JM38510/30605BDA全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

PACKAGE OPTION ADDENDUM

www.ti.com

26-Sep-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CDIP

LCCC

CDIP

CFP

Drawing

JM38510/00903BCA

JM38510/30605B2A

JM38510/30605BCA

JM38510/30605BDA

JM38510/30605SCA

JM38510/30605SDA

SN54164J

OBSOLETE

ACTIVE

J

FK

J

14

20

14

TBD

Call TI

1

Level-NC-NC-NC

Call TI

ACTIVE

J

ACTIVE

W

J

ACTIVE

CFP

ACTIVE

CDIP

CFP

ACTIVE

J

ACTIVE

W

J

ACTIVE

CFP

OBSOLETE

ACTIVE

CDIP

PDIP

SOIC

SN54164J

J

Call TI

SN54LS164J

J

1

Level-NC-NC-NC

Call TI

SN54LS164J

ACTIVE

J

SN74164N

OBSOLETE

ACTIVE

N

D

SN74164N

Call TI

SN74LS164D

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS164D

SN74LS164DE4

SN74LS164DR

SN74LS164DRE4

ACTIVE

SOIC

D

14

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS164J

SN74LS164N

OBSOLETE

ACTIVE

CDIP

PDIP

J

14

TBD

Call TI

N

25

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS164N

ACTIVE

PDIP

N

14

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS164N3

SN74LS164NE4

OBSOLETE

ACTIVE

PDIP

N

14

TBD

Call TI

25

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS164NE4

SN74LS164NSR

ACTIVE

PDIP

SO

N

14

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

NS

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

26-Sep-2005

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

no Sb/Br)

SN74LS164NSR

SN74LS164NSRE4

ACTIVE

SO

NS

14

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SNJ54164J

OBSOLETE

ACTIVE

CDIP

CFP

J

14

20

14

TBD

Call TI

SNJ54164W

W

FK

J

Call TI

SNJ54164W

CFP

Call TI

SNJ54LS164FK

SNJ54LS164J

SNJ54LS164W

LCCC

CDIP

CFP

1

Level-NC-NC-NC

ACTIVE

J

ACTIVE

W

ACTIVE

CFP

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

-

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

&

no Sb/Br)

-

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**)

LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

A

B

NO. OF

TERMINALS

**

18 17 16 15 14 13 12

MIN

MAX

MIN

MAX

0.342

(8,69)

0.358

(9,09)

0.307

(7,80)

0.358

(9,09)

19

20

11

10

9

20

28

44

52

68

84

0.442

(11,23)

0.458

(11,63)

0.406

(10,31)

0.458

(11,63)

21

B SQ

22

0.640

(16,26)

0.660

(16,76)

0.495

(12,58)

0.560

(14,22)

8

A SQ

23

0.739

(18,78)

0.761

(19,32)

0.495

(12,58)

0.560

(14,22)

7

24

25

6

0.938

(23,83)

0.962

(24,43)

0.850

(21,6)

0.858

(21,8)

5

1.141

(28,99)

1.165

(29,59)

1.047

(26,6)

1.063

(27,0)

26 27 28

1

2

3

4

0.080 (2,03)

0.064 (1,63)

0.020 (0,51)

0.010 (0,25)

0.020 (0,51)

0.010 (0,25)

0.055 (1,40)

0.045 (1,14)

0.035 (0,89)

0.045 (1,14)

0.035 (0,89)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

4040140/D 10/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a metal lid.

D. The terminals are gold plated.

E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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enhancements, improvements, and other changes to its products and services at any time and to discontinue

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

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Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

型号:	JM38510/30605BDA
Brand Name：	Texas Instruments
生命周期：	Active
IHS 制造商：	TEXAS INSTRUMENTS INC
零件包装代码：	DFP
包装说明：	DFP-14
针数：	14
Reach Compliance Code：	not_compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	1 week
风险等级：	5.05
Is Samacsys：	N
其他特性：	GATED SERIAL INPUTS (A AND B)
计数方向：	RIGHT
系列：	LS
JESD-30 代码：	R-GDFP-F14
长度：	9.21 mm
负载电容（CL）：	15 pF
逻辑集成电路类型：	SERIAL IN PARALLEL OUT
最大频率@ Nom-Sup：	25000000 Hz
最大I（ol）：	0.0078 A
位数：	8
功能数量：	1
端子数量：	14
最高工作温度：	125 °C
最低工作温度：	-55 °C
输出极性：	TRUE
封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	DFP
封装形状：	RECTANGULAR
封装形式：	FLATPACK
包装方法：	TUBE
峰值回流温度（摄氏度）：	NOT SPECIFIED
最大电源电流（ICC）：	27 mA
Prop。Delay @ Nom-Sup：	32 ns
传播延迟（tpd）：	32 ns
认证状态：	Not Qualified
施密特触发器：	No
筛选级别：	MIL-M-38510
座面最大高度：	2.03 mm
最大供电电压 (Vsup)：	5.25 V
最小供电电压 (Vsup)：	4.75 V
标称供电电压 (Vsup)：	5 V
表面贴装：	YES
技术：	TTL
温度等级：	MILITARY
端子形式：	FLAT
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
触发器类型：	POSITIVE EDGE
宽度：	5.97 mm
最小 fmax：	25 MHz
Base Number Matches：	1

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