JEDEC MO-048 AB ISSUE A)  
15 LEAD PLASTIC SINGLE-IN-LINE PACKAGE STAGGERED  
VERTICAL LEAD FORM  
D
A
SEE TAB  
-X-  
F
DETAIL  
INCHES  
MIN  
MILLIMETERS  
SYMBOL  
MAX  
0.182  
0.031  
0.024  
0.798  
0.694  
0.426  
MIN  
4.37  
MAX  
4.62  
E
A
B
0.172  
0.024  
0.014  
0.778  
0.684  
0.416  
E1  
-Y-  
0.61  
0.79  
L1  
C
0.36  
0.61  
D
19.76  
17.37  
10.57  
20.27  
17.63  
10.82  
TERMINAL  
R1  
N
3
E
TERMINAL  
#1  
L
E1  
E2  
e
H
L
0.110 BSC  
2.79 BSC  
-Z-  
e
0.050 BSC  
0.200 BSC  
0.169 BSC  
0.700 BSC  
1.27 BSC  
5.08 BSC  
4.29 BSC  
17.78 BSC  
e3  
L
e1  
e1  
e2  
e3  
F
B
L
e2  
Z
C
0.024(0.61)  
TYP ALL LEADS  
M
L
H
L
Z
L
L
L
0.057  
0.063  
0.176  
0.710  
1.45  
1.60  
4.47  
H
H
H
H
H
H
H
L
0.150  
0.690  
3.81  
0.010(0.25) M  
X M Y M  
L
17.53  
18.03  
1
N
15  
15  
ØP  
Ø 0.015(0.38)  
M
Z
X S  
ØP  
R1  
0.148  
0.065  
0.152  
0.080  
3.76  
1.65  
3.86  
2.03  
Rev. 1 4/98  
E2  
TAB DETAIL  
NOTES:  
1. Refer to series symbol list, JEDEC Publication No. 95.  
2. Dimensioning and Tolerancing per ANSI Y14.5M-1982.  
3. N is the number of terminals.  
4. Controlling dimension: INCH.  
13  
HIP0080, HIP0081  
Single-In-Line Plastic Packages (SIP)  
-Z-  
Z15.05B  
A
-X-  
D
15 LEAD PLASTIC SINGLE-IN-LINE PACKAGE SURFACE  
MOUNT “GULLWING” LEAD FORM  
F
ØP  
E2  
INCHES  
MIN  
MILLIMETERS  
SYMBOL  
MAX  
0.182  
0.031  
0.024  
0.798  
0.694  
0.426  
MIN  
4.37  
MAX  
4.62  
A
B
0.172  
0.024  
0.018  
0.778  
0.684  
0.416  
E
0.61  
0.79  
C
0.46  
0.61  
E1  
D
19.76  
17.37  
10.57  
20.27  
17.63  
10.82  
R1  
E
-Y-  
E1  
E2  
e
0.110 BSC  
2.79 BSC  
C
0.050 BSC  
0.700 BSC  
1.27 BSC  
15  
e
B TYP  
SURFACES  
e3  
F
17.78 BSC  
0.010  
Z
X
Y
M
M
S
15 LEAD TIPS  
e3  
0.004  
0.008  
0.057  
0.063  
0.080  
0.108  
1.45  
1.60  
2.03  
2.74  
Z
L
0.065  
0.098  
1.66  
2.49  
(NOTE 3)  
L1  
N
15  
15  
ØP  
R1  
0.148  
0.065  
0.152  
0.080  
3.76  
1.65  
3.86  
2.03  
o
o
0 - 8  
L
HEADER  
BOTTOM  
L1  
Rev. 1 11/97  
NOTES:  
1. Dimensioning and Tolerancing per ANSI Y14.5M - 1982.  
2. N is the number of terminals.  
3. All lead surfaces are within 0.004 inch of each other. No lead can  
be more than 0.004 inch above or below the header plane,  
BOTTOM VIEW  
(
-Z- Datum).  
4. Controlling dimension: INCH.  
LAND PATTERN  
0.130  
0.814  
0.407  
OF 0.150  
C
L
0.700  
0.662  
0.774  
0.030 TYP  
0.050 TYP  
0.350  
0.700  
14  
HIP0080, HIP0081  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.  
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-  
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may  
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
Sales Office Headquarters  
NORTH AMERICA  
EUROPE  
ASIA  
Intersil Corporation  
Intersil SA  
Mercure Center  
100, Rue de la Fusee  
1130 Brussels, Belgium  
TEL: (32) 2.724.2111  
FAX: (32) 2.724.22.05  
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Taiwan Limited  
7F-6, No. 101 Fu Hsing North Road  
Taipei, Taiwan  
Republic of China  
TEL: (886) 2 2716 9310  
FAX: (886) 2 2715 3029  
P. O. Box 883, Mail Stop 53-204  
Melbourne, FL 32902  
TEL: (407) 724-7000  
FAX: (407) 724-7240  
15  
配单直通车
HIP0081AS1产品参数
型号:HIP0081AS1
是否Rohs认证: 不符合
生命周期:Transferred
包装说明:, SIP15,.1
Reach Compliance Code:unknown
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.72
内置保护:OVER CURRENT; THERMAL; ZENER CLAMP
驱动器位数:4
输入特性:SCHMITT TRIGGER
接口集成电路类型:BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码:R-PZFM-T15
JESD-609代码:e0
功能数量:4
端子数量:15
最高工作温度:125 °C
最低工作温度:-40 °C
输出特性:OPEN-DRAIN
输出电流流向:SINK
最大输出电流:4.1 A
标称输出峰值电流:1.25 A
输出极性:INVERTED
封装主体材料:PLASTIC/EPOXY
封装等效代码:SIP15,.1
封装形状:RECTANGULAR
封装形式:FLANGE MOUNT
电源:5 V
认证状态:Not Qualified
子类别:Peripheral Drivers
标称供电电压:5 V
表面贴装:NO
技术:BIMOS
温度等级:AUTOMOTIVE
端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE
端子节距:2.54 mm
端子位置:ZIG-ZAG
断开时间:8 µs
接通时间:8 µs
Base Number Matches:1
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