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  • HR9306AT3图
  • 深圳市芯达科技有限公司

     该会员已使用本站9年以上
  • HR9306AT3
  • 数量1680 
  • 厂家EMCT 
  • 封装SMD 
  • 批号2018+ 
  • 一级代理原装进口现货
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  • HR9306AT3图
  • 北京中其伟业科技有限公司

     该会员已使用本站16年以上
  • HR9306AT3
  • 数量10261 
  • 厂家√ 欧美㊣品 
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  • 批号16+ 
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产品型号HR9395-08A的Datasheet PDF文件预览

Preliminary  
HR9395-08A  
GaN Hybrid Power Amplifier  
Product Features  
Applications  
• GaN on SiC HEMT  
• In/Out Impedance Matching  
• Surface Mount Hybrid Type  
• Compact Size & Weight  
• High Efficiency  
• Marine Radar System  
Weather Radar System  
Turn on : Turn on the Gate Voltage supply and last turn On the Drain voltage supplies  
Turn off : Turn off the Drain Voltage and last turn off the Gate voltage  
Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com  
All specifications may change without notice  
Version 0.1  
US Facility : 919-677-8780 / sales@rfhicusa.com  
1 / 6  
Preliminary  
HR9395-08A  
GaN Hybrid Power Amplifier  
Mechanical Specifications  
PARAMETER  
Mass  
UNIT  
g
TYP  
2
REMARK  
-
-
Dimension  
mm  
10 x 15 x 5.4  
Circuit  
Circuit  
Input  
Output  
- VGS  
+ VDS  
Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com  
US Facility : 919-677-8780 / sales@rfhicusa.com  
All specifications may change without notice  
Version 0.1  
2 / 6  
Preliminary  
HR9395-08A  
GaN Hybrid Power Amplifier  
Application Circuit  
Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com  
US Facility : 919-677-8780 / sales@rfhicusa.com  
All specifications may change without notice  
Version 0.1  
3 / 6  
Preliminary  
HR9395-08A  
GaN Hybrid Power Amplifier  
Package Dimensions (Type: NP-18)  
* Unit: mm[inch] | Tolerance: ±0.15[.006]  
* Mounting Configuration Notes  
1. For the proper performance of the device, Ground / Thermal via holes must be designed to remove heat.  
2. To properly use heat sink, ensure the ground/thermal via hole region to contact the heat sink. We recommend the mounting screws be added near the  
heat sink to mount the board.  
3. In designing the necessary RF trace, width will depend upon the PCB material and construction.  
4. Use 1 oz. Copper minimum thickness for the heat sink.  
5. Do not put solder mask on the backside of the PCB in the region where the board contacts the heat sink.  
6. We recommend adding as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.  
Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com  
US Facility : 919-677-8780 / sales@rfhicusa.com  
All specifications may change without notice  
Version 0.1  
4 / 6  
Preliminary  
HR9395-08A  
GaN Hybrid Power Amplifier  
Precautions  
This product is a Gallium Nitride Transistor.  
The Gallium Nitride Transistor requires a Negative Voltage Bias which operates alongside a Positive Voltage Bias. These Biases are  
applied in accordance to the Sequence during Turn-On and Turn-Off.  
The Pallet Amplifier does not have a built-in Bias Sequence Circuit. Therefore, users need to either apply positive voltages and  
negative voltages in the required sequence, or add an external Bias Circuit to this Amplifier.  
Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com  
US Facility : 919-677-8780 / sales@rfhicusa.com  
All specifications may change without notice  
Version 0.1  
5 / 6  
Preliminary  
HR9395-08A  
GaN Hybrid Power Amplifier  
Reflow Profile  
* Reflow oven settings  
Zone  
A
B
C
D
E
F
Temperature(°C)  
Belt speed  
30 ~ 150 ℃  
55 ~ 115 sec  
150 ~ 180 180 ~ 220 220 ~ 220 235 ~ 240 2 ~ 6 / Sec Drop  
55 ~ 75 sec  
30 ~ 50 sec  
30 ~ 50 sec  
5 ~ 10 sec  
60 ~ 90 sec  
RFHIC Corporation reserves the right to make changes to any products herein or to discontinue any product at any time without notice. While product specifications have been thoroughly  
examined for reliability, RFHIC Corporation strongly recommends buyers to verify that the information they are using is accurate before ordering. RFHIC Corporation does not assume  
any liability for the suitability of its products for any particular purpose, and disclaims any and all liability, including without limitation consequential or incidental damages.  
RFHIC products are not intended for use in life support equipment or application where malfunction of the product can be expected to result in personal injury or death. Buyer uses or  
sells such products for any such unintended or unauthorized application, buyer shall indemnify, protect and hold RFHIC Corporation and its directors, officers, stockholders, employees,  
representatives and distributors harmless against any and all claims arising out of such unauthorized use.  
Sales, inquiries and support should be directed to the local authorized geographic distributor for RFHIC Corporation. For customers in the US, please contact the US Sales Team at 919-  
677-8780. For all other inquiries, please contact the International Sales Team at 82-31-8069-3036.  
Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com  
US Facility : 919-677-8780 / sales@rfhicusa.com  
All specifications may change without notice  
Version 0.1  
6 / 6  
配单直通车
HR9306AT3产品参数
型号:HR9306AT3
是否无铅: 含铅
是否Rohs认证: 不符合
生命周期:Transferred
IHS 制造商:EMC TECHNOLOGY & FLORIDA RF LABS
Reach Compliance Code:compliant
风险等级:5.77
其他特性:I/P POWER-MAX(PEAK)=50W
标称衰减:6 dB
特性阻抗:50 Ω
构造:COMPONENT
最大输入功率 (CW):33.01 dBm
JESD-609代码:e4
最大工作频率:12400 MHz
最小工作频率:
最高工作温度:150 °C
最低工作温度:-55 °C
射频/微波设备类型:FIXED ATTENUATOR
端子面层:Gold (Au) - with Nickel (Ni) barrier
最大电压驻波比:1.5
Base Number Matches:1
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