1N6626US thru 1N6631US
VOIDLESS-HERMETICALLY-SEALED
SURFACE MOUNT ULTRA FAST
RECOVERY GLASS RECTIFIERS
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-
19500/590 and is ideal for high-reliability applications where a failure cannot be
tolerated. These industry-recognized 2.0 to 4.0 Amp rated rectifiers for working
peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-
glass construction using an internal “Category I” metallurgical bond. These devices
are also available in axial-leaded packages for thru-hole mounting (see separate
data sheet for 1N6626 thru 1N6631). Microsemi also offers numerous other rectifier
products to meet higher and lower current ratings with various recovery time speed
requirements including standard, fast and ultrafast device types in both through-hole
and surface mount packages.
Package “E”
or D-5B
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
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Surface mount series equivalent to the JEDEC registered
1N6626 to 1N6631 series
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Ultrafast recovery rectifier series 200 to 1000 V
Military and other high-reliability applications
Switching power supplies or other applications
requiring extremely fast switching & low forward
loss
High forward surge current capability
Low thermal resistance
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Voidless hermetically sealed glass package
Extremely robust construction
Triple-layer passivation
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Internal “Category I” Metallurgical bonds
JAN, JANTX, and JANTXV available per MIL-PRF-
19500/590
Controlled avalanche with peak reverse power
capability
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Further options for screening in accordance with MIL-
PRF-19500 for JANS by using a “MSP” prefix, e.g.
MSP6626US, MSP6629US, etc.
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Inherently radiation hard as described in Microsemi
MicroNote 050
Axial-leaded equivalents also available (see separate data
sheet for 1N6626 thru 1N6631)
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
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Junction Temperature: -65oC to +175oC
Storage Temperature: -65oC to +175oC
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CASE: Hermetically sealed voidless hard glass
with Tungsten slugs
Peak Forward Surge Current @ 25oC: 75A (except
1N6631 which is 60A)
Note: Test pulse = 8.3ms, half-sine wave.
Average Rectified Forward Current (IO) at TEC = +110oC:
TERMINATIONS: End caps are Copper with
Tin/Lead (Sn/Pb) finish. Note: Previous
inventory had solid Silver end caps with
Tin/Lead finish.
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MARKING: Cathode band only
POLARITY: Cathode indicated by band
Tape & Reel option: Standard per EIA-481-B
Weight: 539 mg
1N6626US thru 1N6628US
1N6629US thru 1N6631US
4.0 A
2.8 A
(Derate linearly at 1.5%/oC for TEC > +110oC)
Average Rectified Forward Current (IO) at TA=25oC:
See package dimensions and recommended
pad layout on last page
1N6626US thru 1N6628US
1N6629US thru 1N6631US
1.55 A
1.15 A
(Derate linearly at 0.67%/ oC for TA>+25oC. This IO rating
is for PC boards where thermal resistance from mounting
point to ambient is sufficiently controlled where TJ(max) is
not exceeded. See latest issue of MIL-PRF-19500/590)
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Thermal Resistance junction to endcap (RθJEC): 10oC/W
Capacitance at VR= 10 V: 40 pF
Solder temperature: 260oC for 10 s (maximum)
Copyright © 2007
6-07-2007 REV D
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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