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产品型号HSMG-C170的概述

芯片HSMG-C170的概述 HSMG-C170是一种高性能的集成电路，广泛应用于各类现代电子设备中。它的设计目标是提供高效的信号处理能力、低功耗和可靠性，适用于通信、音频处理、图像处理等多个领域。HSMG-C170凭借其强大的功能特性和相对低廉的成本，正在逐步成为市场上备受青睐的芯片之一。芯片HSMG-C170的详细参数 HSMG-C170的详细技术参数为用户的设计提供了重要参考。这些参数主要包括： 1. 电源电压：通常在3.3V到5V之间，即使在负载变化较大的情况下，依然能够稳定工作。 2. 工作温度范围：芯片能够在-40℃到85℃的环境温度下正常运行，这使得它在极端条件下的可靠性显著提高。 3. 引脚数：HSMG-C170拥有多达32个引脚，使其能够满足复杂的外围设备连接需求。这些引脚支持多种通信接口协议，保证与其他设备的良好兼容性。 4. 处理速度：其处理能力可达到100 M...

产品型号HSMG-C170的Datasheet PDF文件预览

Surface Mount Chip LEDs

Technical Data

HSMx-C110/C120/C150/

C170/C177/C190/C191/

C197/C265

Features

• Small Size

• Industry Standard Footprint

• Compatible with IR Solder

• Diffused Optics

Description

These chip LEDs are designed

in an industry standard package

for ease of handling and use.

Various different LED colors are

available in nine compact, single

color packages.

• Operating Temperature

Range of -30°C to +85°C

• Right Angle & Reverse

Mount Package Available

• Various Colors Available

• Available in 8 mm Tape on

7 in. (178 mm) Diameter

Reels

The HSMx-C150 has the industry

standard 3.2 x 1.6 mm footprint

that is excellent for all around use.

The HSMx-C170 has the widely

used 2.0 x 1.25 mm footprint with

0.8 mm profile. The HSMx-C177

has the widely used 2.0 x 1.25 mm

footprint with 0.4 mm profile. The

HSMx-C19x series has the industry

standard 1.6 x 0.8 mm footprint

with varying profile to suit

designers needs, the HSMx-C190

has 0.8 mm profile, the HSMx-

C191 has a low profile of 0.6 mm,

and the HSMx-C197 has the ultra

low profile of 0.4 mm. This family

with its thin profile and wide

viewing angle makes this LED

exceptional for backlighting

mount package with dimensions

of 3.4 x 1.25 x 1.1 mm. These

devices are ideal for LCD

backlighting and sidelighting

applications.

Applications

• Keypad Backlighting

• Push-Button Backlighting

• LCD Backlighting

• Symbol Backlighting

• Front Panel Indicator

In order to facilitate pick and

place operation, these chip LEDs

are shipped in tape and reel with

4000 units per reel for HSMx-

C120, C170, C177, C190, C191,

C197 packages, and 3000 units

per reel for HSMx-C110, C150,

C265 packages.

applications.

All packages are compatible with

IR reflow solder processes. The

small size and wide viewing angle

make these LEDs prime choices

for backlighting applications and

front panel illumination especially

where space is a premium.

The HSMx-C110 is a right angle

package with the universally

accepted dimensions of 3.2 x 1.0

x 1.5 mm. The HSMx-C120 is a

smaller right angle package with

industry standard 1.6 x 0.6 x 1.0

mm. HSMx-C265 is a reverse

Device Selectiion Guide

GaP

Green

HER

Orange

HSMD-C110

HSMD-C120

HSMD-C150

HSMD-C170

HSMD-C177

HSMD-C190

HSMD-C191

HSMD-C197

–

Yellow

Description

Untinted, Non-Diffused

Untinted, Diffused

Untinted, Non-Diffused

HSMG-C110

HSMG-C120

HSMG-C150

HSMG-C170

HSMG-C177

HSMG-C190

HSMG-C191

HSMG-C197

HSMG-C265

HSMS-C110

HSMS-C120

HSMS-C150

HSMS-C170

HSMS-C177

HSMS-C190

HSMS-C191

HSMS-C197

–

HSMY-C110

–

HSMY-C150

HSMY-C170

–

HSMY-C190

HSMY-C191

HSMY-C197

–

As AlGaAs

Red

Description

HSMH-C110

HSMH-C120

HSMH-C150

HSMH-C170

HSMH-C190

HSMH-C191

HSMH-C265

Untinted, Non-Diffused

Untinted, Diffused

Untinted, Non-Diffused

Package Dimensions

CATHODE (ANODE MARK FOR

MARK

HSMH-C170)

(ANODE MARK FOR

HSMH-C150)

CATHODE

MARK

LED DIE

1.25 (0.049)

1.6 (0.063)

0.8 (0.031)

0.62 (0.024)

2.0 (0.079 )

3.2 (0.126 )

[3]

POLARITY

1.4

(0.055)

DIFFUSED

2.0 (0.079)

POLARITY

DIFFUSED

EPOXY

0.6 (0.024)

0.3 (0.012)

1.1 (0.043)

PC BOARD

0.8 (0.031)

0.3 (0.012)

CATHODE LINE

0.5 (0.020)

0.50 ± 0.2

CATHODE LINE

0.50 ± 0.2

(0.020 ± 0.008)

0.4 ± 0.15

(0.016 ± 0.006)

0.4 ± 0.15

(0.016 ± 0.006)

(0.020 ± 0.008)

SOLDERING

TERMINAL

SOLDERING

TERMINAL

HSMx-C150

HSMx-C170

CATHODE (ANODE MARK

LINE FOR HSMH-C110)

CATHODE (ANODE MARK FOR

MARK

HSMH-C190)

LED DIE

1.0 (0.039)

0.8 (0.031)

0.4 (0.016)

2.6 (0.102 )

3.2 (0.126 )

1.6

(0.063 )

POLARITY

CLEAR

EPOXY

1.0

(0.039)

[3]

POLARITY

0.3 (0.012)

1.5 (0.059)

DIFFUSED EPOXY

PC BOARD

0.5 (0.020)

1.6 (0.063 )

0.8 (0.031)

0.3 (0.012)

3.2 (0.126 )

CATHODE LINE

0.3 ± 0.15

(0.012 ± 0.006)

0.3 ± 0.15

(0.012 ± 0.006)

0.8 (0.031)

CATHODE LINE

1.0 (0.039)

0.7 (0.028) MIN.

SOLDERING

TERMINAL

SOLDERING

TERMINAL

HSMx-C190

HSMx-C110

Notes:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.

3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.

CATHODE MARK

CATHODE

MARK

LED DIE

0.8 (0.031)

0.4 (0.016)

1.25

(0.049)

1.6

(0.063 )

0.62

(0.025)

2.00 (0.079)

1.0

(0.039)

POLARITY

DIFFUSED EPOXY

0.40 (0.016)

0.3 (0.012)

DIFFUSED EPOXY

PC BOARD

0.16 (0.006)

0.8 (0.031)

0.26 (0.010)

CATHODE LINE

0.3 ± 0.15

(0.012 ± 0.006)

0.3 ± 0.15

(0.012 ± 0.006)

0.40 ± 0.15

(0.016 ± 0.006)

0.40 ± 0.15

(0.016 ± 0.006)

0.7 (0.028) MIN.

1.10 (0.043) MIN.

SOLDERING

TERMINAL

SOLDERING

TERMINAL

HSMx-C177

HSMx-C191

3.4 (0.134)

CATHODE

CATHODE MARK

LED DIE

MARK (ETCHED)

[ANODE MARK FOR HSMH-C265]

LED DIE

1.25 (0.049)

0.80

(0.031)

0.40 (0.016)

GREEN SOLDER MASK

1.60

(0.063)

POLARITY

1.2

(0.047)

UNDIFFUSED

EPOXY

POLARITY

DIFFUSED

EPOXY

1.1 (0.043)

0.40 (0.016)

PC BOARD

0.16 (0.006)

0.3 (0.012)

CATHODE LINE

0.50 ± 0.15

(0.020 ± 0.006)

0.50 ± 0.15

(0.020 ± 0.006)

0.30 ± 0.15

(0.012 ± 0.006)

0.70 (0.028) MIN.

SOLDERING

TERMINAL

SOLDERING

TERMINAL

HSMx-C265

HSMx-C197

Notes:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.

3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.

CATHODE MARK

(ANODE MARK FOR HSMH-C120)

LED DIE

0.3 (0.012)

0.6 (0.024)

1.6 (0.063)

POLARITY

1.2 (0.047)

CLEAR EPOXY

PC BOARD

1.0 (0.039)

0.4 (0.016)

3 – 0.3 (0.012)

CATHODE LINE

SOLDERING

TERMINAL

HSMx-C120

Notes:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.

3. Polarity for HSMH-C1x0 will be the opposite of what is shown on above drawings.

Absolute Maximum Ratings for GaP at T_A=25°C

Parameter

C110/150/265

C120/170/177/190/191/197

Units

°C

DC Forward Current^[1]

Peak Pulsing Current^[2]

Power Dissipation

100

Reverse Voltage (I_R=100 µA)

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

Soldering Temperature

-30 to +85

-40 to +85

-30 to +85

-40 to +85

See reflow soldering profile (Figure 9 & 10)

Absolute Maximum Ratings for AlGaAs at T_A=25°C

Parameter

C110/150

C120/170/177/190/191/197/265

Units

°C

DC Forward Current^[1]

Peak Pulsing Current^[2]

Power Dissipation

100

Reverse Voltage (I_R=100µA)

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

Soldering Temperature

-30 to +85

-40 to +85

-30 to +85

-40 to +85

See reflow soldering profile (Figure 9 & 10)

Notes:

1. Derate linearly as shown in Figure 4 for temperature above 25°C.

2. Pulse condition of 1/10 duty and 0.1 msec. width.

Electrical Characteristics at T_A=25°C

Reverse

Forward Voltage Breakdown

V_F(Volts) V_R(Volts)

Capacitance

C(pF),

Thermal

Part Number

Color

@ V_F= 0 V, Resistance

@ I_F= 20 mA @ I_R= 100 µA f = 1 MHz Rθ_J-P(°C/W)

Typ.

Max.

Min.

Typ.

HSMS-C110/150

HER

2.1

2.6

400

350

250

HSMS-C120

HSMS-C170/177/190/191/197

HSMD-C110/150

Orange

2.2

2.6

400

350

250

HSMD-C120

HSMD-C170/177/190/191/197

HSMY-C110/150

Yellow

Green

2.1

2.2

2.6

400

250

400

350

250

HSMY-C170/190/191/197

HSMG-C110/150

HSMG-C120

HSMG-C170/177/190191/197/265

HSMH-C110/150

HSMH-C120

HSMH-C170/190/191/265

AlGaAs

1.8

2.6

460

400

300

Optical Characteristics at T_A=25°C

Luminous

Peak

Dominant

Intensity^[1]

Wavelength Wavelength

Viewing

Part Number

Color Iv(mcd)@20mA

␭

_peak(nm)

Typ.

570

␭_d(nm)

Typ.

572

Angle 2␪_1/2(°)^[2]

Min.

Typ.

130

155

170

130

155

170

130

155

170

130

170

130

155

170

HSMG-C110/177/197

HSMG-C120

HSMG-C150/170/190/191/265

HSMS-C110/177/197

HSMS-C120

HSMS-C150/170/190/191

HSMD-C110/177/197

HSMD-C120

HSMD-C150/170/190/191

HSMY-C110/197

Green

HER

4.5

15.0

2.8

10.0

8.0

630

605

626

604

Orange

Yellow

2.8

7.2

8.0

589

660

586

639

HSMY-C150/170/190/191

HSMH-C110

HSMH-C120

AlGaAs

17.0

HSMH-C150/170/190/191/265

Notes:

1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of

the lamp package.

2. ␪_1/2is the off-axis angle where the luminous intensity is 1/2 the peak intensity.

[1]

Color Bin Limits

[1]

Green Color Bins

Yellow/Amber Color Bins

Dom. Wavelength (nm)

Bin ID

Min.

Max.

564.5

567.5

570.5

573.5

576.5

Bin ID

Min.

Max.

561.5

564.5

567.5

570.5

573.5

582.0

584.5

587.0

589.5

592.0

594.5

584.5

587.0

589.5

592.0

594.5

597.0

Tolerance: ± 0.5 nm

[1]

Orange Color Bins

Dom. Wavelength (nm)

Bin ID

Min.

Max.

597.0

600.0

603.0

606.0

609.0

612.0

600.0

603.0

606.0

609.0

612.0

615.0

Tolerance: ± 1 nm

[1]

Light Intensity (Iv) Bin Limits

Intensity (mcd)

Bin ID

Min.

0.11

0.18

0.29

0.45

0.72

1.10

1.80

2.80

4.50

7.20

11.20

18.00

Max.

0.18

0.29

0.45

0.72

1.10

1.80

2.80

4.50

7.20

11.20

18.00

28.50

Bin ID

Min.

Max.

28.50

45.00

71.50

112.50

180.00

285.00

450.00

715.00

1125.00

112.50

180.00

285.00

450.00

715.00

Note:

1. Bin categories are established for classi-

fication of products. Products may not

be available in all categories. Please con-

tact your Agilent representative for infor-

mation on currently available bins.

1125.00 1800.00

1800.00 2850.00

2850.00 4500.00

Tolerance: ± 15%

1.0

GREEN

AlGaAs

YELLOW

ORANGE

0.5

HER

500

550

600

650

700

750

WAVELENGTH – nm

Figure 1. Relative Intensity vs. Wavelength.

1.6

1.2

0.8

100

C110/C150 AlGaAs

C110/C150/C265

HER, ORANGE,

YELLOW, GREEN

AlGaAs

HER

C120/C170/C177/

C190/C191/C197/

C265 AlGaAs

AlGaAs

GREEN

Rθ

J-A

600°C/W

C120/C170/

C177/C190/

C191/C197

HER,

ORANGE,

YELLOW,

GREEN

0.4

Rθ

J-A

YELLOW

800°C/W

GaP

ORANGE

0.1

1.5

100

1.7

1.9

2.1

2.3

– FORWARD CURRENT – mA

– AMBIENT TEMPERATURE – °C

– FORWARD VOLTAGE – V

Figure 2. Forward Current vs.

Forward Voltage.

Figure 3. Luminous Intensity vs.

Forward Current.

Figure 4. Maximum Forward Current

vs. Ambient Temperature.

1.00

0.90

0.80

0.70

0.60

0.50

0.40

0.30

0.20

0.10

-90 -80 -70 -60 -50 -40 -30 -20 -10

10 20 30 40 50 60 70 80 90

ANGLE

1.00

0.90

0.80

0.70

0.60

0.50

0.40

0.30

0.20

0.10

-90 -80 -70 -60 -50 -40 -30 -20 -10

10 20 30 40 50 60 70 80 90

ANGLE

Figure 5. Relative Intensity vs. Angle for HSMx-C110.

100

-90 -80 -70 -60 -50 -40 -30 -20 -10

10 20 30 40 50 60 70 80 90

ANGLE

100

-90 -80 -70 -60 -50 -40 -30 -20 -10

10 20 30 40 50 60 70 80 90

ANGLE

Figure 6. Relative Intensity vs. Angle for HSMx-C120.

100

-90 -80 -70 -60 -50 -40 -30 -20 -10

10 20 30 40 50 60 70 80 90

ANGLE

Figure 7. Relative Intensity vs. Angle for HSMx-C177 and C197.

1.00

0.90

0.80

0.70

0.60

0.50

0.40

0.30

0.20

0.10

-90 -80 -70 -60 -50 -40 -30 -20 -10

10 20 30 40 50 60 70 80 90

ANGLE

Figure 8. Relative Intensity vs. Angle for HSMx-C150, C170, C190, C191 and C265.

10 to 20 SEC.

255 °C (+5/-0)

217 °C

3 °C/SEC. MAX.

100 - 150 °C

6 °C/SEC. MAX.

10 SEC. MAX.

230°C MAX.

4°C/SEC. MAX.

3°C/SEC. MAX.

140-160°C

MAX. 120 SEC.

60 to 150 SEC.

4°C/SEC.

MAX.

TIME

OVER 2 MIN.

TIME

* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.

Figure 9. Recommended Reflow Soldering Profile.

Figure 10. Recommended Pb-Free Reflow Soldering Profile.

0.8 (0.031)

1.5 (0.059)

1.2 (0.047)

1.2

(0.047)

1.2

(0.047)

0.8

(0.031)

0.8

(0.031)

1.5

(0.059)

2.0

(0.079)

1.5

(0.059)

0.9

(0.035)

0.7

(0.028)

Figure 12. Recommended Soldering

Pattern for HSMx-C170 and C177.

Figure 11. Recommended Soldering

Pattern for HSMx-C150.

Figure 13. Recommended Soldering

Pattern for HSMx-C190, C191 and C197.

5.0 (0.200)

0.9 (0.035)

0.4 (0.016)

0.9 (0.035)

0.2 (0.008)

0.4 (0.016)

1.0 (0.039)

0.7 (0.028)

0.15 (0.006)

CENTERING

BOARD

CENTERING

BOARD

1.5

(0.059)

2.0

(0.079)

1.5

(0.059)

0.8

(0.031)

1.2

(0.047)

0.8

(0.031)

Figure 14. Recommended Soldering Pattern

for HSMx-C110.

Figure 15. Recommended Soldering Pattern for HSMx-C120.

USER FEED DIRECTION

2.2 (0.087) DIA. PCB HOLE

CATHODE SIDE

1.25 (0.049)

1.4

(0.055)

2.3

(0.091)

1.4

(0.055)

PRINTED LABEL

Figure 16. Recommended Soldering Pattern for

HSMx-C265.

Figure 17. Reeling Orientation.

8.0 ± 1.0 (0.315 ± 0.039)

10.50 ± 1.0 (0.413 ± 0.039)

Ø 13.1 ± 0.5

(Ø 0.516 ± 0.020)

Ø 20.20 MIN.

(Ø 0.795 MIN.)

3.0 ± 0.5

(0.118 ± 0.020)

59.60 ± 1.00

(2.346 ± 0.039)

178.40 ± 1.00

(7.024 ± 0.039)

4.0 ± 0.5

(0.157 ± 0.020)

5.0 ± 0.5

(0.197 ± 0.020)

Figure 18. Reel Dimensions.

Note: All dimensions in millimeters (inches).

DIM. C

(SEE TABLE 1)

4.00 (0.157)

CATHODE

1.50 (0.059)

0.20 ± 0.05

(0.008 ± 0.002)

1.75 (0.069)

3.50 ± 0.05

(0.138 ± 0.002)

DIM. A

(SEE TABLE 1)

8.00 ± 0.30

(0.315 ± 0.012)

DIM. B

(SEE TABLE 1)

CARRIER TAPE

COVER TAPE

USER FEED

DIRECTION

2.00 ± 0.05

(0.079 ± 0.002)

4.00 (0.157)

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

DIM. A DIM. B

DIM. C

HSMx-C110/C120

POSITION IN

CARRIER TAPE

PART NUMBER

± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)

3.40 (0.134) 1.70 (0.067) 1.20 (0.047)

1.90 (0.075) 1.15 (0.045) 0.80 (0.031)

3.50 (0.138) 1.88 (0.074) 1.27 (0.050)

2.30 (0.091) 1.45 (0.057) 0.95 (0.037)

2.30 (0.091) 1.40 (0.055) 0.60 (0.024)

1.80 (0.071) 0.95 (0.037) 0.87 (0.034)

1.86 (0.073) 0.89 (0.035) 0.87 (0.034)

1.75 (0.069) 0.95 (0.037) 0.60 (0.024)

HSMx-C110 SERIES

HSMx-C120 SERIES

HSMx-C150 SERIES

HSMx-C170 SERIES

HSMx-C177 SERIES

HSMx-C190 SERIES

HSMx-C191 SERIES

HSMx-C197 SERIES

DIM. A

(SEE TABLE 1)

R 1.0 ± 0.05

(0.039 ± 0.002)

DIM. B

(SEE TABLE 1)

R 0.5 ± 0.05

(0.020 ± 0.002)

DIM. C

(SEE TABLE 1)

4.00 (0.157)

CATHODE

1.50 (0.059)

0.20 ± 0.05

(0.008 ± 0.002)

1.75 (0.069)

3.50 ± 0.05

(0.138 ± 0.002)

DIM. A

(SEE TABLE 1)

8.00 ± 0.30

(0.315 ± 0.012)

DIM. B

(SEE TABLE 1)

CARRIER TAPE

COVER TAPE

USER FEED

DIRECTION

2.00 ± 0.05

(0.079 ± 0.002)

4.00 (0.157)

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

DIM. A DIM. B

± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)

HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)

DIM. C

PART NUMBER

Figure 19. Tape Dimensions.

END

START

Storage Condition: 5 to 30˚ C

@ 60% RH max.

Baking is required under the

condition:

a) the blue silica gel indicator

becoming white/transparent color

b) the pack has been opened for

more than 1 week

Baking recommended condition:

60 +/– 5˚C for 20 hours.

THERE SHALL BE A

MOUNTED WITH

COMPONENTS

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MINIMUM OF

230 mm

(9.05 INCH)

MAY CONSIST

OF CARRIER

AND/OR

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

Convective IR Reflow

Soldering

For more information on IR

reflow soldering, refer to

Application Note 1060, Surface

Mounting SMT LED Indicator

Components.

COVER TAPE.

Figure 20. Tape Leader and Trailer Dimensions.

Notes:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.1 mm (± 0.004 in.)unless otherwise specified.

www.agilent.com/semiconductors

For product information and a complete list of

distributors, please go to our web site.

For technical assistance call:

Americas/Canada: +1 (800) 235-0312 or

(916) 788-6763

Europe: +49 (0) 6441 92460

China: 10800 650 0017

Hong Kong: (+65) 6756 2394

India, Australia, New Zealand: (+65) 6755 1939

Japan: (+81 3) 3335-8152 (Domestic/Interna-

tional), or 0120-61-1280 (Domestic Only)

Korea: (+65) 6755 1989

Singapore, Malaysia, Vietnam, Thailand,

Philippines, Indonesia: (+65) 6755 2044

Taiwan: (+65) 6755 1843

Data subject to change.

Obsoletes 5988-6271EN

May 17, 2004

5989-0463EN

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HSMG-C170产品参数

型号:	HSMG-C170
是否Rohs认证：	不符合
生命周期：	Transferred
IHS 制造商：	AGILENT TECHNOLOGIES INC
包装说明：	SMT, 2 PIN
Reach Compliance Code：	unknown
HTS代码：	8541.40.20.00
风险等级：	4.46
颜色：	GREEN
颜色@波长：	Green
配置：	SINGLE
最大正向电流：	0.02 A
最大正向电压：	2.6 V
JESD-609代码：	e0
透镜类型：	DIFFUSED
标称发光强度：	15.0 mcd
安装特点：	SURFACE MOUNT
功能数量：	1
端子数量：	2
最高工作温度：	85 °C
最低工作温度：	-30 °C
光电设备类型：	SINGLE COLOR LED
总高度：	0.8 mm
包装方法：	TAPE AND REEL 7"
峰值波长：	570 nm
最大反向电压：	5 V
形状：	RECTANGULAR
尺寸：	1.4 mm
子类别：	Visible LEDs
表面贴装：	YES
端子面层：	Tin/Lead (Sn/Pb)
端子节距：	2.1 mm
视角：	170 deg

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