HYB39D32322TQ-6中文资料应用文章市场行情现货热卖使用介绍-中国IC网-芯三七

Product Information 2004

M E M O R Y S P E C T R U M

w w w. i n f i n e o n . c o m / m e m o r y

w w w. i n f i n e o n . c o m / m e m o r y / f l a s h

N e v e r s t o p t h i n k i n g .

I n t r o d u c t i o n

A P R I L 2 0 0 4 . Th isedition of Memory Spectrum has been developed

to enable you to easily view the entire range of Infineon’s memory products.

For more related product information and the latest datasheets, please visit

our websites: www.infineon.com/memory and www.infineon.com/memory/flash.

DDR400 Components and DIMMs (PC3200)

2 GB DDR2 Unbuffered DIMM

4 GB DDR2 Registered DIMM

16 Mb and 32 Mb CellularRAM

512 Mb Mobile-RAM

Technology and Trends

As a leading memory products

supplier, Infineon continues to

expand its portfolio with the

recent introduction of:

“Green**”, DRAM Components and Modules

512 Mb and 1 Gb TwinNAND Components

SD Cards/MultiMediaCards

** Lead & Halogen-Free

DRAM Components

Double Data Rate (DDR / DDR2)

and Single Data Rate (SDR).

Synchronous Dynamic Random

Access Memory.

16 Mb

32 Mb

128 Mb

256 Mb

512 Mb

1 Gb

DDR DRAMs

DDR2 DRAMs

SDR DRAMs

Reduced Latency (RLDRAM )

Graphics RAM

+

™

+

Mobile-RAM

+

™

CellularRAM

+

64 MB 128 MB 256 MB 512 MB

1 GB

+

2 GB

4 GB

DRAM Modules

Double Data Rate (DDR / DDR2),

Dual Inline Memory Modules

(DIMMs).

Unbuffered DDR

Registered DDR

Registered DDR Reduced Height

SO-DIMM DDR

+

DDR2

Unbuffered

Registered

+

SO-DIMM DDR2

64 MB 128 MB 256 MB 512 MB

1 GB

2 GB

4 GB

Single Data Rate (SDR), Dual Inline

Memory Modules (DIMMs).

Unbuffered SDR

Registered SDR

SO-DIMM SDR

+

64 Mb 128 Mb 256 Mb 512 Mb

1 Gb

2 Gb

2 GB

4 Gb

4 GB

Flash Components

™

Thin Small Outline Package (TSOP).

TwinFlash

+

64 MB 128 MB 256 MB 512 MB

1 GB

Flash Cards

MultiMediaCards

SD Cards

+

MultiMediaCards and SD Cards.

™

RLDRAM™ and CellularRAM™ are registered trademarks of Infineon Technologies AG. TwinFlash is

a trademark of Infineon Technologies AG, based on Saifun NROM technology.

2

C o n t e n t

4 – 8

5 – 6

DRAM Components

DDR Components

DDR2 Components

SDR Components

7

8

9 – 20

DRAM Modules

DDR Modules

10 – 14

DDR2 Modules

SDR Modules

15 – 17

18 – 20

21 – 24

25 – 26

Specialty DRAMs

Flash

3

D R A M C o m p o n e n t s

Nomenclature DRAM Components

HYB 25

D

128

80

0

C

T

- 6

(Example)

Speed/Performance

3

3.7

5

6

7

7F

7.5

8

=

DDR2-667 4-4-4

DDR2-533 4-4-4

(DDR2)

DDR2-400 3-3-3/DDR400B 3-3-3

DDR333 2.5-3-3/PC166 3-3-3

DDR266A 2-3-3/PC133 2-2-2

DDR266 2-2-2

DDR266B 2.5-3-3/PC133 3-3-3

DDR200 2-2-2/PC100 2-2-2

(DDR2/DDR)

(DDR/SDR)

(DDR)

(DDR/SDR)

Power

none =

Standard Power

L

=

Low-Power Product

Package

C

T

E

F

=

FBGA

Contains Lead

Lead and Halogen-Free (ROHS*-compliant)

TSOP 400 mil

FBGA

G

TSOP stack

Product Revision

Product Variation

Organization

Die Revision

0

=

Standard Product

40

80

16

=

x 4

x 8

x 16

Memory Density

128

256

512

1G

=

128 Mb

256 Mb

512 Mb

1024 Mb

Memory Type

Supply Voltage

Prefix

S

D

T

=

SDR

DDR

DDR2

Single Data Rate SDRAM

Double Data Rate SDRAM

Double Data Rate 2 SDRAM

39

25

18

=

3.3V

2.5V

1.8V

HYB

=

Memory Components

*ROHS = Restriction Of Hazardous Substances

4 4

DDR Components

Generation Organization

Package

Speed

Latency

2-3-3

Sales Description Speed No. Ordering Code

Prod.

Now

Green

XX

128 Mb

DDR266A

DDR333

DDR266A

DDR333

HYB25D128400AT-

HYB25D128400CE-

HYB25D128800AT-

HYB25D128800CE-

7

6

7

6

Q67100 Q4309

Q67100 Q1455

Q67100 Q4311

Q67100 Q1459

32 M x 4

16 M x 8

TSOP-66 (400 mil)

2.5-3-3

2-3-3

2Q04

Now

2.5-3-3

2Q04

XX

DDR266A

DDR333

2-3-3

7

6

Q67100 Q4313

Q67100 Q5044

Q67100 Q1458

HYB25D128160AT-

HYB25D128160CE-

Now

8 M x 16

64 M x 4

TSOP-66 (400 mil)

2.5-3-3

6

2Q04

XX

256 Mb

DDR266A

DDR266

DDR266A

DDR333

DDR400

DDR333

DDR400

DDR266A

DDR333

2-3-3

2-2-2

7

7F

7

Q67100 Q4587

Q67100 Q4880

Q67100 Q5049

Q67100 Q4589

Q67100 Q4275

HYB25D256400BT-

HYB25D256400CE-

HYB25D256800BT-

Now

2-3-3

2.5-3-3

3-3-3

6

5

32 M x 8

TSOP-66 (400 mil)

2.5-3-3

3-3-3

HYB25D256800CE-

HYB25D256800CEL-

HYB25D256800CE-

6

5

7

6

Q67100 Q5051

Q67100 Q1753

Q67100 Q5180

Q67100 Q4593

Q67100 Q4592

Now

XX

2-3-3

2.5-3-3

HYB25D256160BT-

HYB25D256160CE-

Now

16 M x 16

TSOP-66 (400 mil)

DDR400

DDR333

DDR400

3-3-3

2.5-3-3

3-3-3

5

6

5

Q67100 Q4277

Q67100 Q5045

Q67100 Q5182

Now

XX

256 Mb

FBGA

DDR266A

DDR333

DDR400

DDR333

DDR400

2-3-3

2.5-3-3

3-3-3

7

6

5

6

5

Q67100 Q4615

Q67100 Q4614

Q67100 Q1071

Q67100 Q4764

Q67100 Q1418

HYB25D256400BC-

HYB25D256400CC-

Now

64 M x 4

FBGA 60 (8 x 12 mm)

2.5-3-3

3-3-3

2Q04

DDR266A

DDR333

DDR400

DDR266A

DDR333

2-3-3

2.5-3-3

3-3-3

7

6

5

7

6

Q67100 Q4596

Q67100 Q4595

Q67100 Q4443

Q67100 Q4767

Q67100 Q1419

Q67100 Q4599

Q67100 Q4598

HYB25D256800BC-

HYB25D256800CF-

HYB25D256800CC-

Now

2Q04

32 M x 8

16 M x 16

FBGA 60 (8 x 12 mm)

XX

2-3-3

HYB25D256160BC-

HYB25D256160CC-

Now

2.5-3-3

DDR333

2.5-3-3

6

Q67100 Q4770

2Q04

XX = Lead and Halogen-Free

5

DDR Components

Generation Organization

Package

TSOP-66 (400 mil)

256 M x 4 TSOP stack (400 mil)

Speed

Latency

2-3-3

Sales Description Speed No. Ordering Code

Prod.

Now

Green

XX

512 Mb

HYB25D512400AT-

HYB25D512400BE-

7

Q67100 Q4413

Q67100 Q5202

DDR266A

128 M x 4

Now

DDR266A

DDR333

DDR400

DDR266A

DDR333

DDR400

2-3-3

HYB25D1G400BG-

HYB25D512800AT-

7

6

5

7

6

5

On request

Q67100 Q4412

Q67100 Q4415

Q67100 Q5205

Q67100 Q5204

Q67100 Q4411

Q67100 Q4416

Q67100 Q5209

Q67100 Q5208

2.5-3-3

3-3-3

64 M x 8

TSOP-66 (400 mil)

HYB25D512800BE-

XX

2-3-3

HYB25D512160AT-

Now

2.5-3-3

3-3-3

32 M x 16

TSOP-66 (400 mil)

HYB25D512160BE-

HYB25D512400BC-

Now

512 Mb

FBGA

DDR333

DDR400

DDR333

DDR400

DDR333

DDR400

2.5-3-3

3-3-3

6

5

6

5

6

5

Q67100 Q1661

Q67100 Q1693

Q67100 Q1663

Q67100 Q5215

Q67100 Q1451

Q67100 Q1452

Q67100 Q1453

Q67100 Q1454

128 M x 4 FBGA 60 (10x12 mm)

2.5-3-3

3-3-3

HYB25D512800BC-

HYB25D512800BF-

HYB25D512800BC-

HYB25D512800BF-

Now

XX

64 M x 8

FBGA 60 (10x12 mm)

3-3-3

2.5-3-3

3-3-3

32 M x 16 FBGA 60 (10x12 mm)

HYB25D512160BC-

Now

XX = Lead and Halogen-Free

6

DDR2 Components

Generation Organization

Package

Speed

Latency

3-3-3

4-4-4

3-3-3

4-4-4

3-3-3

4-4-4

Sales Description Speed No. Ordering Code

Production Green

256 Mb

DDR2 400

DDR2 533

DDR2 400

DDR2 533

DDR2 400

DDR2 533

5

3.7

5

Q67100 Q1314

Q67100 Q1311

Q67100 Q1322

Q67100 Q1320

Q67100 Q1301

Q67100 Q1293

64 M x 4

32 M x 8

16 M x 16

PTFBGA-60

PTFBGA-84

HYB18T256400AC-

HYB18T256800AC-

HYB18T256160AC-

3Q04

3.7

5

3.7

512 Mb

DDR2 400

DDR2 533

DDR2 400

DDR2 533

DDR2 400

DDR2 533

3-3-3

4-4-4

3-3-3

4-4-4

3-3-3

4-4-4

5

3.7

5

Q67100 Q1350

Q67100 Q1349

Q67100 Q1354

Q67100 Q1352

Q67100 Q1347

Q67100 Q1346

128 M x 4

64 M x 8

32 M x 16

PTFBGA-60

PTFBGA-84

HYB18T512400AC-

HYB18T512800AC-

HYB18T512160AC-

2Q04

3.7

5

3.7

1Gb

DDR2 400

DDR2 533

DDR2 400

DDR2 533

DDR2 400

DDR2 533

3-3-3

4-4-4

3-3-3

4-4-4

3-3-3

4-4-4

5

3.7

5

Q67100 Q1619

Q67100 Q1618

Q67100 Q1622

Q67100 Q1621

Q67100 Q1625

Q67100 Q1624

256 M x 4

128 M x 8

64 M x 16

PTFBGA-68

PTFBGA-92

HYB18T1G400AC-

HYB18T1G800AC-

HYB18T1G160AC-

3Q04

3.7

5

3.7

7

SDR Components

Generation Organization

Package

Speed

PC133

Latency

2-2-2

Sales Description Speed No. Ordering Code

Production Green

Now

128 Mb

32 M x 4

16 M x 8

8 M x 16

TSOP-54 (400 mil)

HYB39S128400CT-

HYB39S128800CT-

HYB39S128160CT-

7

Q67100 Q4101

Q67100 Q4107

Q67100 Q4113

256 Mb

64 M x 4

32 M x 8

16 M x 16

TSOP-54 (400 mil)

PC133

2-2-2

HYB39S256400DT-

HYB39S256800DT-

HYB39S256160DT-

7

Q67100 Q4330

Q67100 Q4332

Q67100 Q4334

Now

256 Mb

FBGA

64 M x 4

32 M x 8

16 M x 16

FBGA-54 (8x12 mm)

PC133

2-2-2

HYB39S256400DC-

HYB39S256800DC-

HYB39S256160DC-

7

Q67100 Q4772

Q67100 Q4774

Q67100 Q4808

512 Mb

128 M x 4

64 M x 8

32 M x 16

TSOP-54 (400 mil)

PC133

3-3-3

HYB39S512400AT-

HYB39S512800AT-

HYB39S512160AT-

7.5

Q67100 Q4404

Q67100 Q4403

Q67100 Q4402

Now

8

D R A M M o d u l e s

Nomenclature DDR/DDR2 Modules

Unbuffered DIMM, Registered DIMM (184-pin) and SO-DIMM (200-pin)

HYS 64

D

32

2

0

G

D

L

- 6 - A

(Example)

Part Number

Extension

Component Die Revision Indicator

Speed

8

7.5

7

7F

6

5

=

PC1600 2-2-2

PC2100 2.5-3-3

PC2100 2-3-3

DDR200

DDR266B

DDR266A

DDR266

DDR333

DDR400 / DDR2-400

DDR2-533

DDR2-667

PC2100 2-2-2

PC2700 2.5-3-3

PC3200 3-3-3 / PC2-3200 3-3-3

PC2-4300 4-4-4

PC2-5300 4-4-4

3.7

3

Power

L

=

Low Power

none =

Standard Power

Module Family

U

R

D

BD

BR

=

Unbuffered DIMM TSOP-based for DDR / FBGA-based for DDR2

Registered DIMM TSOP-based for DDR / FBGA-based for DDR2

SO-DIMM

TSOP-based for DDR / FBGA-based for DDR2

FBGA-based

Registered DIMM FBGA-based

Package Type

Designator

G

H

E

=

Contains Lead

Lead-Free (ROHS*-compliant)

Lead and Halogen-Free available on request (ROHS*-compliant)

Product Variations

Number of

Memory Ranks

0

2

=

One Memory Module Rank

Two Memory Module Ranks

Designator

Data Sheet Defined

Memory Density

per DQ

16

32

64

128

256

=

16 Mb

32 Mb

64 Mb

128 Mb

256 Mb

Power Supply

D

T

=

2.5 V (DDR Modules)

1.8 V (DDR2 Modules)

Data

Width64

=

x 64

(Non-ECC)

72

=

x 72 (ECC)

Prefix

HYS

Standard Prefix for SDRAM-based Memory Modules

*ROHS = Restriction Of Hazardous Substances

9

DDR Modules

Unbuffered DDR DIMM – 184-pin

Compo.

Module

Density

Organi-

zation

Genera-

tion

Compo. # of Ranks Module

Package on Module Height

Module

Speed

Sales

Speed

No.

Ordering

Code

Prod. Green

Organization

Description

128 MB

PC2700

PC3200

PC2700

PC3200

6-B Q67100 Q4940

5-B Q67100 Q5136

6-C Q67100 Q1448

5-C Q67100 Q1754

Now

HYS64D16301GU-

16 M x 64 256 M 16 M x 16 TSOP

1

1.25"

PC2700

PC3200

6-C Q67100 Q4995

5-C Q67100 Q5188

HYS64D16301HU-

Now

X

128MB ECC 16 M x 72 128 M

16 M x 8 TSOP

PC2100 HYS72D16000GU- 7-A Q67100 Q4367 Now

256 MB

PC2100 HYS64D32000GU- 7-B Q67100 Q4517 Now

PC2700

PC3200

PC2700

PC3200

PC2700

PC3200

6-B Q67100 Q4944

5-B Q67100 Q5081

6-C Q67100 Q5184

5-C Q67100 Q1755

6-C Q67100 Q4996

5-C Q67100 Q5189

HYS64D32300GU-

Now

32 M x 64 256 M 32 M x 8 TSOP

1

1.25"

Now

X

HYS64D32300HU-

HYS72D32000GU-

PC2100

PC2100-222

PC2700

PC3200

PC2700

PC3200

PC2700

PC3200

7-B Q67100 Q4519

7F-B Q67100 Q5029

6-B Q67100 Q4946

5-B Q67100 Q4957

6-C Q67100 Q1768

5-C Q67100 Q1756

6-C Q67100 Q4998

5-C Q67100 Q5191

256MB ECC

32 M x 72 256 M 32 M x 8 TSOP

1

1.25"

HYS72D32300GU-

HYS72D32300HU-

Now

X

512 MB

PC2100 HYS64D64020GU- 7-B Q67100 Q4521 Now

PC2700

PC3200

PC2700

PC3200

PC2700

PC3200

6-B Q67100 Q4948

5-B Q67100 Q5084

6-C Q67100 Q1449

5-C Q67100 Q1761

6-C Q67100 Q5001

5-C Q67100 Q5190

HYS64D64320GU-

Now

64 M x 64 256 M 32 M x 8 TSOP

2

1.25"

HYS64D64320HU-

HYS72D64020GU-

Now

PC2100

7-B Q67100 Q4525

7F-B Q67100 Q5030

512MB ECC

PC2100-222

PC2700

PC3200

PC2700

PC3200

PC2700

PC3200

6-B Q67100 Q4950

5-B Q67100 Q4958

6-C Q67100 Q1757

5-C Q67100 Q1762

6-C Q67100 Q4997

5-C Q67100 Q5192

Now

64 M x 72 256 M 32 M x 8 TSOP

2

1.25"

HYS72D64320GU-

HYS72D64320HU-

X = Lead-Free

10

Unbuffered DDR DIMM – 184-pin

Compo.

Module

Density

Organi-

zation

Genera-

tion

Compo. # of Ranks Module Module

Sales

Speed

No.

Ordering

Code

Prod. Green

Organization

Package on Module Height

Speed

Description

PC2100 HYS64D128020GU- 7-A Q67100 Q4656 Now

PC2700 6-A Q67100 Q4823

PC2700 HYS64D128320GU- 6-B Q67100 Q1779 Now

128Mx64512 M 6M4 x 8 TSOP

2

1.25"

PC3200

PC2700

PC3200

5-B Q67100 Q1780

6-B Q67100 Q1426

5-B Q67100 Q1427

Now

X

HYS64D128320HU-

PC2100 HYS72D128020GU- 7-A Q67100 Q4658 Now

PC2700 6-A Q67100 Q4935

PC2700 HYS72D128320GU- 6-B Q67100 Q1781 Now

128Mx72 512 M 64M x 8 TSOP

2

1.25"

PC3200

PC2700

PC3200

5-B Q67100 Q1782

6-B Q67100 Q1065

5-B Q67100 Q1064

Now

X

HYS72D128320HU-

X = Lead-Free

11

Registered DDR DIMM (Reduced Height) – 184-pin

Genera- Compo.

tion Organization

Module

Density

Organi-

zation

Compo. # of Ranks Module

Package on Module Height

Module

Speed

Sales

Speed

No.

Ordering

Code

Prod. Green

Now

Description

128 MB 16 M x 72 128 M 16 M x 8 TSOP

1

1.2"

PC2100

HYS72D16500GR-

7-A

Q67100 Q4446

256 MB

HYS72D32501GR-

HYS72D32501HR-

HYS72D32500GR-

7-A

7-C

7-B

6-B

Q67100 Q4377

Q67100 Q1471

Q67100 Q4457

Q67100 Q4533

Q67100 Q4671

Q67100 Q1461

Q67100 Q1413

128M 32 M x 4 TSOP

1

1.2"

3Q04

Now

X

256 M 32 M x 8 TSOP

PC2100

PC2700

32 M x 72

256 M 32 M x 8 FBGA

1

1.125" PC3200 HYS72D32300GBR- 5-B

PC2700

PC3200

6-C

5-C

2Q04

Q67100 Q1673 3Q04

512 MB

PC2100

PC2100-222

PC2100

7-B

Q67100 Q4463

TSOP

1

1.2"

HYS72D64500GR-

7F-B Q67100 Q5007

7-B

6-B

Q67100 Q4673

Q67100 Q4686

Q67100 Q1462

Q67100 Q1415

Now

64 M x 4

FBGA

PC2700

1.125"

PC3200 HYS72D64300GBR- 5-B

PC2700

PC3200

PC2100

PC2700

6-C

5-C

7-B

6-B

2Q04

64 M x 72 256 M

Q67100 Q1685 3Q04

Q67100 Q4687

Q67100 Q4693

Q67100 Q1463

Q67100 Q1414

Now

32 M x 8

FBGA

2

1.125" PC3200 HYS72D64320GBR- 5-B

PC2700

PC3200

6-C

5-C

2Q04

Q67100 Q1684 3Q04

1 GB

PC2100

PC2100-222

PC2100

7-B

Q67100 Q4752

TSOP

stack

128 M x 4

1.2"

HYS72D128521GR-

7F-B Q67100 Q5008

Now

256 M

7-B

Q67100 Q4674

Q67100 Q4668

Q67100 Q1412

Q67100 Q4990

Q67100 Q1429

Q67100 Q1032

Q67100 Q1687

Q67100 Q1422

Q67100 Q1043

Q67100 Q1686

64 M x 4 FBGA

TSOP

2

1

1.2"

PC2700 HYS72D128320GBR- 6-B

PC2700

PC2100

6-C

HYS72D128500GR- 7-A

7-B

2Q04

Now

128Mx72

128 M x 4

FBGA

1

1.125" PC2700 HYS72D128300GBR- 6-B

Now

512 M

PC3200

PC2100

5-B

7-B

64 M x 8 FBGA

2

1.125" PC2700 HYS72D128321GBR- 6-B

PC3200

5-B

2GB

TSOP

256Mx4

2

1.2"

PC2100

HYS72D256520GR- 7-A

7-B

Q67100 Q4661

Now

stack

Q67100 Q1031

Q67100 Q1030

Q67100 Q1689

256Mx72 512M

128Mx4 FBGA

PC2700 HYS72D256320GBR- 6-B

PC3200 5-B

X = Lead-Free

12

Registered DDR DIMM – 184-pin

Compo.

Module

Density

Organi- Genera-

Compo. # of Ranks Module

Package on Module Height

Module

Speed

Sales

Speed

No.

Ordering

Code

Prod. Green

EOL

Organization

zation

tion

Description

128 MB

PC1600

PC2100

8-A Q67100 Q4372

7-A Q67100 Q4373

16Mx72 128M 16Mx8

TSOP

1

1.7"

HYS72D16000GR-

256 MB

PC1600

PC2100

8-A Q67100 Q4375

7-A Q67100 Q4378

128M 32Mx4 TSOP

256M 32Mx8 TSOP

1

1.7"

HYS72D32001GR-

HYS72D32000GR-

EOL

32Mx72

PC1600

PC2100

8-B Q67100 Q4508

7-B Q67100 Q4509

1

512 MB

1 GB

PC1600

PC2100

8-B Q67100 Q4510

7-B Q67100 Q4511

64Mx72 256M 64Mx4 TSOP

1

1.7"

HYS72D64000GR-

HYS72D128021GR-

EOL

PC1600

PC2100

8-B Q67100 Q4743

7-B Q67100 Q4694

TSOP

128Mx72 256M 128 M x 4

stack

2

EOL = End of Life

13

SO-DIMM DDR – 200-pin

Compo.

Prod.

Now

Module

Density

Organi-

zation

Genera-

tion

Compo. # of Ranks Module

Package on Module Height

Module

Speed

Sales

Speed

No.

Ordering

Code

Green

Organization

Description

128MB

PC2100

PC2700

PC2100

PC2700

7-B Q67100 Q5179

6-B Q67100 Q5187

7-B Q67100 Q4531

HYS64D16001GDL-

16Mx64 256M 16Mx16 TSOP

1

1,25"

HYS64D16000GDL- 6-B Q67100 Q4670

6-C Q67100 Q1763 2Q04

HYS64D16000HDL- 6-C Q67100 Q5078 2Q04

X

PC2100

PC2700

PC3200

PC2700

PC3200

PC2700

PC3200

7-B Q67100 Q4454

6-B Q67100 Q4667 Now

256MB

HYS64D32020GDL- 5-B Q67100 Q5227

32Mx64 256M 16Mx16 TSOP

2

1,25"

6-C Q67100 Q1767

2Q04

5-C Q67100 Q1769

6-C Q67100 Q4831

2Q04

X

HYS64D32020HDL-

5-C Q67100 Q1699

7-B Q67100 Q4680

PC2100

PC2700

PC3200

PC2700

PC3200

PC2700

PC2100

PC2700

PC3200

PC2700

PC3200

PC2700

PC3200

PC2700

PC3200

512MB

6-B Q67100 Q4681 Now

HYS64D64020GBDL- 5-B Q67100 Q1193

6-C Q67100 Q1450

2

256M 32Mx8 FBGA

1,25"

2Q04

5-C Q67100 Q1702

HYS64D64020HBDL- 6-C Q67100 Q4835 3Q04

7-A Q67100 Q4663

X

64Mx64

6-A Q67100 Q4744

HYS64D64020GDL-

Now

6-B Q67100 Q1774

5-B Q67100 Q1783

6-B Q67100 Q1423

5-B Q67100 Q1698

512M 32Mx16 TSOP

2

1,25"

HYS64D64020HDL-

Now

X

1GB

128Mx64 512M

64Mx8

FBGA

2

1,25"

HYS64D128021GBDL- 6-B Q67100 Q1416 Now

6-B Q67100 Q1416

1GB

HYS64D128021GBDL-

Now

5-B Q67100 Q1694

6-B Q67100 Q1028

5-B Q67100 Q1695

128Mx64 512M 64Mx8 FBGA

HYS64D128021HBDL-

Now

X = Lead-Free

14

D D R 2 M o d u l e s

Nomenclature DDR/DDR2 Modules

Unbuffered DIMM, Registered DIMM (240-pin) and SO-DIMM (200-pin)

HYS 64

D

32

2

0

G

D

L

- 6 - A

(Example)

Part Number

Extension

Component Die Revision Indicator

Speed

8

7.5

7

7F

6

5

=

PC1600 2-2-2

PC2100 2.5-3-3

PC2100 2-3-3

DDR200

DDR266B

DDR266A

DDR266

DDR333

DDR400 / DDR2-400

DDR2-533

DDR2-667

PC2100 2-2-2

PC2700 2.5-3-3

PC3200 3-3-3 / PC2-3200 3-3-3

PC2-4300 4-4-4

PC2-5300 4-4-4

3.7

3

Power

L

=

Low Power

none =

Standard Power

Module Family

U

R

D

BD

BR

=

Unbuffered DIMM TSOP-based for DDR / FBGA-based for DDR2

Registered DIMM TSOP-based for DDR / FBGA-based for DDR2

SO-DIMM

TSOP-based for DDR / FBGA-based for DDR2

FBGA-based

Registered DIMM FBGA-based

Package Type

Designator

G

H

E

=

Contains Lead

Lead-Free (ROHS*-compliant)

Lead and Halogen-Free available on request (ROHS*-compliant)

Product Variations

Number of

Memory Ranks

0

2

=

One Memory Module Rank

Two Memory Module Ranks

Designator

Data Sheet Defined

Memory Density

per DQ

16

32

64

128

256

=

16Mb

32Mb

64Mb

128Mb

256Mb

Power Supply

D

T

=

2.5V (DDR Modules)

1.8V (DDR2 Modules)

Data

Width64

=

x64

(Non-ECC)

72

=

x72 (ECC)

Prefix

HYS

Standard Prefix for SDRAM-based Memory Modules

*ROHS = Restriction Of Hazardous Substances

15

Unbuffered DDR2 DIMM – 240-pin

Prod.

Green

Module

Density

Organi- Genera- Compo.

Compo. # of Ranks Module

Module

Speed

Sales

Speed

No.

Ordering

Code

zation tion Organization Package on Module Height

Description

256MB

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1386

3.7-A Q67100 Q1387

32Mx64 512M 32Mx16 PTFBGA84

32Mx72 256M 32Mx8 PTFBGA60

1

30mm

HYS64T32000GU

HYS72T32000GU-

2Q04

3Q04

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1371

3.7-A Q67100 Q1370

256MB ECC

512MB

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1389

3.7-A Q67100 Q1390

64Mx64 512M 64Mx8 PTFBGA60

64Mx72 512M 64Mx8 PTFBGA60

1

30mm

2Q04

HYS64T64000GU-

HYS72T64000GU-

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1392

3.7-A Q67100 Q1393

512MB ECC

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1395

3.7-A Q67100 Q1396

1GB

2Q04

128Mx64 512M 64Mx8 PTFBGA60

128Mx72 512M 64Mx8 PTFBGA60

2

30mm

HYS64T128020GU-

HYS72T128020GU-

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1398

3.7-A Q67100 Q1399

1GB ECC

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1739

3.7-A Q67100 Q1740

2GB

3Q04

256Mx64 1G 128Mx8 PTFBGA68

256Mx72 1G 128Mx8 PTFBGA68

2

30mm

HYS64T256020GU-

HYS72T256020GU-

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1741

3.7-A Q67100 Q1742

2GB ECC

Registered DDR2 DIMM – 240-pin

Compo.

Module

Density

Organi- Genera-

Compo. # of Ranks Module

Package on Module Height

Module

Speed

Sales

Speed

No.

Ordering

Code

Prod. Green

3Q04

Organization

zation

tion

Description

256MB

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1326

3.7-A Q67100 Q1330

32Mx72 256M 32Mx8 PTFBGA60

1

30mm

HYS72T32000GR-

512MB

PC2-3200 3-3-3

PC2-4300 4-4-4

PC2-3200 3-3-3

PC2-4300 4-4-4

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1715

3.7-A Q67100 Q1716

5-A Q67100 Q1367

3.7-A Q67100 Q1366

5-A Q67100 Q1378

3.7-A Q67100 Q1379

64Mx4 PTFBGA60

256M

30mm

HYS72T64001GR-

HYS72T64020GR-

HYS72T64000GR-

3Q04

2Q04

64Mx72

32Mx8 PTFBGA60

2

1

30mm

512M 64Mx8 PTFBGA60

1GB

2GB

PC2-3200 3-3-3

PC2-4300 4-4-4

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1380

3.7-A Q67100 Q1381

5-A Q67100 Q1382

3.7-A Q67100 Q1383

HYS72T128000GR-

HYS72T128020GR-

128Mx4 PTFBGA60

1

30mm

128Mx72 512M

2Q04

64Mx8 PTFBGA60

2

PC2-3200 3-3-3 HYS72T256220GR- 5-A Q67100 Q1891

PC2-4300 4-4-4 HYS72T256020GR- 3.7-A Q67100 Q1918

512M 128Mx4 PTFBGA60

1G 256Mx4 PTFBGA68

2

1

30mm

256Mx72

3Q04

1Q05

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1735

3.7-A Q67100 Q1736

HYS72T256000GR-

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1737

3.7-A Q67100 Q1738

4GB

512Mx72 1G 512Mx4 SDFBGA

2

30mm

HYS72T512022GR-

16

SO-DIMM DDR2 – 200-pin

Compo.

Module

Density

Organi- Genera-

Compo. # of Ranks Module

Package on Module Height

Module

Speed

Sales

Speed

No.

Ordering

Code

Prod.Green

3Q04

Organization

zation

tion

Description

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1401

3.7-A Q67100 Q1402

32 M x 64 512 M 32 M x 16 PTFBGA84

64 M x 64 512 M 32 M x 16 PTFBGA84

1

30 mm

HYS64T32000GDL-

HYS64T64020GDL-

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1404

3.7-A Q67100 Q1405

2

30 mm

3Q04

4Q04

PC2-3200 3-3-3

PC2-4300 4-4-4

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1692

3.7-A Q67100 Q1691

5-A Q67100 Q1743

3.7-A Q67100 Q1744

HYS64T128022GDL-

HYS64T128020GDL-

512 M 128 M x 8 SDFBGA

128Mx64

2

30 mm

1 G

64 M x 16 PTFBGA92

PC2-3200 3-3-3

PC2-4300 4-4-4

5-A Q67100 Q1745

3.7-A Q67100 Q1746

HYS64T256022GDL-

256Mx64 1 G 256 M x 8 SDFBGA

2

30 mm

17

S D R M o d u l e s

Nomenclature SDR Modules

Unbuffered DIMM, Registered DIMM (168-pin) and SO-DIMM (144-pin)

HYS

64

V

32

2

0

GU

L

- 6

- A

(Example)

Part Number

Extension

Component Die Revision Indicator

Speed

6

7

7.5

8

=

166 MHz (PC166 3-3-3)

133 MHz (PC133 2-2-2)

133 MHz (PC133 3-3-3)

100 MHz (PC100 2-2-2)

Power

L

=

Low-Power Product

Standard-Power Product

none

Module Family

GU

GR

GBR

GD

GBD

=

Unbuffered 168-pin DIMM

Registered 168-pin DIMM

Registered 168-pin DIMM (FBGA-based)

144-pin Small Outline DIMM (SO-DIMM)

144-pin SO-DIMM (FBGA-based)

Designator

Product Variations

Number of

Memory Ranks

0

2

=

One Memory Module Rank

Two Memory Module Ranks

Designator

Data Sheet Defined

Memory Density

per DQ

8

16

32

64

128

256

=

8 Mb

16 Mb

32 Mb

64 Mb

128 Mb

256 Mb

Power Supply

Data

V

=

3.3 V (SDR Modules)

Width64

=

x 64

(Non-ECC)

72

=

x 72 (ECC)

Prefix

HYS

Standard Prefix for SDRAM-based Memory Modules

18

Unbuffered SDR DIMM – 168-pin

Compo.

Prod. Green

Module

Density

Organi-

zation

Genera-

tion

Compo. # of Ranks Module

Package on Module Height

Module

Speed

Sales

Speed

No.

Ordering

Code

Organization

Description

128 MB

PC133 3-3-3

PC133 2-2-2

PC133 3-3-3

PC133 2-2-2

7.5-C2 Q67100 Q4079

7-C2 Q67100 Q4080

7.5-D Q67100 Q4466

7-D Q67100 Q4442

128 M 16M x 8

TSOP

1

1.25"

1.15"

HYS64V16300GU-

HYS64V16302GU-

16M x 64

EOL

256M 16M x 16 TSOP

1

PC133 3-3-3

PC133 2-2-2

7.5-C2 Q67100 Q4085

7-C2 Q67100 Q4086

128 MB ECC

256 MB

16M x 72 128 M 16M x 8

TSOP

1

1.25"

HYS72V16300GU-

PC133 3-3-3

PC133 2-2-2

PC133 3-3-3

PC133 2-2-2

7.5-C2 Q67100 Q4082

7-C2 Q67100 Q4083

7.5-D Q67100 Q4359

7-D Q67100 Q4361

128 M 16M x 8

32 M x 64

TSOP

2

1

1.25"

HYS64V32220GU-

HYS64V32300GU-

EOL

256M 32 M x 8

PC133 3-3-3

PC133 2-2-2

PC133 3-3-3

PC133 2-2-2

7.5-C2 Q67100 Q4088

7-C2 Q67100 Q4089

7.5-D Q67100 Q4362

7-D Q67100 Q4360

256 MB ECC

128 M 16M x 8

32 M x 72

TSOP

2

1

1.25"

HYS72V32220GU-

HYS72V32300GU-

256M 32 M x 8

512 MB

PC133 3-3-3

PC133 2-2-2

7.5-D Q67100 Q4390

7-D Q67100 Q4389

64 M x 64 256 M 32 M x 8

64 M x 72 256 M 32 M x 8

TSOP

2

1.25"

HYS64V64220GU-

HYS72V64220GU-

EOL

PC133 3-3-3

PC133 2-2-2

7.5-D Q67100 Q4387

7-D Q67100 Q4388

512 MB ECC

2

EOL = End of Life

19

Registered SDR DIMM – 168-pin

Compo.

Module

Density

Organi-

zation

Genera-

tion

Compo. # of Ranks Module

Package on Module Height

Module

Speed

Sales

Speed

No.

Ordering

Code

Prod. Green

EOL

Organization

Description

PC133 3-3-3

PC133 2-2-2

7.5-C2 Q67100 Q4091

7-C2 Q67100 Q4092

128 MB

16 M x 72 128 M 16 M x 8

TSOP

1

1.5"

HYS72V16301GR-

256 MB

128 M 32 M x 4

TSOP

1

1.5" PC133 3-3-3 HYS72V32301GR- 7.5-C2 Q67100 Q4094

32 M x 72

PC133 3-3-3

PC133 2-2-2

7.5-D Q67100 Q4479 EOL

256 M 32 M x 8

1.5"

HYS72V32300GR-

7-D Q67100 Q4440

512 MB

1 GB

PC133 3-3-3

PC133 2-2-2

7.5-D Q67100 Q4474

7-D Q67100 Q4441

64 M x 72 256 M 64 M x 4

TSOP

1

1.5"

HYS72V64300GR-

EOL

PC133 3-3-3

PC133 2-2-2

PC133 3-3-3

PC133 2-2-2

7.5-D Q67100 Q4725

7-D Q67100 Q4726

7.5-D Q67100 Q4475

7-D Q67100 Q4439

HYS72V128321GR-

HYS72V128320GR-

TSOP

stack

128 M x 72 256 M 128 M x 4

2

1.5"

EOL = End of Life

SO-DIMM SDR – 144-pin

Compo.

Module

Density

Organi-

zation

Genera-

tion

Compo. # of Ranks Module

Module

Speed

Sales

Speed

No.

Ordering

Code

Prod. Green

Package

Organization

on Module Height

Description

128 MB

128 M 8 M x 16

256 M 16 M x 16

TSOP

2

1

1.00" PC133 3-3-3 HYS64V16220GDL- 7.5-C2 Q67100 Q4342

16 M x 64

PC133 3-3-3

PC133 2-2-2

7.5-D Q67100 Q4478 EOL

1.00"

1.15"

HYS64V16200GDL-

HYS64V32220GDL-

HYS64V64220GBDL-

7-D Q67100 Q4363

256 MB

512 MB

PC133 3-3-3

PC133 2-2-2

7.5-D Q67100 Q4472

7-D Q67100 Q4444

32 M x 64 256 M 16 M x 16

64 M x 64 256 M 32 M x 8

TSOP

FBGA

2

EOL

PC133 3-3-3

PC133 2-2-2

7.5-D Q67100 Q4499

7-D Q67100 Q4501

EOL = End of Life

20

S p e c i a l t y D R A M s

Nomenclature Reduced Latency DRAM (RLDRAM^™)

HYB

18

RL

256

32

A

C

- 4

(Example)

Speed

4

5

=

250 MHz

200 MHz

Package

C

=

FBGA

Product Revision

Organization

Die Revision

32

16

=

x 32

x 16

Memory Density

Memory Type

I/O Voltage

Prefix

256

RL

=

256 Mb

Reduced Latency DRAM (RLDRAM)

1.8 V (VDDQ)

18

HYB

Standard Prefix for Memory Components

Reduced Latency DRAM (RLDRAM^™)

Density

Organization

Power Supply

Speed

Package

Prod.

Now

Green

Sales Description

Speed No.

Ordering Code

256 Mb

250 MHz

200 MHz

250 MHz

200 MHz

4

5

4

5

Q67100 Q4355

Q67100 Q4357

Q67100 Q4356

Q67100 Q4358

8 M x 32

HYB18RL25632AC-

2.5 V / 1.8 V VDDQ

T-FBGA-144

16 M x 16

HYB18RL25616AC-

21

Nomenclature Graphics RAM and Mobile-RAM

HYB

25

D

128

32

3

A

C

L

-3.3

(Example)

Speed

2.2

2.5

2.8

3.0

3.3

3.6

4.5

5

=

450 MHz

400 MHz

350 MHz

333 MHz

300 MHz

275 MHz

222 MHz

200 MHz

133 MHz

125 MHz

7.5

8

Power Down Current

Package

Low-Power Down Current

C

T

E

F

=

FBGA

TSOP

TSOP Lead and Halogen-Free

FBGA Lead and Halogen-Free

Product Revision

Interface

Die Revision

0

3

5

=

LV-TTL Interface

Matched Impedance 2.5 V VDDQ

Matched Impedance 1.8 V VDDQ

Organization

80

16

32

=

x 8

x 16

x 32

Memory Density

128

256

512

=

128 Mb

256 Mb

512 Mb

Memory Type

D

L

=

DDR SDRAM or Graphics RAM

Low-Power SDRAM (Mobile-RAM)

Supply Voltage

18

25

39

=

1.8 VVDD

2.5 VDD / 1.8 VVDD or 2.5 VDDQ

3.3 VDD / 3.3 VDDQ

Prefix

HYB

HYE

=

Standard Prefix for Memory Components

Prefix for Extended Temperature Version

(-25°C – +85°C)

22

Graphics RAM

Density

Organization Power Supply

Speed

Sales Description

Speed No.

Ordering Code

Package

Prod.

EOL

Green

128 Mb

333 MHz

300 MHz

3.0

3.3

3.6

4.5

Q67100 Q4866

Q67100 Q4121

Q67100 Q4348

Q67100 Q4930

Q67100 Q4123

Q67100 Q4786

HYB25D128323C-

4 M x 32

2.5 V

275 MHz

222 MHz

FBGA-144

HYB25D128323CL-

HYB25D128323C-

HYB25D128323CL-

256 Mb

166 MHz

200 MHz

250 MHz

500 MHz

450 MHz

400 MHz

6.0

5.0

4.0

20

Q67100 Q4592

Q67100 Q4277

Q67100 Q1408

Q67100 Q1409

Q67100 Q4868

Q67100 Q4869

Q67100 Q4870

HYB25D256160BT-

HYB25D256161CE-

Now

M

16 x 16

2.5 V

1.8 V

TSOP-66

FBGA-144

XX

X

8 M x 32

HYB18T256321F-

22

3Q04

25

XX = Lead and Halogen-Free

X = Lead-Free

EOL = End of Life

Mobile-RAM

Density

Organization Power Supply Power Supply Speed Latency Sales Description

Speed No. Ordering Code

Package Prod. Green

Core

I/O

128 Mb

HYB25L128160AC-

7.5

Q67100 Q4542 FBGA-54

2.5V

2.5V/1.8V

HYE25L128160AC- 7.5 ETR Q67100 Q4544 FBGA-54

Now

HYB39L128160AT-

HYB39L128160AC-

HYB18L128160BF-

HYB18L128160BC-

7.5

Q67100 Q4624 TSOP-54

Q67100 Q4546 FBGA-54

3.3V

1.8V

3.3V

1.8V

133MHz 3-3-3

8Mx16

Q67100 Q1581 FBGA-54 2Q04 XX

Q67100 Q1588 FBGA-54 2Q04

256Mb

HYB25L256160AC-

7.5

Q67100 Q5145 FBGA-54

2.5V

3.3V

1.8V

2.5V/1.8V

3.3V

HYE25L256160AC- 7.5 ETR Q67100 Q5148 FBGA-54

Now

HYB39L256160AC-

HYB39L256160AT-

HYB18L256160BF-

HYB18L256160BC-

7.5

Q67100 Q5144 FBGA-54

Q67100 Q4627 TSOP-54

16Mx16

133MHz 3-3-3

Q67100 Q1295 FBGA-54 2Q04 XX

Q67100 Q1577 FBGA-54 2Q04

1.8V

512 Mb

HYB25L512160AC-

7.5

Q67100 Q4921 FBGA-54

Now

Dual

16Mx16

3.3V or

2.5V/1.8V

133MHz 3-3-3

3.3V or 2.5V

HYE25L512160AC- 7.5 ETR Q67100 Q4923 FBGA-54

23

= Halogen-Free

XX = Lead and Halogen-Free

ETR = Extended Temperature

™

Nomenclature CellularRAM

HYE

18

P

16

1

A

C

-60

(Example)

Speed

Package

C

W

=

Chip-size Package

Wafer / Known Good Die

Product Revision

Interface

Die Revision

0

1

=

Sync /Async / Page

Async / Page only

Organization

16

=

x 16

Memory Density

16

32

=

16 Mb

32 Mb

Memory Type

Supply Voltage

Prefix

P

=

CellularRAM (PSRAM)

18

1.8V VDD / 1.8 – 3.0V VDDQ

Extended Temperature

HYE

™

CellularRAM

Density

Organization

Interface

SRAM

Speed

85ns

70ns

Sales Description Speed No.

Ordering Code

Package

Prod.

Green

X

16Mb

85

HYE18P16161AC-

70

Q67100 Q5098

Q67100 Q5099

VFBGA-48

Async

1Mx16

2Q04

HYE18P16161AW-

70

Q67100 Q5101 Wafer/KGD

32Mb

Async

85ns

70ns

85

70

Q67100 Q5103

Q67100 Q5104

VFBGA-48

HYE18P32161AC-

HYE18P32161AW-

2Mx16

SRAM

2Q04

X

Q67100 Q5106 Wafer/KGD

32Mb

Sync

80MHz/70ns

66MHz/85ns

12.5

15

Q67100 Q1802

Q67100 Q5108

VFBGA-54

HYE18P32160AC-

SRAM

/ Flash

66MHz/85ns HYE18P32160AW-

15

Q67100 Q5110 Wafer/KGD

X = Lead-Free

24

F l a s h

™

Nomenclature TwinFlash Components

HYF

33

DS

512

80

0

A

T

C

(Example)

Temperature Range

Package

C

T

=

Commercial (0°C – +70°C)

TSOP I 48-P-1220-0.5

Process Technology

Product Variation

A

B

=

170 nm Process Technology

170 nm Process Technology (Enhanced Write Speed)

0

2

=

Standard Product (Tape & Reel Packing)

Stacked Die (Tape & Reel Packing)

Organization

80

=

x 8

Memory Density

512

1G

=

512 Mb

1024 Mb

Memory Type

DS

=

Data SLC: TwinFlash Single-Level Cell (2 bit / cell)

Supply and

I/O Voltage

33

31

=

3.3V core and 3V I/O

3.3V core and 1.8V I/O

Prefix

HYF

=

Flash Memory Components

™

TwinFlash Components

Density

Organization

Page Size

Block Size

Core

I/O

Write

Sales

Ordering Code

Package

Voltage Voltage

Speed

Description

512 Mb

3 V

Normal

HYF33DS512800ATC

64 M x 8 512 + 16 Bytes 16 K + 512 Bytes 3 V

3 V

Enhanced HYF33DS512800BTC

On request P-TSOPI-48

1.8 V Enhanced HYF31DS512800BTC

3 V

Normal

HYF33DS1G802ATC

HYF33DS1G802BTC

HYF31DS1G802BTC

1 Gb

128 M x 8 512 + 16 Bytes 16 K + 512 Bytes 3 V

Enhanced

1.8 V Enhanced

25

™

Nomenclature TwinFlash Cards

HYC

3

N

256

0

NO

5

0

AA

1

A

(Example)

Package

A

B

C

D

=

SD (commercial)

MMC (commercial)

miniSD (commercial)

mini MMC (commercial)

Memory Revision

Controller Generation

Firmware

A

B

=

170 nm Process Technology

110 nm Process Technology

1

2

=

1st generation

2nd generation

AA

AB

=

1st firmware

2nd firmware

Content

0

1

=

No content

Content 1 rev. label

Label Size

0

1

=

No label

16 MB

2

3

4

5

6

7

32 MB

64 MB

128 MB

256 MB

512 MB

1 GB

Label Shortcut

Speed

NO

IF

=

No label

IFX label

0

1

=

Standard

Future use

Memory Capacity

64

=

64 MB

128

256

512

01G

128 MB

256 MB

512 MB

1024 MB

Technology

N

=

TWIN-NAND

Supply Voltage

3

1

=

3.3V Core

1.8V Core (Dual-Voltage)

Type

C

=

Flash Card

™

TwinFlash Cards

Card

Density

64 MB

Operating Voltage

2.7V – 3.6V

Sales Description

Ordering Code

HYC3N0640NO00AA1AB

HYC3N1280NO00AA1AB

HYC3N2560NO00AA1AB

Multi

Media

Cards

128 MB

256 MB

On request

SD

Cards

64 MB

128 MB

256 MB

HYC3N0640NO00AA1AA

HYC3N1280NO00AA1AA

HYC3N2560NO00AA1AA

2.7V – 3.6V

On request

26

More detailed Information on

Memory Products is available:

On our Internet websites:

www.infineon.com/memory and www.infineon.com/memory/flash

C

Datasheets

C

Simulation models

C

Memory Spectrum (PDF version)

C

Brochures (PDF version)

Please note

Warnings

Edition 2004 April

The information in this document is subject to change

without notice. The information herein describes certain

components and shall not be considered as a guarantee

of characteristics.

Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but

not limited to warranties of non-infringement regarding

circuits, descriptions and charts stated herein.

Infineon Technologies is an approved CECC manufacturer.

Due to technical requirements, components may contain

dangerous substances. For information on the types

in question, please contact your nearest Infineon

Technologies office.

Published by

Infineon Technologies AG,

St.-Martin-Straße 53,

D-81669 München

Infineon Technologies components may only be used in

life-support devices or systems with the express written

approval of Infineon Technologies if a failure of such

components can reasonably be expected to cause the

failure of that life-support device or system, or to affect

the safety or effectiveness of that device or system.

Life-support devices or systems are intended to be

implanted in the human body, or to support and/or

maintain and sustain and/or protect human life. If they

fail, it is reasonable to assume that the health of the

user or other persons may be endangered.

Information

For further information on technology, delivery terms and

conditions and prices, please contact your nearest

Infineon Technologies office in Germany or our Infineon

Technologies representatives worldwide.

(www.infineon.com).

27

*

INFINEON TECHNOLOGIES ^{SALES OFFICES WORLDWIDE}

D

IL

SGP

USA

U.S.A.

AUS

Australia

Germany

Israel

Singapore

Siemens Ltd.

885 Mountain Highway

Bayswater, Victoria 3153

Infineon Technologies AG

Völklinger Straße 4

40219 Düsseldorf

Nisko Ltd.

Infineon Technologies Asia

Pacific Pte. Ltd.

25 New Industrial Road

KHL Building

Singapore 536 211

Infineon Technologies

2A,Habarzel Street

North America Corp.

Tel Aviv 69710

8203 Willow Place South, Suite 660

Houston, TX 77070

T

(+61) 3-97 21 21 11

T

(+49) 211-20 95 49 0

T

(+9 72) 3 -7 65 73 00

Fax (+61) 3-97 21 72 75

Fax (+49) 211-20 95 49 60

Fax (+9 72) 3 -7 65 73 33

T

(+1) 28 17 74-05 55

T

(+65) 68 40 07 32

Fax (+1) 28 17 74-05 61

Infineon Technologies AG

Naegelsbachstraße 26

91052 Erlangen

Fax (+65) 68 40 00 77

Infineon Technologies

North America Corp.

2529 Commerce Drive

Kokomo, IN 46902

I

A

Austria

Italy

Infineon Technologies Villach AG

Sales Office

Austria AG

Operngasse 20b/31

1040 Wien

Infineon Technologies Italia S.r.l.

Via Vipiteno, 4

20128 Milano

T

(+49) 91 31-97 00 1-0

ZA

South Africa

Fax (+49) 91 31-97 00-99

Siemens Components

P.O. Box 3438

Halfway House 1685

Gauteng

T

(+1) 7 65-4 56 19 28

T

(+39) 022 52 04-1

Infineon Technologies AG

Paderborner Straße 1

30539 Hannover

Fax (+1) 7 65-4 56 38 36

Fax (+39) 022 52 04-43 95

T

(+43) 1-5 87-70 70 0

Infineon Technologies

North America Corp.

21800 Haggerty Road, Suite 112

Northville, MI 48167

Fax (+43) 1-5 87-70 70 20

T

(+27) 11 6 52-20 00

T

(+49) 5 11-87 65 62 0

Fax (+27) 11 6 52-25 73

J

Japan

Fax (+49) 5 11-87 65 62 90

Infineon Technologies Japan K.K.

Takanawa Park Tower 8F/9F/12F/17F

3-20-14, Higashi-Gotanda,

Shinagawa-ku,

Belgium/

Netherlands

Infineon Technologies Holding B.V.

Sales Division

Westblaak 32

3012 KM Rotterdam

Infineon Technologies AG

Rosenheimer Straße 116

81669 München

T

(+1) 2 48-3 74 08 90

B

NL

L

E

Spain

Fax (+1) 2 48-3 74 25 01

Siemens S.A.

Tokyo 141-0022

División Componentes

Ronda de Europa, 5

28760 Tres Cantos-Madrid

T

(+49) 89-23 40

Infineon Technologies

North America Corp.

3000 CentreGreen Way

Raleigh, NC 27513

T

(+81) 3 54 49 64 11

Fax (+49) 89-23 42 46 94

Fax (+81) 3 54 49 64 01

T

(+31) 10-2 17 68 00

T

(+34) 91-5 14 71 54

Infineon Technologies AG

Memory Products Sales

Gustav-Heinemann-Ring 212

81739 München

Fax (+31) 10-2 17 68 19

Fax (+34) 91-5 14 70 13

T

(+1) 91 96 77-27 00

Fax (+1) 91 96 78 19 34

ROK

Korea

Infineon Technologies Korea Co., Ltd.

Room No. 2& 3, 9th floor

Daelim Acrotel Building

467-6 Dokock-Dong, Kangnam-Gu

Seoul, Korea 135-971

T

(+49) 89-23 42 38 01

Infineon Technologies

North America Corp.

6170 Cornerstone Ct East, Suite 240

San Diego, CA 92121

BR

S

Brazil

Sweden

Fax (+49) 89-23 42 04 90

Infineon Technologies AG

Infineon Technologies

South America Ltda.

Av. Mutinga, 3800 - prédio 3

05110-901 São Paulo-SP

Infineon Technologies Nordic AB

P.O. Box 46

164 93 Kista

Südwestpark 65

90449 Nürnberg

T

(+1) 85 85 26-22 01

T

(+82) 23 46 00-900

T

(+46) 8-7 03 59 00

Fax (+1) 85 85 26-22 02

T

(+55) 11-39 08-25 64

Fax (+82) 23 46 00-901 /902

Fax (+46) 8-7 03 59 01

T

(+49) 9 11-2 52 93 0

Fax (+55) 11-39 08-27 28

Fax (+49) 9 11-2 52 93 93

Infineon Technologies Corporation

1730 North First Street

San José, CA 95112

CH

Malaysia MAL

Infineon Technologies (M) SDN BHD

Krystal Point II

1-4-11/12, Lebuh Bukit Kecil 6

11900 Bayan Lepas

Penang. Malaysia

Switzerland

CDN

Canada

Infineon Technologies

Switzerland AG

Badenerstraße 623

P.O. Box 1570

T

(+1) 4 08-5 01 60 00

DK

Denmark

Infineon Technologies Corporation

340 March Road, Suite 301

Kanada, Ontario K2K 2E2

Fax (+1) 4 08-5 01 24 24

Infineon Technologies Nordic A/S

Herlev Hovedgade 201A

DK 2730 Herlev

Infineon Technologies

North America Corp.

1901 N. Roselle Rd., Suite 1020

Schaumburg, IL 60195

T

(+1) 6 13-5 91- 38 35

8048 Zürich

T

(+45) 44 50 77 00

Fax (+1) 6 13-5 91- 89 54

T

(+60) 46 44 77 66

T

(+41) 1- 4 97 80 40

Fax (+45) 44 50 77 01

Fax (+60) 46 41 48 72

Fax (+41) 1- 4 97 80 50

T

(+1) 84 78 84-70 09

Fax (+1) 84 78 84-75 99

China CN

Infineon Technologies

FIN

Finland

RC

New Zealand NZ

Taiwan

Infineon Technologies Nordic OY

Visitor´s Address Linnouitustie 4A

P. O . B o x 27 6

International Trade (Shanghai) Co., Ltd.

Beijing Representative Office

12th Floor, Quantum Plaza

No.27 Zhichun Road

Siemens Components

300 Great South Road

Greenland, Auckland

Infineon Technologies

Taiwan Ltd.

12F-1, No. 3-2 Yuan Qu Street

Nan Kang Software Park

Twain 115, R.O.C.

FIN-02601 Espoo

T

(+64) 95 20 30 33

T

(+3 58) 10-680 84 00

Haidian District,

Fax (+64) 95 20 15 56

Fax (+3 58) 10-680 84 01

Beijing 100083,

T

(+8 86) 2-26 55 75 00

People’s Republic of China

Fax (+8 86) 2-26 55 75 01-8

T

(+86) 10 82 35 61 18

PL

Poland

F

France

Fax (+86) 10 82 35 54 74

Siemens SP. z.o.o.

ul. Zupnicza 11

03-821 Warszawa

Infineon Technologies France SAS

39 – 47, Bd. Ornano

93527 Saint-Denis CEDEX 2

Turkey

TR

Infineon Technologies

Hong Kong Ltd.

Siemens Sanayi ve Ticaret A.S.

Yakacik Yolu No: 111

T

(+48) 22-8 70 91 50

Hong Kong Office

302 Level 3 Festival Walk

80 Tat Chee Avenue

Kowloon Tong

T

(+33) 1-48 09 72 00

Fax (+48) 22-8 70 91 59

34861 Kartal, Istanbul

Fax (+33) 1-48 09 72 90

T

(+90) 21 64 59 28 51

Fax (+90) 21 64 19 31 90

P

Portugal

Siemens S.A.

Hong Kong

IND

India

T

(+8 52) 28 32 05 00

Infineon Technologies

India Pvt. Ltd.

OG Componentes Electronicos

Rua Irmaos Siemens, 1

Alfragide

Fax (+8 52) 28 27 97 62

GB

United Kingdom

10th Floor, Discoverer Building

International Technology Park

Whitefield Road

Infineon Technologies UK Ltd.

Infineon House

Fleet Mill

Minley Road

Fleet, Hampshire GU51 2RD

Infineon Technologies

2720-093 Amadora

International Trade (Shanghai) Co., Ltd.

No. 8, Lane 647, Songtao Road

Zhangjiang Hi-Tech Park

T

(+3 51) 21-4 17 85 90

Bangalore 560 066, India

Fax (+3 51) 21-4 17 80 83

T

(+91) 80 8 41 00-17/18

Pudong, Shanghai, China

Fax (+91) 80 8 41 00 12

T

(+44) 1252-77 2200

T

(+86) 21-38 95 37 08

Fax (+44) 1252-77 2201

Fax (+86) 21-50 80 62 04

RUS

Russia

INTECH electronics

ul. Smolnaja 24a/1203

125 445 Moscow

IRL

Ireland

USA

U.S.A.

Infineon Technologies Ireland Ltd.

69 Fitzwilliam Lane

Dublin 2

(+35) 31-79 99 500

Fax (+35) 31-79 99 501

D

Germany

Infineon Technologies

North America Corp.

T

(+70) 95 -4 51 97 37

Infineon Technologies AG

Siemensstraße 31 – 33

71254 Ditzingen/Stuttgart

(+49) 7 1 56-1 79 19-10

Fax (+49) 7 1 56-1 79 19-90

Fax (+70) 95 -4 51 86 08

T

3700 West Parmer Lane, Suite 102

Austin, TX 78727

T

(+1) 51 23 41-71 27

Fax (+1) 51 23 41-99 26

* and representative offices

Ordering No. B166-H8399-X-X-7600

Printed in Germany

WS 04045.

www.infineon.com

型号:	HYB39L128160AC-7.5
是否Rohs认证：	不符合
生命周期：	Obsolete
IHS 制造商：	INFINEON TECHNOLOGIES AG
零件包装代码：	BGA
包装说明：	TFBGA, BGA54,9X9,32
针数：	54
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.32.00.02
风险等级：	5.85
Is Samacsys：	N
访问模式：	FOUR BANK PAGE BURST
最长访问时间：	5.4 ns
其他特性：	AUTO/SELF REFRESH
最大时钟频率 (fCLK)：	133 MHz
I/O 类型：	COMMON
交错的突发长度：	1,2,4,8
JESD-30 代码：	R-PBGA-B54
JESD-609代码：	e0
长度：	9 mm
内存密度：	134217728 bit
内存集成电路类型：	SYNCHRONOUS DRAM
内存宽度：	16
功能数量：	1
端口数量：	1
端子数量：	54
字数：	8388608 words
字数代码：	8000000
工作模式：	SYNCHRONOUS
最高工作温度：	70 °C
最低工作温度：
组织：	8MX16
输出特性：	3-STATE
封装主体材料：	PLASTIC/EPOXY
封装代码：	TFBGA
封装等效代码：	BGA54,9X9,32
封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	3.3 V
认证状态：	Not Qualified
刷新周期：	4096
座面最大高度：	1.2 mm
自我刷新：	YES
连续突发长度：	1,2,4,8,FP
最大待机电流：	0.0004 A
子类别：	DRAMs
最大压摆率：	0.16 mA
最大供电电压 (Vsup)：	3.6 V
最小供电电压 (Vsup)：	3 V
标称供电电压 (Vsup)：	3.3 V
表面贴装：	YES
技术：	CMOS
温度等级：	COMMERCIAL
端子面层：	Tin/Lead (Sn/Pb)
端子形式：	BALL
端子节距：	0.8 mm
端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	8 mm
Base Number Matches：	1

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