SPICE MODEL: IMX8
IMX8
Lead-free Green
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
·
·
·
·
·
Epitaxial Planar Die Construction
SOT-26
Complementary PNP Type Available (IMT4)
Small Surface Mount Package
A
Dim Min Max Typ
B2
B1
E1
Lead Free/RoHS Compliant (Note 3)
"Green" Device, Note 4 and 5
A
B
C
D
F
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
C
B
C2
E2
C1
Mechanical Data
¾
¾
0.95
0.55
H
·
Case: SOT-26
¾
¾
·
Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability
Classification 94V-0
H
J
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
K
M
K
L
J
·
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
F
L
D
M
a
Terminals: Solderable per MIL-STD-202, Method 208
B2
B1
E1
Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
0°
8°
¾
All Dimensions in mm
·
·
·
Marking (See Page 2): KX8
Ordering & Date Code Information: See Page 2
Weight: 0.016 grams (approximate)
C2
E2
C1
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
VCBO
VCEO
VEBO
IC
Value
120
120
5.0
Unit
V
Collector-Base Voltage
Collector-Emitter Voltage
V
Emitter-Base Voltage
V
Collector Current - Continuous
Power Dissipation (Note 1)
50
mA
mW
°C/W
°C
Pd
300
417
R
qJA
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage and Temperature Range
Tj, TSTG
-55 to +150
@ TA = 25°C unless otherwise specified
Electrical Characteristics
Characteristic
OFF CHARACTERISTICS (Note 2)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Symbol
Min
Typ
Max
Unit
Test Condition
V(BR)CBO
V(BR)CEO
V(BR)EBO
ICBO
IC = 50mA
IC = 1.0mA
120
120
5.0
¾
¾
¾
¾
¾
¾
¾
¾
V
V
IE = 50mA
¾
V
VCB = 100V
VEB = 4.0V
0.5
0.5
mA
mA
IEBO
Emitter Cutoff Current
¾
ON CHARACTERISTICS (Note 2)
DC Current Gain
IC = 2.0mA, VCE = 6.0V
IC = 10mA, IB = 1.0mA
hFE
180
¾
¾
820
0.5
¾
VCE(SAT)
Collector-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
¾
V
VCE = 12V, IC = 2.0mA,
f = 100MHz
fT
Current Gain-Bandwidth Product
¾
140
¾
MHz
Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 200mW per element must not be exceeded.
2. Short duration test pulse used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product
manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30304 Rev. 7 - 2
1 of 4
IMX8
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ã Diodes Incorporated