ZHCS321E
–
JUNE 2009
–
REVISED DECEMBER 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS
PRODUCT
ISO1050DUB
ISO1050LDW
(1)
ISO1050DW
RATED ISOLATION
2500 V
RMS
2500 V
RMS (2)
5000 V
RMS
PACKAGE
DUB-8
DW-16
DW-16
MARKED AS
ISO1050
ISO1050L
ISO1050
ORDERING NUMBER
ISO1050DUB (rail)
ISO1050DUBR (reel)
ISO1050LDW (rail)
ISO1050LDWR (reel)
ISO1050DW (rail)
ISO1050DWR (reel)
(1)
(2)
Product Preview
Certifiactions Pending
ABSOLUTE MAXIMUM RATINGS
(1)
V
CC1
, V
CC2
V
I
V
CANH
or V
CANH
I
O
Supply voltage
(3)
(2)
VALUE / UNIT
–0.5
V to 6 V
–0.5
V to 6 V
–27
V to 40 V
±15
mA
JEDEC Standard 22, Method A114-C.01
JEDEC Standard 22, Test Method C101
ANSI/ESDS5.2-1996
Bus pins and GND2
All pins
All pins
All pins
(4)
Voltage input (TXD)
Voltage range at any bus terminal (CANH, CANL)
Receiver output current
Human Body Model
±4
kV
±4
kV
±1.5
kV
±200
V
–65°C
to 150°C
–55°C
to 150°C
ESD
Charged Device Model
Machine Model
Storage temperature
Junction temperature
T
stg
T
J
(1)
(2)
(3)
(4)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
This isolator is suitable for basic isolation within the safety limiting data. Maintenance of the safety data must be ensured by means of
protective circuitry.
All input and output logic voltage values are measured with respect to the GND1 logic side ground. Differential bus-side voltages are
measured to the respective bus-side GND2 ground terminal.
Tested while connected between Vcc2 and GND2.
RECOMMENDED OPERATING CONDITIONS
MIN
V
CC1
V
CC2
V
I
or V
IC
V
IH
V
IL
V
ID
I
OH
I
OL
T
A
T
J
(1)
2
Supply voltage, controller side
Supply voltage, bus side
Voltage at bus pins (separately or common mode)
High-level input voltage
Low-level input voltage
Differential input voltage
High-level output current
Low-level output current
Ambient Temperature
Junction temperature (see THERMAL CHARACTERISTICS)
Driver
Receiver
Driver
Receiver
–55
–55
TXD
TXD
–12
3
4.75
(1)
NOM
5
MAX
5.5
5.25
12
5.25
0.8
7
UNIT
V
V
V
V
V
V
mA
2
0
–7
–70
–4
70
4
105
125
mA
°C
°C
The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
Copyright
©
2009–2011, Texas Instruments Incorporated
ETC [ ETC ]
