JAN2N4235应用文章市场行情现货热卖使用介绍供应商报价-中国IC网-芯三七

This is an advance copy of the dated document. The final document from Defense Automated Printing Service may be slightly

different in format due to electronic conversion processes. Actual technical content will be the same.

The documentation process conversion

measures necessary to comply with this

revision shall be completed by 2 February 1999

INCH-POUND

MIL-PRF-19500/580A

2 November 1998

SUPERSEDING

MIL-S-19500/580

23 April 1990

PERFORMANCE SPECIFICATION SHEET

SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON AMPLIFIER,

TYPES 2N4234, 2N4335 AND 2N4236 JAN, JANTX AND JANTXV

This specification is approved for use by all Depart-

ments and Agencies of the Department of Defense.

1. SCOPE

1.1 Scope. This specification covers the performance requirements for PNP , silicon, amplifier transistor. Three levels of product

.

assurance are provided for each device type as specified in MIL-PRF-19500

1.2 Physical dimensions. See figure 1, TO-39.

1.3 Maximum ratings. Unless otherwise specified, T = +25°C.

A

Type

P

T

1/

P

T

V

CBO

V

CEO

V

EBO

I

C

I

B

T

and T

STG

op

T

= +25°C T = +25°C

C

A

1/

2/

W

V dc

A dc

°C

2N4234

2N4235

2N4236

1.0

6.0

40

60

80

40

60

80

7.0

1.0

0.5

-65 to +200

1/ Derate linearly 5.7 mW/°C for T > +25°C;

A

1/ Derate linearly 34mW/°C for T > +25°C;

C

1.4 Primary electrical characteristics at T = +25°C.

A

h

FE

at V

CE = 1.0 V dc 1/

V

CE(sat)1 1/

V

BE(sat)2 1/

I

C = 1.0 A dc

/h

fe

f = 10 MHz

/

C

obo

f = 100 kHz

Limits

R

qJC

I

C = 1.0 A dc

max

I

B = 0.1 A dc

V

h

FE3

B = 0.1 A dc

CE = 10 V dc CB = 10 V dc

I

FE1

FE2

I

C

= 100 mA dc I = 250 mA dc I = 500 mA dc

C C

CE = 100 mA dc

E = 0

pF

°C

29

V dc

1.5

Min

Max

40

30

150

20

3.0

100

0.6

1/ Pulsed, see 4.5.1.

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this

document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street,

Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end

of this document or by letter.

AMSC N/A

FSC 5961

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

MIL-PRF-19500/580A

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include

documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has

been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements

documents cited in sections 3 and 4 of this specification, whether or not they are listed.

2.2 Government documents.

2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document

to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department

of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-19500

STANDARD

MILITARY

MIL-STD-750

- Semiconductor Devices, General Specification for.

-

Test Methods for Semiconductor Devices.

(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for

related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,

however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing

on the applicable qualified products list before contract award (see 4.2 and 6.3).

3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in

MIL-PRF-19500 and as follows.

3.3 Interface requirements and physical dimensions. The interface requirements and physical dimensions shall be as specified in

MIL-PRF-19500 and on figure 1 (TO-39) herein.

3.3.1 Lead material and finish. Lead material shall be Kovar or Alloy 52 for the TO - 39; a copper core or plated core is permitted.

Lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead material or finish is

desired, it shall be specified in the acquisition document (see 6.5).

3.4 Marking. Marking shall be in accordance with MIL-PRF-19500.

3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as

specified in 1.3, 1.4, and table I herein.

3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and 4.4.3 herein.

2

MIL-PRF-19500/580A

Symbol

Dimensions

Millimeters

Notes

(see

Inches

note 3)

Min

Max

.355

.260

.370

Min

7.75

6.10

8.51

Max

8.51

6.60

9.39

CD

CH

HD

LC

LD

LL

.305

.240

.335

.200 BSC

5.08 BSC

10

.016

.500

.016

- - -

.021

.750

.019

.050

0.41

12.70

0.41

- - -

0.53

19.05

0.48

10, 11

11, 12

LU

1.27

L

1

L

2

.250

- - -

6.35

- - -

11, 12

P

.100

- - -

2.54

- - -

9

8

Q

.050

1.27

r

TL

.010

.045

0.25

1.14

13

7

.029

.028

0.74

0.72

TW

a

.034

0.86

6

45° BSC

10

Term 1

Term 2

Term 3

Emitter

Base

Collector

NOTES:

1. Dimensions are in inches.

2. Metric equivalents are given in parentheses for general

information only.

3. Refer to applicable symbol list.

4. The US Government preferred system of measurement is

the metric SI system. However, this item was originally

designed using inch-pound units of measurement. In the

event of a conflict between the metric and inch-pound

units, the inch-pound units shall take precedence.

5. Lead number 1 is the emitter, lead number 2 is the

base, lead number 4 is omitted from this outline. The collector is number 3 and is electrically connected to the case.

6. Beyond r (radius) max, TW shall be held for a minimum length of 0.011 inch (0.28 mm).

7. TL measured from maximum HD.

8. Outline in this zone is not controlled.

9. CD shall not vary more than 0.010 inch (0.25 mm) in zone P. This zone is controlled for automatic handling.

10. Leads at gauge plane 0.054 + 0.001 - 0.000 inch (1.37 +0.03 - 0.00 mm) below seating plane shall be within 0.007 inch (0.18

mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC.

11. LU applies between L and L . LD applies between L and LL minimum. Diameter is uncontrolled in L and beyond LL

1

2

1

minimum.

12. All three leads.

13. r (radius) applies to both inside corners of tab.

FIGURE 1. Physical dimensions for (TO-39).

3

MIL-PRF-19500/580A

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

a. Qualification inspection (see 4.2).

b. Screening (see 4.3)

c. Conformance inspection (see 4.4).

4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.

4.2.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-PRF-19500 and table III herein.

4.3 Screening (JANS, JANTX and JANTXV levels only). Screening shall be in accordance with MIL-PRF-19500 (Appendix E, table

IV), and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits

of table I herein shall not be acceptable.

Screen (see appendix E,

Measurement

table IV of MIL-PRF-19500)

JANTX and JANTXV level

1/

Method 3131 (see 4.3.2)

11

I

, and h

FE2

CBO

12

13

See 4.3.1

Subgroup 2 of table I herein

DI

= 100 percent of initial value, or 10 nA dc

whichever is greater;

CBO

Dh

FE2

= ± 15percent of initial value.

1/ Shall be performed anytime before screen 10.

4.3.1 Power burn-in conditions. Power burn-in conditions are as follows:

V

CB

³ 20 V dc; P 1.0 W at T + + 30 °C ± 5°C.

T A

NOTE: No heat sink or forced air cooling on the devices shall be permitted.

4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as specified herein.

Alternate flow is allowed for quality conformance inspection in accordance with appendix E of MIL-PRF-19500.

4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of MIL-PRF-19500. End-

point electrical measurements shall be in accordance with table III herein.

4

MIL-PRF-19500/580A

4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in

appendix E, table VIa (JANS) and table VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500, and herein. Electrical measurements

(end-points) and delta requirements shall be in accordance with table III herein.

4.4.2.1 Group B inspection, appendix E, table VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500.

Subgroup

B3

Method

1051

Condition

³ 10 V dc; P = 1.0 W; T = + 30 °C ± 5°C. No heat sink nor forced-air cooling

V

CB

T

A

on the device shall be permitted.

4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in

appendix E, table VII of MIL-PRF-19500 and as follows. Electrical measurements (end-points) and delta requirements shall be in

accordance with table III herein.

Subgroup

C2

Method

2036

Condition

Test condition E.

C6

1026

V ³ 10 V dc; P = 1.0 W; T = + 30 °C ± 5°C. No heat sink nor forced-air cooling

CB T A

on the device shall be permitted.

4.4.4 Group E Inspection. Group E inspection shall be conducted in accordance with appendix E, table IX of MIL-PRF-19500 and

table II herein. . Electrical measurements (end-points) and delta requirements shall be in accordance with table III herein.

4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.

4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.

4.5.2 Thermal response( DV measurement). The DV measurement shall be performed in accordance with method 3131 of MIL-

BE

STD-750. The DV

conditions and maximum V

limit shall be derived by each vendor. The chosen DV

measurement and

BE

conditions for each device in the qualification lot and read and record measurements shall be submitted in the qualification report and a

thermal response curve shall be plotted. The chosen V values shall be considered final after the manufacturer has had the opportunity

BE

to test five consecutive lots. The following measurements shall apply:

a. Measuring current (I

)

M

5 mA.

........................................................

b. Measurement voltage (V

)

20 V (same as V ).

H

.................................................

...............................................

CE

c. Collector heating current (I )

200 mA (minimum for).

H

d. Collector-emitter heating voltage

20 V (minimum).

1200 ms.

...........................................

e. Heating time (t )

...................................................................

H

f.

Measurement time delay (t

)

5 ms.

............................................

MD

Sample window time (t

SW

)

10 ms maximum.

..................................................

5

MIL-PRF-19500/580A

4.5.3 Thermal resistance. Thermal resistance measurements shall be conducted in accordance with method 3131 of MIL-STD-750.

Maximum limit of R_QJCshall be 29°C/W. The following test conditions shall apply:

a. Heating power shall be chosen such that the calculated junction to reference point temperature difference is greater than

+50°C.

b.

c.

Collector to emitter voltage magnitude shall be 20 V dc.

Reference temperature measuring point shall be the case.

d.

e.

Reference point temperature shall be + 25°C £ T £ +35°C and recorded before the test is started.

R

Mounting arrangement shall be with heat sink to case.

f.

Maximum limit shall be R_QJC= 29°C/W.

6

MIL-PRF-19500/580A

TABLE I. Group A inspection.

Inspection 1/

Subgroup 1

MIL-STD-750

Conditions

Symbol

Limits

Unit

Method

2071

Min

Max

Visual and mechanical

inspection

Subgroup 2

Breakdown voltage

collector to emitter

2N4234

2N4235

2N4236

3011

3041

Bias condition D, pulsed (see 4.5.1)

V

Vdc

(BR)CEO

I

C

= 100 mA dc

40

60

80

Collector emitter cutoff

current

2N4234

2N4235

2N4236

Bias condition D

I

1.0

mA dc

CEO

V

CE = 30 V dc

CE = 40 V dc

CE = 60 V dc

Collector emitter cutoff

current

2N4234

2N4235

2N4236

3041

3036

Bias condition A, V

BE = 1.5 V dc

I

100

nA dc

CEX1

V

CE = 40 V dc

CE = 60 V dc

CE = 80 V dc

Collector to baser cutoff

current

2N4234

2N4235

2N4236

Bias condition D

I

100

0.5

nA dc

CBO

V

CE = 40 V dc

CE = 60 V dc

CE = 80 V dc

Emitter to base cutoff

current

3061

3076

3071

Bias condition D, V

BE = 7 V dc

I

mA dc

EBO

Forward current transfer

ratio

Pulsed (see 4.5.1), I = 100 mA dc V

C

CE = 1.0 V dc

40

30

20

h

FE1

Forward current transfer

ratio

Pulsed (see 4.5.1), I = 250 mA dc V

C

CE = 1.0 V dc

150

h

FE2

Forward current transfer

ratio

Pulsed (see 4.5.1), I = 500 mA dc V

C

CE = 1.0 V dc

h

FE3

Collector to emitter voltage

(saturated

Pulsed (see 4.5.1), I = 1.0 A dc

V

0.6

0.4

V dc

C

CE(sat)1

CE(sat)2

I

B

= 100 mA dc

Collector to emitter voltage

(saturated

3071

Pulsed (see 4.5.1), I = 500 mA dc

C

I

B

= 50 mA dc

See footnote at end of table.

7

MIL-PRF-19500/580A

TABLE I. Group A inspection - Continued.

Inspection 1/

MIL-STD-750

Conditions

Symbol

Limits

Unit

Method

Min

Max

Subgroup 2 Continued

Base emitter voltage

3066

Test condition A, pulsed (see 4.5.1) ), I

= 500 mA dc , I = 50 mA dc

V

1.1

1.5

V dc

BE(sat)1

C

B

Base emitter voltage

Test condition A, pulsed (see 4.5.1) ), I

= 1.0 A dc , I = 100 mA dc

V

BE(sat)2

C

B

Subgroup 3

High-temperature

operation:

T = +150°C

A

Collector to emitter cutoff

current

2N4234

2N4235

2N4236

3041

Bias condition A, V

BE = 1.5 V dc

I

1.0

mA dc

CEX2

V

CE = 30 V dc

CE = 40 V dc

CE = 60 V dc

Low-temperature

operation:

T

= -55°C

A

Forward current transfer

ratio

3076

Pulsed (see 4.5.1), I = 250 mA dc

15

3

h

C

FE4

V

CE = 1.0 V dc

Subgroup 4

|h

|

FE

Magnitude of small-signal

short-circuit forward-current

transfer ratio

3306

3236

I

C

= 100 mA dc, V

CE = 10 V dc,

f = 10 MHz

Open circuit output

capacitance

I

E

= 0, V

CB = 10 V dc,

100

pF

C

obo

f = 100 MHz

Subgroup 5

Safe operating area

(continuous dc)

3051

T

= +25°C; t ³ 0.5 s, 1 cycle.

C

Test 1

I

= 1.0 A dc, V

CE = 6 V dc,

C

Test 2

I

= 500 mA dc, V

CE = 12 V dc,

See footnote at end of table.

8

MIL-PRF-19500/580A

TABLE I. Group A inspection - Continued.

Inspection 1/

MIL-STD-750

Conditions

Symbol

Limits

Min Max

Unit

Method

Subgroup 5 - Continued

Test 3

I

= 166 mA dc, V

= 100 mA dc, V

C

CE = 30 V dc,

2N4234

C

CE = 50 V dc,

2N4235

I

C

= 71 mA dc, V

2N4236

CE = 70 V dc,

End point electricals

See table III, steps 1, 2, 3 and 4

Subgroups 6 and 7

Not applicable

1/ For sampling plan, see MIL-PRF-19500.

9

MIL-PRF-19500/580A

TABLE II. Group E inspection (all quality levels) for qualification only.

MIL-STD-750

Qualification

and large lot

quality

Inspection

Method

Conditions

conformance

inspection

Subgroup 1

22 devices

c = 0

Thermal shock

(glass strain)

1056

1071

0°C to + 100°C, 100 cycles

Hermetic seal

Fine leak

Gross leak

Electrical measurements

Subgroup 2

See table III, steps 1, 2, 3, 4, 5 and 6

32 devices

c = 0

High temperature reverse bias

Electrical measurements

1039

Test condition A, 1,000 hours

See table III, steps 1, 2, 3 and 4

Subgroup 3

DPA

3 devices

c = 0

2102

3161

Subgroup 4

22 devices

c = 0

Thermal resistance

Subgroup 5

R

= 29 °C/W maximum. See 4.5.3

qJC

Not applicable

10

MIL-PRF-19500/580A

TABLE III. Groups A, B, C, and E electrical measurements. 1/ 2/ 3/

Step

1.

Inspection

MIL-STD-750

Conditions

Bias condition D

Symbol

Limits

Unit

Method

3036

Min

Max

100

Collector to base cutoff

current

nA dc

I

CBO

2N4234

2N4235

2N4236

V

CB

V

CB

V

CB

= 40 V dc

= 60 V dc

= 80 V dc

2.

3.

Collector to emitter voltage

(saturated)

3071

3066

Pulsed (see 4.5.1)

0.4

1.1

V dc

V

CE(sat)

I

C

I

B

= 500 mA dc

= 50 mA dc

2

Base emitter voltage

(saturated)

Test condition A, pulsed (see

4.5.1)

BE(sat)1

I

C

I

B

= 500 mA dc

= 50 mA dc

4.

5.

Forward current transfer

ratio

3076

3036

30

150

I

= 250 mA dc

h

FE2

C

V

= 1.0 V dc;

CE

Pulsed (see 4.5.1)

Collector to base cutoff

current

Bias condition D

100 percent of initial value or 10 nA

dc whichever is greater.

DI

CBO

1/

2N4234

2N4235

2N4236

V

CB

V

CB

V

CB

= 40 V dc

= 60 V dc

= 80 V dc

6.

Forward current transfer

ratio

3076

± 25 percent change from initial

recorded value.

I

= 250 mA dc

Dh

FE2

1/

C

V

= 1.0 V dc;

CE

Pulsed (see 4.5.1)

1/ Devices which exceed the group A limits for this test shall not be shipped.

2/ The electrical measurements for appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500 are as follows:

a. Subgroup 2, see table III herein, steps 1, 2, 3, and 4.

b. Subgroup 3, see table III herein, steps 1, 2, 3, 4, 5, and 6.

c. Subgroup 6, see table III herein, steps 1, 2, 3, 4, 5, and 6.

3/ The electrical measurements for appendix E, table VII of MIL-PRF-19500 are as follows:

a. Subgroup 2, see table III herein, steps 1, 2, 3, and 4.

b. Subgroup 3, see table III herein, steps 1, 2, 3, and 4.

c. Subgroup 6, see table III herein, steps 1, 2, 3, 4, 5, and 6.

11

MIL-PRF-19500/580A

5. PACKAGING

5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When

actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to

ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points' packaging activity

within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging data retrieval is

available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or by contacting

the responsible packaging activity.

5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-PRF-19500.

6. NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)

6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification.

6.2 Acquisition requirements. See MIL- PRF-19500.

6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of

award of contract, qualified for inclusion in Qualified Products List QPL No.19500 whether or not such products have actually been so

listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the

products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded

contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be

obtained from Defense Supply Center Columbus, ATTN: DSCC-VQE, 3990 East Broad Street, Columbus, OH 43216-5000.

6.4 Application guidance. The following NPN type transistor is complementary to the PNP device listed herein.

NPN

PNP

2N4237

2N4238

2N4239

2N4234

2N4235

2N4236

6.5 Substitution information. Devices covered by this specification are substitutable for the manufacturer's and user's Part or

Identifying Number (PIN). This information in no way implies that manufacturer's PIN's are suitable for the military PIN.

Military PIN

Manufacturer’s

CAGE Code

04713

Manufacturer’s and

user’s PIN

2N4234

JAN2N4234 or

JANTX2N4234 or

JANTXV2N4234

ST1054H

JAN2N4235 or

JANTX2N4235 or

JANTXV2N4235

04713

2N4235

ST1351H

JAN2N4235 or

JANTX2N4235 or

JANTXV2N4235

2N4236

ST1374H

ST1559H

ST1711H

ST347H

ST675H10

ST675H11

ST675H12

ST688H

ST801H

ST831H

12

MIL-PRF-19500/580A

6.6 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous

issue due to the extensiveness of the changes.

Custodians:

Army - CR

Navy - EC

Preparing activity:

DLA - CC

Air Force - 17

NASA - NA

(Project 5961-2028)

Review activities:

Army - AR, MI, SM

Air Force - 11, 13, 19, 85

Navy - AS, CG, MC, OS

13

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