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产品型号K4B1G1646I-BCK0的概述

芯片K4B1G1646I-BCK0的概述 K4B1G1646I-BCK0是一款由韩国三星电子（Samsung Electronics）公司生产的DDR3 SDRAM（双倍数据率同步动态随机存取存储器）芯片。这款芯片广泛应用于各种消费电子产品，如智能手机、平板电脑、笔记本电脑和其他嵌入式系统。DDR3 SDRAM技术相比于其前辈DDR2来说，提供了更高的带宽和更低的功耗，成为现代计算机内存系统中不可或缺的一部分。芯片K4B1G1646I-BCK0的详细参数 K4B1G1646I-BCK0的主要参数如下： 1. 存储容量：1GB（825MB） 2. 总线宽度：x16 3. 数据速率：1066MT/s、1333MT/s 4. 工作电压：1.5V（±0.075V） 5. 延迟时间： - CL（CAS Latency）：9、8（不同版本） 6. 封装类型：FBGA（Fine Ball G...

产品型号K4B2G0446B的Datasheet PDF文件预览

May. 2010

DDR3 SDRAM Memory

Product Guide

SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND

SPECIFICATIONS WITHOUT NOTICE.

Products and specifications discussed herein are for reference purposes only. All information discussed

herein is provided on an "AS IS" basis, without warranties of any kind.

This document and all information discussed herein remain the sole and exclusive property of Samsung

Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property

right is granted by one party to the other party under this document, by implication, estoppel or other-

wise.

Samsung products are not intended for use in life support, critical care, medical, safety equipment, or

similar applications where product failure could result in loss of life or personal or physical harm, or any

military or defense application, or any governmental procurement to which special terms or provisions

may apply.

For updates or additional information about Samsung products, contact your nearest Samsung office.

All brand names, trademarks and registered trademarks belong to their respective owners.

- 1 -

May. 2010

Product Guide

DDR3 SDRAM Memory

1. DDR3 SDRAM MEMORY ORDERING INFORMATION

K 4 B X X X X X X X - X X X X

Speed

Temp & Power

SAMSUNG Memory

DRAM

Package Type

DRAM Type

Density

Revision

Interface (VDD, VDDQ)

# of Internal Banks

Bit Organization

7. Interface ( VDD, VDDQ)

1. SAMSUNG Memory : K

2. DRAM : 4

6 : SSTL (1.5V, 1.5V)

8. Revision

M : 1st Gen.

A : 2nd Gen.

B : 3rd Gen.

C : 4th Gen.

D : 5th Gen.

E : 6th Gen.

F : 7th Gen

G : 8th Gen

H : 9th Gen

3. DRAM Type

B : DDR3 SDRAM

4. Density

51 : 512Mb

1G :

2G :

4G :

1Gb

2Gb

4Gb

9. Package Type

: FBGA (Lead-free)

H : FBGA (Halogen-free & Lead-free)

: FBGA (Lead-free, DDP)

5. Bit Organization

04 : x 4

08 : x 8

16 : x16

M : FBGA (Halogen-free & Lead-free, DDP)

10. Temp & Power

C : Commercial Temp.( 0°C ~ 85°C) & Normal Power

L : Commercial Temp.( 0°C ~ 85°C) & Low Power

Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)

6. # of Internal Banks

3 : 4 Banks

4 : 8 Banks

5 : 16 Banks

11. Speed

F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

H9 : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

- 2 -

May. 2010

Product Guide

DDR3 SDRAM Memory

2. DDR3 SDRAM Component Product Guide

Package & Power,

Density

Banks

Part Number

Org.

VDD Voltage

PKG

Avail.

NOTE

Temp. (-C/-L) & Speed

HC(L)F7/F8/H9/K0

K4B1G0446E

K4B1G0846E

256M x 4

128M x 8

78 ball

FBGA

HC(L)F7/F8/H9/K0

1.5V

96 ball

FBGA

1Gb E-die

8Banks

K4B1G1646E

HC(L)F7/F8/H9/K0

64M x 16

Now

K4B1G0446E

K4B1G0846E

K4B1G0446F

K4B1G0846F

K4B1G0446F

K4B1G0846F

K4B2G0446B

K4B2G0846B

HYF7/F8/H9

256M x 4

128M x 8

256M x 4

128M x 8

256M x 4

128M x 8

512M x 4

256M x 8

78 ball

FBGA

1.35V

1.5V

HYF7/F8/H9

HC(L)F8/H9/K0

HY(L)F8/H9

78 ball

FBGA

1Gb F-die

2Gb B-die

8Banks

Now

1.35V

HY(L)F8/H9

HC(L)F7/F8/H9

78 ball

FBGA

1.5V

96 ball

FBGA

K4B2G1646B

HC(L)F7/F8/H9

128M x 16

K4B2G0446B

K4B2G0846B

K4B2G0446C

K4B2G0846C

K4B2G0446C

K4B2G0846C

K4B2G0446E

K4B2G0846E

K4B4G0446A

K4B2G0846A

K4B4G0446A

K4B2G0846A

K4B4G0446B

K4B2G0846B

K4B4G0446C

K4B2G0846C

HYF7/F8/H9

512M x 4

256M x 8

512M x 4

256M x 8

512M x 4

256M x 8

512M x 4

256M x 8

1G x 4

78 ball

FBGA

1.35V

1.5V

HYF7/F8/H9

HC(L)F8/H9/K0

HY(L)F8/H9

78 ball

FBGA

2Gb C-die

DDP 2Gb E-die

4Gb A-die

8Banks

Now

1.35V

1.5V

HY(L)F8/H9

MC(L)F7/F8/H9

HC(L)F8/H9/K0

HY(L)F8/H9/K0

MC(L)F7/F8/H9

78 ball

FBGA

1.5V

78 ball

FBGA

512M x 8

1G x 4

1.35V

1.5V

512M x 8

1G x 4

78 ball

FBGA

DDP 4Gb B-die

DDP 4Gb C-die

8Banks

Now

512M x 8

1G x 4

78 ball

FBGA

1.5V

Feb.’10

512M x 8

* NOTE : 1.35V product is 1.5V operatable.

- 3 -

May. 2010

Product Guide

DDR3 SDRAM Memory

3. DDR3 SDRAM Module Ordering Information

M X X X B X X X X X X X - X X X

Memory Module

DIMM Type

Data bits

Speed

Temp & Power

PCB Revision

DRAM Component Type

Depth

Package

# of Banks in Comp. & Interface

Bit Organization

Component Revision

1. Memory Module : M

8. Component Revision

1st Gen.

3rd Gen.

5th Gen.

2nd Gen.

4th Gen.

6th Gen.

8th Gen.

2. DIMM Type

F : 7th Gen.

3 : DIMM

4 : SODIMM

9. Package

FBGA(Lead-free)

FBGA(Lead-free & Halogen-free)

FBGA(Lead-free, DDP)

3. Data Bits

71 : x64 204pin Unbuffered SODIMM

78 : x64 240pin Unbuffered DIMM

91 : x72 240pin ECC unbuffered DIMM

92 : x72 240pin VLP Registered DIMM

93 : x72 240pin Registered DIMM

FBGA(Lead-free & Halogen-free, DDP)

10. PCB Revision

0 : None

1 : 1st Rev.

2 : 2nd Rev.

4 : 4th Rev.

3 : 3rd Rev.

S : Reduced Layer

4. DRAM Component Type

B : DDR3 SDRAM (1.5V VDD)

11. Temp & Power

5. Depth

: Commercial Temp.( 0°C ~ 85°C) & Normal Power

: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)

32 : 32M

64 : 64M

28 : 128M

56 : 256M

51 : 512M

1G : 1G

2G : 2G

33 : 32M (for 128Mb/512Mb)

65 : 64M (for 128Mb/512Mb)

29 : 128M (for 128Mb/512Mb)

57 : 256M (for 512Mb/2Gb)

52 : 512M (for 512Mb/2Gb)

1K : 1G (for 2Gb)

12. Speed

F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

2K : 2G (for 2Gb)

F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

H9: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

6. # of Banks in comp. & Interface

7 : 8Banks & SSTL-1.5V

NOTE: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),

PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)

7. Bit Organization

0 : x 4

3 : x 8

4 : x16

- 4 -

May. 2010

Product Guide

DDR3 SDRAM Memory

4. DDR3 SDRAM Module Product Guide

4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)

240Pin DDR3 Unbuffered DIMM

Comp.

Version

Internal

Banks

Org.

Density

Part Number

Speed

Raw Card

Composition

Rank

PKG

Height

Avail.

NOTE

M378B2873EH1

M378B2873FH0

M391B2873EH1

M391B2873FH0

M378B5673EH1

M378B5673FH0

M378B5773CH0

M391B5673EH1

M391B5673FH0

M391B5773CH0

M378B5273BH1

M378B5273CH0

M391B5273BH1

M391B5273CH0

CF8/H9

CF8/H9/K0*

CF8/H9

128M x 8

8 pcs 1Gb E-die

8 pcs 1Gb F-die

9 pcs 1Gb E-die

9 pcs 1Gb F-die

78 ball

FBGA

128Mx 64

1GB

A(1Rx8)

30mm

Now

78 ball

FBGA

128Mx 72

256Mx 64

1GB

2GB

D(1Rx8)

30mm

Now

CF8/H9/K0*

CF8/H9

128M x 8 * 16 pcs 1Gb E-die

128M x 8 * 16 pcs 1Gb F-die

B(2Rx8)

A(1Rx8)

E(2Rx8)

D(1Rx8)

B(2Rx8)

78 ball

FBGA

CF8/H9/K0*

CF8/H9

256M x 8

* 8 pcs 2Gb C-die

128M x 8 * 18 pcs 1Gb E-die

128M x 8 * 18 pcs 1Gb F-die

78 ball

FBGA

256Mx 72

2GB

CF8/H9/K0*

CF8/H9

30mm

Now

256M x 8

* 9 pcs 2Gb C-die

256M x 8 * 16 pcs 2Gb B-die

256M x 8 * 16 pcs 2Gb C-die

256M x 8 * 18 pcs 2Gb B-die

256M x 8 * 18 pcs 2Gb C-die

78 ball

FBGA

512Mx 64

512Mx 72

4GB

30mm

Now

CF8/H9/K0*

CF8/H9

78 ball

FBGA

E(2Rx8)

CF8/H9/K0*

78 ball

FBGA

1Gx 64

1Gx 72

8GB

M378B1G73AH0

M391B1G73AH0

CF8/H9/K0*

B(2Rx8)

E(2Rx8)

512M x 8 * 16 pcs 4Gb A-die

512M x 8 * 18 pcs 4Gb A-die

30mm

Now

78 ball

FBGA

* NOTE : K0(1600Mbps) will be available by ES level

4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)

240Pin DDR3 Unbuffered DIMM

Comp.

Version

Internal

Banks

Org.

Density

Part Number

Speed

Raw Card

Composition

Rank

PKG

Height

Avail.

NOTE

M391B2873EH1

M391B2873FH0

M391B5673EH1

M391B5673FH0

M391B5773CH0

M391B5273BH1

M391B5273CH0

YF8/H9

128M x 8

9 pcs 1Gb E-die

9 pcs 1Gb F-die

78 ball

FBGA

128Mx 72

1GB

D(1Rx8)

30mm

Now

128M x 8 * 18 pcs 1Gb E-die

128M x 8 * 18 pcs 1Gb F-die

E(2Rx8)

D(1Rx8)

E(2Rx8)

78 ball

FBGA

256Mx 72

2GB

30mm

Now

256M x 8

* 9 pcs 2Gb C-die

256M x 8 * 18 pcs 2Gb B-die

256M x 8 * 18 pcs 2Gb C-die

78 ball

FBGA

512Mx 72

1Gx 72

4GB

8GB

30mm

Now

78 ball

FBGA

M391B1G73AH0

YF8/H9

E(2Rx8)

512M x 8 * 18 pcs 4Gb A-die

* NOTE : 1.35V product is 1.5V operatable.

- 5 -

May. 2010

Product Guide

DDR3 SDRAM Memory

4.3 204Pin DDR3 SoDIMM (1.5V Product)

204Pin DDR3 SODIMM

Composition

Comp.

Version

Internal

Banks

Org.

Density

Part Number

Speed

Raw Card

Rank

PKG

Height Avail. NOTE

78 ball

FBGA

M471B2873EH1

M471B2874EH1

M471B2873FHS

CF8/H9

B(1Rx8)

A(2Rx16)

B(1Rx8)

128M x 8

8 pcs 1Gb E-die

128Mx 64

1GB

64M x 16 * 8 pcs 1Gb E-die

64M x 16 * 8 pcs 1Gb F-die

96 ball

30mm

Now

78 ball

FBGA

M471B5673EH1

M471B5673FH0

M471B5773CHS

M471B5273BH1

M471B5273CH0

CF8/H9

128M x 8 * 16 pcs 1Gb E-die

128M x 8 * 16 pcs 1Gb F-die

F(2Rx8)

B(1Rx8)

F(2Rx8)

78 ball

FBGA

256Mx 64

2GB

256M x 8

* 8 pcs 2Gb C-die

256M x 8 * 16 pcs 2Gb B-die

256M x 8 * 16 pcs 2Gb C-die

78 ball

FBGA

512Mx 64

1Gx 64

4GB

8GB

30mm

Now

78 ball

FBGA

M471B1G73AH0

CF8/H9

F(2Rx8)

512M x 8 * 16 pcs 4Gb A-die

4.4 204Pin DDR3 SoDIMM (1.35V Product)

204Pin DDR3 SODIMM

Comp.

Composition

Internal

Banks

Org.

Density

Part Number

Speed

Raw Card

Rank

PKG

Height

Avail.

NOTE

Version

78 ball

FBGA

128Mx 64

1GB

M471B2873FHS

YF8/H9

B(1Rx8)

128M x 8

8 pcs 1Gb F-die

30mm

Now

M471B5673FH0

M471B5773CHS

M471B5273BH1

M471B5273CH0

YF8/H9

F(2Rx8)

B(1Rx8)

128M x 8 * 16 pcs 1Gb F-die

256M x 8 8 pcs 2Gb C-die

78 ball

FBGA

256Mx 64

2GB

256M x 8 * 16 pcs 2Gb B-die

256M x 8 * 16 pcs 2Gb C-die

78 ball

FBGA

512Mx 64

1Gx 64

4GB

8GB

F(2Rx8)

30mm

Now

78 ball

FBGA

M471B1G73AH0

YF8/H9

512M x 8 * 16 pcs 4Gb A-die

* NOTE : 1.35V product is 1.5V operatable.

- 6 -

May. 2010

Product Guide

DDR3 SDRAM Memory

4.5 240Pin DDR3 Registered DIMM (1.5V Product)

240Pin DDR3 Registered DIMM

Comp.

Version

Internal

Banks

Org.

Density

Part Number

Speed

Raw Card

Composition

Rank

PKG

Height Avail. NOTE

M393B2873EH1

M393B2873FH0

M393B5673EH1

M393B5673FH0

M393B5670EH1

M393B5670FH0

M393B5773CH0

M393B5173EH1

M393B5173FH0

M393B5170EH1

M393B5170FH0

M393B5273BH1

M393B5273CH0

M393B5270BH1

M393B5270CH0

CF8/H9

CF8

128M x 8

9 pcs

1Gb E-die

1Gb F-die

78 ball

FBGA

128Mx 72

1GB

A(1Rx8)

30mm

Now

128M x 8

256M x 4

256M x 8

128M x 8

256M x 4

256M x 8

512M x 4

18 pcs 1Gb E-die

18 pcs 1Gb F-die

18 pcs 1Gb E-die

18 pcs 1Gb F-die

B(2Rx8)

78 ball

FBGA

256Mx 72

2GB

C(1Rx4)

A(1Rx8)

H(4Rx8

9 pcs

2Gb C-die

36 pcs 1Gb E-die

36 pcs 1Gb F-die

36 pcs 1Gb E-die

36 pcs 1Gb F-die

18 pcs 2Gb B-die

18 pcs 2Gb C-die

18 pcs 2Gb B-die

18 pcs 2Gb C-die

CF8/H9

E(2Rx4)

B(2Rx8)

78 ball

FBGA

512Mx 72

4GB

30mm

Now

C(1Rx4)

DDP

x 4

M393B1G70EM1

CF8

F(4Rx4)

H(4Rx8)

36 pcs 1Gb E-die

512M

M393B1K73BH1

M393B1K73CH0

M393B1K70BH1

M393B1K70CH0

CF8

256M x 8

512M x 4

36 pcs 2Gb B-die

36 pcs 2Gb C-die

36 pcs 2Gb B-die

36 pcs 2Gb C-die

78 ball

FBGA

1Gx 72

8GB

30mm

Now

CF8/H9

E(2Rx4)

F(4Rx4)

DDP

x 4

M393B2K70BM1

M393B2K70CM0

CF8

36 pcs 2Gb B-die

36 pcs 2Gb C-die

DDP

x 4

78 ball

FBGA

CF8/H9

2Gx 72

4Gx 72

16GB

32GB

30mm

Now

M393B2G70AH0

M393B2G73AH0

CF8/H9

E(2Rx4)

H(4Rx8)

1G x 4

36 pcs 4Gb A-die

512M x 8

DDP

x 4

78 ball

FBGA

M393B4G70AH0

CF8/H9

AB(4Rx4)

36 pcs 4Gb A-die

- 7 -

May. 2010

Product Guide

DDR3 SDRAM Memory

4.6 240Pin DDR3 Registered DIMM (1.35V Product)

240Pin DDR3 Registered DIMM

Comp.

Version

Internal

Banks

Org.

Density

Part Number

Speed

Raw Card

Composition

Rank

PKG

Height Avail.

NOTE

M393B2873EH1

M393B2873FH0

M393B5673EH1

M393B5673FH0

M393B5670EH1

M393B5670FH0

M393B5773CH0

M393B5173EH1

M393B5173FH0

M393B5170EH1

M393B5170FH0

M393B5273BH1

M393B5273CH0

M393B5270BH1

M393B5270CH0

YF8/H9

YF8

128M x 8

9 pcs

1Gb E-die

1Gb F-die

78 ball

FBGA

128Mx 72

1GB

A(1Rx8)

30mm

Now

128M x 8

256M x 4

256M x 8

128M x 8

256M x 4

256M x 8

512M x 4

18 pcs 1Gb E-die

18 pcs 1Gb F-die

18 pcs 1Gb E-die

18 pcs 1Gb F-die

B(2Rx8)

78 ball

FBGA

256Mx 72

2GB

C(1Rx4)

A(1Rx8)

H(4Rx8)

9 pcs

2Gb C-die

36 pcs 1Gb E-die

36 pcs 1Gb F-die

36 pcs 1Gb E-die

36 pcs 1Gb F-die

18 pcs 2Gb B-die

18 pcs 2Gb C-die

18 pcs 2Gb B-die

18 pcs 2Gb C-die

YF8/H9

E(2Rx4)

B(2Rx8)

78 ball

FBGA

512Mx 72

4GB

30mm

Now

C(1Rx4)

F(4Rx4)

H(4Rx8)

DDP

x 4

M393B1G70EM1

YF8

36 pcs 1Gb E-die

512M

M393B1K73BH1

M393B1K73CH0

M393B1K70BH1

M393B1K70CH0

YF8

256M x 8

512M x 4

36 pcs 2Gb B-die

36 pcs 2Gb C-die

36 pcs 2Gb B-die

36 pcs 2Gb C-die

78 ball

FBGA

1Gx 72

8GB

30mm

Now

YF8/H9

E(2Rx4)

F(4Rx4)

DDP

x 4

M393B2K70BM1

M393B2K70CM0

YF8

36 pcs 2Gb B-die

36 pcs 2Gb C-die

DDP

x 4

78 ball

FBGA

YF8/H9

2Gx 72

4Gx 72

16GB

32GB

30mm

Now

M393B2G70AH0

M393B2G73AH0

YF8/H9

E(2Rx4)

H(4Rx8)

1G x 4

36 pcs 4Gb A-die

512M x 8

DDP

x 4

78 ball

FBGA

M393B4G70AH0

YF8/H9

AB(4Rx4)

36 pcs 4Gb A-die

* NOTE : 1.35V product is 1.5V operatable.

- 8 -

May. 2010

Product Guide

DDR3 SDRAM Memory

4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)

240Pin DDR3 VLP Registered DIMM

Comp.

Version

Internal

Banks

Org.

Density

Part Number

Speed

Raw Card

Composition

Rank

PKG

Height

Avail. NOTE

M392B2873EH1

M392B2873FH0

M392B5673EH1

M392B5673FH0

M392B5670EH1

M392B5670FH0

M392B5773CH0

CF8/H9

128M x 8

9 pcs

1Gb E-die

1Gb F-die

1Gb E-die

1Gb F-die

1Gb E-die

1Gb F-die

78 ball

FBGA

128Mx 72

1GB

K(1Rx8)

18.75mm

Now

128M x 8

256M x 4

128M x 8

9 pcs

18 pcs

9 pcs

L(2Rx8

78 ball

FBGA

256Mx 72

2GB

18.75mm

Now

M(1Rx4)

K(1Rx8)

DDP

x 4

M392B5170EM1

M392B5170FM0

CF8/H9

18 pcs

1Gb E-die

1Gb F-die

512M

N(2Rx4)

DDP

x 4

512M

78 ball

FBGA

512Mx 72

4GB

18.75mm

Now

M392B5273BH1

M392B5273CH0

M392B5270BH1

M392B5270CH0

CF8/H9

256M x 8

512M x 4

18 pcs

2Gb B-die

2Gb C-die

2Gb B-die

2Gb C-die

L(2Rx8)

M(1Rx4)

DDP

x 8

M392B1K73BM1

M392B1K73CM0

M392B1K70BM1

M392B1K70CM0

M392B2G70AM0

M392B2G73AM0

CF8

18 pcs

2Gb B-die

2Gb C-die

2Gb B-die

2Gb C-die

4Gb A-die

512M

V(4Rx8)

N(2Rx4)

DDP

x 8

CF8/H9

512M

78 ball

FBGA

1Gx 72

8GB

18.75mm

Now

DDP

x 4

DDP

x 4

DDP

N(2Rx4)

V(4Rx8)

Jun.’10

78 ball

FBGA

2Gx 72

16GB

DDP

- 9 -

May. 2010

Product Guide

DDR3 SDRAM Memory

4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)

240Pin DDR3 VLP Registered DIMM

Comp.

Version

Internal

Banks

Org.

Density

Part Number

Speed

Raw Card

Composition

Rank

PKG

Height

Avail. NOTE

M392B2873EH1

M392B2873FH0

M392B5673EH1

M392B5673FH0

M392B5670EH1

M392B5670FH0

M392B5773CH0

YF8/H9

128M x 8

9 pcs

1Gb

E-die

F-die

E-die

F-die

E-die

F-die

C-die

78 ball

FBGA

128Mx 72

1GB

K(1Rx8)

18.75mm

Now

128M x 8 * 18 pcs 1Gb

256M x 4 * 18 pcs 1Gb

L(2Rx8)

M(1Rx4)

78 ball

FBGA

256Mx 72

2GB

18.75mm

Now

K(1Rx8)

N(2Rx4)

512M x 4

DDP

9 pcs

2Gb

M392B5170EM1

YF8/H9

x 4 * 18 pcs 1Gb

E-die

512M

M392B5170FM0

M392B5273BH1

M392B5273CH0

M392B5270BH1

M392B5270CH0

YF8/H9

512M x 4 * 18 pcs 1Gb

256M x 8 * 18 pcs 2Gb

512M x 4 * 18 pcs 2Gb

F-die

B-die

C-die

B-die

C-die

78 ball

FBGA

512Mx 72

4GB

18.75mm

Now

L(2Rx8)

M(1Rx4)

DDP

M392B1K73BM1

M392B1K73CM0

M392B1K70BM1

M392B1K70CM0

M392B2G70AM0

M392B2G73AM0

YF8

x 8 * 18 pcs 2Gb

512M

B-die

C-die

B-die

C-die

A-die

V(4Rx8)

N(2Rx4)

DDP

YF8

x 8 * 18 pcs 2Gb

512M

78 ball

FBGA

1Gx 72

2Gx 72

8GB

18.75mm

Now

DDP

YF8/H9

x 4 * 18 pcs 2Gb

DDP

x 4 * 18 pcs 2Gb

DDP

N(2Rx4)

V(4Rx8)

x4 * 18 pcs 4Gb

Now

78 ball

FBGA

16GB

DDP

x8 * 18 pcs 4Gb

Jun.’10

* NOTE : 1.35V product is 1.5V operatable.

- 10 -

May. 2010

Product Guide

DDR3 SDRAM Memory

5. RDIMM RCD Information

5.1 5.1 RCD Identification in JEDEC Description in Module Label

5.2 5.2 Label Example

4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P1

0920

M393B5170EH1-CH9

Made in Korea

5.3 RCD Information

- Example

Voltage

Vendor

Inphi

IDT

Revision

Module P/N

JEDEC Description On Label

4GB 2Rx4 PC3-10600R-09-10-E1-P1

4GB 2Rx4 PC3-10600R-09-10-E1-D2

4GB 2Rx4 PC3L-8500R-07-10-E1-P1

4GB 2Rx4 PC3L-8500R-07-10-E1-D2

LV GS02 C0

LV DDR3 B0

LV GS02 C0

LV DDR3 B0

M393B5170EH1-CH9

M393B5170EH1-YF8

1.5V

Inphi

IDT

1.35V

- 11 -

May. 2010

Product Guide

DDR3 SDRAM Memory

6. Package Dimension

78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)

7.50 ± 0.10

0.80 x 8 = 6.40

#A1 INDEX MARK

(Datum A)

(Datum B)

0.80 1.60

3.20

7.50 ± 0.10

#A1

2 1

0.35 ± 0.05

1.10 ± 0.10

(0.95)

78 - ∅0.45 Solder ball

(Post Reflow ∅0.05 ± 0.05)

0.2 A B

MOLDING AREA

(1.90)

Top

Bottom

96Ball FBGA for 1Gb E-die (x16)

7.50 ± 0.10

0.80 x 8 = 6.40

#A1 INDEX MARK

0.80 1.60

3.20

7.50 ± 0.10

#A1

2 1

(Datum A)

(Datum B)

0.35 ± 0.05

1.10 ± 0.10

(0.95)

96 - ∅0.45 Solder ball

(Post Reflow ∅0.05 ± 0.05)

0.2 A B

MOLDING AREA

(1.90)

Top

Bottom

- 12 -

May. 2010

Product Guide

DDR3 SDRAM Memory

78Ball FBGA for 2Gb B-die (x4/x8)

9.00 ± 0.10

#A1 INDEX MARK

(Datum A)

(Datum B)

0.80 1.60

3.20

9.00 ± 0.10

#A1

2 1

0.35 ± 0.05

1.10 ± 0.10

(0.95)

78 - ∅0.45 Solder ball

(Post Reflow ∅0.50 ± 0.05)

0.2 A B

MOLDING AREA

(1.90)

Top

Bottom

96Ball FBGA for 2Gb B-die (x16)

9.00 ± 0.10

#A1 INDEX MARK

0.80 1.60

3.20

9.00 ± 0.10

#A1

2 1

(Datum A)

(Datum B)

0.35 ± 0.05

1.10 ± 0.10

(0.95)

96 - ∅0.45 Solder ball

(Post Reflow ∅0.50 ± 0.05)

0.2 A B

MOLDING AREA

(1.90)

Top

Bottom

- 13 -

May. 2010

Product Guide

DDR3 SDRAM Memory

78Ball DDP for 1Gb E-die (x4/x8)

9.00 ± 0.10

0.80 x 8 = 6.40

#A1 INDEX MARK

(Datum A)

(Datum B)

0.80 1.60

3.20

9.00 ± 0.10

#A1

2 1

0.35 ± 0.05

1.40 ± 0.10

78 - ∅0.45 Solder ball

(Post Reflow ∅0.50 ± 0.05)

0.2 A B

Top

Bottom

78Ball DDP for 2Gb B-die (x4/x8)

10.00 ± 0.10

0.80 x 8 = 6.40

#A1 INDEX MARK

(Datum A)

(Datum B)

0.80 1.60

3.20

10.00 ± 0.10

#A1

8 7 6 5 4 3 2 1

0.35 ± 0.05

1.40 ± 0.10

78 - ∅0.45 Solder ball

(Post Reflow ∅0.50 ± 0.05)

0.2 A B

Top

Bottom

- 14 -

May. 2010

Product Guide

DDR3 SDRAM Memory

78Ball DDP for 2Gb C-die (x4/x8)

8.00 ± 0.10

0.80 x 8 = 6.40

#A1 INDEX MARK

(Datum A)

0.80 1.60

3.20

8.00 ± 0.10

#A1

2 1

(Datum B)

0.35 ± 0.05

1.40 ± 0.10

78 - ∅0.45 Solder ball

(Post Reflow ∅0.50 ± 0.05)

0.2 A B

TOP VIEW

BOTTOM VIEW

78Ball for 4Gb A-die (x4/x8)

10.00 ± 0.10

0.80 x 8 = 6.40

3.20

#A1 INDEX MARK

(Datum A)

0.80

1.60

10.00 ± 0.10

#A1

3 2 1

(Datum B)

78 - ∅0.45 Solder ball

(Post Reflow ∅0.50 ± 0.05)

0.2 A B

(0.95)

MOLDING AREA

0.35 ± 0.05

1.10 ± 0.10

(1.90)

BOTTOM VIEW

TOP VIEW

- 15 -

May. 2010

Product Guide

7. Module Dimension

DDR3 SDRAM Memory

x64/x72 240pin DDR3 SDRAM Unbuffered DIMM

Units : Millimeters

133.35 ± 0.15

128.95

N/A

(for x64)

SPD

ECC

(for x72)

(2)

2.50

54.675

Max 4.0

47.00

71.00

N/A

(for x64)

ECC

(for x72)

1.270 ± 0.10

5.00

2x 2.10 ± 0.15

0.80 ± 0.05

0.2 ± 0.15

3.80

1.50±0.10

1.00

2.50

Detail A

Detail B

- 16 -

May. 2010

Product Guide

DDR3 SDRAM Memory

x64 204pin DDR3 SDRAM Unbuffered SODIMM

Units : Millimeters

0.10 M C A B

67.60

63.60

Max 3.8

1.00 ± 0.10

24.80

21.00

39.00

2X 1.80

0.10 M C A B

(OPTIONAL HOLES)

2X 4.00 ± 0.10

0.10 M C A B

0.60

0.45 ± 0.03

1.65

4.00 ± 0.10

2.55

0.25 MAX

1.00 ± 0.10

Detail A

Detail B

- 17 -

May. 2010

Product Guide

DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM Registered DIMM

Units : Millimeters

Max 4.0

133.35 ± 0.15

128.95

10.9

9.76

18.92

32.40

18.93

9.74

2.50

1.0 max

54.675

47.00

1.27 ± 0.10

71.00

5.00

0.80 ± 0.05

3.80

0.2 ± 0.15

10.9

0.4

2.50

1.00

1.50±0.10

Detail A

Detail B

Detail C

2x 2.10 ± 0.15

Address, Command and Control lines

- 18 -

May. 2010

Product Guide

DDR3 SDRAM Memory

Registered DIMM Heat Spreader Design

1. FRONT PART

Outside

133.15 ± 0.2

0.65 ± 0.2

130.45 ± 0.15

9.26

29.77

11.9

31.4

0.15

1.3

127 ± 0.12

1.3

Inside

Green Line : TIM Attatch Line

Reg. pedestal line

80.78

119.29

128.5

2. BACK PART

Outside

Inside

Green Line : TIM Attatch Line

- 19 -

May. 2010

Product Guide

DDR3 SDRAM Memory

3. CLIP PART

39.3 ± 0.2

Upper Bending

Tilting Gap

29.77

0.1 ~ 0.3

0.5

4. DDR3 RDIMM ASS’Y View

Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)

132.95 ± 133.45

39.3 ± 0.2

E (Clip open size)

text mark ’B’ or ’K’

punch press_stamp

- 20 -

May. 2010

Product Guide

DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM VLP Registered DIMM

Units : Millimeters

133.35 ± 0.15

128.95

Max 4.0

9.76

20.92

32.40

20.93

9.74

54.675

1.0 max

47.00

71.00

1.27 ± 0.10

SPD/TS

18.10

5.00

0.80 ± 0.05

9.9

3.80

0.2 ± 0.15

1.50±0.10

1.00

2.50

Detail A

Detail B

Detail C

SPD/TS

Address, Command and Control lines

- 21 -

May. 2010

Product Guide

DDR3 SDRAM Memory

VLP Registered DIMM Heat Spreader Design

1. FRONT PART

Outside

130.45

8.69

20.82

17.9

6.4

20.82

8.69

Driver

IC(DP:0.18mm)

DRIVER IC 0.18 -0/+0.1

Inside

Driver

IC(DP:0.18mm)

2. BACK PART

Outside

Driver

IC(DP:0.18mm)

Inside

Driver

IC(DP:0.18mm)

- 22 -

May. 2010

Product Guide

DDR3 SDRAM Memory

3. CLIP PART

35.82

7.4 ± 0.1

Clip open size

3.2~4.5

0.1

SIDE-L

FRONT

SIDE-R

4. ASS’Y VIEW

Reference thickness total (Maximum) : 7.71 (With Clip thickness)

TIM Thickness 0.25

* Dimension Index

Mono

Typ.

43.9

6.8

DDP

Typ.

44.4

7.3

6.3

7.3

Note

Min.

Max.

Min.

Max.

6.7

6.9

7.2

7.4

5.8

6.7

2.5

6.8

6.9

3.6

7.2

2.6

7.4

3.8

E (Clip open size)

- 23 -

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K4B2G0446C-HCF80产品参数

型号:	K4B2G0446C-HCF80
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Obsolete
IHS 制造商：	SAMSUNG SEMICONDUCTOR INC
零件包装代码：	BGA
包装说明：	TFBGA, BGA78,9X13,32
针数：	78
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.32.00.36
风险等级：	5.69
Is Samacsys：	N
访问模式：	MULTI BANK PAGE BURST
最长访问时间：	0.3 ns
其他特性：	AUTO/SELF REFRESH
最大时钟频率 (fCLK)：	533 MHz
I/O 类型：	COMMON
交错的突发长度：	8
JESD-30 代码：	R-PBGA-B78
JESD-609代码：	e1
长度：	11 mm
内存密度：	2147483648 bit
内存集成电路类型：	DDR DRAM
内存宽度：	4
湿度敏感等级：	3
功能数量：	1
端口数量：	1
端子数量：	78
字数：	536870912 words
字数代码：	512000000
工作模式：	SYNCHRONOUS
最高工作温度：	85 °C
最低工作温度：
组织：	512MX4
输出特性：	3-STATE
封装主体材料：	PLASTIC/EPOXY
封装代码：	TFBGA
封装等效代码：	BGA78,9X13,32
封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	260
电源：	1.5 V
认证状态：	Not Qualified
刷新周期：	8192
座面最大高度：	1.2 mm
自我刷新：	YES
连续突发长度：	8
最大待机电流：	0.012 A
子类别：	DRAMs
最大压摆率：	0.16 mA
最大供电电压 (Vsup)：	1.575 V
最小供电电压 (Vsup)：	1.425 V
标称供电电压 (Vsup)：	1.5 V
表面贴装：	YES
技术：	CMOS
温度等级：	OTHER
端子面层：	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：	BALL
端子节距：	0.8 mm
端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	7.5 mm
Base Number Matches：	1

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