JM38510/30702BEA全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

PACKAGE OPTION ADDENDUM

www.ti.com

26-Sep-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

LCCC

CDIP

CFP

Drawing

76007012A

7600701EA

ACTIVE

FK

J

20

16

20

16

1

TBD

Call TI

Level-NC-NC-NC

7600701EA

J

7600701FA

W

J

7600701FA

CFP

7700401EA

CDIP

CFP

7700401EA

J

7700401FA

W

FK

J

7700401FA

CFP

JM38510/30702B2A

JM38510/30702BEA

JM38510/30702BFA

JM38510/30702SEA

JM38510/30702SFA

SN54LS139AJ

SN54S139J

LCCC

CDIP

CFP

J

W

J

CFP

CDIP

CFP

J

W

J

CFP

CDIP

SOIC

J

SN54S139J

J

SN74LS139AD

D

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS139AD

SN74LS139ADE4

SN74LS139ADR

SN74LS139ADRE4

SN74LS139AN

ACTIVE

SOIC

PDIP

D

N

16

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

25

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS139AN

25

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74LS139AN3

OBSOLETE

PDIP

N

16

TBD

Call TI

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

26-Sep-2005

Orderable Device

SN74LS139ANE4

SN74LS139ANSR

SN74LS139ANSRE4

SN74S139AD

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

PDIP

SO

N

NS

D

25

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SO

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

PDIP

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74S139ADE4

SN74S139AN

D

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

N

25

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74S139AN3

SN74S139ANE4

OBSOLETE

ACTIVE

PDIP

N

16

TBD

Call TI

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74S139ANSR

ACTIVE

SO

NS

16

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74S139ANSRE4

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SNJ54LS139AFK

SNJ54LS139AJ

SNJ54LS139AW

SNJ54S139FK

SNJ54S139J

ACTIVE

LCCC

CDIP

CFP

FK

J

20

16

20

16

1

TBD

Call TI

Level-NC-NC-NC

J

W

FK

J

CFP

LCCC

CDIP

CFP

SNJ54S139J

J

SNJ54S139W

W

CFP

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

-

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

&

no Sb/Br)

-

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

26-Sep-2005

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 3

MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**)

LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

A

B

NO. OF

TERMINALS

**

18 17 16 15 14 13 12

MIN

MAX

MIN

MAX

0.342

(8,69)

0.358

(9,09)

0.307

(7,80)

0.358

(9,09)

19

20

11

10

9

20

28

44

52

68

84

0.442

(11,23)

0.458

(11,63)

0.406

(10,31)

0.458

(11,63)

21

B SQ

22

0.640

(16,26)

0.660

(16,76)

0.495

(12,58)

0.560

(14,22)

8

A SQ

23

0.739

(18,78)

0.761

(19,32)

0.495

(12,58)

0.560

(14,22)

7

24

25

6

0.938

(23,83)

0.962

(24,43)

0.850

(21,6)

0.858

(21,8)

5

1.141

(28,99)

1.165

(29,59)

1.047

(26,6)

1.063

(27,0)

26 27 28

1

2

3

4

0.080 (2,03)

0.064 (1,63)

0.020 (0,51)

0.010 (0,25)

0.020 (0,51)

0.010 (0,25)

0.055 (1,40)

0.045 (1,14)

0.035 (0,89)

0.045 (1,14)

0.035 (0,89)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

4040140/D 10/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a metal lid.

D. The terminals are gold plated.

E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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enhancements, improvements, and other changes to its products and services at any time and to discontinue

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

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Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

型号:	JM38510/30702BEA
生命周期：	Active
IHS 制造商：	DEFENSE LOGISTICS AGENCY
零件包装代码：	DIP
包装说明：	DIP,
针数：	16
Reach Compliance Code：	unknown
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	5.59
系列：	LS
JESD-30 代码：	R-GDIP-T16
长度：	19.3 mm
功能数量：	2
端子数量：	16
最高工作温度：	125 °C
最低工作温度：	-55 °C
输出极性：	INVERTED
封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	DIP
封装形状：	RECTANGULAR
封装形式：	IN-LINE
传播延迟（tpd）：	60 ns
座面最大高度：	4.19 mm
最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	4.5 V
标称供电电压 (Vsup)：	5 V
表面贴装：	NO
技术：	TTL
温度等级：	MILITARY
端子形式：	THROUGH-HOLE
端子节距：	2.54 mm
端子位置：	DUAL
宽度：	7.62 mm
Base Number Matches：	1

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