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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • HIP2101IBZT
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  • 深圳市宏世佳电子科技有限公司

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  • HIP2101IBZT 现货库存
  • 数量3550 
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  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
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     该会员已使用本站7年以上
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     该会员已使用本站13年以上
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     该会员已使用本站15年以上
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  • 数量85000 
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  • 深圳市恒达亿科技有限公司

     该会员已使用本站16年以上
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     该会员已使用本站11年以上
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     该会员已使用本站7年以上
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  • 深圳市宏世佳电子科技有限公司

     该会员已使用本站13年以上
  • HIP2101IBZT
  • 数量4825 
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     该会员已使用本站17年以上
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  • 数量5000 
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     该会员已使用本站11年以上
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  • 数量5000 
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     该会员已使用本站5年以上
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  • 数量8500 
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  • 深圳市欧立现代科技有限公司

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  • 数量3800 
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  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
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  • 数量10000 
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  • 万三科技(深圳)有限公司

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  • 数量660000 
  • 厂家RENESAS(瑞萨)/IDT 
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  • 批号23+ 
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  • 深圳市华芯盛世科技有限公司

     该会员已使用本站13年以上
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  • 数量865000 
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     该会员已使用本站14年以上
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  • 数量5000 
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  • 数量12000 
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  • 数量8800 
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  • 数量20182 
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  • 数量295898 
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  • 数量6935 
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  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
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  • 数量12195 
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  • 批号▉▉:2年内 
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  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
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  • 数量11530 
  • 厂家Intersil 
  • 封装8-SOIC(3.9mm寬) 
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产品型号HIP2101IBZT的概述

芯片HIP2101IBZT的概述 HIP2101IBZT 是一款高效的驱动芯片,主要用于电源管理和控制领域,特别是在需要高功率驱动的应用场景中。该芯片由先进的技术制造,使其在集成电路领域具有高度的灵活性和可靠性。HIP2101IBZT 通常用于 DC-DC 转换器、马达驱动和其他高功率应用中,其设计旨在提供高效稳定的性能,同时降低能耗。 芯片HIP2101IBZT的详细参数 HIP2101IBZT 的技术参数包括工作电压范围、输出电流能力、开关频率等。其中: - 工作电压范围:HIP2101IBZT 的输入电压从 10V 到 80V,这个宽广的电压范围使其适用于多种电源管理应用。 - 输出电流能力:该芯片可提供高达 2A 的输出电流,满足大多数电源驱动需求。 - 开关频率:可配置的开关频率在 50kHz 到 100kHz 之间,用户可根据负载需求选择相应的频率以优化效率。 - 驱动电流...

产品型号HIP2101IBZT的Datasheet PDF文件预览

DATASHEET  
HIP2101  
FN9025  
Rev.10.00  
Aug 8, 2019  
100V/2A Peak, Low Cost, High Frequency Half Bridge Driver  
The HIP2101 is a high frequency, 100V Half Bridge  
Features  
N-Channel power MOSFET driver IC. It is equivalent to the  
HIP2100 with the added advantage of full TTL/CMOS  
compatible logic input pins. The low-side and high-side gate  
drivers are independently controlled and matched to 13ns.  
This gives users total control over dead time for specific  
power circuit topologies. Undervoltage protection on both the  
low-side and high-side supplies force the outputs low. An  
on-chip diode eliminates the discrete diode required with  
other driver ICs. A new level-shifter topology yields the  
low-power benefits of pulsed operation with the safety of DC  
operation. Unlike some competitors, the high-side output  
returns to its correct state after a momentary undervoltage of  
the high-side supply.  
• Drives N-Channel MOSFET Half Bridge  
• SOIC, EPSOIC, QFN and DFN Package Options  
• SOIC, EPSOIC and DFN Packages Compliant with 100V  
Conductor Spacing Guidelines of IPC-2221  
• Pb-free Product Available (RoHS Compliant)  
• Bootstrap Supply Max Voltage to 114VDC  
• On-Chip 1Ω Bootstrap Diode  
• Fast Propagation Times for Multi-MHz Circuits  
• Drives 1000pF Load with Rise and Fall Times Typ. 10ns  
• TTL/CMOS Input Thresholds Increase Flexibility  
• Independent Inputs for Non-Half Bridge Topologies  
• No Start-Up Problems  
Applications  
Telecom Half Bridge Power Supplies  
• Avionics DC-DC Converters  
• Two-Switch Forward Converters  
Active Clamp Forward Converters  
• Outputs Unaffected by Supply Glitches, HS Ringing Below  
Ground, or HS Slewing at High dv/dt  
• Low Power Consumption  
• Wide Supply Range  
Related Literature  
• Supply Undervoltage Protection  
• 3Ω Output Driver Resistance  
• QFN/DFN Package:  
For a full list of related documents, visit our website:  
HIP2101 device page  
- Compliant to JEDEC PUB95 MO-220  
QFN - Quad Flat No Leads - Package Outline  
- Near Chip Scale Package footprint, which improves  
PCB efficiency and has a thinner profile  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 1 of 15  
HIP2101  
Ordering Information  
PART NUMBER  
(Notes 2, 3)  
TEMP.  
RANGE (°C)  
TAPE AND REEL  
(Units) (Note 1)  
PACKAGE  
(RoHS Compliant)  
PKG.  
DWG. #  
HIP2101IBZ  
HIP2101IBZT  
HIP2101IBZT7A  
HIP2101EIBZ  
HIP2101EIBZT  
HIP2101IRZ  
HIP2101IRZT  
HIP2101IR4Z  
HIP2101IR4ZT  
NOTES:  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-
2.5k  
250  
-
8 Ld SOIC  
M8.15  
8 Ld SOIC  
M8.15  
8 Ld SOIC  
M8.15  
8 Ld EPSOIC  
8 Ld EPSOIC  
16 Ld 5x5 QFN  
16 Ld 5x5 QFN  
12 Ld 4x4 DFN  
12 Ld 4x4 DFN  
M8.15C  
M8.15C  
L16.5x5  
L16.5x5  
L12.4x4A  
L12.4x4A  
2.5k  
-
6k  
-
6k  
1. See TB347 for details about reel specifications.  
2. Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which  
are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL classified at Pb-free peak reflow  
temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J-STD-020C.  
3. For Moisture Sensitivity Level (MSL), see the HIP2101 device page. For more information about MSL, see TB363.  
Pinouts  
HIP2101 (SOIC, EPSOIC)  
HIP2101IR4 (DFN)  
HIP2101 (QFN)  
TOP VIEW  
TOP VIEW  
TOP VIEW  
1
2
3
4
8
7
6
5
LO  
V
V
DD  
V
1
2
3
4
5
6
12  
11  
10  
9
LO  
DD  
16 15 14 13  
HB  
HO  
HS  
SS  
EPAD  
NC  
NC  
HB  
HO  
HS  
V
SS  
NC  
HB  
HO  
NC  
NC  
1
2
3
4
12  
11  
10  
9
LI  
NC  
NC  
LI  
HI  
EPAD  
V
SS  
EPAD  
LI  
8
7
HI  
NC  
5
6
7
8
NOTE: EPAD = Exposed PAD.  
Pin Descriptions  
SYMBOL  
DESCRIPTION  
V
Positive Supply to lower gate drivers. De-couple this pin to V . Bootstrap diode connected to HB.  
DD  
SS  
HB  
High-Side Bootstrap supply. External bootstrap capacitor is required. Connect positive side of bootstrap capacitor to this pin.  
Bootstrap diode is on-chip.  
HO  
HS  
High-Side Output. Connect to gate of High-Side power MOSFET.  
High-Side Source connection. Connect to source of High-Side power MOSFET. Connect negative side of bootstrap capacitor to  
this pin.  
HI  
LI  
High-Side input.  
Low-Side input.  
V
Chip negative supply, generally will be ground.  
Low-Side Output. Connect to gate of Low-Side power MOSFET.  
Exposed pad. Connect to ground or float. The EPAD is electrically isolated from all other pins.  
SS  
LO  
EPAD  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 2 of 15  
HIP2101  
Application Block Diagram  
+12V  
+100V  
SECONDARY  
CIRCUIT  
V
DD  
HB  
DRIVE  
HI  
HO  
HS  
LO  
HI  
LI  
PWM  
CONTROLLER  
DRIVE  
LO  
REFERENCE  
HIP2101  
AND  
ISOLATION  
V
SS  
Functional Block Diagram  
HB  
HO  
V
DD  
HI  
UNDER  
VOLTAGE  
LEVEL SHIFT  
DRIVER  
HS  
UNDER  
VOLTAGE  
LO  
DRIVER  
LI  
V
SS  
EPAD (EPSOIC, QFN and DFN PACKAGES ONLY)  
*EPAD = Exposed Pad. The EPAD is electrically isolated from all other pins. For  
best thermal performance connect the EPAD to the PCB power ground plane.  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 3 of 15  
HIP2101  
+48V  
+12V  
SECONDARY  
CIRCUIT  
HIP  
2101  
PWM  
ISOLATION  
FIGURE 1. TWO-SWITCH FORWARD CONVERTER  
+48V  
SECONDARY  
CIRCUIT  
+12V  
HIP  
2101  
PWM  
ISOLATION  
FIGURE 2. FORWARD CONVERTER WITH AN ACTIVE CLAMP  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 4 of 15  
HIP2101  
Absolute Maximum Ratings  
Thermal Information  
Supply Voltage, V  
V
-V  
(Notes 4, 5) . . . . . . . . -0.3V to 18V  
Thermal Resistance (Typical)  
(°C/W)  
(°C/W)  
JC  
DD, HB HS  
JA  
LI and HI Voltages (Note 5) . . . . . . . . . . . . . . . . . . . . . -0.3V to 7.0V  
SOIC (Note 6) . . . . . . . . . . . . . . . . . . .  
EPSOIC (Note 7) . . . . . . . . . . . . . . . . .  
QFN (Note 7) . . . . . . . . . . . . . . . . . . . .  
95  
40  
37  
40  
N/A  
3.0  
6.5  
3.0  
Voltage on LO (Note 5) . . . . . . . . . . . . . . . . . . . -0.3V to V  
+0.3V  
+0.3V  
DD  
Voltage on HO (Note 5) . . . . . . . . . . . . . . . V  
-0.3V to V  
HS  
HB  
Voltage on HS (Continuous) (Note 5) . . . . . . . . . . . . . . -1V to 110V  
Voltage on HB (Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +118V  
DFN (Note 7) . . . . . . . . . . . . . . . . . . . .  
o
Max Power Dissipation at 25 C in Free Air (SOIC, Note 6) . . . . 1.3W  
o
Average Current in V  
to HB diode. . . . . . . . . . . . . . . . . . . 100mA  
DD  
Max Power Dissipation at 25 C in Free Air (EPSOIC, Note 7). . 3.1W  
o
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 (1kV)  
Max Power Dissipation at 25 C in Free Air (QFN, Note 7). . . . . 3.3W  
Storage Temperature Range . . . . . . . . . . . . . . . . . . .-65°C to 150°C  
Junction Temperature Range. . . . . . . . . . . . . . . . . . .-55°C to 150°C  
Lead Temperature (Soldering 10s - SOIC Lead Tips Only) . . 300°C  
For Recommended soldering conditions see TB389.  
Maximum Recommended Operating Conditions  
Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . .+9V to 14.0VDC  
DD  
Voltage on HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1V to 100V  
Voltage on HS . . . . . . . . . . . . . . .(Repetitive Transient) -5V to 105V  
Voltage on HB . . V +8V to V +14.0V and V  
HS HS DD  
-1V to V +100V  
DD  
HS Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <50V/ns  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” can cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the recommended operating conditions of this specification is not implied.  
NOTES:  
4. The HIP2101 is capable of derated operation at supply voltages exceeding 14V. Figure 16 shows the high-side voltage derating curve for this  
mode of operation.  
5. All voltages referenced to V unless otherwise specified.  
SS  
6. is measured with the component mounted on a high-effective thermal conductivity test board in free air. See TB379 for details.  
JA  
7. is measured in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach” features.   
the  
JA  
JC,  
“case temp” is measured at the center of the exposed metal pad on the package underside. See TB379.  
Electrical Specifications  
V
= V  
= 12V, V = V  
SS  
= 0V, No Load on LO or HO, unless otherwise specified  
HS  
DD  
HB  
T = -40°C TO  
J
T
= 25°C  
125°C  
J
PARAMETERS  
SYMBOL  
TEST CONDITIONS  
MIN  
TYP MAX  
MIN  
MAX UNIT  
SUPPLY CURRENTS  
V
V
Quiescent Current  
Operating Current  
I
LI = HI = 0V  
f = 500kHz  
LI = HI = 0V  
f = 500kHz  
-
-
-
-
-
-
0.3  
1.7  
0.45  
3.0  
0.15  
2.5  
1.5  
-
-
-
-
-
-
-
0.6  
3.4  
0.2  
3
mA  
mA  
mA  
mA  
A  
DD  
DD  
DD  
I
I
DDO  
Total HB Quiescent Current  
Total HB Operating Current  
I
0.1  
HB  
HBO  
1.5  
HB to V Current, Quiescent  
SS  
I
V
= V = 114V  
HB  
0.05  
0.7  
10  
-
HBS  
HS  
HB to V Current, Operating  
SS  
I
f = 500kHz  
mA  
HBSO  
INPUT PINS  
Low Level Input Voltage Threshold  
V
0.8  
1.65  
1.65  
200  
-
2.2  
-
0.8  
-
-
V
V
IL  
High Level Input Voltage Threshold  
Input Pulldown Resistance  
V
-
-
2.2  
500  
IH  
R
100  
k  
I
UNDER VOLTAGE PROTECTION  
V
V
Rising Threshold  
V
7
-
7.3  
0.5  
6.9  
0.4  
7.8  
-
6.5  
8
-
V
V
V
V
DD  
DD  
DDR  
DDH  
HBR  
HBH  
Threshold Hysteresis  
V
-
6
-
HB Rising Threshold  
V
V
6.5  
-
7.5  
-
8
-
HB Threshold Hysteresis  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 5 of 15  
HIP2101  
Electrical Specifications  
V
= V  
= 12V, V = V  
SS  
= 0V, No Load on LO or HO, unless otherwise specified (Continued)  
HS  
DD  
HB  
T = -40°C TO  
J
T
= 25°C  
125°C  
J
PARAMETERS  
BOOT STRAP DIODE  
Low-Current Forward Voltage  
High-Current Forward Voltage  
Dynamic Resistance  
SYMBOL  
TEST CONDITIONS  
MIN  
TYP MAX  
MIN  
MAX UNIT  
V
I
I
I
= 100A  
= 100mA  
= 100mA  
-
-
-
0.45  
0.7  
0.70  
0.92  
1
-
-
-
0.7  
1
V
V
DL  
VDD-HB  
VDD-HB  
VDD-HB  
V
DH  
R
0.8  
1.5  
D
LO GATE DRIVER  
Low Level Output Voltage  
High Level Output Voltage  
Peak Pullup Current  
V
I
I
= 100mA  
-
-
-
-
0.25  
0.25  
2
0.3  
0.3  
-
-
-
-
-
0.4  
0.4  
-
V
V
A
A
OLL  
OHL  
OHL  
LO  
LO  
V
= -100mA, V  
OHL  
= V -V  
DD LO  
I
V
V
= 0V  
LO  
LO  
Peak Pulldown Current  
HO GATE DRIVER  
I
= 12V  
2
-
-
OLL  
Low Level Output Voltage  
High Level Output Voltage  
Peak Pullup Current  
V
I
I
= 100mA  
-
-
-
-
0.25  
0.25  
2
0.3  
0.3  
-
-
-
-
-
0.4  
0.4  
-
V
V
A
A
OLH  
OHH  
OHH  
HO  
HO  
V
= -100mA, V  
= V -V  
HB HO  
OHH  
I
V
V
= 0V  
HO  
HO  
Peak Pulldown Current  
I
= 12V  
2
-
-
OLH  
Switching Specifications  
V
= V  
= 12V, V = V = 0V, No Load on LO or HO, unless otherwise specified  
SS HS  
DD  
HB  
T
= -40°C  
J
T
= 25°C  
TO 125°C  
J
TEST  
PARAMETERS  
SYMBOL  
CONDITIONS  
MIN TYP MAX MIN MAX UNIT  
Lower Turn-Off Propagation Delay (LI Falling to LO Falling)  
Upper Turn-Off Propagation Delay (HI Falling to HO Falling)  
Lower Turn-On Propagation Delay (LI Rising to LO Rising)  
Upper Turn-On Propagation Delay (HI Rising to HO Rising)  
Delay Matching: Lower Turn-On and Upper Turn-Off  
Delay Matching: Lower Turn-Off and Upper Turn-On  
Either Output Rise/Fall Time  
t
-
-
-
-
-
-
-
-
-
-
-
-
25  
25  
25  
25  
2
43  
43  
43  
43  
13  
13  
-
-
-
-
-
-
-
-
-
-
-
-
-
56  
56  
56  
56  
16  
16  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
us  
ns  
ns  
ns  
ns  
LPHL  
t
t
HPHL  
t
LPLH  
HPLH  
t
MON  
t
2
MOFF  
t
t
C = 1000pF  
10  
0.5  
20  
10  
-
RC, FC  
L
Either Output Rise/Fall Time (3V to 9V)  
t
t
C = 0.1F  
0.6  
-
0.8  
-
R, F  
L
Either Output Rise Time Driving DMOS  
t
C = IRFR120  
L
RD  
Either Output Fall Time Driving DMOS  
t
C = IRFR120  
-
-
FD  
L
Minimum Input Pulse Width that Changes the Output  
Bootstrap Diode Turn-On or Turn-Off Time  
t
-
50  
-
PW  
t
10  
-
BS  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 6 of 15  
HIP2101  
Timing Diagrams  
LI  
HI  
HI,  
LI  
t
t
,
t
t
,
HPLH  
HPHL  
LPHL  
LO  
HO  
LPLH  
t
t
MOFF  
MON  
HO,  
LO  
FIGURE 3.  
FIGURE 4.  
Typical Performance Curves  
3.500  
3.000  
2.500  
2.000  
1.500  
4.000  
3.500  
150°C, 125°C  
25°C  
150°C  
3.000  
125°C  
2.500  
2.000  
1.500  
1.000  
0.500  
0.000  
25°C  
-40°C  
-40°C  
1.000  
0.500  
0.000  
10  
30  
50  
70  
90 200 400  
600  
800 1000  
10  
30  
50  
70  
90 200 400  
600  
800 1000  
FREQUENCY (kHz)  
FREQUENCY (kHz)  
FIGURE 5B.  
FIGURE 5A.  
FIGURE 5. OPERATING CURRENT vs FREQUENCY  
500  
10  
V
= V  
= 9V  
DD  
HB  
V
= V  
= 12V  
= 14V  
400  
300  
200  
100  
HB  
HB  
DD  
DD  
V
= V  
T = 150°C  
T = -40°C  
T = 125°C  
T = 25°C  
1
0.1  
0.01  
10  
100  
1000  
-50  
0
50  
TEMPERATURE (°C)  
100  
150  
FREQUENCY (kHz)  
FIGURE 6. HB TO VSS OPERATING CURRENT vs  
FREQUENCY  
FIGURE 7. HIGH LEVEL OUTPUT VOLTAGE vs TEMPERATURE  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 7 of 15  
HIP2101  
Typical Performance Curves (Continued)  
500  
7.6  
7.4  
7.2  
7.0  
6.8  
6.6  
V
= V  
= 9V  
DD  
HB  
V
= V  
= 12V  
= 14V  
400  
300  
200  
100  
HB  
HB  
DD  
DD  
V
V
DDR  
HBR  
V
= V  
-50  
0
50  
TEMPERATURE (°C)  
100  
150  
-50  
0
50  
TEMPERATURE (°C)  
100  
150  
FIGURE 8. LOW LEVEL OUTPUT VOLTAGE vs  
TEMPERATURE  
FIGURE 9. UNDERVOLTAGE LOCKOUT THRESHOLD vs  
TEMPERATURE  
30  
0.54  
0.5  
t
t
HPHL  
HPLH  
t
V
LPHL  
LPLH  
DDH  
25  
20  
15  
0.46  
0.42  
0.38  
0.34  
0.3  
t
V
HBH  
-50  
0
50  
TEMPERATURE (°C)  
100  
150  
-50  
0
50  
TEMPERATURE (°C)  
100  
150  
FIGURE 11. PROPAGATION DELAYS vs TEMPERATURE  
FIGURE 10. UNDERVOLTAGE LOCKOUT HYSTERESIS vs  
TEMPERATURE  
2.5  
2.0  
1.5  
1.0  
0.5  
0
2.5  
2.0  
1.5  
1.0  
0.5  
0
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
V
, V (V)  
HO LO  
V
, V (V)  
LO HO  
FIGURE 12. PEAK PULLUP CURRENT vs OUTPUT VOLTAGE  
FIGURE 13. PEAK PULLDOWN CURRENT vs OUTPUT  
VOLTAGE  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 8 of 15  
HIP2101  
Typical Performance Curves (Continued)  
1
60  
50  
40  
30  
20  
10  
0
0.1  
0.01  
I
vs V  
HB  
HB  
I
vs V  
DD  
DD  
0.001  
-4  
110  
-5  
110  
110-6  
0
5
10  
(V)  
15  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
V
, V  
DD HB  
FORWARD VOLTAGE (V)  
FIGURE 14. BOOTSTRAP DIODE I-V CHARACTERISTICS  
FIGURE 15. QUIESCENT CURRENT vs VOLTAGE  
120  
100  
80  
60  
40  
20  
0
12  
14  
15  
TO V VOLTAGE (V)  
16  
V
DD  
SS  
FIGURE 16. VHS VOLTAGE vs V  
VOLTAGE  
DD  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 9 of 15  
HIP2101  
Revision History  
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make  
sure that you have the latest revision.  
DATE  
REVISION  
CHANGE  
Aug 8, 2019  
FN9025.10  
Added Related Literature.  
Updated Links throughout.  
Updated Ordering information by removing obsolete parts, adding tape and reel part information,  
updating notes, and adding Note 3.  
Removed About Intersil section.  
Updated disclaimer.  
Updated POD M8.15C to latest revision changes are as follows:  
-Updated Millimeter MIN and MAX values for A from: 1.43 MIN and 1.68 MAX to: 1.422 MIN and 1.700  
MAX  
-Updated Inch MAX for A from: 0.066 to: 0.067  
-A1 Inches changed MIN from: 0.001 to 0.0, and A1 Millimeters MIN from 0.03 to 0.0  
-L Millimeter Min changed from: 0.41 to 0.406  
Nov 12, 2015  
FN9025.9  
- Updated Ordering Information Table on page 2.  
- Added Revision History.  
- Added About Intersil Verbiage.  
- Updated POD L12.4X4A to latest revision changes are as follow:  
Updated to new POD format by removing table listing dimensions and moving dimensions onto  
drawing.  
Added Typical Recommended Land Pattern.  
Bottom View changed "3.2 REF" TO "2.5 REF"  
Typical Recommended Land Pattern changed "3.80" to "3.75"  
From: Tiebar shown (if present) is a non-functional feature.  
To: Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or  
ends).  
- Updated POD M8.15 to latest revision changes are as follow:  
Updated to new POD format by removing table and moving dimensions onto drawing and adding land  
pattern.  
Changed in Typical Recommended Land Pattern the following:  
2.41(0.095) to 2.20(0.087)  
0.76 (0.030) to 0.60(0.023)  
0.200 to 5.20(0.205)  
Changed Note 1 "1982" to "1994"  
- Updated POD M8.15C to most current version.  
Removed "u" symbol from drawing (overlaps the "a" on Side View).  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 10 of 15  
HIP2101  
For the most recent package outline drawing, see L12.4x4A.  
Package Outline Drawings  
L12.4x4A  
12 Lead Dual Flat No-Lead Plastic Package (DFN)  
Rev 3, 3/15  
2.5 REF  
4.00  
A
PIN #1 INDEX AREA  
6
10X 0.50 BSC  
B
6
1
12X 0 . 45  
6
PIN 1  
INDEX AREA  
4.00  
1.58  
0.15  
(4X)  
12  
7
0.10 M C A B  
C
0.05 M  
12 X 0.25  
4
TOP VIEW  
( 2.80 )  
2.80  
BOTTOM VIEW  
SEE DETAIL "X"  
1.00 MAX  
( 12 X 0.65 )  
C
0.10  
BASE PLANE  
C
SEATING PLANE  
0.08 C  
SIDE VIEW  
0 . 2 REF  
( 3.75)  
( 1.58)  
C
0 . 00 MIN.  
0 . 05 MAX.  
( 10X 0 . 5 )  
( 12X 0 . 25)  
DETAIL "X"  
TYPICAL RECOMMENDED LAND PATTERN  
NOTES:  
1. Dimensions are in millimeters.  
Dimensions in ( ) for Reference Only.  
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.  
3. Unless otherwise specified, tolerance : Decimal ± 0.05  
4. Lead width applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
5. Tiebar shown (if present) is a non-functional feature and may  
be located on any of the 4 sides (or ends).  
The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 identifier may be  
either a mold or mark feature.  
6.  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 11 of 15  
HIP2101  
For the most recent package outline drawing, see L16.5x5.  
L16.5x5  
16 Lead Quad Flat No-Lead Plastic Package (QFN)  
(Compliant to JEDEC MO-220VHHB ISSUE C)  
MILLIMETERS  
SYMBOL  
MIN  
NOMINAL  
MAX  
1.00  
0.05  
1.00  
NOTES  
A
A1  
A2  
A3  
b
0.80  
0.90  
-
-
-
-
-
-
9
0.20 REF  
9
0.28  
2.55  
2.55  
0.33  
0.40  
2.85  
2.85  
5, 8  
D
5.00 BSC  
-
D1  
D2  
E
4.75 BSC  
9
2.70  
7, 8  
5.00 BSC  
-
E1  
E2  
e
4.75 BSC  
9
2.70  
7, 8  
0.80 BSC  
-
k
0.25  
0.35  
-
-
-
-
L
0.60  
0.75  
0.15  
8
L1  
N
-
16  
4
4
-
10  
2
Nd  
Ne  
P
3
4
-
3
0.60  
12  
9
-
-
9
Rev. 2 10/02  
NOTES:  
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.  
2. N is the number of terminals.  
3. Nd and Ne refer to the number of terminals on each D and E.  
4. All dimensions are in millimeters. Angles are in degrees.  
5. Dimension b applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
6. The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 identifier may be  
either a mold or mark feature.  
7. Dimensions D2 and E2 are for the exposed pads which provide  
improved electrical and thermal performance.  
8. Nominal dimensionsare providedtoassist with PCB LandPattern  
Design efforts, see Intersil Technical Brief TB389.  
9. Features and dimensions A2, A3, D1, E1, P & are present when  
Anvil singulation method is used and not present for saw  
singulation.  
10. Depending on the method of lead termination at the edge of the  
package, a maximum 0.15mm pull back (L1) maybe present. L  
minus L1 to be equal to or greater than 0.3mm.  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 12 of 15  
HIP2101  
M8.15  
For the most recent package outline drawing, see M8.15.  
8 Lead Narrow Body Small Outline Plastic Package  
Rev 4, 1/12  
DETAIL "A"  
1.27 (0.050)  
0.40 (0.016)  
INDEX  
AREA  
6.20 (0.244)  
5.80 (0.228)  
0.50 (0.20)  
x 45°  
0.25 (0.01)  
4.00 (0.157)  
3.80 (0.150)  
8°  
0°  
1
2
3
0.25 (0.010)  
0.19 (0.008)  
SIDE VIEW “B”  
TOP VIEW  
2.20 (0.087)  
1
8
SEATING PLANE  
0.60 (0.023)  
1.27 (0.050)  
1.75 (0.069)  
5.00 (0.197)  
4.80 (0.189)  
2
3
7
6
1.35 (0.053)  
-C-  
4
5
0.25(0.010)  
0.10(0.004)  
1.27 (0.050)  
0.51(0.020)  
0.33(0.013)  
5.20(0.205)  
SIDE VIEW “A  
TYPICAL RECOMMENDED LAND PATTERN  
NOTES:  
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.  
2. Package length does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
inch) per side.  
3. Package width does not include interlead flash or protrusions. Interlead  
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.  
4. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
5. Terminal numbers are shown for reference only.  
6. The lead width as measured 0.36mm (0.014 inch) or greater above the  
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).  
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not  
necessarily exact.  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 13 of 15  
HIP2101  
For the most recent package outline drawing, see M8.15C.  
M8.15C  
N
8 Lead Narrow Body Small Outline Exposed Pad  
Plastic Package (EPSOIC)  
Index  
Area  
0.25(0.010)  
M
B M  
H
E
Inches  
Millimeters  
-B-  
Symbol  
Min  
0.056  
0.0  
Max  
Min  
1.422  
0.0  
Max  
1.700  
0.13  
0.49  
0.25  
4.98  
3.99  
Notes  
A
A1  
B
0.067  
0.005  
0.0192  
0.0098  
0.196  
0.157  
-
-
1
2
3
Top View  
0.0138  
0.0075  
0.189  
0.150  
0.35  
0.19  
4.80  
3.811  
9
-
C
D
E
L
3
4
-
Seating Plane  
A
e
0.050 BSC  
1.27 BSC  
-A-  
D
h x 45°  
H
h
0.230  
0.010  
0.016  
0.244  
0.016  
0.035  
5.84  
0.25  
0.406  
6.20  
0.41  
0.89  
-
5
6
7
-
-C-  
α
L
e
B
A1  
N
α
8
8
C
0.10(0.004)  
0°  
-
8°  
0°  
-
8°  
0.25 (0.010) M  
Side View  
C A M B S  
P
0.126  
0.099  
3.200  
2.514  
11  
11  
P1  
-
-
Rev. 2 5/19  
Notes:  
1. Symbols are defined in the “MO Series Symbol List” in  
Section 2.2 of Publication Number 95.  
1
2
3
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
P1  
3. Dimension “D” does not include mold flash, protrusions or  
gate burrs. Mold flash, protrusion, and gate burrs shall not  
exceed 0.15mm (0.006 inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions.  
Interlead flash and protrusions shall not exceed 0.25mm  
(0.010 inch) per side.  
N
P
Bottom View  
5. The chamfer on the body is optional. If it is not present, a  
visual index feature must be located within the crosshatched  
area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or  
greater above the seating plane, shall not exceed a  
maximum value of 0.61mm (0.024 inch).  
10. Controlling dimension: Millimeter. Converted inch  
dimensions are not necessarily exact.  
11. Dimensions “P” and “P1” are thermal and/or electrical  
enhanced variations. Values shown are maximum size of  
exposed pad within lead count and body size.  
FN9025 Rev.10.00  
Aug 8, 2019  
Page 14 of 15  
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Corporate Headquarters  
ContactInformation
TOYOSU FORESIA, 3-2-24 Toyosu,  
For further information on a product, technology, the most up-to-date  
Koto-ku, Tokyo 135-0061, Japan  
www.renesas.com  
version of a document, or your nearest sales office, please visit:  
www.renesas.com/contact/  
Trademarks  
Renesas and the Renesas logo are trademarks of Renesas Electronics  
Corporation. All trademarks and registered trademarks are the property  
of their respective owners.  
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配单直通车
HIP2101IBZT产品参数
型号:HIP2101IBZT
Brand Name:Intersil
生命周期:Unknown
零件包装代码:DFN, QFN, SOIC
包装说明:SOP, SOP8,.25
针数:12, 16, 8
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:1 week
风险等级:5.05
高边驱动器:YES
接口集成电路类型:HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码:R-PDSO-G8
JESD-609代码:e3
长度:4.9 mm
湿度敏感等级:1
功能数量:1
端子数量:8
最高工作温度:125 °C
最低工作温度:-40 °C
标称输出峰值电流:2 A
封装主体材料:PLASTIC/EPOXY
封装代码:SOP
封装等效代码:SOP8,.25
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260
电源:12 V
认证状态:Not Qualified
座面最大高度:1.75 mm
子类别:MOSFET Drivers
最大供电电压:14 V
最小供电电压:9 V
标称供电电压:12 V
表面贴装:YES
技术:CMOS
温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING
端子节距:1.27 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:30
断开时间:0.056 µs
接通时间:0.056 µs
宽度:3.9 mm
Base Number Matches:1
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