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产品型号JM38510/08101BCA的概述

芯片 JM38510/08101BCA 概述 JM38510/08101BCA 是一种专用集成电路(IC),主要用于特定的军事与航空航天应用。该芯片最初设计用于满足军事环境下的高可靠性和高稳定性的需求,同时也可应用于其他高要求的电子设备中。该芯片的设计目标是包括耐高温、抗辐射以及长寿命等特性,确保在极端条件下的性能稳定。 芯片 JM38510/08101BCA 的详细参数 JM38510/08101BCA 的技术参数及特性如下: 1. 电源电压:该芯片能够在多个电压范围内运行,一般工作电压为5V±10%,并具备良好的电源噪声抑制能力。 2. 工作温度范围:该芯片可在人造环境中工作,工作温度范围为-55°C到+125°C,这使得其在极端气候下依然表现良好。 3. 封装类型:JM38510/08101BCA 通常采用DIP(双列直插封装)封装形式,便于在电路板上进行焊接和安装。 4...

产品型号JM38510/08101BCA的Datasheet PDF文件预览

SN54S140, SN74S140  
DUAL 4-INPUT POSITIVE-NAND 50-OHM LINE DRIVERS  
SDLS210 – DECEMBER 1983 – REVISED MARCH 1988  
Copyright 1988, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54S140, SN74S140  
DUAL 4-INPUT POSITIVE-NAND 50-OHM LINE DRIVERS  
SDLS210 – DECEMBER 1983 – REVISED MARCH 1988  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54S140, SN74S140  
DUAL 4-INPUT POSITIVE-NAND 50-OHM LINE DRIVERS  
SDLS210 – DECEMBER 1983 – REVISED MARCH 1988  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CFP  
Drawing  
JM38510/08101BCA  
JM38510/08101BDA  
JM38510/08101BDA  
SN54S140J  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
W
W
J
14  
14  
14  
14  
14  
14  
1
1
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
CFP  
CDIP  
CDIP  
SOIC  
SN54S140J  
J
SN74S140D  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S140D  
SN74S140DE4  
SN74S140DE4  
SN74S140DR  
SN74S140DR  
SN74S140DRE4  
SN74S140DRE4  
SN74S140N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
D
D
D
D
D
D
D
N
N
14  
14  
14  
14  
14  
14  
14  
14  
14  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74S140N  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74S140N3  
SN74S140N3  
SN74S140NE4  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
PDIP  
N
N
N
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74S140NE4  
SN74S140NSR  
SN74S140NSR  
SN74S140NSRE4  
SN74S140NSRE4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SO  
N
14  
14  
14  
14  
14  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
NS  
NS  
NS  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SNJ54S140FK  
SNJ54S140FK  
SNJ54S140J  
SNJ54S140J  
SNJ54S140W  
SNJ54S140W  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
FK  
FK  
J
20  
20  
14  
14  
14  
14  
1
1
1
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
J
W
W
CFP  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2005  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
MECHANICAL DATA  
MLCC006B – OCTOBER 1996  
FK (S-CQCC-N**)  
LEADLESS CERAMIC CHIP CARRIER  
28 TERMINAL SHOWN  
A
B
NO. OF  
TERMINALS  
**  
18 17 16 15 14 13 12  
MIN  
MAX  
MIN  
MAX  
0.342  
(8,69)  
0.358  
(9,09)  
0.307  
(7,80)  
0.358  
(9,09)  
19  
20  
11  
10  
9
20  
28  
44  
52  
68  
84  
0.442  
(11,23)  
0.458  
(11,63)  
0.406  
(10,31)  
0.458  
(11,63)  
21  
B SQ  
22  
0.640  
(16,26)  
0.660  
(16,76)  
0.495  
(12,58)  
0.560  
(14,22)  
8
A SQ  
23  
0.739  
(18,78)  
0.761  
(19,32)  
0.495  
(12,58)  
0.560  
(14,22)  
7
24  
25  
6
0.938  
(23,83)  
0.962  
(24,43)  
0.850  
(21,6)  
0.858  
(21,8)  
5
1.141  
(28,99)  
1.165  
(29,59)  
1.047  
(26,6)  
1.063  
(27,0)  
26 27 28  
1
2
3
4
0.080 (2,03)  
0.064 (1,63)  
0.020 (0,51)  
0.010 (0,25)  
0.020 (0,51)  
0.010 (0,25)  
0.055 (1,40)  
0.045 (1,14)  
0.045 (1,14)  
0.035 (0,89)  
0.045 (1,14)  
0.035 (0,89)  
0.028 (0,71)  
0.022 (0,54)  
0.050 (1,27)  
4040140/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a metal lid.  
D. The terminals are gold plated.  
E. Falls within JEDEC MS-004  
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配单直通车
JM38510/08101BCA产品参数
型号:JM38510/08101BCA
Brand Name:Texas Instruments
生命周期:Active
IHS 制造商:TEXAS INSTRUMENTS INC
零件包装代码:DIP
包装说明:DIP,
针数:14
Reach Compliance Code:not_compliant
HTS代码:8542.39.00.01
Factory Lead Time:1 week
风险等级:1.49
其他特性:IOL = 60MA @ VOL = 0.5V; IOH = 3MA @ VOH = 2.5V; LG-MAX
系列:S
JESD-30 代码:R-GDIP-T14
长度:19.56 mm
负载电容(CL):50 pF
逻辑集成电路类型:NAND GATE
最大I(ol):0.04 A
功能数量:2
输入次数:4
端子数量:14
最高工作温度:125 °C
最低工作温度:-55 °C
封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP
封装形状:RECTANGULAR
封装形式:IN-LINE
包装方法:TUBE
峰值回流温度(摄氏度):NOT SPECIFIED
最大电源电流(ICC):44 mA
Prop。Delay @ Nom-Sup:7.5 ns
传播延迟(tpd):6.5 ns
认证状态:Not Qualified
施密特触发器:NO
筛选级别:MIL-M-38510 Class B
座面最大高度:5.08 mm
最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V
表面贴装:NO
技术:TTL
温度等级:MILITARY
端子形式:THROUGH-HOLE
端子节距:2.54 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6.67 mm
Base Number Matches:1
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