RT9168/A
indefinite amount of time without damaging the part by
cooperation of current limit and thermal protection.
Operating Region and Power Dissipation
The maximum power dissipation of RT9168/A depends
on the thermal resistance of the case and circuit board,
the temperature difference between the die junction
and ambient air, and the rate of airflow. The power
dissipation across the device is P = I
(V - V
).
OUT
IN
OUT
The maximum power dissipation is: PMAX = (T - T )
J
A
/θ
JA
where T - T is the temperature difference between
J
A
the RT9168/A die junction and the surrounding
environment, θ is the thermal resistance from the
JA
junction to the surrounding environment. The GND pin
of the RT9168/A performs the dual function of
providing an electrical connection to ground and
channeling heat away. Connect the GND pin to ground
using a large pad or ground plane.
DS9168/A-03 May 2001
www.richtek-ic.com.tw
9
ETC [ ETC ]
