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产品型号IS41C16128的Datasheet PDF文件预览

®
IS41C16128  
128K x 16 (2-MBIT) DYNAMIC RAM  
WITH EDO PAGE MODE  
ISSI  
AUGUST 1998  
DESCRIPTION  
FEATURES  
TheISSIIS41C16128isa131,072x16-bithigh-performance  
CMOSDynamicRandomAccessMemory.TheIS41C16128  
offers an accelerated cycle access called EDO Page Mode.  
EDO Page Mode allows 256 random accesses within a  
single row with access cycle time as short as 12 ns per 16-  
bit word. The Byte Write control, of upper and lower byte,  
makes the IS41C16128 ideal for use in 16-, 32-bit wide data  
bus systems.  
• Extended Data-Out (EDO) Page Mode  
access cycle  
• TTL compatible inputs and outputs  
• Refresh Interval: 512 cycles/8 ms  
• Refresh Mode : RAS-Only, CAS-before-RAS  
(CBR), and Hidden  
• JEDEC standard pinout  
These features make the IS41C16128 ideally suited for  
high band-width graphics, digital signal processing,  
high-performance computing systems, and peripheral  
applications.  
• Single +5V ± 10% power supply  
• Byte Write and Byte Read operation via two CAS  
• Available in 40-pin SOJ and TSOP (Type II)  
• Industrial temperature available  
The IS41C16128 is packaged in a 40-pin 400-mil SOJ and  
TSOP (Type II).  
FUNCTIONAL BLOCK DIAGRAM  
OE  
WE  
WE  
CONTROL  
LOGICS  
OE  
CONTROL  
LOGIC  
CAS  
CLOCK  
GENERATOR  
LCAS  
UCAS  
CAS  
WE  
DATA I/O BUS  
RAS  
CLOCK  
RAS  
GENERATOR  
COLUMN DECODERS  
SENSE AMPLIFIERS  
REFRESH  
COUNTER  
I/O0-I/O15  
MEMORY ARRAY  
131,072 x 16  
ADDRESS  
BUFFERS  
A0-A8  
This document contains PRELIMINARY data. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We  
assume no responsibility for any errors which may appear in this publication. © Copyright 1998, Integrated Silicon Solution, Inc.  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
1
08/20/98  
®
IS41C16128  
ISSI  
KEY TIMING PARAMETERS  
Parameter  
-35  
-40  
-45  
-50  
-60  
Max. RAS Access Time (tRAC)  
Max. CAS Access Time (tCAC)  
Max. Column Address Access Time (tAA)  
Min. EDO Page Mode Cycle Time (tPC)  
Min. Read/Write Cycle Time (tRC)  
35 ns  
10 ns  
18 ns  
12 ns  
60 ns  
40 ns  
12 ns  
20 ns  
15 ns  
75 ns  
45 ns  
13 ns  
22 ns  
17 ns  
80 ns  
50 ns  
14 ns  
25 ns  
20 ns  
90 ns  
60 ns  
15 ns  
30 ns  
25 ns  
110 ns  
PIN CONFIGURATIONS  
40-Pin TSOP (Type II)  
40-Pin SOJ  
VCC  
I/O0  
I/O1  
I/O2  
I/O3  
VCC  
I/O4  
I/O5  
I/O6  
I/O7  
1
2
3
4
5
6
7
8
9
10  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
GND  
I/O15  
I/O14  
I/O13  
I/O12  
GND  
I/O11  
I/O10  
I/O9  
VCC  
I/O0  
I/O1  
I/O2  
I/O3  
VCC  
I/O4  
I/O5  
I/O6  
I/O7  
NC  
1
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
GND  
I/O15  
I/O14  
I/O13  
I/O12  
GND  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
2
3
4
5
6
7
8
I/O8  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
NC  
NC  
WE  
RAS  
NC  
A0  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
NC  
NC  
LCAS  
UCAS  
OE  
LCAS  
UCAS  
OE  
WE  
RAS  
NC  
A8  
A8  
A0  
A7  
A7  
A1  
A6  
A1  
A6  
A2  
A5  
A2  
A5  
A3  
A4  
A3  
A4  
VCC  
GND  
VCC  
GND  
PIN DESCRIPTIONS  
A0-A8  
I/O0-15  
WE  
Address Inputs  
Data Inputs/Outputs  
Write Enable  
OE  
Output Enable  
RAS  
Row Address Strobe  
Upper Column Address Strobe  
Lower Column Address Strobe  
Power  
UCAS  
LCAS  
Vcc  
GND  
NC  
Ground  
No Connection  
2
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
08/20/98  
®
IS41C16128  
ISSI  
TRUTH TABLE  
Function  
RAS  
H
LCAS UCAS  
WE  
X
OE  
X
Address tR/tC I/O  
Standby  
H
L
L
H
L
X
High-Z  
Read: Word  
Read: Lower Byte  
L
H
L
ROW/COL  
ROW/COL  
DOUT  
L
H
H
L
Lower Byte, DOUT  
Upper Byte, High-Z  
Read: Upper Byte  
L
H
L
H
L
ROW/COL  
Lower Byte, High-Z  
Upper Byte, DOUT  
Write: Word (Early Write)  
L
L
L
L
L
L
L
X
X
ROW/COL  
ROW/COL  
DIN  
Write: Lower Byte (Early Write)  
H
Lower Byte, DIN  
Upper Byte, High-Z  
Write: Upper Byte (Early Write)  
Read-Write(1,2)  
L
L
H
L
L
L
L
X
ROW/COL  
ROW/COL  
Lower Byte, High-Z  
Upper Byte, DIN  
HL  
LH  
DOUT, DIN  
EDO Page-Mode Read(2) 1st Cycle:  
2nd Cycle:  
L
L
L
HL  
HL  
LH  
HL  
HL  
LH  
H
H
H
L
L
L
ROW/COL  
NA/COL  
NA/NA  
DOUT  
DOUT  
DOUT  
Any Cycle:  
EDO Page-Mode Write(1) 1st Cycle:  
2nd Cycle:  
L
L
HL  
HL  
HL  
HL  
L
L
X
X
ROW/COL  
NA/COL  
DIN  
DIN  
EDO Page-Mode  
Read-Write(1,2)  
1st Cycle:  
2nd Cycle:  
L
L
HL  
HL  
HL  
HL  
HL  
HL  
LH  
LH  
ROW/COL  
NA/COL  
DOUT, DIN  
DOUT, DIN  
Hidden Refresh2)  
Read LHL  
Write LHL  
L
L
L
L
H
L
L
X
ROW/COL  
ROW/COL  
DOUT  
DOUT  
RAS-Only Refresh  
CBR Refresh(3)  
L
H
L
H
L
X
X
X
X
ROW/NA  
X
High-Z  
High-Z  
HL  
Notes:  
1. These WRITE cycles may also be BYTE WRITE cycles (either LCAS or UCAS active).  
2. These READ cycles may also be BYTE READ cycles (either LCAS or UCAS active).  
3. At least one of the two CAS signals must be active (LCAS or UCAS).  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
3
08/20/98  
®
IS41C16128  
ISSI  
Functional Description  
Refresh Cycle  
The IS41C16128 is a CMOS DRAM optimized for high-  
speed bandwidth, low power applications. During READ  
or WRITE cycles, each bit is uniquely addressed through  
the 17 address bits. The row address is latched by the  
Row Address Strobe (RAS). The column address is  
latched by the Column Address Strobe (CAS). RAS is  
usedtolatchthefirstninebitsandCASisusedtolatchthe  
latter nine bits.  
To retain data, 512 refresh cycles are required in each  
8 ms period. There are two ways to refresh the memory.  
1. Byclockingeachofthe512rowaddresses(A0through  
A8) with RASat least once every 8 ms. Any read, write,  
read-modify-write or RAS-only cycle refreshes the ad-  
dressed row.  
2. Using a CAS-before-RAS refresh cycle. CAS-before-  
RAS refresh is activated by the falling edge of RAS,  
while holding CAS LOW. In CAS-before-RAS refresh  
cycle, an internal 9-bit counter provides the row ad-  
dresses and the external address inputs are ignored.  
TheIS41C16128hastwoCAScontrols,LCASandUCAS.  
The LCAS and UCAS inputs internally generates a CAS  
signalfunctioninginanidenticalmannertothesingleCAS  
input on the other 128K x 16 DRAMs. The key difference  
is that each CAS controls its corresponding I/O tristate  
logic (in conjunction with OE and WE and RAS). LCAS  
controls I/O0 through I/O7 and UCAS controls I/O8  
through I/O15.  
CAS-before-RAS is a refresh-only mode and no data  
access or device selection is allowed. Thus, the output  
remains in the High-Z state during the cycle.  
The IS41C16128 CAS function is determined by the first  
CAS (LCAS or UCAS) transitioning LOW and the last  
transitioning back HIGH. The two CAS controls give the  
IS41C16128 both BYTE READ and BYTE WRITE cycle  
capabilities.  
Extended Data Out Page Mode  
EDOpagemodeoperationpermitsall256columnswithin  
a selected row to be randomly accessed at a high data  
rate.  
In EDO page mode read cycle, the data-out is held to the  
next CAS cycle’s falling edge, instead of the rising edge.  
For this reason, the valid data output time in EDO page  
mode is extended compared with the fast page mode. In  
the fast page mode, the valid data output time becomes  
shorter as the CAS cycle time becomes shorter. There-  
fore, in EDO page mode, the timing margin in read cycle  
is larger than that of the fast page mode even if the CAS  
cycle time becomes shorter.  
Memory Cycle  
A memory cycle is initiated by bring RAS LOW and it is  
terminated by returning both RAS and CAS HIGH. To  
ensures proper device operation and data integrity any  
memory cycle, once initiated, must not be ended or  
aborted before the minimum tRAS time has expired. A new  
cycle must not be initiated until the minimum precharge  
time tRP, tCP has elapsed.  
InEDOpagemode,duetotheextendeddatafunction,the  
CAScycle time can be shorter than in the fast page mode  
if the timing margin is the same.  
Read Cycle  
The EDO page mode allows both read and write opera-  
tions during one RAS cycle, but the performance is  
equivalent to that of the fast page mode in that case.  
A read cycle is initiated by the falling edge of CAS or OE,  
whichever occurs last, while holding WE HIGH. The  
column address must be held for a minimum time speci-  
fied by tAR. Data Out becomes valid only when tRAC, tAA,  
tCAC and tOEA are all satisfied. As a result, the access time  
is dependent on the timing relationships between these  
parameters.  
Power-On  
After application of the VCC supply, an initial pause of  
200 µs is required followed by a minimum of eight initial-  
ization cycles (any combination of cycles containing a  
RAS signal).  
Write Cycle  
AwritecycleisinitiatedbythefallingedgeofCASandWE,  
whichever occurs last. The input data must be valid at or  
before the falling edge of CAS or WE, whichever occurs  
last.  
During power-on, it is recommended that RAS track with  
VCC or be held at a valid VIH to avoid current surges.  
4
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
08/20/98  
®
IS41C16128  
ISSI  
ABSOLUTE MAXIMUM RATINGS(1)  
Symbol Parameters  
Rating  
Unit  
VT  
Voltage on Any Pin Relative to GND  
–1.0 to +7.0  
V
V
VCC  
IOUT  
PD  
Supply Voltage  
–1.0 to +7.0  
Output Current  
50  
1
mA  
W
Power Dissipation  
Operation Temperature  
TA  
Com.  
Ind.  
0 to +70  
–40 to +85  
°C  
TSTG  
Storage Temperature  
–55 to +125  
°C  
Note:  
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent  
damage to the device. This is a stress rating only and functional operation of the device at these  
or any other conditions above those indicated in the operational sections of this specification is not  
implied. Exposure to absolute maximum rating conditions for extended periods may affect  
reliability.  
RECOMMENDED OPERATING CONDITIONS (Voltages are referenced to GND.)  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
VCC  
VIH  
VIL  
TA  
Supply Voltage  
4.5  
2.4  
5.0  
5.5  
VCC + 1.0  
+0.8  
V
V
Input High Voltage  
Input Low Voltage  
Ambient Temperature  
–1.0  
V
Com.  
Ind.  
0
–40  
+70  
+85  
°C  
CAPACITANCE(1,2)  
Symbol  
Parameter  
Input Capacitance: A0-A8  
Max.  
Unit  
CIN1  
CIN2  
CIO  
5
7
7
pF  
pF  
pF  
Input Capacitance: RAS, UCAS, LCAS, WE, OE  
Data Input/Output Capacitance: I/O0-I/O15  
Notes:  
1. Tested initially and after any design or process changes that may affect these parameters.  
2. Test conditions: TA = 25°C, f = 1 MHz, VCC = 5.0V + 10%.  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
5
08/20/98  
®
IS41C16128  
ISSI  
ELECTRICAL CHARACTERISTICS(1) (Recommended Operation Conditions unless otherwise noted.)  
Symbol Parameter  
Test Condition  
Speed Min. Max.  
Unit  
IIL  
Input Leakage Current  
Any input 0V < VIN < 5.5V  
–10  
10  
µA  
Other inputs not under test = 0V  
IIO  
Output Leakage Current  
Output is disabled (Hi-Z)  
0V < VOUT < 5.5V  
–10  
10  
µA  
VOH  
VOL  
Output High Voltage Level  
Output Low Voltage Level  
IOH = –2.5 mA  
IOL = +2.1 mA  
2.4  
V
V
0.4  
ICC1  
ICC2  
ICC3  
Stand-by Current: TTL  
RAS, LCAS, UCAS VIH  
2
1
mA  
mA  
mA  
Stand-by Current: CMOS  
RAS, LCAS, UCAS VCC – 0.2V  
Operating Current:  
RAS, LCAS, UCAS,  
Address Cycling, tRC = tRC (min.)  
-35  
-40  
-45  
-50  
-60  
230  
130  
120  
110  
100  
Random Read/Write(2,3,4)  
Average Power Supply Current  
ICC4  
ICC5  
ICC6  
Operating Current:  
RAS = VIL, LCAS, UCAS,  
Cycling tPC = tPC (min.)  
-35  
-40  
-45  
-50  
-60  
220  
90  
85  
80  
70  
mA  
mA  
mA  
EDO Page Mode(2,3,4)  
Average Power Supply Current  
Refresh Current:  
RAS Cycling, LCAS, UCAS VIH  
tRC = tRC (min.)  
-35  
-40  
-45  
-50  
-60  
230  
130  
120  
100  
100  
RAS-Only(2,3)  
Average Power Supply Current  
Refresh Current:  
RAS, LCAS, UCAS Cycling  
tRC = tRC (min.)  
-35  
-40  
-45  
-50  
-60  
230  
130  
120  
100  
100  
CBR(2,3,5)  
Average Power Supply Current  
Notes:  
1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycles (RAS-Only or CBR) before proper device  
operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded.  
2. Dependent on cycle rates.  
3. Specified values are obtained with minimum cycle time and the output open.  
4. Column-address is changed once each EDO page cycle.  
5. Enables on-chip refresh and address counters.  
6
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
08/20/98  
®
IS41C16128  
ISSI  
AC CHARACTERISTICS(1,2,3,4,5,6) (Recommended Operating Conditions unless otherwise noted.)  
-35  
Min. Max.  
-40  
Min. Max.  
-45  
Min. Max.  
-50  
Min. Max.  
-60  
Min. Max. Units  
Symbol Parameter  
tRC  
Random READ or WRITE Cycle Time  
Access Time from RAS(6, 7)  
60  
35  
20  
6
35  
10  
18  
10K  
75  
40  
25  
6
40  
12  
20  
10K  
80  
45  
25  
7
45  
13  
22  
10K  
90  
50  
30  
8
50  
14  
25  
10K  
110  
60  
40  
10  
10  
60  
20  
0
60  
15  
30  
10K  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tRAC  
tCAC  
tAA  
(6, 8, 15)  
Access Time from CAS  
Access Time from Column-Address(6)  
RAS Pulse Width  
tRAS  
tRP  
RAS Precharge Time  
CAS Pulse Width(26)  
tCAS  
tCP  
10K  
10K  
10K  
10K  
10K  
CAS Precharge Time(9, 25)  
CAS Hold Time (21)  
RAS to CAS Delay Time(10, 20)  
Row-Address Setup Time  
Row-Address Hold Time  
Column-Address Setup Time(20)  
Column-Address Hold Time(20)  
5
5
7
8
tCSH  
tRCD  
tASR  
tRAH  
tASC  
tCAH  
tAR  
35  
11  
0
40  
17  
0
45  
18  
0
50  
19  
0
28  
28  
32  
36  
45  
6
6
7
8
10  
0
0
0
0
0
6
6
7
8
10  
40  
Column-Address Hold Time  
(referenced to RAS)  
30  
30  
35  
40  
tRAD  
tRAL  
tRPC  
tRSH  
tCLZ  
tCRP  
tOD  
RAS to Column-Address Delay Time(11)  
Column-Address to RAS Lead Time  
RAS to CAS Precharge Time  
RAS Hold Time(27)  
CAS to Output in Low-Z(15, 29)  
CAS to RAS Precharge Time(21)  
Output Disable Time(19, 28, 29)  
Output Enable Time(15, 16)  
12  
18  
0
20  
15  
10  
12  
20  
0
20  
15  
10  
13  
22  
0
22  
15  
12  
14  
25  
0
25  
15  
15  
15  
30  
0
30  
15  
15  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
8
12  
3
13  
3
14  
3
15  
3
3
5
5
5
5
5
3
3
3
3
3
tOE  
10  
10  
5
10  
10  
5
10  
10  
5
10  
10  
5
10  
10  
5
tOEHC  
tOEP  
tOES  
tRCS  
tRRH  
OE HIGH Hold Time from CAS HIGH  
OE HIGH Pulse Width  
OE LOW to CAS HIGH Setup Time  
Read Command Setup Time(17, 20)  
0
0
0
0
0
Read Command Hold Time  
(referenced to RAS)(12)  
0
0
0
0
0
tRCH  
Read Command Hold Time  
(referenced to CAS)(12, 17, 21)  
0
0
0
0
0
ns  
tWCH  
tWCR  
Write Command Hold Time(17, 27)  
5
6
7
8
10  
50  
ns  
ns  
Write Command Hold Time  
(referenced to RAS)(17)  
30  
30  
35  
40  
tWP  
Write Command Pulse Width(17)  
5
10  
8
6
7
8
10  
10  
15  
15  
0
ns  
ns  
ns  
ns  
ns  
ns  
tWPZ  
tRWL  
tCWL  
tWCS  
tDHR  
WE Pulse Widths to Disable Outputs  
Write Command to RAS Lead Time(17)  
Write Command to CAS Lead Time(17, 21)  
Write Command Setup Time(14, 17, 20)  
Data-in Hold Time (referenced to RAS)  
10  
12  
12  
0
10  
13  
13  
0
10  
14  
14  
0
8
0
30  
30  
35  
40  
40  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
7
08/20/98  
®
IS41C16128  
ISSI  
AC CHARACTERISTICS (Continued)(1,2,3,4,5,6) (Recommended Operating Conditions unless otherwise noted.)  
-35  
-40  
-45  
-50  
-60  
Symbol Parameter  
Min. Max.  
Min. Max.  
Min. Max.  
Min. Max.  
Min. Max. Units  
tACH  
Column-Address Setup Time to CAS  
15  
15  
15  
15  
15  
ns  
Precharge during WRITE Cycle  
tOEH  
OE Hold Time from WE during  
READ-MODIFY-WRITE cycle(18)  
8
8
8
10  
15  
ns  
tDS  
Data-In Setup Time(15, 22)  
Data-In Hold Time(15, 22)  
0
6
0
6
0
7
0
8
0
ns  
ns  
ns  
ns  
tDH  
10  
tRWC  
tRWD  
READ-MODIFY-WRITE Cycle Time  
80  
45  
100  
50  
115  
60  
125  
70  
140  
80  
RAS to WE Delay Time during  
READ-MODIFY-WRITE Cycle(14)  
tCWD  
tAWD  
tPC  
CAS to WE Delay Time(14, 20)  
Column-Address to WE Delay Time(14)  
25  
30  
12  
30  
30  
15  
32  
40  
17  
34  
42  
20  
36  
49  
25  
ns  
ns  
ns  
EDO Page Mode READ or WRITE  
Cycle Time(24)  
tRASP  
tCPA  
RAS Pulse Width in EDO Page Mode  
Access Time from CAS Precharge(15)  
35 100K  
40 100K  
45 100K  
50 100K  
60 100K  
ns  
ns  
ns  
21  
23  
25  
27  
34  
tPRWC  
EDO Page Mode READ-WRITE  
Cycle Time(24)  
40  
45  
46  
47  
56  
tCOH  
tOFF  
Data Output Hold after CAS LOW  
3
3
3
3
3
3
3
3
3
3
ns  
ns  
Output Buffer Turn-Off Delay from  
CAS or RAS(13,15,19, 29)  
15  
15  
15  
15  
15  
tWHZ  
Output Disable Delay from WE  
3
15  
3
15  
3
15  
3
15  
3
15  
ns  
ns  
tCLCH  
Last CAS going LOW to First CAS  
returning HIGH(23)  
10  
10  
10  
10  
10  
tCSR  
tCHR  
tORD  
CAS Setup Time (CBR REFRESH)(30, 20)  
CAS Hold Time (CBR REFRESH)(30, 21)  
8
8
0
10  
10  
0
10  
10  
0
10  
10  
0
10  
10  
0
ns  
ns  
ns  
OE Setup Time prior to RAS during  
HIDDEN REFRESH Cycle  
tREF  
tT  
Refresh Period (512 Cycles)  
Transition Time (Rise or Fall)(2, 3)  
1
8
1
8
1
8
1
8
1
8
ms  
ns  
50  
50  
50  
50  
50  
8
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
08/20/98  
®
IS41C16128  
ISSI  
Notes:  
1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycle (RAS-Only or CBR) before proper device  
operation is assured. The eight RAS cycles wake-up should be repeated any time the tREF refresh requirement is exceeded.  
2. VIH (MIN) and VIL (MAX) are reference levels for measuring timing of input signals. Transition times, are measured between VIH and  
VIL (or between VIL and VIH) and assume to be 1 ns for all inputs.  
3. In addition to meeting the transition rate specification, all input signals must transit between VIH and VIL (or between VIL and VIH)  
in a monotonic manner.  
4. If CAS and RAS = VIH, data output is High-Z.  
5. If CAS = VIL, data output may contain data from the last valid READ cycle.  
6. Measured with a load equivalent to one TTL gate and 50 pF.  
7. Assumes that tRCD tRCD (MAX). If tRCD is greater than the maximum recommended value shown in this table, tRAC will increase by  
the amount that tRCD exceeds the value shown.  
8. Assumes that tRCD tRCD (MAX).  
9. If CAS is LOW at the falling edge of RAS, data out will be maintained from the previous cycle. To initiate a new cycle and clear the  
data output buffer, CAS and RAS must be pulsed for tCP.  
10. Operation with the tRCD (MAX) limit ensures that tRAC (MAX) can be met. tRCD (MAX) is specified as a reference point only; if tRCD  
is greater than the specified tRCD (MAX) limit, access time is controlled exclusively by tCAC.  
11. Operation within the tRAD (MAX) limit ensures that tRCD (MAX) can be met. tRAD (MAX) is specified as a reference point only; if tRAD  
is greater than the specified tRAD (MAX) limit, access time is controlled exclusively by tAA.  
12. Either tRCH or tRRH must be satisfied for a READ cycle.  
13. tOFF (MAX) defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL.  
14. tWCS, tRWD, tAWD and tCWD are restrictive operating parameters in LATE WRITE and READ-MODIFY-WRITE cycle only. If tWCS tWCS  
(MIN), the cycle is an EARLY WRITE cycle and the data output will remain open circuit throughout the entire cycle. If tRWD tRWD  
(MIN), tAWD tAWD (MIN) and tCWD tCWD (MIN), the cycle is a READ-WRITE cycle and the data output will contain data read from  
the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until CAS and RAS or OE go back  
to VIH) is indeterminate. OE held HIGH and WE taken LOW after CAS goes LOW result in a LATE WRITE (OE-controlled) cycle.  
15. Output parameter (I/O) is referenced to corresponding CAS input, I/O0-I/O7 by LCAS and I/O8-I/O15 by UCAS.  
16. During a READ cycle, if OEis LOW then taken HIGH before CASgoes HIGH, I/O goes open. If OEis tied permanently LOW, a LATE  
WRITE or READ-MODIFY-WRITE is not possible.  
17. Write command is defined as WE going low.  
18. LATEWRITEandREAD-MODIFY-WRITEcyclesmusthavebothtOD andtOEH met(OEHIGHduringWRITEcycle)inordertoensure  
that the output buffers will be open during the WRITE cycle. The I/Os will provide the previously written data if CAS remains LOW  
and OE is taken back to LOW after tOEH is met.  
19. The I/Os are in open during READ cycles once tOD or tOFF occur.  
20. The first χCAS edge to transition LOW.  
21. The last χCAS edge to transition HIGH.  
22. These parameters are referenced to CAS leading edge in EARLY WRITE cycles and WE leading edge in LATE WRITE or READ-  
MODIFY-WRITE cycles.  
23. Last falling χCAS edge to first rising χCAS edge.  
24. Last rising χCAS edge to next cycle’s last rising χCAS edge.  
25. Last rising χCAS edge to first falling χCAS edge.  
26. Each χCAS must meet minimum pulse width.  
27. Last χCAS to go LOW.  
28. I/Os controlled, regardless UCAS and LCAS.  
29. The 3 ns minimum is a parameter guaranteed by design.  
30. Enables on-chip refresh and address counters.  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
9
08/20/98  
®
IS41C16128  
ISSI  
READ CYCLE  
t
RC  
t
RAS  
t
RP  
RAS  
t
CSH  
t
RSH  
t
RRH  
t
CRP  
ASR  
t
CAS CLCH  
t
t
RCD  
UCAS/LCAS  
t
AR  
t
RAD  
tRAL  
t
t
RAH  
t
CAH  
t
ASC  
ADDRESS  
WE  
Row  
Column  
Row  
t
RCS  
t
RCH  
t
AA  
t
RAC  
(1)  
OFF  
t
t
CAC  
CLZ  
t
Open  
Open  
Valid Data  
I/O  
OE  
t
OE  
tOD  
t
OES  
Undefined  
Don't Care  
Note:  
1. tOFF is referenced from rising edge of RAS or CAS, whichever occurs last.  
10  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
08/20/98  
®
IS41C16128  
ISSI  
EARLY WRITE CYCLE (OE = DON'T CARE)  
t
RC  
t
RAS  
tRP  
RAS  
t
CSH  
t
RSH  
t
CRP  
ASR  
t
CAS CLCH  
t
t
RCD  
UCAS/LCAS  
ADDRESS  
t
AR  
t
RAD  
t
t
t
RAL  
CAH  
ACH  
t
t
RAH  
t
ASC  
Row  
Column  
Row  
t
t
CWL  
RWL  
t
WCR  
t
WCS  
tWCH  
t
WP  
WE  
I/O  
t
DH  
t
DS  
Valid Data  
Don't Care  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
11  
08/20/98  
®
IS41C16128  
ISSI  
READ WRITE CYCLE (LATE WRITE and READ-MODIFY-WRITE Cycles)  
t
t
RWC  
RAS  
t
RP  
RAS  
t
CSH  
t
RSH  
t
CRP  
ASR  
t
CAS CLCH  
t
t
RCD  
UCAS/LCAS  
t
AR  
t
RAD  
tRAL  
t
t
RAH  
tCAH  
t
ASC  
t
ACH  
ADDRESS  
WE  
Row  
Column  
Row  
t
RWD  
tCWL  
t
RCS  
t
CWD  
t
RWL  
t
AWD  
t
WP  
t
AA  
t
RAC  
t
t
CAC  
CLZ  
t
DS  
tDH  
Open  
Open  
Valid DOUT  
Valid DIN  
I/O  
OE  
t
OD  
tOEH  
t
OE  
Undefined  
Don't Care  
12  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
08/20/98  
®
IS41C16128  
ISSI  
EDO-PAGE-MODE READ CYCLE  
tRASP  
tRP  
tCP  
RAS  
(1)  
tCSH  
tPC  
tRSH  
tCAS,  
tCRP  
tRCD  
tCAS,  
tCP  
tCAS,  
tCLCH  
tCP  
tCLCH  
tCLCH  
UCAS/LCAS  
tAR  
tRAD  
tRAL  
tASR  
tASC  
tCAH tASC  
tCAH tASC  
tCAH  
ADDRESS  
WE  
Row  
Column  
Column  
Column  
Row  
tRAH  
tRRH  
tRCS  
tRCH  
tAA  
tAA  
tAA  
tRAC  
tCPA  
tCPA  
tCAC  
tCLZ  
tCAC  
tCOH  
tCAC  
tCLZ  
tOFF  
Open  
Open  
Valid Data  
Valid Data  
Valid Data  
I/O  
OE  
tOE  
tOES  
tOEHC  
tOE  
tOES  
tOD  
tOD  
tOEP  
Undefined  
Don't Care  
Note:  
1. tPC can be measured from falling edge of CAS to falling edge of CAS, or from rising edge of CAS to rising edge of CAS. Both  
measurements must meet the tPC specifications.  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
13  
08/20/98  
®
IS41C16128  
ISSI  
EDO-PAGE-MODE EARLY-WRITE CYCLE  
t
RASP  
t
RP  
RAS  
t
CSH  
t
PC  
t
RSH  
t
CRP  
t
RCD  
t
CAS,  
t
CP  
t
CAS,  
t
CP  
t
CAS,  
tCP  
t
CLCH  
t
CLCH  
tCLCH  
UCAS/LCAS  
ADDRESS  
t
AR  
tACH  
t
ACH  
t
ACH  
CAH  
t
RAD  
t
RAL  
t
ASR  
t
ASC  
t
CAH  
t
ASC  
t
t
ASC  
t
CAH  
Row  
Column  
Column  
Column  
Row  
t
RAH  
t
CWL  
WCS  
WCH  
t
CWL  
tCWL  
t
t
WCS  
t
WCS  
t
t
WCH  
tWCH  
t
WP  
t
WP  
t
WP  
WE  
t
WCR  
DHR  
tRWL  
t
tDS  
tDS  
tDS  
t
DH  
t
DH  
tDH  
I/O  
OE  
Valid Data  
Valid Data  
Valid Data  
Don't Care  
14  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
08/20/98  
®
IS41C16128  
ISSI  
EDO-PAGE-MODE READ-WRITE CYCLE (LATE WRITE and READ-MODIFY WRITE Cycles)  
tRASP  
tRP  
RAS  
(1)  
tCSH  
tPC / tPRWC  
tRSH  
tCRP  
tASR  
tRCD  
tCAS, tCLCH  
tCP  
tCAS, tCLCH  
tCP  
tCAS, tCLCH  
tCP  
UCAS/LCAS  
ADDRESS  
tAR  
tRAD  
tASC  
tRAL  
tCAH  
tCAH  
tASC  
tCAH  
tASC  
tRAH  
Row  
Column  
Column  
Column  
Row  
tRWD  
tRCS  
tRWL  
tCWL  
tWP  
tCWL  
tWP  
tCWL  
tWP  
tAWD  
tCWD  
tAWD  
tCWD  
tAWD  
tCWD  
WE  
tAA  
tAA  
tCPA  
tAA  
tCPA  
tRAC  
tDH  
tDS  
tDH  
tDS  
tDH  
tDS  
tCAC  
tCLZ  
tCAC  
tCLZ  
tCAC  
tCLZ  
Open  
Open  
I/O  
OE  
DOUT  
DIN  
tOD  
DOUT  
DIN  
tOD  
DOUT  
DIN  
tOD  
tOE  
tOE  
tOE  
tOEH  
Undefined  
Don't Care  
Note:  
1. tPC can be measured from falling edge of CAS to falling edge of CAS, or from rising edge of CAS to rising edge of CAS. Both  
measurements must meet the tPC specifications.  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
15  
08/20/98  
®
IS41C16128  
ISSI  
EDO-PAGE-MODE READ-EARLY-WRITE CYCLE (Psuedo READ-MODIFY WRITE)  
tRASP  
tRP  
RAS  
tCSH  
tPC  
tPC  
tRSH  
tCAS  
tCRP  
tASR  
tRCD  
tCAS  
tCP  
tCAS  
tCP  
tCP  
UCAS/LCAS  
tAR  
tACH  
tRAL  
tRAD  
tASC  
tCAH  
tASC  
tCAH  
tASC  
tCAH  
tRAH  
ADDRESS  
WE  
Row  
Column (A)  
Column (B)  
Column (N)  
Row  
tRCS  
tRCH  
tWCS  
tWCH  
tWHZ  
tAA  
tAA  
tCPA  
tCAC  
tCOH  
tRAC  
tCAC  
tDS  
tDH  
Open  
Open  
I/O  
OE  
Valid Data (A)  
Valid Data (B)  
DIN  
tOE  
Don't Care  
16  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
08/20/98  
®
IS41C16128  
ISSI  
AC WAVEFORMS  
READ CYCLE (With WE-Controlled Disable)  
RAS  
tCSH  
tCRP  
tASR  
tRCD  
tCP  
tCAS  
UCAS/LCAS  
tAR  
tRAD  
tRAH  
tCAH  
tRCH  
tASC  
tRCS  
tASC  
ADDRESS  
WE  
Row  
Column  
Column  
tRCS  
tAA  
tWPZ  
tWHZ  
tRAC  
tCAC  
tCLZ  
tCLZ  
Open  
Open  
Valid Data  
I/O  
OE  
tOE  
tOD  
Undefined  
Don't Care  
RAS-ONLY REFRESH CYCLE (OE, WE = DON'T CARE)  
t
RC  
t
RAS  
tRP  
RAS  
t
CRP  
t
RPC  
UCAS/LCAS  
t
ASR  
tRAH  
ADDRESS  
I/O  
Row  
Row  
Open  
Don't Care  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
17  
08/20/98  
®
IS41C16128  
ISSI  
CBR REFRESH CYCLE (Addresses; WE, OE = DON'T CARE)  
t
RP  
t
RAS  
t
RP  
tRAS  
RAS  
t
CHR  
tCHR  
t
RPC  
CP  
tRPC  
t
t
CSR  
t
CSR  
UCAS/LCAS  
I/O  
Open  
HIDDEN REFRESH CYCLE (WE = HIGH; OE = LOW)(1)  
t
RAS  
t
RAS  
t
RP  
RAS  
t
CRP  
t
RCD  
t
RSH  
tCHR  
UCAS/LCAS  
t
AR  
t
RAD  
t
RAL  
t
ASR  
t
RAH  
tCAH  
t
ASC  
ADDRESS  
Row  
Column  
t
AA  
t
RAC  
(2)  
OFF  
t
t
CAC  
t
CLZ  
Open  
Open  
Valid Data  
I/O  
OE  
t
OE  
tOD  
t
ORD  
Undefined  
Don't Care  
Notes:  
1. A Hidden Refresh may also be performed after a Write Cycle. In this case, WE = LOW and OE = HIGH.  
2. tOFF is referenced from rising edge of RAS or CAS, whichever occurs last.  
18  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
08/20/98  
®
IS41C16128  
ISSI  
400-MIL PLASTIC SOJ  
Package Code: K  
N
E1  
E
1
SEATING PLANE  
D
A
b
C
A2  
e
B
A1  
E2  
400-mil Plastic SOJ (K)  
Inches Millimeters  
Symbol Min  
Max  
Min  
Max  
Ref. Std.  
N
40  
A
0.025  
0.082  
0.144  
0.66  
2.08  
3.66  
A1  
A2  
B
b
C
D
E
E1  
E2  
e
Notes:  
0.015 0.019  
0.026 0.032  
0.007 0.013  
1.020 1.030  
0.430 0.450  
0.395 0.405  
0.346 0.386  
0.050 BSC  
0.38 0.48  
0.66 0.81  
0.18 0.33  
25.91 26.16  
10.92 11.43  
10.03 10.28  
8.79 9.80  
1.27 BSC  
1. Controlling dimension: inches, unless otherwise specified.  
2. BSC = Basic lead spacing between centers.  
3. Dimensions D and E1 do not include mold flash protru-  
sions and should be measured from the bottom of the  
package  
.
4. Formed leads shall be planar with respect to one another  
within 0.004 inches at the seating plane.  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
19  
08/20/98  
®
IS41C16128  
ISSI  
PLASTIC TSOP  
Package Code: T (Type 2)  
N
N/2+1  
H
E
1
N/2  
D
SEATING PLANE  
A
L
α
e
B
C
A1  
Plastic TSOP (T - Type II)  
Inches Millimeters  
Symbol Min Max Min Max  
Notes:  
1. Controlling dimension: inches, unless otherwise specified.  
2. BSC = Basic lead spacing between centers.  
Ref. Std.  
3. Dimensions D and E do not include mold flash protrusions  
N
A
A1  
B
C
D
E
e
40/44  
and should be measured from the bottom of the package  
4. Formed leads shall be planar with respect to one another  
within 0.004 inches at the seating plane.  
.
0.039 0.047  
0.002 0.008  
0.012 0.016  
0.0047 0.0083  
0.721 0.729  
0.462 0.470  
0.0315 BSC  
0.396 0.404  
0.017 0.023  
1.00 1.20  
0.05 0.20  
0.30 0.40  
0.12 0.21  
18.313 18.517  
11.735 11.938  
0.800 BSC  
H
L
10.058 10.262  
0.432 0.584  
α
0°  
5°  
0°  
5°  
20  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
08/20/98  
®
IS41C16128  
ISSI  
ORDERING INFORMATION  
Commercial Range: 0°C to 70°C  
Speed (ns) Order Part No.  
Package  
35  
35  
IS41C16128-35K  
IS41C16128-35T  
400-mil SOJ  
400-mil TSOP (Type 2)  
40  
40  
IS41C16128-40K  
IS41C16128-40T  
400-mil SOJ  
400-mil TSOP (Type 2)  
45  
45  
IS41C16128-45K  
IS41C16128-45T  
400-mil SOJ  
400-mil TSOP (Type 2)  
50  
50  
IS41C16128-50K  
IS41C16128-50T  
400-mil SOJ  
400-mil TSOP (Type 2)  
60  
60  
IS41C16128-60K  
IS41C16128-60T  
400-mil SOJ  
400-mil TSOP (Type 2)  
Industrial Range: –40°C to 85°C  
Speed (ns) Order Part No.  
Package  
35  
35  
IS41C16128-35KI  
IS41C16128-35TI  
400-mil SOJ  
400-mil TSOP (Type 2)  
40  
40  
IS41C16128-40KI  
IS41C16128-40TI  
400-mil SOJ  
400-mil TSOP (Type 2)  
45  
45  
IS41C16128-45KI  
IS41C16128-45TI  
400-mil SOJ  
400-mil TSOP (Type 2)  
50  
50  
IS41C16128-50KI  
IS41C16128-50TI  
400-mil SOJ  
400-mil TSOP (Type 2)  
60  
60  
IS41C16128-60KI  
IS41C16128-60TI  
400-mil SOJ  
400-mil TSOP (Type 2)  
®
ISSI  
Integrated Silicon Solution, Inc.  
2231 Lawson Lane  
Santa Clara, CA 95054  
Fax: (408) 588-0806  
Toll Free: 1-800-379-4774  
email: sales@issi.com  
http://www.issi.com  
Integrated Silicon Solution, Inc.  
PRELIMINARY DR002-1D  
21  
08/20/98  
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