6
Reflow Temperature Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
MAXIMUM SOLDER REFLOW THERMAL PROFILE
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
Regulatory Information
Agency/Standard
Underwriters Laboratory
(UL)
HCPL-3120
HCPL-J312
HCNW3120
Recognized under UL 1577, Component Recognition
Program, Category, File E55361
Canadian Standards Association
(CSA)
File CA88324, per Component Acceptance
Notice #5
Verband Deutscher Electrotechniker
(VDE)
DIN VDE 0884 (June 1992)
British Standards Institute
(BSI)
Certification According to BS EN60065: 1994
(BS415:1994), BS EN60950: 1992 (BS7002:1992)
Option 060
Pending
Insulation and Safety Related Specifications
Value
HCPL- HCPL-
Symbol 3120
J312
L(101)
7.1
7.4
HCNW
3120
9.6
Parameter
Minimum External
Air Gap (Clearance)
Minimum External
Tracking (Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
Units
mm
L(102)
7.4
8.0
10.0
mm
0.08
0.5
1.0
mm
CTI
>175
>175
>200
Volts
Conditions
Measured from input terminals to
output terminals, shortest distance
through air.
Measured from input terminals to
output terminals, shortest distance
path along body.
Insulation thickness between emitter
and detector; also known as distance
through insulation.
DIN IEC 112/VDE 0303 Part 1
IIIa
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89,
Table 1)
ETC [ ETC ]
