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产品型号JM38510/30102BDA的概述

芯片JM38510/30102BDA概述 JM38510/30102BDA是一款广泛应用于航空航天、军事和其他高可靠性领域的高性能集成电路。作为美国国防部的军用标准部件,该芯片具有卓越的抗干扰能力和耐恶劣环境的特性。该芯片主要用于数据采集、信号处理和控制系统等关键领域,因其具有良好的电气性能和可靠性,使其在复杂系统中发挥重要作用。JM38510/30102BDA的设计考虑了长时间使用和高温、高湿等极端环境下的稳定性,适合用于各种现代化的电子设备中。 芯片JM38510/30102BDA的详细参数 JM38510/30102BDA的主要技术参数如下: - 工作电压:5V - 功耗:典型功耗为50mW,最大功耗为100mW - 工作温度范围:-55°C至125°C - 输入电压范围:0V至5V - 输出电流:最大为20mA - 传输延迟:不超过20ns - 封装类型:DIP-16 上述参数...

产品型号JM38510/30102BDA的Datasheet PDF文件预览

SN5474, SN54LS74A, SN54S74  
SN7474. SN74LS74A, SN74S74  
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR  
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988  
Copyright 1988, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN5474, SN54LS74A, SN54S74  
SN7474. SN74LS74A, SN74S74  
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR  
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN5474, SN54LS74A, SN54S74  
SN7474. SN74LS74A, SN74S74  
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR  
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN5474, SN54LS74A, SN54S74  
SN7474. SN74LS74A, SN74S74  
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR  
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN5474, SN54LS74A, SN54S74  
SN7474. SN74LS74A, SN74S74  
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR  
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN5474, SN54LS74A, SN54S74  
SN7474. SN74LS74A, SN74S74  
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR  
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Oct-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CFP  
Drawing  
JM38510/00205BCA  
JM38510/00205BDA  
JM38510/00205BDA  
JM38510/07101BCA  
JM38510/07101BCA  
JM38510/07101BDA  
JM38510/07101BDA  
JM38510/30102B2A  
JM38510/30102B2A  
JM38510/30102BCA  
JM38510/30102BCA  
JM38510/30102BDA  
JM38510/30102BDA  
JM38510/30102SCA  
JM38510/30102SCA  
JM38510/30102SDA  
JM38510/30102SDA  
SN5474J  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
J
W
W
J
14  
14  
14  
14  
14  
14  
14  
20  
20  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
CFP  
Call TI  
CDIP  
CDIP  
CFP  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Call TI  
ACTIVE  
J
ACTIVE  
W
W
FK  
FK  
J
ACTIVE  
CFP  
ACTIVE  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
ACTIVE  
ACTIVE  
ACTIVE  
J
ACTIVE  
W
W
J
ACTIVE  
CFP  
ACTIVE  
CDIP  
CDIP  
CFP  
ACTIVE  
J
ACTIVE  
W
W
J
ACTIVE  
CFP  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
SOIC  
SOIC  
PDIP  
PDIP  
PDIP  
PDIP  
SOIC  
SN5474J  
J
Call TI  
SN54LS74AJ  
J
1
1
1
1
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Call TI  
SN54LS74AJ  
ACTIVE  
J
SN54S74J  
ACTIVE  
J
SN54S74J  
ACTIVE  
J
SN7474DR  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
D
D
N
N
N
N
D
SN7474DR  
Call TI  
SN7474N  
Call TI  
SN7474N  
Call TI  
SN7474N3  
Call TI  
SN7474N3  
Call TI  
SN74LS74AD  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS74AD  
SN74LS74ADBR  
SN74LS74ADBR  
SN74LS74ADBRE4  
SN74LS74ADBRE4  
SN74LS74ADE4  
SN74LS74ADE4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SSOP  
SSOP  
SSOP  
SSOP  
SOIC  
SOIC  
D
DB  
DB  
DB  
DB  
D
14  
14  
14  
14  
14  
14  
14  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Oct-2005  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
no Sb/Br)  
SN74LS74ADR  
SN74LS74ADR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS74ADRE4  
SN74LS74ADRE4  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LS74AJ  
SN74LS74AJ  
SN74LS74AN  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
PDIP  
J
J
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
N
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74LS74AN  
ACTIVE  
PDIP  
N
14  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74LS74AN3  
SN74LS74AN3  
SN74LS74ANE4  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
PDIP  
N
N
N
14  
14  
14  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74LS74ANE4  
SN74LS74ANSR  
SN74LS74ANSR  
SN74LS74ANSRG4  
SN74LS74ANSRG4  
SN74S74D  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
OBSOLETE  
PDIP  
SO  
N
NS  
NS  
NS  
NS  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
PDIP  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S74D  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S74DE4  
SN74S74DE4  
SN74S74DR  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S74DR  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74S74DRE4  
SN74S74DRE4  
SN74S74N  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74S74N  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74S74N3  
N
TBD  
Call TI  
Call TI  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Oct-2005  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
PDIP  
PDIP  
Drawing  
SN74S74N3  
OBSOLETE  
ACTIVE  
N
N
14  
14  
TBD  
Call TI  
Call TI  
SN74S74NE4  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74S74NE4  
SN74S74NSR  
SN74S74NSR  
SN74S74NSRE4  
SN74S74NSRE4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SO  
N
14  
14  
14  
14  
14  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
NS  
NS  
NS  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SNJ5474J  
SNJ5474J  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
CFP  
J
J
14  
14  
14  
14  
20  
20  
14  
14  
14  
14  
20  
20  
14  
14  
14  
14  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
SNJ5474W  
W
W
FK  
FK  
J
Call TI  
SNJ5474W  
CFP  
Call TI  
SNJ54LS74AFK  
SNJ54LS74AFK  
SNJ54LS74AJ  
SNJ54LS74AJ  
SNJ54LS74AW  
SNJ54LS74AW  
SNJ54S74FK  
SNJ54S74FK  
SNJ54S74J  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
1
1
1
1
1
1
1
1
1
1
1
1
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
ACTIVE  
ACTIVE  
ACTIVE  
J
ACTIVE  
W
W
FK  
FK  
J
ACTIVE  
CFP  
ACTIVE  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
ACTIVE  
ACTIVE  
SNJ54S74J  
ACTIVE  
J
SNJ54S74W  
SNJ54S74W  
ACTIVE  
W
W
ACTIVE  
CFP  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Oct-2005  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 4  
MECHANICAL DATA  
MLCC006B – OCTOBER 1996  
FK (S-CQCC-N**)  
LEADLESS CERAMIC CHIP CARRIER  
28 TERMINAL SHOWN  
A
B
NO. OF  
TERMINALS  
**  
18 17 16 15 14 13 12  
MIN  
MAX  
MIN  
MAX  
0.342  
(8,69)  
0.358  
(9,09)  
0.307  
(7,80)  
0.358  
(9,09)  
19  
20  
11  
10  
9
20  
28  
44  
52  
68  
84  
0.442  
(11,23)  
0.458  
(11,63)  
0.406  
(10,31)  
0.458  
(11,63)  
21  
B SQ  
22  
0.640  
(16,26)  
0.660  
(16,76)  
0.495  
(12,58)  
0.560  
(14,22)  
8
A SQ  
23  
0.739  
(18,78)  
0.761  
(19,32)  
0.495  
(12,58)  
0.560  
(14,22)  
7
24  
25  
6
0.938  
(23,83)  
0.962  
(24,43)  
0.850  
(21,6)  
0.858  
(21,8)  
5
1.141  
(28,99)  
1.165  
(29,59)  
1.047  
(26,6)  
1.063  
(27,0)  
26 27 28  
1
2
3
4
0.080 (2,03)  
0.064 (1,63)  
0.020 (0,51)  
0.010 (0,25)  
0.020 (0,51)  
0.010 (0,25)  
0.055 (1,40)  
0.045 (1,14)  
0.045 (1,14)  
0.035 (0,89)  
0.045 (1,14)  
0.035 (0,89)  
0.028 (0,71)  
0.022 (0,54)  
0.050 (1,27)  
4040140/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a metal lid.  
D. The terminals are gold plated.  
E. Falls within JEDEC MS-004  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
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does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
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Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
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www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  
配单直通车
JM38510/30102BDA产品参数
型号:JM38510/30102BDA
Brand Name:Texas Instruments
生命周期:Active
IHS 制造商:TEXAS INSTRUMENTS INC
零件包装代码:DFP
包装说明:DFP-14
针数:14
Reach Compliance Code:not_compliant
HTS代码:8542.39.00.01
Factory Lead Time:1 week
风险等级:5.05
Is Samacsys:N
系列:LS
JESD-30 代码:R-GDFP-F14
长度:9.21 mm
负载电容(CL):15 pF
逻辑集成电路类型:D FLIP-FLOP
最大频率@ Nom-Sup:25000000 Hz
最大I(ol):0.008 A
位数:1
功能数量:2
端子数量:14
最高工作温度:125 °C
最低工作温度:-55 °C
输出极性:COMPLEMENTARY
封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DFP
封装形状:RECTANGULAR
封装形式:FLATPACK
包装方法:TUBE
峰值回流温度(摄氏度):NOT SPECIFIED
最大电源电流(ICC):8 mA
Prop。Delay @ Nom-Sup:40 ns
传播延迟(tpd):40 ns
认证状态:Not Qualified
筛选级别:MIL-M-38510 Class B
座面最大高度:2.03 mm
最大供电电压 (Vsup):5.25 V
最小供电电压 (Vsup):4.75 V
标称供电电压 (Vsup):5 V
表面贴装:YES
技术:TTL
温度等级:MILITARY
端子形式:FLAT
端子节距:1.27 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
触发器类型:POSITIVE EDGE
宽度:5.97 mm
最小 fmax:25 MHz
Base Number Matches:1
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