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产品型号HMC470ALP3E的概述

HMC470ALP3E 芯片概述 HMC470ALP3E 是由业界知名的射频组件供应商 Analog Devices (前身为 Hittite Microwave Corporation) 生产的一种高性能射频数字转换器。该芯片被广泛用于通信、雷达和测试设备等应用中，特别是需要高频和高线性度的场合。HMC470ALP3E 主要用于将数字信号转换为高频射频信号，因其具有良好的性能和卓越的可靠性，在现代无线系统中扮演着重要角色。 HMC470ALP3E 详细参数 HMC470ALP3E 的主要技术参数包括： 1. 频率范围：该芯片的工作频率范围广泛，通常为 0.1 GHz 到 12 GHz，这使得它适用于多种无线应用。 2. 输入失配：HMC470ALP3E 提供出色的输入失配性能，通常在 -15 dB 以上，确保在不同负载情况下良好的信号传输。 3. 线性度：高线性度是 HMC470AL...

产品型号HMC470ALP3E的Datasheet PDF文件预览

0.1 GHz to 3 GHz,1 dB LSB, 5-Bit,

GaAs Digital Attenuator

Data Sheet

HMC470A

FEATURES

FUNCTIONAL BLOCK DIAGRAM

Attenuation range: 1 dB LSB steps to 31 dB

Insertion loss: 1.7 dB typical at 3 GHz

Excellent attenuation accuracy: 0.3 dB typical

High Input linearity

0.1dB compression (P0.1dB): 27 dBm typical

Third-order intercept (IP3): 48 dBm typical

High power handling: 27 dBm

VDD

RF1

12 V1

11 RF2

Low phase shift: 27° at 3 GHz

NIC

Single-supply operation: 3 V to 5 V

CMOS-/TTL-compatible parallel control

16-lead, 3 mm × 3 mm LFCSP package

ACG1

ACG6

HMC470A

APPLICATIONS

PACKAGE

BASE

Cellular infrastructure

Microwave radios and very small aperture terminals (VSATs)

Test equipment and sensors

GND

Figure 1.

IF and RF designs

GENERAL DESCRIPTION

The HMC470A is a 5-bit digital attenuator with a 31 dB

attenuation control range in 1 dB steps.

The HMC470A operates with a single positive supply voltage

from 3 V to 5 V and provides CMOS-/TTL-compatible parallel

control interface by incorporating an on-chip driver. The

HMC470A comes in a RoHS compliant, compact, 3 mm × 3 mm

LFCSP package.

The HMC470A offers excellent attenuation accuracy and high

input linearity over the specified frequency range from 100 MHz to

3 GHz. However, this digital attenuator features ACG pins for

external ac grounding capacitors to extend the operation below

100 MHz.

Rev. A

Document Feedback

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Trademarks and registeredtrademarks arethe property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781.329.4700

Technical Support

www.analog.com

HMC470A* PRODUCT PAGE QUICK LINKS

Last Content Update: 12/16/2017

COMPARABLE PARTS

View a parametric search of comparable parts.

DESIGN RESOURCES

• HMC470A Material Declaration

• PCN-PDN Information

EVALUATION KITS

• Quality And Reliability

• HMC470A Evaluation Board

• Symbols and Footprints

DOCUMENTATION

Data Sheet

DISCUSSIONS

View all HMC470A EngineerZone Discussions.

• HMC470A-DSCC: Military Data Sheet

• HMC470A-EP: Enhanced Product Data Sheet

SAMPLE AND BUY

• HMC470A: 0.1 GHz to 3 GHz,1 dB LSB, 5-Bit, GaAs Digital

Visit the product page to see pricing options.

Attenuator Data Sheet

TECHNICAL SUPPORT

Submit a technical question or find your regional support

number.

TOOLS AND SIMULATIONS

• HMC470A S-Parameters

REFERENCE MATERIALS

DOCUMENT FEEDBACK

Product Selection Guide

Submit feedback for this data sheet.

• RF, Microwave, and Millimeter Wave IC Selection Guide

2017

This page is dynamically generated by Analog Devices, Inc., and inserted into this data sheet. A dynamic change to the content on this page will not

trigger a change to either the revision number or the content of the product data sheet. This dynamic page may be frequently modified.

HMC470A

Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1

Insertion Loss, Return Loss, State Error, Step Error, and

Relative Phase ................................................................................6

Input Power Compression and Third-Order Intercept............8

Theory of Operation .........................................................................9

Power Supply..................................................................................9

RF Input and Output ....................................................................9

ACGx Pins......................................................................................9

Applications Information .............................................................. 10

Evaluation Board ........................................................................ 10

Outline Dimensions ....................................................................... 11

Ordering Guide .......................................................................... 11

Applications....................................................................................... 1

Functional Block Diagram .............................................................. 1

General Description......................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Absolute Maximum Ratings............................................................ 4

Thermal Resistance ...................................................................... 4

ESD Caution.................................................................................. 4

Pin Configuration and Function Descriptions............................. 5

Interface Schematics..................................................................... 5

Typical Performance Characteristics ............................................. 6

REVISION HISTORY

9/2017—Rev. 01.0716 to Rev. A

This Hittite Microwave Products data sheet has been reformatted to

meet the styles and standards of Analog Devices, Inc.

Change to Product Title................................................................... 1

Updated Outline Dimensions....................................................... 11

Rev. A | Page 2 of 11

Data Sheet

HMC470A

SPECIFICATIONS

V_DD= 3 V to 5 V, V_CTL= 0 V or V_DD, T_CASE= 25°C, 50 Ω system, unless otherwise noted.

Table 1.

Parameter

Symbol Test Conditions/Comments

Min

Typ

Max

3.0

Unit

GHz

FREQUENCY RANGE

INSERTION LOSS

0.1

0.1 GHz to 1.5 GHz

1.5 GHz to 2.3 GHz

2.3 GHz to 3.0 GHz

1.3

1.5

1.7

1.6

1.8

2.0

ATTENUATION

Range

Between minimum and

maximum attenuation states,

0.1 GHz to 3.0 GHz

Between any successive

attenuation states, 0.1 GHz to

3.0 GHz

Between any successive

attenuation states, 0.1 GHz to

33 GHz

Referenced to insertion loss

state

Step Size

Step Error

State Error

< 0.2

All attenuation states, 0.1 GHz to −(0.3 + 2% of

+(0.3 + 2% of

attenuation

state)

+(0.3 + 3% of

attenuation

state)

+(0.3 + 6% of

attenuation

state)

2.3 GHz

attenuation

state)

1 dB to 15 dB attenuation states, −(0.3 + 3% of

2.3 GHz to 3.0 GHz

attenuation

state)

16 dB to 31 dB attenuation

states, 2.3 GHz to 3.0 GHz

−(0.3 + 6% of

attenuation

state)

RETURN LOSS

RF1 and RF2 pins, all attenuation

states, 0.1 GHz to 3.0 GHz

RELATIVE PHASE

Between minimum and

maximum attenuation states

0.1 GHz to 1.5 GHz

1.5 GHz to 3.0 GHz

Degrees

SWITCHING CHARACTERISTICS

Rise and Fall Time

On and Off Time

Between all attenuation states

t_RISE, t_FALL10% to 90% of RF output

t_ON, t_OFF

50% VCTL to 90% of RF output

INPUT LINEARITY¹

All attenuation states, 250 MHz

to 3.0 GHz

0.1 dB Compression

P0.1dB

VDD = 3 V

VDD = 5 V

10 dBm per tone, 1 MHz spacing

1.7

dBm

Third-Order Intercept

IP3

I_DD

SUPPLY CURRENT

DIGITAL CONTROL INPUTS

V1 to V5 pins

Voltage

Low

High

V_INL

V_INH

2.0

0.8

VDD

Current

Low

High

I_INL

I_INH

µA

¹Input linearity performance degrades at frequencies less than 250 MHz; see Figure 16 to Figure 19.

Rev. A | Page 3 of 11

HMC470A

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

7 V

Digital Control Input Voltage

RF Input Power¹(All Attenuation States,

f = 250 MHz to 3 GHz, T_CASE= 85°C)

V_DD= 3 V

V_DD= 5 V

Continuous Power Dissipation, P_DISS

(T_CASE= 85°C)

Temperature

Junction, T_J

Storage

Reflow²((Moisture Sensitivity Level 3

(MSL3) Rating)

−1 V to V_DD+1 V

–1

–2

–3

–4

–5

25 dBm

27 dBm

0.5 W

150°C

−65°C to +150°C

260°C

0.1

FREQUENCY (GHz)

Figure 2. Power Derating at Frequencies Less Than 250 MHz

ESD Sensitivity

Human Body Model (HBM)

THERMAL RESISTANCE

250 V (Class 1A)

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

¹For power derating at frequencies less than 250 MHz, see Figure 2.

²See the Ordering Guide for more information.

θ_JCis the junction to case thermal resistance.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Table 3. Thermal Resistance

Package Type

HCP-16-1¹

θ_JC

130²

Unit

°C/W

¹Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board with five thermal vias. See JEDEC JESD51.

²The device is set to maximum attenuation state.

Only one absolute maximum rating can be applied at any one time.

ESD CAUTION

Rev. A | Page 4 of 11

Data Sheet

HMC470A

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

VDD

RF1

12 V1

11 RF2

HMC470A

TOP VIEW

NIC

(Not to Scale)

ACG1

ACG6

NOTES

1. NIC = THESE PINS ARE NOT INTERNALLY CONNECTED;

HOWEVER, ALL DATA SHOWN HEREIN WAS

MEASURED WHEN THESE PINS CONNECTED TO RF/DC

GROUND OF EVALUATION BOARD.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE

CONNECTED TO GROUND FOR PROPER OPERATION.

Figure 3. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

VDD

RF1

Power Supply.

This pin can be used as RF input or output of attenuator. This pin is dc-coupled to VDD and ac matched to

50 Ω. An external dc blocking capacitor is required. Select the capacitor value for the lowest frequency of

operation.

3, 10

NIC

Not Internally Connected. These pins are not internally connected; however, all data shown herein was

measured when these pins connected to RF/DC ground of evaluation board.

4 to 9

ACG1 to ACG6

AC Grounding Capacitor Pins. These pins can be left no connected when operating above 700 MHz. For

frequencies less than 700 MHz, connect capacitors larger than 100 pF as close to the ACGx pins as

possible. Select the capacitor value for the lowest frequency of operation.

RF2

This pin can be used as RF input or output of attenuator. This pin is dc-coupled to VDD V and ac matched

to 50 Ω. An external dc blocking capacitor is required. Select the capacitor value for the lowest frequency

of operation.

12 to 16

V1 to V5

EPAD

Parallel Control Voltage Inputs. These pins select the required attenuation (see Table 5).

Exposed Pad. The exposed pad must be connected to ground for proper operation.

INTERFACE SCHEMATICS

VDD

RF1,

RF2

1.5kΩ

V1 TO V5

50kΩ

Figure 5. Digital Control Input Interface

Figure 4. RF1, RF2 Interface Schematic

Rev. A | Page 5 of 11

HMC470A

Data Sheet

TYPICAL PERFORMANCE CHARACTERISTICS

INSERTION LOSS, RETURN LOSS, STATE ERROR, STEP ERROR, AND RELATIVE PHASE

–0.5

–1.0

–1.5

–2.0

–2.5

–3.0

+85°C

+25°C

–40°C

–5

–10

–15

–20

–25

–30

–35

0dB

1dB

2dB

4dB

8dB

16dB

31dB

FREQUENCY (GHz)

Figure 6. Insertion Loss vs. Frequency over Temperature

Figure 9. Normalized Attenuation vs. Frequency over Major Attenuation

States

0dB

1dB

2dB

4dB

8dB

16dB

31dB

0dB

1dB

–5

–10

–15

–20

–25

–30

–35

–40

2dB

–5

–10

–15

–20

–25

–30

–35

–40

4dB

8dB

16dB

31dB

FREQUENCY (GHz)

Figure 7. RF1 Return Loss vs. Frequency over Major Attenuation States

Figure 10. RF2 Return Loss vs. Frequency over Major Attenuation States

1.0

2.0

0.1GHz

0dB

0.5GHz

1.0GHz

2.0GHz

3.0GHz

0.8

0.6

1dB

1.5

1.0

2dB

4dB

8dB

16dB

31dB

0.4

0.5

0.2

–0.2

–0.4

–0.6

–0.8

–1.0

–0.5

–1.0

–1.5

–2.0

ATTENUATION STATE (dB)

FREQUENCY (GHz)

Figure 8. State Error vs. Attenuation State over Frequency

Figure 11. State Error vs. Frequency over Major Attenuation States

Rev. A | Page 6 of 11

Data Sheet

HMC470A

1.0

0.8

0dB

1dB

2dB

4dB

8dB

16dB

31dB

0.1GHz

0.5GHz

1.0GHz

2.0GHz

3.0GHz

0.8

0.6

0.4

0.2

–0.2

–0.4

–0.6

–0.8

–1.0

–0.2

–0.4

–0.6

–0.8

–1.0

ATTENUATION STATE (dB)

FREQUENCY (GHz)

Figure 12. Step Error vs. Attenuation State over Frequency

Figure 14. Step Error vs. Frequency over Major Attenuation States

0dB

1dB

2dB

0.1GHz

0.5GHz

1.0GHz

2.0GHz

3.0GHz

4dB

8dB

16dB

31dB

–10

–20

–10

–20

ATTENUATION STATE (dB)

FREQUENCY (GHz)

Figure 15. Relative Phase vs. Frequency over Major Attenuation States

Figure 13. Relative Phase vs. Attenuation State over Frequency

Rev. A | Page 7 of 11

HMC470A

Data Sheet

INPUT POWER COMPRESSION AND THIRD-ORDER INTERCEPT

+85°C

+25°C

–40°C

+85°C

+25°C

–40°C

FREQUENCY (GHz)

Figure 16. Input P0.1dB vs. Frequency at Minimum Attenuation State over

Temperature, V^DD= 5 V

Figure 18. Input P0.1dB vs. Frequency at Minimum Attenuation State over

Temperature, V^DD= 3 V

+85°C

+25°C

–40°C

+85°C

+25°C

–40°C

FREQUENCY (GHz)

Figure 17. Input IP3 vs. Frequency at Minimum Attenuation State over

Temperature, V^DD= 5 V

Figure 19. Input IP3 vs. Frequency at Minimum Attenuation State over

Temperature, V^DD= 3 V

Rev. A | Page 8 of 11

Data Sheet

HMC470A

THEORY OF OPERATION

The HMC470A incorporates a 5-bit attenuator that offers an

attenuation range of 31 dB in 1 dB steps and a driver for

CMOS-/TTL-compatible parallel control of the 5-bit attenuator.

See Table 5 for the truth table.

RF INPUT AND OUTPUT

The HMC470A is bidirectional. The RF1 and RF2 pins are

internally matched to 50 Ω; therefore, they do not require

external matching components. These pins are dc-coupled to

VDD; therefore, dc blocking capacitors are required on RF lines.

Table 5. P4 to P0 Truth Table

Digital Control Input¹

Attenuation

State (dB)

0 dB (reference)

1 dB

2 dB

4 dB

8 dB

16 dB

31 dB

ACGx PINS

The HMC470A is a positive bias GaAs attenuator so it requires

floating capacitors between the attenuator bits and ground. The

HMC470A uses on-chip floating capacitors that are sufficient

for operation at frequencies greater than 700 MHz. The HMC470A

also features the ACGx pins to externally connect larger floating

capacitors. Select the value of external floating capacitors based

on the minimum operating frequency, whereas the ACGx pins

can be left open when operating above 700 MHz.

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

High

Low

¹Any combination of the control voltage input states shown in Table 5

provides an attenuation equal to the sum of the bits selected.

POWER SUPPLY

The HMC470A requires a single supply voltage applied to the

VDD pin, and CMOS/TTL-compatible control voltages applied

to the V1 to V5 pins. The ideal power-up sequence is as follows:

1. Connect the ground reference.

2. Power up VDD and VSS. The relative order is not

important.

3. Apply the digital control inputs. The relative order of the

digital control inputs is not important.

4. Apply an RF input signal to RF1 or RF2.

The power-down sequence is the reverse of the power-up

sequence.

Rev. A | Page 9 of 11

HMC470A

Data Sheet

APPLICATIONS INFORMATION

thru calibration line connects J9 and J10; this transmission line

is used to measure the loss of the PCB over the environmental

conditions being evaluated.

EVALUATION BOARD

The HMC470A uses a 4-layer evaluation board. The copper

thickness is 0.5 oz (0.7 mil) on each layer. The top dielectric

material is 10 mil Rogers RO4350 for optimal high frequency

performance, whereas the middle and bottom dielectric materials

are FR-4 type materials to achieve an overall board thickness of

62 mil. RF and DC traces are routed on the top copper layer.

The bottom and middle layers are grounded planes that provide

a solid ground for the RF transmission lines. The RF transmission

lines are designed using a coplanar waveguide (CPWG) model

with a width of 16 mil and ground spacing of 13 mil to have a

characteristic impedance of 50 Ω. For enhanced RF and thermal

grounding, as many plated through vias as possible are arranged

around transmission lines and under the exposed pad of the

package.

The ACG pins are connected to ground through 330 pF

capacitors.

Figure 21 and Table 6 show the evaluation board schematic and

bill of materials, respectively.

1nF

VDD

RF1

RF2

1nF

Figure 20 shows the top view of the populated HMC470A

Evaluation board, available from Analog Devices, Inc., upon

request (see the Ordering Guide).

HMC470A

NIC

ACG1

ACG6

330pF

1nF

THRU CAL

Figure 21. Evaluation Board Schematic

Table 6. List of Materials for EVAL-HMC470A

Item

J1, J2

J3,

Description

PCB mount, SMA connector

2 × 6-pin header

Figure 20. Populated Evaluation Board -- Top View

J4, J5

C1, C2

C4 to C7

C8, C9

PCB mount, 2.9mm RF connector, do not insert

1 nF capacitor, 0402 package

1 nF capacitor, 0603package

330 pF capacitor, 0402 package

1 nF capacitor, 0402 package, do not insert

HMC470A Digital Attenuator

The evaluation board is grounded from the 2 × 6-pin header, J3.

The supply and digital control pins are also connected to the J3.

A 1 nF decoupling capacitor is placed on the supply trace to

filter high frequency noise.

The RF1 and RF2 ports are connected through 50 Ω transmission

lines to the SMA connectors, J1 and J2, respectively. The RF1

and RF2 ports are ac-coupled with external 330 pF capacitors. A

PCB

106978-4 Evaluation PCB

Rev. A | Page 10 of 11

Data Sheet

HMC470A

OUTLINE DIMENSIONS

DETAIL A

(JEDEC 95)

3.10

3.00 SQ

2.90

0.30

0.25

0.20

PIN 1

INDICATOR

PIN 1

INDIC ATOR AREA OPTIO

(SEE DETAIL A)

0.50

BSC

EXPOSED

PAD

1.95

1.70 SQ

1.50

0.45

0.40

0.35

0.20 MIN

TOP VIEW

BOTTOM VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

0.90

0.85

0.80

0.05 MAX

0.02 NOM

COPLANARITY

0.08

SECTION OF THIS DATA SHEET.

SEATING

PLANE

0.20 REF

COMPLIANT WITH JEDEC STANDARDS MO-220-VEED-4.

Figure 22. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.85 mm Package Height

(HCP-16-1)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Range

MSL

Package

Option

Model¹

Rating²Package Description

Branding³

H470A

XXXX

HMC470ALP3E

−40°C to +85°C MSL3

16-Lead Lead Frame Chip Scale Package [LFCSP]

Evaluation Board

HCP-16-1

HMC470ALP3ETR

EV1HMC470ALP3

−40°C to +85°C MSL3

HCP-16-1

H470A

XXXX

¹All models are RoHS Compliant.

²See the Absolute Maximum Ratings section.

³XXXX is the 4-digit lot number.

registered trademarks are the property of their respective owners.

D14806-0-9/17(A)

Rev. A | Page 11 of 11

HMC470ALP3E相关文章

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HMC470ALP3E产品参数

型号:	HMC470ALP3E
Brand Name：	Analog Devices Inc
是否无铅：	含铅
是否Rohs认证：	符合
生命周期：	Active
包装说明：	LCC16,.12SQ,20
针数：	16
制造商包装代码：	HCP-16-1
Reach Compliance Code：	compliant
风险等级：	1.63
其他特性：	CMOS COMPATIBLE
标称衰减：	31 dB
特性阻抗：	50 Ω
构造：	COMPONENT
最大输入功率 (CW)：	25 dBm
最大插入损耗：	2 dB
JESD-609代码：	e3
安装特点：	SURFACE MOUNT
端子数量：	16
最大工作频率：	3000 MHz
最小工作频率：	100 MHz
最高工作温度：	85 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装等效代码：	LCC16,.12SQ,20
电源：	3/5 V
射频/微波设备类型：	VARIABLE ATTENUATOR
表面贴装：	YES
技术：	GAAS
端子面层：	Tin (Sn)
Base Number Matches：	1

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