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产品型号HMU16GC-45的概述

芯片HMU16GC-45概述 HMU16GC-45是一款高性能的存储芯片,特别适用于各种电子设备,如移动电话、平板电脑及嵌入式系统等。其设计目标是为了满足当今快速发展的信息技术需求,在数据处理和存储领域中发挥至关重要的作用。由于其小巧的体积和高密度的存储能力,HMU16GC-45成为了现代电子产品中不可或缺的组件之一。 该芯片采用先进的NAND闪存技术,具备较高的读写速度和稳定的性能,能够有效支持大数据量的快速存取。这使得HMU16GC-45被广泛应用于数据中心、高性能计算和嵌入式设备等领域。 HMU16GC-45的详细参数 HMU16GC-45的参数涵盖了其电气特性、存储容量、接口类型以及工作温度等关键指标。 - 存储容量:16 GB - 数据传输速率:最大可达400 MB/s - 接口类型:支持SPI和专有并行接口 - 工作电压:3.3 V - 读/写耐久性:支持超过10,000次...

产品型号HMU16GC-45的Datasheet PDF文件预览

HMU16, HMU17  
TM  
Data Sheet  
November 1999  
File Number 2803.4  
16 x 16-Bit CMOS Parallel Multipliers  
Features  
itle  
MU  
,
The HMU16 and HMU17 are high speed, low power CMOS  
16-bit x 16-bit multipliers ideal for fast, real time digital signal  
processing applications.  
• 16 x 16-Bit Parallel Multiplier with Full 32-Bit Product  
• High-Speed (35ns) Clocked Multiply Time  
• Low Power Operation  
U1  
The X and Y operands along with their mode controls (TCX  
and TCY) have 17-bit input registers. The mode controls  
independently specify the operands as either two’s  
complement or unsigned magnitude format, thereby allowing  
mixed mode multiplication operations.  
- I  
- I  
= 500µA Maximum  
= 7.0mA Maximum at 1MHz  
CCSB  
CCOP  
b-  
t
x
• Supports Two’s Complement, Unsigned Magnitude and  
Mixed Mode Multiplication  
• HMU16 is Compatible with the AM29516, LMU16,  
IDT7216 and the CY7C516  
-Bit  
OS  
ral-  
Two 16-bit output registers are provided to hold the most and  
least significant halves of the result (MSP and LSP). For  
asynchronous output, these registers may be made  
transparent through the use of the Feedthrough Control  
(FT).  
• HMU17 is Compatible with the AM29517, LMU17,  
IDT7217 and the CY7C517  
• TTL Compatible Inputs/Outputs  
• Three-State Outputs  
lti-  
ers)  
utho  
)
ey-  
rds  
ter-  
Additional inputs are provided for format adjustment and  
rounding. The Format Adjust control (FA) allows the user to  
select either a left shifted 31-bit product or a full 32-bit  
product, whereas the round control (RND) provides the  
capability of rounding the most significant portion of the  
result.  
Applications  
• Fast Fourier Transform Analysis  
• Digital Filtering  
The HMU16 has independent clocks (CLKX, CLKY, CLKL,  
CLKM) associated with each of these registers to maximize  
throughput and simplify bus interfacing. The HMU17 has  
only a single clock input (CLK), but makes use of three  
register enables (ENX, ENY and ENP). The ENX and ENY  
inputs control the X and Y Input Registers, while ENP  
controls both the MSP and LSP Output Registers. This  
configuration facilitates the use of the HMU17 for  
microprogrammed systems.  
• Graphic Display Systems  
• Image Processing  
rpo-  
ion,  
i-  
n-  
ctor,  
ral-  
• Radar and Sonar  
• Speech Synthesis and Recognition  
Ordering Information  
TEMP.  
PKG.  
NO.  
o
PART NUMBER  
HMU16JC-35  
HMU16JC-45  
HMU16GC-35  
HMU16GC-45  
HMU17JC-35  
HMU17JC-45  
HMU17GC-35  
HMU17GC-45  
RANGE ( C)  
PACKAGE  
68 Ld PLCC  
68 Ld PLCC  
68 Ld CPGA  
68 Ld CPGA  
68 Ld PLCC  
68 Ld PLCC  
68 Ld CPGA  
68 Ld CPGA  
The two halves of the product may be routed to a single  
16-bit three-state output port via a multiplexer, and in  
addition, the LSP is connected to the Y-input port through a  
separate three-state buffer.  
lti-  
er,  
C,  
gi-  
,
P,  
e-  
l
0 to 70  
N68.95  
N68.95  
G68.B  
G68.B  
N68.95  
N68.95  
G68.B  
G68.B  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
nc-  
n,  
0 to 70  
se-  
nd,  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc.  
Copyright © Intersil Americas Inc. 2001, All Rights Reserved  
1
HMU16, HMU17  
Pinouts  
68 LEAD PLCC  
TOP VIEW  
9
8 7 6 5 4 3 2 1 6867666564636261  
NC  
X12  
X11  
X10  
X9  
X8  
X7  
X6  
X5  
X4  
X3  
X2  
X1  
X0  
P15, P31  
P14, P30  
P13, P29  
P12, P28  
P11, P27  
P10, P26  
P9, P25  
P8, P24  
P7, P23  
P6, P22  
P5, P21  
P4, P20  
P3, P19  
P2, P18  
P1, P17  
P0, P16  
NC  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
OEL  
CLKL (CLK)  
CLKY (ENY)  
2728293031323334353637383940414243  
68 LEAD CPGA  
TOP VIEW  
11  
10  
9
N/C  
X13  
X14  
X15  
RND  
TCX  
TCY  
V
GND  
FT  
OEP  
CC  
MSP  
SEL  
CLKX  
(ENX)  
CLKM  
(ENP)  
X11  
X9  
X12  
X10  
X8  
V
GND  
FA  
N/C  
CC  
P30/  
P14  
P31/  
P15  
P28/  
P12  
P29/  
P13  
8
X7  
P26/  
P10  
P27/  
P11  
7
X5  
X6  
P24/  
P8  
P25/  
P9  
6
X3  
X4  
P22/  
P6  
P23/  
P7  
5
X1  
X2  
P20/  
P4  
P21/  
P5  
4
OEL  
X0  
CLKY CLKL  
(ENY) (CLK)  
P18/  
P2  
P19/  
P3  
3
Y10/ Y12/  
Y14/  
P14  
P16/  
P0  
P17/  
P1  
2
N/C  
Y0/P0 Y2/P2 Y4/P4 Y6/P6 Y8/P8  
Y1/P1 Y3/P3 Y5/P5 Y7/P7 Y9/P9  
P10  
P12  
Y11/  
P11  
Y13/  
P13  
Y15/  
P15  
1
N/C  
K
A
B
C
D
E
F
G
H
J
L
2
HMU16, HMU17  
Functional Block Diagrams  
HMU16  
X0 - 15 TCX  
RND  
TCY Y0 - 15/PO - 15  
REGISTER  
REGISTER  
REGISTER  
OEL  
CLKX  
CLKY  
MULTIPLIER ARRAY  
FA  
FT  
FORMAT ADJUST  
MSP  
LSP  
RESISTER  
RESISTER  
CLKM  
CLKL  
MSPSEL  
OEP  
MULTIPLEXER  
P16 - 31/PO - 15  
HMU17  
RND  
X0 - 15 TCX TCX  
REGISTER  
TCY Y0 - 15/PO - 15  
REGISTER  
REGISTER  
OEL  
CLK  
ENX  
ENY  
MULTIPLIER ARRAY  
FA  
FT  
FORMAT ADJUST  
MSP  
LSP  
RESISTER  
RESISTER  
ENP  
MSPSEL  
MULTIPLEXER  
OEP  
P16 - 31/PO - 15  
3
HMU16, HMU17  
Pin Description  
PLCC PIN  
SYMBOL  
NUMBER  
TYPE  
DESCRIPTION  
. The +5V power supply pins. A 0.1µF capacitor between the V  
V
1, 68  
V
and GND pins is  
CC  
CC  
CC  
recommended.  
GND  
2, 3  
GND. The device ground.  
X0-X15  
47-59, 61-63  
I
X-Input Data. These 16 data inputs provide the multiplicand which may be in two's complement  
or unsigned magnitude format.  
Y0-Y15/  
P0-P15  
27-42  
I/O  
Y-Input/LSP Output Data. This 16-bit port is used to provide the multiplier which may be in two's  
complement or unsigned magnitude format. It may also be used for output of the Least Significant  
Product (LSP).  
P16-P31/  
P0-P15  
10-25  
O
I
Output Data. This 16-bit port may provide either the MSP (P16-31) or the LSP (P0-15).  
TCY, TCX  
66, 67  
Two's Complement Control. Input data is interpreted as two's complement when this control is  
HIGH. A LOW indicates the data is to be interpreted as unsigned magnitude format.  
FT  
FA  
5
6
I
Feed through Control. When this control is HIGH, both the MSP and LSP Registers are  
transparent. When LOW, the registers are latched by their associated clock signals.  
I
Format Adjust Control. A full 32-bit product is selected when this control line is HIGH. A LOW on  
this control line selects a left shifted 31-bit product with the sign bit replicated in the LSP. This  
control is normally HIGH, except for certain two's complement integer and fractional  
applications.  
RND  
MSPSEL  
OEL  
65  
4
I
I
I
I
Round Control. When this control is HIGH, a one is added to the Most Significant Bit (MSB) of the  
LSP. This position is dependent on the FA control; FA = HIGH indicates RND adds to the 2-15 bit  
-16  
(P15), and FA = LOW indicates RND adds to the 2  
bit (P14).  
Output Multiplexer Control. When this control is LOW, the MSP is available for output at the  
dedicated output port, and the LSP is available at the Y-input/LSP output port. When MSPSEL is  
HIGH, the LSP is available at both ports and the MSP is not available for output.  
46  
7
Y-In/P0-15 Output Port Three-State Control. When OEL is HIGH, the output drivers are in the high  
impedance state. This state is required for Ydata input. When OEL is LOW, the port is enabled for  
LSP output.  
OEP  
P16-31/P0-15 Output Port Three-State Control. A LOW on this control line enables the output  
port. When OEP is HIGH, the output drivers are in the high impedance state.  
THE FOLLOWING PIN DESCRIPTIONS APPLY TO THE HMU16 ONLY  
CLKX  
64  
I
X-Register Clock. The rising edge of this clock loads the X-data Input Register along with the TCX  
and RND Registers.  
CLKY  
44  
I
Y-Register Clock. The rising edge of this clock loads the Y-data Input Register along with the TCY  
and RND Registers.  
CLKM  
CLKL  
8
I
I
MSP Register Clock. The rising edge of CLKM loads the Most Significant Product (MSP) Register.  
LSP Register Clock. The rising edge of CLKL loads the Least Significant Product (LSP) Register.  
45  
THE FOLLOWING PIN DESCRIPTIONS APPLY TO THE HMU17 ONLY  
CLK  
ENX  
45  
64  
I
I
Clock. The rising edge of this clock will load all enabled registers.  
X-Register Enable. When ENX is LOW, the X-register is enabled; X-input data and TCX will be  
latched at the rising edge of CLK. When ENX is high, the X-register is in a hold mode.  
ENY  
ENP  
44  
8
I
I
Y-Register Enable. ENY enables the Y-register. (See ENX).  
Product Register Enable. ENP enables the Product Register. Both the MSP and LSP  
Sections are enabled by ENP. (See ENX).  
4
HMU16, HMU17  
Functional Description  
The HMU16/HMU17 are high speed 16 x 16-bit multipliers  
designed to perform very fast multiplication of two 16-bit  
binary numbers. The two 16-bit operands (X and Y) may be  
independently specified as either two's complement or  
unsigned magnitude format by the two's complement  
controls (TCX and TCY). When either of these control lines  
is LOW, the respective operand is treated as an unsigned  
16-bit value; and when it is HIGH, the operand is treated as  
a signed value represented in two's complement format. The  
operands along with their respective controls are latched at  
the rising edge of the associated clock signal. The HMU16  
accomplishes this through the use of independent clock  
inputs for each of the Input Registers (CLKX and CLKY),  
while the HMU17 utilizes a single clock signal (CLK) along  
with the X and Y register enable inputs (ENX and ENY).  
The HMU16/HMU17 multipliers are equipped with two 16-bit  
Output Registers (MSP and LSP) which are provided to hold  
the most and least significant portions of the resultant  
product respectively. The HMU16 uses independent clocks  
(CLKM and CLKL) for latching the two output registers, while  
the HMU17 uses a single clock input (CLK) along with the  
Product Latch Enable (ENP). The MSP and LSP Registers  
may also be made transparent for asynchronous output  
through the use of the Feed through Control (FT). There are  
two output configurations which may be selected when using  
the HMU16/HMU17 multipliers. The first configuration allows  
the simultaneous access of the most and least significant  
halves of the product. When the MSPSEL input is LOW, the  
Most Significant Product will be available at the dedicated  
output port (P16-31/P0-15). The Least Significant Product is  
simultaneously available at the bidirectional port shared with  
the Y-inputs (Y0-15/P0-15) through the use of the LSP  
output enable (OEL). The other output configuration involves  
multiplexing the MSP and LSP Registers onto the dedicated  
output port through the use of the MSPSEL control. When  
the MSPSEL control is LOW, the Most Significant Product  
will be available at the dedicated output port; and when  
MSPSEL is HIGH, the Least Significant Product will be  
available at this port. This configuration allows access of the  
entire 32-bit product by a 16-bit wide system bus.  
Input controls are also provided for rounding and format  
adjustment of the 32-bit product. The Round input (RND) is  
provided to accommodate rounding of the most significant  
portion of the product by adding one to the Most Significant  
Bit (MSB) of the LSP Register. The position of the MSB is  
dependent on the state of the Format Adjust Control (see Pin  
Descriptions and Multiplier Input/Output Format Tables). The  
Round input is latched into the RND Register whenever  
either of the input registers is clocked. The Format Adjust  
control (FA) allows the product output to be formatted. When  
the FA control is HIGH, a full 32-bit product is output; and  
when FA is LOW, a left-shifted 31-bit product is output with  
the sign bit replicated in bit position 15 of the LSP. The FA  
control must be HIGH for unsigned magnitude, and mixed  
mode multiplication operations. It may be LOW for certain  
two's complement integer and fractional operations only (see  
Multiplier Input/ Output Formats Table).  
5
HMU16, HMU17  
6
HMU16, HMU17  
7
HMU16, HMU17  
8
HMU16, HMU17  
Absolute Maximum Ratings  
Thermal Information  
o
o
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V  
Input, Output or I/O Voltage Applied . . . . . GND 0.5V to V +0.5V  
Storage Temperature Range . . . . . . . . . . . . . . . . . . . 65 C to 150 C  
Thermal Resistance (Typical, Note 1)  
θ
( C/W)  
θ
( C/W)  
JA  
JC  
CC  
PLCC . . . . . . . . . . . . . . . . . . . . . . . . . .  
CPGA . . . . . . . . . . . . . . . . . . . . . . . . . .  
Maximum Package Power Dissipation at 70 C  
43.2  
42.69  
15.1  
10.0  
o
o
o
PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.7W  
CPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.46  
Maximum Junction Temperature  
Operating Conditions  
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.75V to +5.25V  
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C  
o
o
o
PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150 C  
o
o
CPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175 C  
Maximum Lead Temperature (Soldering, 10s). . . . . . . . . . . . .300 C  
Die Characteristics  
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4500 Gates  
CAUTION: Stresses above those listed in the ``Absolute Maximum Ratings'' may cause permanent damage to the device. This is a stress only rating, and operation at  
these or any other conditions above those indicated in the operations sections of this specification is not implied.  
NOTE:  
1. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
o
o
DC Electrical Specifications  
PARAMETER  
V
= 5.0V 5%, T = 0 C to 70 C  
CC A  
SYMBOL  
TEST CONDITIONS  
MIN  
2.0  
-
MAX  
-
UNITS  
V
Logical One Input Voltage  
Logical Zero Input Voltage  
Output High Voltage  
V
V
V
= 5.25V  
= 4.75V  
IH  
CC  
V
0.8  
-
V
IL  
CC  
V
I
I
= 400mA, V  
CC  
= 4.75V  
= 4.75V  
2.6  
-
V
OH  
OH  
Output Low Voltage  
V
= +4.0mA, V  
0.4  
10  
10  
500  
V
OL  
OL  
CC  
Input Leakage Current  
I
V = V  
or GND, V = 5.25V  
CC  
10  
10  
-
µA  
µA  
µA  
I
I
CC  
Output or I/O Leakage Current  
Standby Power Supply Current  
I
V
= V  
or GND, V  
= 5.25V  
CC  
O
O
CC  
I
V = V  
or GND, V  
= 5.25V  
CCSB  
I
CC  
CC  
Outputs Open  
Operating Power Supply Current  
NOTE:  
I
V = V or GND, V  
f = 1MHz (Note 2)  
= 5.25V  
-
7.0  
mA  
CCOP  
I
CC  
CC  
2. Operating Supply Current is proportional to frequency, Typical rating is 5mA/MHz.  
o
Capacitance T = 25 C, Note 3  
A
PARAMETER  
Input Capacitance  
SYMBOL  
TEST CONDITIONS  
TYPICAL  
UNITS  
C
Frequency = 1MHz. All measurements  
referenced to device ground.  
15  
10  
10  
pF  
pF  
pF  
IN  
Output Capacitance  
I/O Capacitance  
NOTE:  
C
OUT  
C
I/O  
3. Not tested, but characterized at initial design and at major process/design changes.  
9
HMU16, HMU17  
o
o
AC Electrical Specifications  
V
= 5.0V 5%, T = 0 C to 70 C, Note 6  
CC A  
HMU16/HMU17-35  
HMU16/HMU17-45  
TEST  
PARAMETER  
Unclocked Multiply Time  
Clocked Multiply Time  
X, Y, RND Setup Time  
X, Y, RND Hold Time  
Clock Pulse Width High  
Clock Pulse Width Low  
MSPSEL to Product Out  
Output Clock to P  
SYMBOL  
CONDITIONS  
MIN  
MAX  
55  
35  
-
MIN  
MAX  
70  
45  
-
UNITS  
ns  
t
-
-
-
-
MUC  
t
ns  
MC  
t
15  
2
18  
2
ns  
S
t
-
-
ns  
H
t
10  
10  
-
-
15  
15  
-
-
ns  
PWH  
t
-
-
ns  
PWL  
t
22  
22  
22  
22  
22  
-
25  
25  
25  
25  
25  
-
ns  
PDSEL  
t
t
t
-
-
ns  
PDP  
PDY  
ENA  
Output Clock to Y  
-
-
ns  
Three-State Enable Time  
Three-State Disable Time  
Note 4  
-
-
ns  
t
-
-
ns  
DIS  
Clock Enable Setup Time  
(HMU17 Only)  
t
15  
15  
ns  
SE  
Clock Enable Hold Time  
(HMU17 Only)  
t
2
0
-
-
2
0
-
-
ns  
ns  
HE  
Clock Low Hold Time CLKXY  
Relative to CLKML  
t
Note 5  
HCL  
(HMU16 Only)  
Output Rise Time  
Output Fall Time  
NOTES:  
t
From 0.8V to 2.0V  
From 2.0V to 0.8V  
-
-
8
8
-
-
8
8
ns  
ns  
r
t
f
4. Transition is measured at 200mV from steady state voltage with loading specified in AC Test Circuit, V = 1.5V, R = 500Ω  
1
1
and C = 40pF.  
1
5. To ensure the correct product is entered in the output registers, new data may not be entered into the input registers before the output registers  
have been clocked.  
6. Refer to AC Test Circuit, with V = 2.4V, R = 500and C = 40pF.  
1
1
1
AC Test Circuit  
AC Testing Input, Output Waveforms  
V
1
R
1
V
V
0.3V  
OH  
1.5V  
1.5V  
DUT  
0V  
OL  
C
(SEE NOTE)  
1
NOTE: Includes Stray and Jig Capacitance.  
NOTE: AC Testing: All parameters tested as per test circuit. Input  
rise and fall times are driven at 1ns/V.  
10  
HMU16, HMU17  
Timing Diagrams  
THREE  
STATE  
CONTROL  
3.0V  
1.5V  
0V  
1.5V  
DATA  
INPUT  
t
t
ENA  
DIS  
t
t
H
S
3.0V  
1.5V  
0V  
CLOCK  
INPUT  
OUTPUT  
THREE  
STATE  
HIGH IMPEDANCE  
1.7V  
1.3V  
FIGURE 7. SETUP AND HOLD TIME  
FIGURE 8. THREE-STATE CONTROL  
t
PWH  
t
t
HCL  
PWH  
CLK  
CLKX  
CLKY  
t
PWL  
t
H
t
t
HE  
SE  
ENX  
ENY  
t
t
PWL  
S
INPUT  
XI YI  
t
t
H
S
RND  
INPUT  
XI YI  
RND  
t
MC  
CLKM  
CLKL  
t
t
HE  
SE  
t
PDY  
ENP  
OUTPUT Y  
MSPSEL  
OUTPUT Y  
t
t
PDY  
MC  
t
PDSEL  
t
PDSEL  
MSPSEL  
t
PDP  
t
PDP  
OUTPUT P  
OUTPUT P  
t
MUC  
t
MUC  
FIGURE 9. HMU16 TIMING DIAGRAM  
FIGURE 10. HMU17 TIMING DIAGRAM  
11  
HMU16, HMU17  
Ceramic Pin Grid Array Packages (CPGA)  
G68.B MIL-STD-1835 CMGA3-P68D (P-AC)  
68 LEAD CERAMIC PIN GRID ARRAY PACKAGE  
–A–  
D
S1  
INCHES  
MIN  
MILLIMETERS  
D1  
SYMBOL  
MAX  
0.345  
0.145  
0.0215  
0.020  
0.058  
0.080  
1.180  
MIN  
5.46  
1.78  
0.41  
0.41  
1.07  
-
MAX  
8.76  
3.68  
NOTES  
A
A1  
b
0.215  
0.070  
0.016  
0.016  
0.042  
-
-
3
8
-
0.55  
b1  
b2  
C
0.51  
–B–  
1.47  
4
-
S
2.03  
D
1.140  
28.96  
29.97  
-
E1  
E
D1  
E
1.000 BSC  
25.4 BSC  
-
1.140  
1.180  
28.96  
29.97  
-
E1  
e
1.000 BSC  
25.4 BSC  
-
0.100 BSC  
0.008 REF  
2.54 BSC  
0.20 REF  
6
-
k
L
0.120  
0.140  
0.060  
3.05  
3.56  
1.52  
-
Q1  
S
0.025  
0.003  
-
0.64  
0.08  
-
5
10  
-
C
S
0.000 BSC  
0.00 BSC  
INDEX CORNER  
SEE NOTE 9  
b1  
S1  
M
N
-
-
11  
11  
1
2
SEE  
NOTE 7  
121  
121  
Rev. 0 6/20/95  
b
SECTION B-B  
A
0.008  
C
NOTES:  
SEATING PLANE  
AT STANDOFF  
1. “M” represents the maximum pin matrix size.  
–C–  
2. “N” represents the maximum allowable number of pins. Number  
of pins and location of pins within the matrix is shown on the  
pinout listing in this data sheet.  
B
B
k
A1  
3. Dimension “A1” includes the package body and Lid for both cav-  
ity-up and cavity-down configurations. This package is cavity  
down. Dimension “A1” does not include heatsinks or other  
attached features.  
L
b2  
e
4. Standoffs are required and shall be located on the pin matrix di-  
agonals. The seating plane is defined by the standoffs at dimen-  
sion “Q1”.  
5. Dimension “Q1” applies to cavity-down configurations only.  
6. All pins shall be on the 0.100 inch grid.  
Q
7. Datum C is the plane of pin to package interface for both cavity  
up and down configurations.  
SECTION A-A  
b
8. Pin diameter includes solder dip or custom finishes. Pin tips shall  
have a radius or chamfer.  
M
M
M
M
B
Ø0.030  
Ø0.010  
C
C
A
A
A
9. Corner shape (chamfer, notch, radius, etc.) may vary from that  
shown on the drawing. The index corner shall be clearly unique.  
10. Dimension “S” is measured with respect to datums A and B.  
11. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
12. Controlling dimension: INCH.  
L
A1  
Q
12  
HMU16, HMU17  
Plastic Leaded Chip Carrier Packages (PLCC)  
0.042 (1.07)  
0.048 (1.22)  
N68.95 (JEDEC MS-018AE ISSUE A)  
0.042 (1.07)  
0.056 (1.42)  
0.004 (0.10)  
C
68 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE  
PIN (1) IDENTIFIER  
0.025 (0.64)  
0.045 (1.14)  
0.050 (1.27) TP  
INCHES  
MILLIMETERS  
R
C
L
SYMBOL  
MIN  
MAX  
MIN  
4.20  
MAX  
4.57  
NOTES  
A
A1  
D
0.165  
0.090  
0.985  
0.950  
0.441  
0.985  
0.950  
0.441  
0.180  
0.120  
0.995  
0.958  
0.469  
0.995  
0.958  
0.469  
-
2.29  
3.04  
-
-
D2/E2  
D2/E2  
25.02  
24.13  
11.21  
25.02  
24.13  
11.21  
25.27  
24.33  
11.91  
25.27  
24.33  
11.91  
C
L
D1  
D2  
E
3
E1 E  
4, 5  
-
VIEW “A”  
E1  
E2  
N
3
4, 5  
6
0.020 (0.51)  
MIN  
68  
68  
A1  
D1  
D
Rev. 2 11/97  
A
SEATING  
PLANE  
0.020 (0.51) MAX  
3 PLCS  
-C-  
0.026 (0.66)  
0.032 (0.81)  
0.013 (0.33)  
0.021 (0.53)  
0.025 (0.64)  
MIN  
0.045 (1.14)  
MIN  
VIEW “A” TYP.  
NOTES:  
1. Controlling dimension: INCH. Converted millimeter dimensions are  
not necessarily exact.  
2. Dimensions and tolerancing per ANSI Y14.5M-1982.  
3. Dimensions D1 and E1 do not include mold protrusions. Allowable  
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1  
and E1 include mold mismatch and are measured at the extreme  
material condition at the body parting line.  
-C-  
4. To be measured at seating plane  
contact point.  
5. Centerline to be determined where center leads exit plastic body.  
6. “N” is the number of terminal positions.  
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.  
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-  
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No  
license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site www.intersil.com  
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