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  • 北京元坤伟业科技有限公司

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产品型号HLMP-EL12-WZKDD的Datasheet PDF文件预览

HLMP-EGxx, HLMP-ELxx and HLMP-EHxx  
T-ꢀ¾ (5mm) Extra High Brightness AlInGaP LED Lamps  
Data Sheet  
Description  
Features  
Theseꢀ Precisionꢀ Opticalꢀ Performanceꢀ AlInGaPꢀ LEDsꢀ ꢀ Viewingꢀangle:ꢀ15°,ꢀ23°,ꢀ30°  
providesuperiorlightoutputforexcellentreadabilityinꢀ  
sunlightꢀ andꢀ areꢀ extremelyꢀ reliable.ꢀ AlInGaPꢀ LEDꢀ tech-  
nologyꢀprovidesꢀextremelyꢀstableꢀlightꢀoutputꢀoverꢀlongꢀ  
periodsꢀ ofꢀ time.ꢀ Precisionꢀ Opticalꢀ Performanceꢀ lampsꢀ  
utilizeꢀtheꢀaluminumꢀindiumꢀgalliumꢀphosphideꢀ(AlInGaP)ꢀ  
technology.ꢀ  
ꢀ Highꢀluminousꢀoutput  
•ꢀ Colors:  
590nmꢀAmber  
615nmꢀRed-Orange  
626nmꢀRed  
•ꢀ Packageꢀoptions:  
Theseꢀ LEDꢀ lampsꢀ areꢀ untinted,T-1¾ꢀ packagesꢀ incorpo-  
ratingsecondgenerationopticsproducingwelldefinedꢀ  
spatialꢀradiationꢀpatternsꢀatꢀspecificꢀviewingꢀconeꢀangles.  
Withꢀorꢀwithoutꢀleadꢀstandoff  
•ꢀ Superiorꢀresistanceꢀtoꢀmoisture  
•ꢀ Untintedꢀnon-diffusedꢀforꢀ15°ꢀandꢀ30°ꢀlamps  
•ꢀ Untintedꢀdiffusedꢀforꢀ23°ꢀlamps  
Theseꢀ lampsꢀ areꢀ madeꢀ withꢀ anꢀ advancedꢀ opticalꢀ gradeꢀ  
epoxyꢀ offeringꢀ superiorꢀ highꢀ temperatureꢀ andꢀ highꢀ  
moistureꢀ resistanceꢀ performanceꢀ inꢀ outdoorꢀ signalꢀ andꢀ  
signꢀ application.ꢀ Theꢀ maximumꢀ LEDꢀ junctionꢀ tempera-  
tureꢀlimitꢀofꢀ+130°Cꢀenablesꢀhighꢀtemperatureꢀoperationꢀ  
inꢀ brightꢀ sunlightꢀ conditions.ꢀ Theꢀ epoxyꢀ containsꢀ bothꢀ  
uv-aꢀ andꢀ uv-bꢀ inhibitorsꢀ toꢀ reduceꢀ theꢀ effectsꢀ ofꢀ longꢀ  
termꢀexposureꢀtoꢀdirectꢀsunlight.  
Applications  
•ꢀꢀ Trafficꢀmanagement:  
-ꢀ Trafficꢀsignals  
-ꢀ Pedestrianꢀsignals  
-ꢀ Workꢀzoneꢀwarningꢀlights  
-ꢀ Variableꢀmessageꢀsigns  
•ꢀꢀ Commercialꢀoutdoorꢀadvertising  
-ꢀ Signs  
Benefits  
•ꢀꢀ Superiorꢀperformanceꢀforꢀoutdoorꢀenvironments  
•ꢀꢀ Suitableꢀforꢀauto-insertionꢀontoꢀPCꢀboard  
-ꢀ Marquees  
Package Dimension  
A
B
5.00 ± 0.20  
5.00 ± 0.20  
(0.197 ±0.008)  
(0.197 ± 0.008)  
1.14 ± 0.20  
(0.045 ±0.008)  
8.71 ± 0.20  
(0.343 ± 0.008)  
8.71 ± 0.20  
(0.343 ± 0.008)  
d
1.14 ± 0.20  
(0.045 ± 0.008)  
2.35 (0.093)  
MAX.  
0.70 (0.028)  
MAX.  
1.50 ± 0.15  
(0.059 ± 0.006)  
31.60  
MIN.  
31.60  
(1.244)  
MIN.  
(1.244)  
0.70 (0.028)  
MAX.  
CATHODE  
LEAD  
CATHODE  
LEAD  
0.50 ± 0.10  
(0.020 ± 0.004)  
0.50 ± 0.10  
(0.020 ± 0.004)  
SQ. TYP.  
SQ. TYP.  
1.00  
MIN.  
1.00  
MIN.  
(0.039)  
(0.039)  
5.80 ± 0.20  
5.80 ± 0.20  
(0.228 ± 0.008)  
(0.228 ± 0.008)  
CATHODE  
FLAT  
CATHODE  
FLAT  
2.54 ± 0.38  
2.54 ± 0.38  
(0.100 ± 0.015)  
(0.100 ± 0.015)  
NOTES:  
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).  
PART NO.  
d
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN  
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.  
HLMP-XX13  
HLMP-XX23  
HLMP-XX37  
12.42 ± 0.25  
(0.489 ± 0.010)  
3. RECOMMENDED PC BOARD HOLE DIAMETERS:  
11.59 ± 0.25  
(0.446 ± 0.010)  
- LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF  
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).  
11.96 ± 0.25  
(0.471 ± 0.010)  
- LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS  
= 0.965/0.889 (0.038/0.035).  
4. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.  
5. FOR IDENTIFICATION OF POLARITY AFTER THE LEADS ARE TRIMMED OFF, PLEASE REFER TO THE ILLUSTRATION BELOW:  
CATHODE  
ANODE  
7. MAJOR HEAT PATH IS THROUGH THE ANODE LEAD  
Device Selection Guide  
Luminous Intensity  
Lamps without  
Standoffs on Leads  
(Outline Drawing A)  
Lamps with  
Standoffs on Leads  
(Outline Drawing B)  
[1,2,5]  
Iv (mcd)  
@ 20mA  
Typical Viewing  
Angle 2θ½ (Deg)  
Color and Dominant  
Wavelength (nm), Typ.  
[4]  
[3]  
Min.  
Max.  
15°  
Amberꢀ590  
HLMP-EL12-VY0DD  
HLMP-EL12-XYKDD  
HLMP-EH12-VY0DD  
HLMP-EG12-VY0DD  
HLMP-EG12-WX0DD  
HLMP-EL22-UXKDD  
HLMP-EL22-UX0DD  
HLMP-EL22-VWKDD  
HLMP-EH22-TW0DD  
HLMP-EG22-UX0DD  
HLMP-EG22-VW0DD  
HLMP-EL35-TW0DD  
HLMP-EL35-TWKDD  
HLMP-EL35-UVKDD  
HLMP-EH35-SV0DD  
HLMP-EG35-TW0DD  
HLMP-EG35-UV0DD  
HLMP-EL13-VY0DD  
4200  
7200  
4200  
4200  
5500  
3200  
3200  
4200  
2500  
3200  
4200  
2500  
2500  
3200  
1900  
2500  
3200  
12000  
12000  
12000  
12000  
9300  
9300  
9300  
7200  
7200  
9300  
7200  
7200  
7200  
5500  
5500  
7200  
5500  
Red-Orangeꢀ615  
Redꢀ626  
HLMP-EH13-VY0DD  
HLMP-EG13-VY0DD  
23°  
Amberꢀ590  
HLMP-EL23-UXKDD  
HLMP-EL23-UX0DD  
Red-Orangeꢀ615  
Redꢀ626  
HLMP-EH23-TW0DD  
HLMP-EG23-UX0DD  
30°  
Amberꢀ590  
HLMP-EL37-TW0DD  
HLMP-EL37-TWKDD  
Red-Orangeꢀ615  
Redꢀ626  
HLMP-EH37-SV0DD  
HLMP-EG37-TW0DD  
Notes:  
1.ꢀ Theꢀluminousꢀintensityꢀisꢀmeasuredꢀonꢀtheꢀmechanicalꢀaxisꢀofꢀtheꢀlampꢀpackage.  
2.ꢀ Theꢀopticalꢀaxisꢀisꢀcloselyꢀalignedꢀwithꢀtheꢀpackageꢀmechanicalꢀaxis.  
3.ꢀ Dominantꢀwavelength,ꢀλd,ꢀisꢀderivedꢀfromꢀtheꢀCIEꢀChromaticityꢀDiagramꢀandꢀrepresentsꢀtheꢀcolorꢀofꢀtheꢀlamp.  
4.ꢀ θ½ꢀisꢀtheꢀoff-axisꢀangleꢀwhereꢀtheꢀluminousꢀintensityꢀisꢀhalfꢀtheꢀon-axisꢀintensity.ꢀ  
5.ꢀ Toleranceꢀforꢀeachꢀintensityꢀbinꢀlimitꢀisꢀ ꢀ15%.  
Part Numbering System  
HLMP – E x x x - x x x x x  
Mechanical Options  
00 : Bulk Packaging  
DD : Ammo Pack  
YY : Flexi-Bin; Bulk Packaging  
ZZ : Flexi-Bin; Ammo Pack  
Color Bin Selections  
0 : Full color distribution  
2 : Amber color bin 2 only  
4 : Amber color bin 4 only  
K : Amber color bin 2 and 4 only  
Z : Special Vf Bin Range  
Maximum Intensity Bin  
0 : No maximum intensity bin limitation  
Minimum Intensity Bin  
Viewing Angle and Lead Standoffs  
12 : 15 deg without lead standoffs  
13 : 15 deg with lead standoffs  
22 : 23 deg without lead standoffs  
23 : 23 deg with lead standoffs  
35 : 30 deg without lead standoffs  
37 : 30 deg with lead standoffs  
Color  
G : 626nm Red  
H : 615nm Red-Orange  
L : 590nm Amber  
Note:ꢀPleaseꢀreferꢀtoꢀABꢀ5337ꢀforꢀcompleteꢀinformationꢀonꢀpartꢀnumberingꢀsystem.  
Absolute Maximum Ratings at T = 25°C  
A
DCꢀForwardꢀCurrentꢀ[1]  
50ꢀmA  
PeakꢀPulsedꢀForwardꢀCurrent  
AverageꢀForwardꢀCurrent  
ReverseꢀVoltageꢀ(Irꢀ=ꢀ100ꢀµA)ꢀ  
OperatingꢀTemperatureꢀ  
StorageꢀTemperatureꢀ  
100ꢀmA  
30ꢀmA  
5ꢀV  
–40°Cꢀtoꢀ+100°C  
–40°Cꢀtoꢀ+100°C  
Notes:  
1.ꢀ DerateꢀlinearlyꢀasꢀshownꢀinꢀFigureꢀ4.  
Electrical/ Optical Characteristics at T = 25ºC  
A
Parameter  
Symbol  
Minimum Average Maximum Units  
Test Condition  
ForwardꢀVoltageꢀ  
Amber  
Red  
IFꢀ=ꢀ20mA  
2.20  
2.10  
2.00  
VF  
1.80  
2.40  
V
Red-Orange  
PeakꢀWavelength  
Amberꢀ  
Red  
Red-Orange  
DominantꢀWavelengthꢀ[1]  
Amberꢀ  
Red  
Red-Orange  
IFꢀ=ꢀ20mA  
IFꢀ=ꢀ20mA  
590  
626  
615  
λPEAK  
nm  
nm  
584.5  
620.0  
612.0  
594.5  
630.0  
621.7  
λd  
VR  
ReverseꢀVoltage  
SpectralꢀHalfwidth  
Capacitanceꢀ  
5
V
IRꢀ=ꢀ100μA  
Dλ  
½
17  
nm  
pF  
IFꢀ=ꢀ20ꢀmA  
C
40  
VFꢀ=ꢀ0,ꢀfꢀ=ꢀ1ꢀMHz  
LEDꢀJunction-to-AnodeꢀLead  
ThermalꢀResistance  
J-PIN  
240  
ºC/W  
LuminousꢀEfficacyꢀ[2]  
Amberꢀ  
Red  
EmittedꢀLuminousꢀFlux/Emittedꢀ  
RadiantꢀFlux  
480  
150  
260  
hV  
lm/W  
Red-Orange  
LuminousꢀFlux  
jV  
he  
1300  
30  
mlm  
IFꢀ=ꢀ20mA  
LuminousꢀEfficiencyꢀ[3]  
lm/W  
EmittedꢀLuminousꢀFlux/ꢀElectricalꢀ  
Power  
Notes:  
1.ꢀ Thedominantwavelength,λdisderivedfromtheCIEChromaticityDiagramreferencedtoIlluminantE.ꢀToleranceforeachcolorofdominantꢀ  
wavelengthꢀisꢀ+/-ꢀ0.5nm.  
2.ꢀ Theꢀradiantꢀintensity,ꢀIeꢀinꢀwattsꢀperꢀsteradian,ꢀmaybeꢀfoundꢀfromꢀtheꢀequationꢀIeꢀ=ꢀIvꢀ/ꢀηVꢀwhereꢀIvꢀisꢀtheꢀluminousꢀintensityꢀinꢀcandelaꢀandꢀηVꢀisꢀ  
theꢀluminousꢀefficacyꢀinꢀlumens/watt.  
3.ꢀ h ꢀ=ꢀj ꢀ/ꢀI ꢀꢀxꢀV ,ꢀwhereꢀj ꢀꢀisꢀtheꢀemittedꢀluminousꢀflux,ꢀI ꢀisꢀelectricalꢀforwardꢀcurrentꢀandꢀV ꢀisꢀtheꢀforwardꢀvoltage.  
e
V
F
F
V
F
F
Figure 1. Relative intensity vs. peak wavelength  
5
60  
50  
40  
30  
20  
10  
2.5  
Red  
2
Red-Orange  
Amber  
1.5  
1
0.5  
0
0
0
0.5  
1
1.5  
2
2.5  
3
0
10  
20  
30  
40  
50  
FORWARD VOLTAGE - V  
DC FORWARD CURRENT - mA  
Figure 2. Forward current vs. forward voltage  
Figure 3. Relative luminous intensity vs. forward current  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0
0
20  
40  
60  
80  
100  
120  
-90  
-60  
-30  
0
30  
60  
90  
TA - AMBIENT TEMPERATURE - ºC  
ANGULAR DISPLACEMENT - DEGREES  
Figure 4. Maximum forward current vs. ambient temperature  
Figure 5. Representative spatial radiation pattern for 15° viewing angle  
lamps  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
-90  
-60  
-30  
0
30  
60  
90  
-90  
-60  
-30  
0
30  
60  
90  
ANGULAR DISPLACEMENT -DEGREES  
ANGULAR DISPLACEMENT - DEGREES  
Figure 6. Representative spatial radiation pattern for 23° viewing angle  
lamps  
Figure 7. Representative spatial radiation pattern for 30° viewing angle  
lamps  
10  
1
Amber  
Red  
Red-Orange  
0.1  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
JUNCTION TEMPERATURE - °C  
Figure 8. Relative light output vs. junction temperature  
Intensity Bin Limits (mcd at 20mA)  
Forward Voltage Bin Limits (V at 20mA)  
Bin Name  
Minimum  
1500  
Maximum  
1900  
Bin Name  
VD  
Minimum  
1.8  
Maximum  
2.0  
R
S
1900  
2500  
VA  
2.0  
2.2  
T
2500  
3200  
VB  
2.2  
2.4  
U
V
W
X
Y
Z
1
3200  
4200  
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.05V  
4200  
5500  
Amber Color Bin Limits (nm at 20mA)  
5500  
7200  
Bin Name  
Minimum  
584.5  
Maximum  
587.0  
7200  
9300  
1
2
4
6
9300  
12000  
16000  
21000  
27000  
587.0  
589.5  
12000  
16000  
21000  
589.5  
592.0  
592.0  
594.5  
2
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.5nm  
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ15%  
Note:ꢀ Binꢀ categoriesꢀ areꢀ establishedꢀ forꢀ classificationꢀ ofꢀ products.ꢀ  
Productsꢀmayꢀnotꢀavailableꢀinꢀallꢀbinꢀcategories.  
Precautions:  
Lead Forming:  
Note:ꢀ  
1.ꢀ PCBꢀ withꢀ differentꢀ sizeꢀ andꢀ designꢀ (componentꢀ density)ꢀ willꢀ haveꢀ  
differentꢀ heatꢀ massꢀ (heatꢀ capacity).Thisꢀ mightꢀ causeꢀ aꢀ changeꢀ inꢀ  
temperatureꢀ experiencedꢀ byꢀ theꢀ boardꢀ ifꢀ sameꢀ waveꢀ solderingꢀ  
settingisused.So,ꢀitꢀisꢀrecommendedꢀtoꢀre-calibrateꢀtheꢀsolderingꢀ  
profileꢀagainꢀbeforeꢀloadingꢀaꢀnewꢀtypeꢀofꢀPCB.  
2.ꢀ AvagoꢀTechnologies’highbrightnessLEDareusinghighefficiencyꢀ  
LEDꢀdieꢀwithꢀsingleꢀwireꢀbondꢀasꢀshownꢀbelow.ꢀCustomerꢀisꢀadvisedꢀ  
totakeextraprecautionduringwavesolderingtoensurethattheꢀ  
maximumꢀwaveꢀtemperatureꢀdoesꢀnotꢀexceedꢀ250°Cꢀandꢀtheꢀsolderꢀ  
contactꢀ timeꢀ doesꢀ notꢀ exceedingꢀ 3sec.ꢀ Over-stressingꢀ theꢀ LEDꢀ  
duringꢀsolderingꢀprocessꢀmightꢀcauseꢀprematureꢀfailureꢀtoꢀtheꢀLEDꢀ  
dueꢀtoꢀdelamination.  
ꢀ TheꢀleadsꢀofꢀanꢀLEDꢀlampꢀmayꢀbeꢀpreformedꢀorꢀcutꢀtoꢀ  
lengthꢀpriorꢀtoꢀinsertionꢀandꢀsolderingꢀonꢀPCꢀboard.  
ꢀ Forꢀ betterꢀ control,ꢀ itꢀ isꢀ recommendedꢀ toꢀ useꢀ properꢀ  
tooltopreciselyformandcuttheleadstoapplicableꢀ  
lengthꢀratherꢀthanꢀdoingꢀitꢀmanually.  
ꢀ Ifꢀmanualꢀleadꢀcuttingꢀisꢀnecessary,ꢀcutꢀtheꢀleadsꢀafterꢀ  
thesolderingprocess.ꢀThesolderconnectionformsaꢀ  
mechanicalꢀgroundꢀwhichꢀpreventsꢀmechanicalꢀstressꢀ  
duetoleadcuttingfromtravelingintoLEDpackage.ꢀ  
Thisꢀisꢀhighlyꢀrecommendedꢀforꢀhandꢀsolderꢀoperation,ꢀ  
asꢀtheꢀexcessꢀleadꢀlengthꢀalsoꢀactsꢀasꢀsmallꢀheatꢀsink.  
Avago Technologies LED configuration  
Soldering and Handling:  
ꢀ Careꢀ mustꢀ beꢀ takenꢀ duringꢀ PCBꢀ assemblyꢀ andꢀ  
solderingꢀ processꢀ toꢀ preventꢀ damageꢀ toꢀ theꢀ LEDꢀ  
component.ꢀ  
ꢀ LEDꢀ componentꢀ mayꢀ beꢀ effectivelyꢀ handꢀ solderedꢀ  
toꢀ PCB.ꢀ However,ꢀ itꢀ isꢀ onlyꢀ recommendedꢀ underꢀ  
unavoidableꢀcircumstancesꢀsuchꢀasꢀrework.ꢀTheꢀclosestꢀ  
manualꢀ solderingꢀ distanceꢀ ofꢀ theꢀ solderingꢀ heatꢀ  
sourceꢀ (solderingꢀ iron’sꢀ tip)ꢀ toꢀ theꢀ bodyꢀ isꢀ 1.59mm.ꢀ  
SolderingꢀtheꢀLEDꢀusingꢀsolderingꢀironꢀtipꢀcloserꢀthanꢀ  
1.59mmꢀmightꢀdamageꢀtheꢀLED.  
Anode  
Note:ꢀElectricalꢀconnectionꢀbetweenꢀbottomꢀsurfaceꢀofꢀLEDꢀdieꢀandꢀ  
theꢀleadꢀframeꢀisꢀachievedꢀthroughꢀconductiveꢀpaste.  
ꢀ Anyꢀ alignmentꢀ fixtureꢀ thatꢀ isꢀ beingꢀ appliedꢀ duringꢀ  
waveꢀ solderingꢀ shouldꢀ beꢀ looselyꢀ fittedꢀ andꢀ shouldꢀ  
notꢀapplyꢀweightꢀorꢀforceꢀonꢀLED.ꢀNonꢀmetalꢀmaterialꢀ  
isꢀ recommendedꢀ asꢀ itꢀ willꢀ absorbꢀ lessꢀ heatꢀ duringꢀ  
waveꢀsolderingꢀprocess.  
1.59mm  
Note:ꢀInꢀorderꢀtoꢀfurtherꢀassistꢀcustomerꢀinꢀdesigningꢀjigꢀaccuratelyꢀ  
thatꢀ fitꢀ AvagoTechnologies’ꢀ product,ꢀ 3Dꢀ modelꢀ ofꢀ theꢀ productꢀ isꢀ  
availableꢀuponꢀrequest.  
ꢀ ESDꢀ precautionꢀ mustꢀ beꢀ properlyꢀ appliedꢀ onꢀ theꢀ  
solderingꢀ stationꢀ andꢀ personnelꢀ toꢀ preventꢀ ESDꢀ  
damagetotheLEDcomponentthatisESDsensitive.ꢀ  
DoꢀreferꢀtoꢀAvagoꢀapplicationꢀnoteꢀANꢀ1142ꢀforꢀdetails.ꢀ  
Thesolderingironusedshouldhavegroundedtiptoꢀ  
ensureꢀelectrostaticꢀchargeꢀisꢀproperlyꢀgrounded.  
ꢀ Atꢀ elevatedꢀ temperature,ꢀ LEDꢀ isꢀ moreꢀ susceptibleꢀ toꢀ  
mechanicalꢀstress.ꢀTherefore,ꢀPCBꢀmustꢀallowedꢀtoꢀcoolꢀ  
downꢀ toꢀ roomꢀ temperatureꢀ priorꢀ toꢀ handling,ꢀ whichꢀ  
includesꢀremovalꢀofꢀalignmentꢀfixtureꢀorꢀpallet.  
ꢀ Recommendedꢀsolderingꢀcondition:  
ꢀ IfꢀPCBꢀboardꢀcontainsꢀbothꢀthroughꢀholeꢀ(TH)ꢀLEDꢀandꢀ  
otherꢀsurfaceꢀmountꢀcomponents,ꢀitꢀisꢀrecommendedꢀ  
thatꢀ surfaceꢀ mountꢀ componentsꢀ beꢀ solderedꢀ onꢀ theꢀ  
topꢀsideꢀofꢀtheꢀPCB.ꢀIfꢀsurfaceꢀmountꢀneedꢀtoꢀbeꢀonꢀtheꢀ  
bottomꢀ side,ꢀ theseꢀ componentsꢀ shouldꢀ beꢀ solderedꢀ  
usingꢀreflowꢀsolderingꢀpriorꢀtoꢀinsertionꢀtheꢀTHꢀLED.  
Wave  
Soldering  
Manual Solder  
Dipping  
[1, 2]  
Pre-heatꢀtemperature 105ꢀ°CꢀMax.  
-
Preheatꢀtime  
Peakꢀtemperature  
Dwellꢀtime  
60ꢀsecꢀMax  
250ꢀ°CꢀMax.  
3ꢀsecꢀMax.  
-
260ꢀ°CꢀMax.  
5ꢀsecꢀMax  
ꢀ RecommendedPCboardplatedthroughholes(PTH)ꢀ  
sizeꢀforꢀLEDꢀcomponentꢀleads.  
Note:ꢀ  
LED component  
lead size  
Plated through  
hole diameter  
1.ꢀ Aboveꢀ conditionsꢀ refersꢀ toꢀ measurementꢀ withꢀ thermocoupleꢀ  
mountedꢀatꢀtheꢀbottomꢀofꢀPCB.  
2.ꢀ Itꢀisꢀrecommendedꢀtoꢀuseꢀonlyꢀbottomꢀpreheatersꢀinꢀorderꢀtoꢀreduceꢀ  
thermalꢀstressꢀexperiencedꢀbyꢀLED.  
Diagonal  
0.45ꢀxꢀ0.45ꢀmm  
0.636ꢀmm  
0.98ꢀtoꢀ1.08ꢀmm  
(0.039ꢀtoꢀ0.043ꢀinch)  
(0.018xꢀ0.018ꢀinch) (0.025ꢀinch)  
0.50ꢀxꢀ0.50ꢀmm 0.707ꢀmm  
(0.020xꢀ0.020ꢀinch) (0.028ꢀinch)  
1.05ꢀtoꢀ1.15ꢀmm  
(0.041ꢀtoꢀ0.045ꢀinch)  
ꢀ Waveꢀ solderingꢀ parametersꢀ mustꢀ beꢀ setꢀ andꢀ  
maintainedꢀ accordingꢀ toꢀ theꢀ recommendedꢀ  
temperatureꢀ andꢀ dwellꢀ time.ꢀ Customerꢀ isꢀ advisedꢀ  
toꢀ performꢀ dailyꢀ checkꢀ onꢀ theꢀ solderingꢀ profileꢀ toꢀ  
ensurethatitisalwaysconformingtorecommendedꢀ  
solderingꢀconditions.  
ꢀ Over-sizingꢀ theꢀ PTHꢀ canꢀ leadꢀ toꢀ twistedꢀ LEDꢀ afterꢀ  
clinching.ꢀOnꢀtheꢀotherꢀhandꢀunderꢀsizingꢀtheꢀPTHꢀcanꢀ  
causeꢀdifficultyꢀinsertingꢀtheꢀTHꢀLED  
Recommended Wave Soldering Profile  
Recommended solder:  
Sn63 (Leaded solder alloy)  
SAC305 (Lead free solder alloy)  
LAMINAR WAVE  
HOT AIR KNIFE  
TURBULENT WAVE  
250  
200  
150  
100  
50  
Flux: Rosin flux  
Solder bath temperature:  
245°C 5°C (maximum peak  
temperature = 250°C)  
Dwell time: 1.5 sec - 3.0 sec  
(maximum = 3sec)  
Note: Allow for board to be  
sufficiently cooled to room  
temperature before exerting  
mechanical force.  
PREHEAT  
30  
0
90  
100  
40  
80  
10  
20  
60  
70  
50  
TIME (MINUTES)  
Figure 9. Recommended Wave Soldering Profile  
Ammo Packs Drawing  
Note:ꢀTheꢀammo-packsꢀdrawingꢀisꢀapplicableꢀforꢀpackagingꢀoptionꢀ–DDꢀ&ꢀ-ZZꢀandꢀregardlessꢀstandoffꢀorꢀnon-standoff  
Figure 10. Dimension for ammo pack  
Packaging Box for Ammo Packs  
Note:ꢀTheꢀdimensionꢀforꢀammoꢀpackꢀisꢀapplicableꢀforꢀtheꢀdeviceꢀwithꢀstandoffꢀandꢀwithoutꢀstandoff.  
Figure 11. The arrangement of unit in ammo pack  
Packaging Label:  
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)  
STANDARD LABEL LS0002  
RoHS Compliant  
(1P) Item: Part Number  
e3  
max temp 250C  
(Q) QTY: Quantity  
(1T) Lot: Lot Number  
LPN:  
CAT: Intensity Bin  
BIN: Refer to below information  
(9D)MFG Date: Manufacturing Date  
(P) Customer Item:  
(V) Vendor ID:  
(9D) Date Code: Date Code  
Made In: Country of Origin  
DeptID:  
ꢀ0  
(ii) Avago Baby Label (Only available on bulk packaging)  
RoHS Compliant  
e3  
max temp 250C  
Lamps Baby Label  
(1P) PART #: Part Number  
(1T) LOT #: Lot Number  
(9D)MFG DATE: Manufacturing Date  
QUANTITY: Packing Quantity  
C/O: Country of Origin  
Customer P/N:  
CAT: Intensity Bin  
Supplier Code:  
BIN: Refer to below information  
DATECODE: Date Code  
Acronyms and Definition:  
BIN:ꢀ  
Example:ꢀ  
(i)ꢀColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly  
(i)ꢀColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly  
(Applicableꢀ forꢀ partꢀ numberꢀ withꢀ colorꢀ binsꢀ butꢀ  
withoutꢀVFꢀbinꢀORꢀpartꢀnumberꢀwithꢀVFꢀbinsꢀandꢀnoꢀ  
colorꢀbin)  
BIN:ꢀ2ꢀ(representꢀcolorꢀbinꢀ2ꢀonly)  
BIN:ꢀVBꢀ(representꢀVFꢀbinꢀ“VB”ꢀonly)  
(ii)ꢀColorꢀbinꢀincorporateꢀwithꢀVFꢀBin  
ORꢀ  
BIN:ꢀ2VB  
(ii)ꢀColorꢀbinꢀincorporatedꢀwithꢀVFꢀBin  
VB:ꢀVFꢀbinꢀ“VB”  
(Applicableꢀ forꢀ partꢀ numberꢀ thatꢀ haveꢀ bothꢀ colorꢀ  
binꢀandꢀVFꢀbin)  
2:ꢀꢀColorꢀbinꢀ2ꢀonly  
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE  
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR  
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE  
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.  
Data subject to change. Copyright © ꢁ005-ꢁ00ꢇ Avago Technologies. All rights reserved.  
AV0ꢁ-00ꢆꢄEN - January ꢀ5, ꢁ00ꢇ  
配单直通车
HLMP-EL12-WZ0DD产品参数
型号:HLMP-EL12-WZ0DD
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Obsolete
IHS 制造商:AVAGO TECHNOLOGIES INC
包装说明:ROHS COMPLIANT, PLASTIC PACKAGE-2
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8541.40.20.00
风险等级:5.82
其他特性:HIGH RELIABILITY
颜色:AMBER
配置:SINGLE
最大正向电流:0.05 A
JESD-609代码:e3
透镜类型:UNTINTED NONDIFFUSED
标称发光强度:10750.0 mcd
安装特点:RADIAL MOUNT
功能数量:1
端子数量:2
最高工作温度:100 °C
最低工作温度:-40 °C
光电设备类型:SINGLE COLOR LED
总高度:8.71 mm
包装方法:AMMO PACK
峰值波长:590 nm
形状:ROUND
尺寸:5 mm
表面贴装:NO
T代码:T-1 3/4
端子面层:Matte Tin (Sn)
端子节距:2.54 mm
视角:15 deg
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