RGE
Radial Leaded
RGE Product Data
Now that you have selected your RGE device, please review the
device’s characteristics in this section to verify that the device will
perform as required.
Electrical characteristics (25°C)
Initial
resistance
R min.
(
Ω
)
0.034
0.020
0.014
0.009
0.006
0.005
0.004
0.003
0.003
0.002
0.002
Post-trip
resistance
R1 max .
(
Ω
)
0.105
0.063
0.044
0.030
0.021
0.018
0.015
0.012
0.010
0.009
0.008
New
New
New
New
4
New
New
Part
Number
RGE300
RGE400
RGE500
RGE600
RGE700
RGE800
RGE900
RGE1000
RGE1100
RGE1200
RGE1400
IH
(A)
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
11.0
12.0
14.0
IT
(A)
5.1
6.8
8.5
10.2
11.9
13.6
15.3
17.0
18.7
20.4
23.8
Max. time
to trip (s)
at 5 x IH
2.0
3.5
3.6
5.8
8.0
9.0
12.0
12.5
13.5*
16.0
20.0
P
d
(W)
2.3
2.4
2.6
2.8
3.0
3.0
3.3
3.3
3.7
4.2
4.6
IH = Hold current—maximum current at which the device will not trip at 25°C.
IT = Trip current—minimum current at which the device will always trip at 25°C.
Pd = Typical power dissipation—typical amount of power dissipated by the device when in tripped state in 25°C still air.
R min. = Minimum device resistance at 25°C prior to tripping.
R max. = Maximum device resistance at 25°C prior to tripping.
R1 max. = Maximum device resistance at 25°C measured 1 hour post trip.
* Device tested at 60 A.
Physical characteristics
Lead material
Soldering characteristics
Insulating material
RGE300—RGE1100: Tin lead-plated copper, 20 AWG,
∅
0.81 mm/0.032 in
RGE1200—RGE1400: Tin lead-plated copper, 18AWG,
∅ 1.0
mm/0.04 in
Solderability per ANSI/J-STD-002
Solder heat withstand per IEC 68-2-20:
RGE300, Test T
b
; should be soldered to the printed circuit in less than
4 seconds at maximum temperature of 260°C ± 5°.
RGE500—RGE1400, Test Tb; can withstand 10 seconds at 260°C ±5°.
Cured, flame-retardant epoxy polymer; meets UL 94V-0 requirements
Note: Devices are not designed to be placed through a reflow process.
Agency recognitions
CSA
¨
TUV
UL
File # CA 78165C
Certificate # R9677540
File # E74889
RGE Devices
Raychem Circuit Protection Devices
134