HMC265LM3应用文章市场行情现货热卖使用介绍供应商报价-中国IC网-芯三七

HMC265LM3

v01.1201

MICROWAVE CORPORATION

GaAs MMIC SUB-HARMONIC

SMT MIXER, 20 - 31 GHz

Typical Applications

The HMC265LM3 is ideal for:

• 20 and 31 GHz Microwave Radios

Features

Integrated LO Ampliﬁer: -4 dBm Input

Sub-Harmonically Pumped (x2) LO

High 2LO/RF Isolation: > 28 dB

LM3 SMT Package

• Downconverter for Point to Point Radios

• LMDS and SATCOM

Functional Diagram

General Description

The HMC265LM3 is a 20 - 31 GHz surface mount

sub-harmonically pumped (x2) MMIC mixer down-

converter with integrated LO and IF ampliﬁers in

a SMT leadless chip carrier package. The 2LO to

RF and IF isolations are an excellent 28 to 47 dB,

eliminating the need for additional ﬁltering. The

LO ampliﬁer is a single bias (+3V to +4V) two

stage design with only -4 dBm drive requirement.

All data is with the non-hermetic, epoxy sealed

LM3 packaged device mounted in a 50 ohm test

ﬁxture. Utilizing the HMC265LM3 eliminates the

need for wirebonding, thereby providing a con-

sistent connection interface for the customer.

12

Electrical Speciﬁcations,T_A= +25° C, As a Function of Vdd

IF = 2 GHz

LO = -4 dBm & Vdd = +4V

LO = -4 dBm & Vdd = +3V

Parameter

Units

Min.

Typ.

20 - 31

10 - 15.5

0.7 - 3

3

Max.

Min.

Typ.

27 - 30

13.5 - 15

0.7 - 3

4

Max.

Min.

Typ.

Max.

Frequency Range, RF

21 - 30

GHz

dB

Frequency Range, LO

Frequency Range, IF

Conversion Gain (RF to IF)

Noise Figure (SSB)

2LO to RF Isolation

2LO to IF Isolation

10.5 - 15

0.8 - 2.8

-2

0

-1

3

13

28

47

8

13

dB

21

39

2

28

40

6

35

20

38

2

dB

47

48

dB

IP3 (Input)

8

10

dBm

mA

1 dB Compression (Input)

Supply Current (Idd)

-1

+2

0

+3

0

50

40

*Unless otherwise noted, all measurements performed as downconverter, IF= 2 GHz.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

12 - 94

HMC265LM3

v01.1201

MICROWAVE CORPORATION

GaAs MMIC SUB-HARMONIC

SMT MIXER, 20 - 31 GHz

Conversion Gain vs.

Temperature @ LO = -4 dBm, Vdd= +4V

Temperature @ LO = -4 dBm, Vdd= +3V

10

5

0

-5

-10

+25C

-40C

+85C

+25C

-40C

+85C

-15

-20

-15

-20

18

20

22

24

26

28

30

32

34

18

20

22

24

26

28

30

32

34

12

RF FREQUENCY (GHz)

Conversion Gain

vs. LO Drive @ Vdd = +4V

vs. LO Drive @ Vdd = +3V

10

5

10

5

0 dBm

-4 dBm

0 dBm

0

-8 dBm

-5

-6 dBm

-10

-2 dBm

-15

-20

-15

-20

18

20

22

24

26

28

30

32

34

18

20

22

24

26

28

30

32

34

RF FREQUENCY (GHz)

Isolation @ LO = -4 dBm, Vdd = +4V

Isolation @ LO = -4 dBm, Vdd = +3V

10

LO/RF

0

-10

LO/IF

RF/IF

-20

-30

-40

-50

-60

-70

-20

-30

-40

-50

-60

-70

2LO/RF

2LO/IF

18

20

22

24

26

28

30

32

34

18

20

22

24

26

28

30

32

34

RF FREQUENCY (GHz)

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

12 - 95

HMC265LM3

v01.1201

MICROWAVE CORPORATION

GaAs MMIC SUB-HARMONIC

SMT MIXER, 20 - 31 GHz

Input P1dB @ LO = -4 dBm, Vdd = +4V

Input IP3 vs. LO Drive @ Vdd = +4V *

20

5

4

-2 dBm

16

3

2

12

8

1

0

-1

-2

-3

-4

-5

-6 dBm

4

-4 dBm

0

18

20

22

24

26

28

30

32

34

18

20

22

24

26

28

30

32

34

12

RF FREQUENCY (GHz)

RF & LO Return Loss

IF Return Loss

@ LO = -4 dBm, Vdd = +4V

0

-2

0

-2

-4

-6

-8

-10

-12

-14

-16

-18

-20

-10

-12

-14

-16

-18

-20

RF

LO

0

5

10

15

20

25

30

35

0

1

2

3

4

5

6

FREQUENCY (GHz)

IF FREQUENCY (GHz)

IF Bandwidth @ LO = -4 dBm

10

5

0

-5

-10

-15

-20

Vdd = +3V

Vdd = +4V

0

1

2

3

4

5

6

IF FREQUENCY (GHz)

* Two-tone input power = -10 dBm each tone, 1 MHz spacing.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

12 - 96

HMC265LM3

v01.1201

MICROWAVE CORPORATION

GaAs MMIC SUB-HARMONIC

SMT MIXER, 20 - 31 GHz

Absolute Maximum Ratings

RF / IF Input (Vdd = +5V)

LO Drive (Vdd = +5V)

Vdd

+13 dBm

5.5V

Continuous Pdiss (Ta = 85 °C)

(derate 2.52 mW/°C above 85 °C)

227 mW

Storage Temperature

Operating Temperature

-65 to +150 °C

-40 to +85 °C

12

Outline Drawing

NOTES:

1. MATERIAL: PLASTIC

2. PLATING: GOLD OVER NICKEL

3. DIMENSIONS ARE IN INCHES [MILLIMETERS].

4. ALL TOLERANCES ARE 0.005 [ 0.13].

5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND.

6.

INDICATES PIN 1

•

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

12 - 97

HMC265LM3

v01.1201

MICROWAVE CORPORATION

GaAs MMIC SUB-HARMONIC

SMT MIXER, 20 - 31 GHz

Pin Description

Pin Number

Function

Description

Interface Schematic

This pin may be connected to the housing ground or left

unconnected.

1, 2

N/C

Power supply for the LO Ampliﬁer. An external RF bypass

capacitor of 100 - 330 pF is required as close to the package as

possible.

3

Vdd

RF Port. This pin is AC coupled and matched to 50 Ohm from

20 - 30 GHz.

4

5

RF

IF

IF Port. This pin is AC coupled and matched to 50 Ohm from

0.7 - 3 GHz.

12

LO Port. This pin is AC coupled and matched to 50 Ohm from

10 - 15 GHz.

6

7

LO

GND

Must be soldered to PCB RF ground.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

12 - 98

HMC265LM3

v01.1201

MICROWAVE CORPORATION

GaAs MMIC SUB-HARMONIC

SMT MIXER, 20 - 31 GHz

Evaluation PCB

12

The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground

(GSG) probes for testing. Suggested probe pitch is 400mm (16 mils). Alternatively, the board can be mounted in

a metal housing with 2.4 mm coaxial connectors.

Evaluation Circuit Board Layout Design Details

Layout Technique

Material

Micro Strip to CPWG

Rogers 4003 with 1/2 oz. Cu

0.008” (0.20 mm)

Dielectric Thickness

Microstrip Line Width

CPWG Line Width

CPWG Line to GND Gap

Ground Via Hole Diameter

C1

0.018” (0.46 mm)

0.016” (0.41 mm)

0.005” (0.13 mm)

0.008” (0.20 mm)

100 pF Capacitor, 0402 Pkg.

LM3 package mounted to evaluation PCB

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

12 - 99

HMC265LM3

v01.1201

MICROWAVE CORPORATION

GaAs MMIC SUB-HARMONIC

SMT MIXER, 20 - 31 GHz

Suggested LM3-01 PCB Land Pattern Tolerance: 0.003ꢀ ( 0.08 mmꢁ

12

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

12 - 100

HMC265LM3

v01.1201

MICROWAVE CORPORATION

GaAs MMIC SUB-HARMONIC

SMT MIXER, 20 - 31 GHz

HMC265LM3 Recommended SMT Attachment Technique

Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting

225

The HMC LM3 package was designed to be compatible with

high volume surface mount PCB assembly processes. The

200

LM3 package requires a speciﬁc mounting pattern to allow

proper mechanical attachment and to optimize electrical per-

formance at millimeterwave frequencies. This PCB layout pat-

175

150

tern can be found on each LM3 product data sheet. It can also

125

be provided as an electronic drawing upon request from Hittite

Sales & Application Engineering.

100

75

Follow these precautions to avoid permanent damage:

50

Cleanliness: Observe proper handling procedures to ensure

clean devices and PCBs. LM3 devices should remain in their

12

25

0

1

2

3

4

5

6

7

8

original packaging until component placement to ensure no

contamination or damage to RF, DC & ground contact areas.

TIME (min)

Static Sensitivity: Follow ESD precautions to protect against ESD strikes.

General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair of bent

tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to

the top of the lid.

Solder Materials & Temperature Proﬁle: Follow the information contained in the application note. Hand soldering is not

recommended. Conductive epoxy attachment is not recommended.

Solder Paste

Solder paste should be selected based on the user’s experience and be compatible with the metallization systems

used. See the LM3 data sheet Outline drawing for pin & ground contact metallization schemes.

Solder Paste Application

Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste

will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical

performance. Excess solder may create unwanted electrical parasitics at high frequencies.

Solder Reﬂow

The soldering process is usually accomplished in a reﬂow oven but may also use a vapor phase process. A solder

reﬂow proﬁle is suggested above.

Prior to reﬂowing product, temperature proﬁles should be measured using the same mass as the actual assemblies.

The thermocouple should be moved to various positions on the board to account for edge and corner effects and vary-

ing component masses.The ﬁnal proﬁle should be determined by mounting the thermocouple to the PCB at the location

of the device.

Follow solder paste and oven vendor’s recommendations when developing a solder reﬂow proﬁle. A standard proﬁle

will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.

Allow enough time between reaching pre-heat temperature and reﬂow for the solvent in the paste to evaporate and the

ﬂux to completely activate. Reﬂow must then occur prior to the ﬂux being completely driven off. The duration of peak

reﬂow temperature should not exceed 15 seconds. Packages have been qualiﬁed to withstand a peak temperature of

235°C for 15 seconds. Verify that the proﬁle will not expose device to temperatures in excess of 235°C.

Cleaning

A water-based ﬂux wash may be used.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

12 - 101

型号:	HMC265LM3
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Transferred
IHS 制造商：	HITTITE MICROWAVE CORP
包装说明：	LCC6(UNSPEC)
Reach Compliance Code：	compliant
ECCN代码：	EAR99
风险等级：	5.67
Is Samacsys：	N
特性阻抗：	50 Ω
构造：	COMPONENT
下变频增益-最小值：	-2 dB
最大中频频率：	3000 MHz
最小中频频率：	700 MHz
输入功率最小值（CW）：	13 dBm
JESD-609代码：	e4
LO 可调谐：	YES
安装特点：	SURFACE MOUNT
端子数量：	6
最高工作温度：	85 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装等效代码：	LCC6(UNSPEC)
电源：	3/4 V
最大射频输入频率：	31000 MHz
最小射频输入频率：	20000 MHz
射频/微波设备类型：	DOWN CONVERTER
子类别：	RF/Microwave Mixers
表面贴装：	YES
技术：	GAAS
端子面层：	Gold (Au) - with Nickel (Ni) barrier
Base Number Matches：	1

电子百科

产品导航

产品型号HMC265LM3的概述

产品型号HMC265LM3的Datasheet PDF文件预览

HMC265LM3相关产品

HMC265LM3相关文章

IC37:专业IC行业平台