JM38510/01203BEA全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

SN54122, SN54123, SN54130, SN54LS122, SN54LS123,

SN74122, SN74123, SN74130, SN74LS122, SN74LS123

RETRIGGERABLE MONOSTABLE MULTIVIBRATORS

SDLS043 – DECEMBER 1983 – REVISED MARCH 1988

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54122, SN54123, SN54130, SN54LS122, SN54LS123,

SN74122, SN74123, SN74130, SN74LS122, SN74LS123

RETRIGGERABLE MONOSTABLE MULTIVIBRATORS

SDLS043 – DECEMBER 1983 – REVISED MARCH 1988

2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54122, SN54123, SN54130, SN54LS122, SN54LS123,

SN74122, SN74123, SN74130, SN74LS122, SN74LS123

RETRIGGERABLE MONOSTABLE MULTIVIBRATORS

SDLS043 – DECEMBER 1983 – REVISED MARCH 1988

3

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54122, SN54123, SN54130, SN54LS122, SN54LS123,

SN74122, SN74123, SN74130, SN74LS122, SN74LS123

RETRIGGERABLE MONOSTABLE MULTIVIBRATORS

SDLS043 – DECEMBER 1983 – REVISED MARCH 1988

4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54122, SN54123, SN54130, SN74122, SN74123, SN74130

RETRIGGERABLE MONOSTABLE MULTIVIBRATORS

SDLS043 – DECEMBER 1983 – REVISED MARCH 1988

5

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54LS122, SN54LS123, SN74LS122, SN74LS123

RETRIGGERABLE MONOSTABLE MULTIVIBRATORS

SDLS043 – DECEMBER 1983 – REVISED MARCH 1988

6

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54122, SN54123, SN54130, SN74122, SN74123, SN74130

RETRIGGERABLE MONOSTABLE MULTIVIBRATORS

SDLS043 – DECEMBER 1983 – REVISED MARCH 1988

7

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54LS122, SN54LS123, SN74LS122, SN74LS123

RETRIGGERABLE MONOSTABLE MULTIVIBRATORS

SDLS043 – DECEMBER 1983 – REVISED MARCH 1988

8

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54LS122, SN54LS123, SN74LS122, SN74LS123

RETRIGGERABLE MONOSTABLE MULTIVIBRATORS

SDLS043 – DECEMBER 1983 – REVISED MARCH 1988

9

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CDIP

CFP

Drawing

5962-7603901VEA

5962-7603901VFA

7603901EA

ACTIVE

OBSOLETE

ACTIVE

OBSOLETE

ACTIVE

J

W

J

16

20

16

14

16

14

16

1

None

Call TI

Level-NC-NC-NC

Call TI

CDIP

CFP

7603901FA

W

J

JM38510/01203BEA

JM38510/31401B2A

JM38510/31401BEA

JM38510/31401BFA

SN54122J

CDIP

LCCC

CDIP

CFP

FK

J

W

J

CDIP

PDIP

SN54123J

J

1

Level-NC-NC-NC

Call TI

SN54LS123J

J

SN74122N

N

SN74123N

25

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74123N3

OBSOLETE

ACTIVE

PDIP

SOIC

N

D

16

14

None

Call TI Call TI

SN74LS122D

50

2500

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74LS122DR

SN74LS122N

ACTIVE

SOIC

PDIP

D

N

14

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS122N3

OBSOLETE

ACTIVE

PDIP

SO

N

14

None

Call TI

SN74LS122NSR

NS

2000

40

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74LS123D

ACTIVE

SOIC

D

16

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74LS123DR

2500

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74LS123J

SN74LS123N

OBSOLETE

ACTIVE

CDIP

PDIP

J

16

None

Call TI

N

25

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS123N3

OBSOLETE

ACTIVE

PDIP

SO

N

16

None

Call TI

SN74LS123NSR

NS

2000

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SNJ54122J

SNJ54123J

OBSOLETE

ACTIVE

CDIP

CFP

J

14

16

20

16

None

Call TI

1

Level-NC-NC-NC

SNJ54123W

W

FK

J

SNJ54LS123FK

SNJ54LS123J

SNJ54LS123W

LCCC

CDIP

CFP

W

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for

such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

product or service voids all express and any implied warranties for the associated TI product or service and

is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

Audio

Amplifiers

amplifier.ti.com

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DSP

dsp.ti.com

Broadband

Digital Control

Military

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Interface

Logic

interface.ti.com

logic.ti.com

Power Mgmt

Microcontrollers

power.ti.com

Optical Networking

Security

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

microcontroller.ti.com

Telephony

Video & Imaging

Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

型号:	JM38510/01203BEA
Brand Name：	Texas Instruments
生命周期：	Active
零件包装代码：	DIP
包装说明：	DIP,
针数：	16
Reach Compliance Code：	not_compliant
HTS代码：	8542.39.00.01
风险等级：	5.14
Is Samacsys：	N
系列：	TTL/H/L
JESD-30 代码：	R-GDIP-T16
长度：	19.56 mm
逻辑集成电路类型：	MONOSTABLE MULTIVIBRATOR
最大I（ol）：	0.016 A
数据/时钟输入次数：	2
功能数量：	2
端子数量：	16
最高工作温度：	125 °C
最低工作温度：	-55 °C
输出极性：	COMPLEMENTARY
封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	DIP
封装形状：	RECTANGULAR
封装形式：	IN-LINE
峰值回流温度（摄氏度）：	NOT SPECIFIED
传播延迟（tpd）：	40 ns
认证状态：	Not Qualified
筛选级别：	MIL-M-38510 Class B
座面最大高度：	5.08 mm
最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	4.5 V
标称供电电压 (Vsup)：	5 V
表面贴装：	NO
技术：	TTL
温度等级：	MILITARY
端子形式：	THROUGH-HOLE
端子节距：	2.54 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	7.62 mm
Base Number Matches：	1

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