PFMD
Polymeric PTC Resettable Fuse – Surface Mount
Typical Time to Trip at 23 °C
PF
MD
.02
0
PF
MD
.03
5
PF
MD
.05
0
PF
MD
PF
.075
MD
.11
0
NEW
•
High Density Circuit Board Application:
100
Time to Trip (Seconds)
Hard disk drives,
PC motherboards
PC peripherals
Point-of-sale (POS) equipment
PCMCIA cards
•
Packaged per EIA 481-2 standard
10
9E
1
0.1
Approvals:
UL
CSA
TÜV
recognition
pending
approval
0.01
0.001
0.1
1
10
100
Fault current (Amps)
Dimensions
A
C
Solder Pad Layouts
1.00
(0.039)
2.5
(0.098)
2.00
(0.079)
PFMD.035
3.45
(0.136)
PFMD.020, 050, 075, 110
1.78
(0.070)
3.15
(0.124)
Typical Part Marking
Represents total content. Layout may vary.
PART
IDENTIFICATION
B
MANUFACTURER'S
TRADEMARK
110
9E
MIN
D
TOP
VIEW
SIDE
VIEW
MIN
Dimentions in mm / (inch)
Technical Data
Operating/Storage Temperature
Maximum Device Surface Temperature
in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Mechanical Shock
Solvent Resistance
Vibration
Terminal material
Termination pad solderability
-40°C to +85°C
125°C
+85°C, 1000 hours
±5% typical resistance change
+85°C, 85% R.H. 1000 hours
±5% typical resistance change
+125°C/-40°C 10 times
±10% typical resistance change
MIL-STD-202, Method 213,
No resistance change
Condition 1 (100g, 6 seconds)
MIL-STD-202, Method 215
No change
MIL-STD-883C, Method 2007.1,
No change
Condition A
Solder-plated copper
Meets EIA Specification RS-186-9E, ANSI/J-STD-002 Cat.3
Test Procedures And Requirements
Test Conditions
Accept/Reject Criteria
Verify dimensions and materials
In still air @ 23°C
At 8 Amps , Vmax, 23°C
30 min. at Ihold
Vmax, Imax, 100 cycles
Vmax, 48 hours
Per PF physical description
Rmin
≤
R
≤
Rmax
T
≤
max. time to trip (seconds)
No trip
No arcing or burning
No arcing or burning
Test
Visual/Mech.
Resistance
Time to Trip
Hold Current
Trip Cycle Life
Trip Endurance
106
Schurter, Inc. • Phone 707-778-6311 • Fax 707-778-6401 • E-mail info@schurterinc.com • Website http://www.schurterinc.com
ETC [ ETC ]
