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产品型号LC5210D的Datasheet PDF文件预览

LC5200 Series  
LED Drivers  
Features and Benefits  
Description  
Supply voltage, VBB, 450 V maximum,  
25 to 400 V recommended; Note: lowest voltage can vary  
depending on LED loads  
LC5200 series is an off-line LED driver IC which includes  
both a main controller integrated circuit (MIC) and a  
power MOSFET. Its high voltage capability allows direct  
connection to a wide range of supply voltages ranging from  
25 to 400 V (recommended). The LC5200 uses constant  
current mode to drive LEDs. The package is a standard  
8-pin DIP, with pin 7 removed for greater creepage distance  
from the supply pin.  
Output current IO(max) options:  
0.5 A, LC5205D  
1.0 A, LC5210D  
Constant current control circuit:  
Fixed off-time PWM constant current control, off-time  
adjustable by external components  
Externally adjustable output current by input voltage  
to REF pin  
Output current dimming by external PWM signal; low  
signal to TOFF pin shuts off output current, and PWM  
signal input to that pin enables dimming  
Undervoltage lockout protection (UVLO)  
Overcurrent protection (OCP); latched in response to the  
short-to-GND condition  
Thermal Shutdown protection (TSD); protects IC from  
damage due to excess temperature, auto-restart when  
temperature drops below threshold  
Package: 7-pin DIP  
Not to scale  
Functional Block Diagram  
VBB  
OUT  
MIC  
TSD  
Reg  
Regulator  
UVLO  
Gate  
Current  
Control  
Logic  
OCP  
Toff  
Ref  
Driver  
GND  
Sen  
48102.002  
LC5200 Series  
LED Drivers  
Selection Guide  
Part Number  
Output Current, IO(max)  
(A)  
0.5  
1.0  
LC5205D  
LC5210D  
Absolute Maximum Ratings at TA = 25°C  
Characteristic  
Symbol  
Notes  
Rating  
450  
Units  
Supply Voltage  
VBB  
V
V
A
A
Output Breakdown Voltage  
Output Current  
VO  
450  
LC5205D, tw 1 μs  
LC5210D, tw 1 μs  
0.5  
IO  
1.0  
REF Pin Input Voltage  
SENSE Pin Voltage  
VREF  
VRS  
–0.3 toVREG +0.3  
±2  
V
V
tw 1 μs  
On Sanken evaluation PCB; affected by applica-  
tion PCB layout  
Allowable Power Dissipation  
PD  
1.73  
W
Junction Temperature  
TJ  
TA  
150  
ºC  
ºC  
ºC  
Operating Ambient Temperature  
Storage Temperature  
–40 to 105  
–40 to 150  
T
stg  
Recommended Operating Conditions  
Characteristic  
Symbol  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Lowest voltage can vary depending on LED  
loads  
Supply Voltage  
VBB  
25  
400  
V
LC5205D  
0.4  
0.8  
0.5  
105  
A
A
Average Output Current  
IO  
LC5210D  
REF Input Voltage  
Case Temperature  
VREF  
TC  
In normal operation  
Measured at center of case, TJ < 150°C  
V
°C  
Terminal List Table  
Name  
Number  
Function  
Regulator output pin for powering external components. Connect 0.1 μF bypass  
capacitor between this pin and GND.  
Reg  
1
Pin-out Diagram  
For self-oscillation operation, connect external capacitor and resistor to set  
off-time. For externally-controlled PWM operation, input PWM adjustment signal.  
8
7
6
5
GND  
Reg  
Toff  
Ref  
Sen  
1
2
3
4
Toff  
2
(Removed)  
VBB  
Ref  
Sen  
OUT  
3
4
5
Reference voltage input pin, for output peak current.  
OUT  
Connect external resistor for PWM peak current control and OCP.  
Internally connected to the MOSFET drain, output connection to LED load.  
Supply voltage pin; internally connected to the voltage regulator to power the  
internal circuits.  
VBB  
6
7
8
No connection; pin removed to increase creepage distance from VBB pin.  
Device ground pin.  
GND  
All performance characteristics given are typical values for  
circuit or system baseline design only and are at the nominal  
operating voltage and an ambient temperature of 25°C, un-  
less otherwise stated.  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
2
48102.002  
LC5200 Series  
LED Drivers  
ELECTRICAL CHARACTERISTICS Valid at TA = 25°C and VBB = 140 V, unless otherwise noted  
Characteristics  
Supply Voltage Input Current  
MOSFET Breakdown Voltage  
MOSFET On-Voltage  
Symbol  
Test Conditions  
Min.  
Typ.  
2
Max.  
Unit  
mA  
mA  
V
IBB  
Normal operation  
1
IBBS  
At output off  
0.6  
VDSS  
ID = 1 mA  
450  
ID = 0.5 A, LC5205  
3
V
VDS(on)  
I
D = 1.0 A, LC5210  
ID = 0.5 A, LC5205  
D = 1.0 A, LC5210  
2.5  
0.85  
0.9  
12  
V
V
MOSFET Diode Forward Voltage  
VF  
I
V
REG Pin Output Voltage  
VREG  
IREG  
fclk  
IREG = 0 mA  
11.5  
12.5  
2
V
REG Pin Maximum Output Current  
Maximum PWM Operating Frequency  
REF Pin Input Voltage  
VREG = 11.5 V  
PWM frequency  
mA  
kHz  
V
200  
1
VREF  
IREF  
0
REF Pin Input Current  
±10  
μA  
VREF  
– 0.03  
VREF  
+ 0.03  
SENSE Pin Voltage  
VRS  
VREF  
V
SENSE Pin Current  
IRS  
±10  
3
μA  
V
OCP Threshold Voltage  
PWM Off-Time  
VOCP  
TPOFF  
Measured at SENSE pin  
RTOFF = 560 kΩ, CTOFF = 220 pF  
21  
13  
14  
150  
55  
20  
50  
μs  
V
UVLO On Threshold Voltage  
UVLO Off Threshold Voltage  
TSD Threshold Temperature  
TSD Hysteresis Temperature  
VUVLO(on) For VBB  
VUVLO(off) For VBB  
V
TTSD  
Main controller IC (MIC) temperature  
°C  
°C  
ns  
ns  
TTSDhys  
tr  
tf  
ID = 0.4 A  
ID = 0.4 A  
Switching Time  
Power Dissipation versus Ambient Temperature  
PD = 1.73 W  
R
θJA = 72°C/W  
Ambient Temperature, TA (°C)  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
3
48102.002  
LC5200 Series  
LED Drivers  
Functional Description  
perature increase. When the temperature drops by the hysteresis  
amount, TTSDhys , or if the supply voltage is recycled, the device  
returns to normal operation. Note: The primary source of heating  
is the MOSFET, and there is a delay while the heat spreads to the  
MIC and is sensed. Therefore, a rapid temperature increase of the  
MOSFET may damage the device.  
Regulator  
The LC5200 series provides 12 V output voltage, generated  
from the supply voltage on the VBB pin, which is used to power  
internal circuits and external components. When the gate capaci-  
tance charging of the MOSFET occurs, it generates a current  
surge, which results in ripple voltage. This could affect operation,  
therefore, connect a 0.1 μF ceramic capacitor at the REG pin to  
stabilize operation.  
OCP (Overcurrent Protection)  
When the SENSE pin input voltage reaches the OCP threshold,  
Current Control  
V
OCP, it shuts off the output and shifts into latch mode. In order  
Current control is done by a fixed off-time PWM topology. The  
output current level can be set by the input voltage on the REF  
pin, and voltage across the current sense resistor at the SENSE  
pin. In addition, the fixed off-time can be adjusted by the values  
selected for the external capacitor and resistor at the TOFF pin.  
to release from latch mode, cycle the device power supply.  
Note: OCP is for protecting the device from excess current. OCP  
may not work at an LED-short condition because the coil may  
suppress current increase.  
Internal Switching Logic  
UVLO (Undervoltage Lock Out)  
This prevents the device from malfunctioning by shutting down  
the output circuit when the internal supply voltage becomes lower  
than the ULVO threshold voltage, VUVLO . In addition, the UVLO  
circuit is used for the power-on reset function of overcurrent  
protection (OCP).  
The device turns the MOSFET gate driver circuit on or off based  
on the status of the current control sensing circuit and the protec-  
tion circuits.  
Gate-Driver Operation  
This comprises the MOSFET gate driver circuit.  
TSD (Thermal Shutdown)  
The two device versions in the LC5200 series are distinguished  
from each other by the MOSFET current rating. Select the current  
rating that best matches the application circuit.  
When the main control chip (MIC) temperature exceeds the TSD  
threshold temperature, TTSD , the device shuts off the output (sys-  
tem logic continues to operate), in order to avoid abnormal tem-  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
4
48102.002  
LC5200 Series  
LED Drivers  
Application Information  
ratings. Set the total voltage drop across the LED string to be  
less than VBB; otherwise, the LED string turns off. As a general  
design rule, the PWM off-time should be longer if there is a small  
drop in voltage across the LED string, and it should be shorter  
if there is a high drop in voltage across the LED string. For the  
LC5205D, a 9 to 30 V drop across the LED string is recom-  
mended for proper operation.  
Typical Application Example  
A typical application circuit is shown in figure 1. The values of  
the external components are shown in the adjacent table.  
Component Value Setting  
LED LED current should not exceed the LC5200 device current  
Line  
Filter  
Input  
CO  
Di  
LED  
L
VBB  
Reg  
ROf f  
R1  
R2  
LC5200 OUT  
Toff  
Ref  
Sen  
GND  
COf f  
RS  
C1  
Figure 1. Typical application circuit  
Referenced Typical Application Components  
Symbol  
Components  
Values / Ratings  
Descriptions  
Main supply source voltage rectifying capacitor  
Note: 1 F can be used  
C0  
Electrolytic capacitor  
100 F / 450 V  
C1  
COff  
Di  
Capacitor  
Capacitor  
Diode  
0.1 F / 25 V  
100 pF / 25 V  
RL3A  
The internal regulator output capacitor  
PWM off-time adjusting capacitor  
High voltage, ultrafast rectifying, current recirculation diode  
PWMing choke coil  
L
Coil  
1 mH / 1 A  
―――  
LED  
R1  
LEDs  
LED load  
Resistor  
Resistor  
Resistor  
Resistor  
680 kΩ / 1/8 W  
20 kΩ / 1/8 W  
620 kΩ / 1/8 W  
1.0 Ω / 1 W  
Reference pin voltage setup resistor  
Reference pin voltage setup resistor  
PWM off-time adjusting resistor  
Output current sensing resistor  
R2  
ROff  
RS  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
5
48102.002  
LC5200 Series  
LED Drivers  
L This is the choke coil for constant-current PWM operation. The R1, R2, RS These determine the LED peak current, according to  
higher the inductance of this component, the less ripple amplitude  
the output current has. In general, 0.5 to 20 mH is recommended.  
Also ensure the coil does not saturate at the peak of the ripple  
current. Saturation causes high surge current and it could cause  
damage to the LEDs or the device.  
the following formula:  
IPEAK = VREG × R2 / ( [ R1 + R2 ] × RS )  
For example, if the target is an IPEAK of 0.35 A, the formula  
becomes:  
Di This diode provides a path for recirculation current. If a diode  
with slow recovery characteristics is used, it will cause surge  
current when the MOSFET turns on, as well as noise increase and  
device malfunction may result. In addition, it causes efficiency  
drop. Therefore, the Sanken RL3A ultrafast recovery diode, or a  
diode of better or equal recovery characteristics (50 ns), is recom-  
mended.  
IPEAK 12 (V) × 20 (kΩ) / ([20 (kΩ) + 680 (kΩ) ] × 1 Ω)  
= 0.35 A  
Based on it, R1 = 20 kΩ, R2 = 680 kΩ, and RS = 1 Ω can be  
determined.  
Note that R1 and R2 cause power consumption by the internal  
regulator. Therefore, follow the formula below in order to mini-  
mize the power consumption:  
CO This is the main supply voltage rectifying capacitor. The  
greater the capacitance, the less ripple voltage occurs. In addition,  
because higher output power causes an increase of the ripple volt-  
age, choose a proper value of capacitance for the output power.  
Even if the capacitance is low (like 1000 pF) and the ripple  
voltage becomes high, the device works. It also makes possible  
a non-electrolytic capacitor design, which results in lengthening  
unit life and reducing unit size and cost. However, if the bottom  
of the ripple voltage falls below the LC5200 UVLO threshold,  
or below the voltage drop of the LED string, the LEDs are turned  
off during that period.  
( R1 + R2 ) > 500 kΩ  
In actual design, the current peak tends to be higher than the esti-  
mated value, due to internal circuit delays. This becomes obvious  
at high di/dt conditions, which can result from high VBB or from  
low coil inductance.  
With regard to the resistor RS, because output current runs  
through it, use a resistor rated for 2 to 3 times higher than the  
power dissipation.  
C1 This capacitor is for stabilizing the internal regulator circuit  
operation. Connect a 0.1 μF capacitor as close to the device as  
possible in order to operate the MOSFET properly. Using a small  
capacitance value causes slow switching speed and malfunction-  
ing, however, a large value of capacitance causes slow startup.  
R
OFF, COFF These decide PWM off-time, TPOFF. Figure 2 shows  
PWM off-time curves based on various values of Coff and Roff.  
PWM off-time is approximately 20 μs at the recommended val-  
ues: Roff = 560 kΩ and Coff = 220 pF.  
50  
F
p
0
7
4
=
f
f
O
C
F
p
0
2
2
=
f
f
O
C
20  
10  
5
F
p
0
0
1
=
f
f
CO  
F
p
7
4
=
f
f
CO  
F
p
22  
=
COff  
F
p
10  
=
f
f
CO  
2
1
200  
400  
600  
800  
1000  
ROff[kΩ]  
Figure 2. Affect of various values for capacitor COFF and resistor ROFF on PWM off-time  
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48102.002  
LC5200 Series  
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Description of Operation  
Current Control  
PWM current control works as shown in figure 3.  
Reg  
PWM On Period. During MOSFET on-time, the current runs  
3V 2V  
through the ION path (shown in red in figure 3, panel A).  
ROff  
Comp1  
MOSFET Turn Off. During on-time, the current increases as  
the red waveform in panel B, and when it reaches the VSENSE  
threshold voltage, the MOSFET turns off.  
-
S
R
Q
Toff  
Ref  
+
COff  
6V  
PWM Off Period. During MOSFET off-time, the back EMF  
occurs on the coil and the energy which is charged on the coil  
during the on-time is deenergized by the current IOFF running  
through the path in blue of panel A.  
Comp2  
+
-
Blank Pulse  
VRef  
I
MOSFET Turn On. After the fixed off-time, which is set by the  
external capacitor and resistor at the Toff pin, the MOSFET turns  
on again, and repeats the above operations.  
O
OUT  
Sen  
Figure 4 shows the current control circuit and figure 5 shows the  
timing diagram of that circuit. When the MOSFET turns on, both  
the load current and VSen, across the sensing resistor RS, increase.  
Comp2 compares VSen and VRef and its output is inverted at VSen  
> VRef (see point A in figure 5). This resets the latter RS latch and  
it results in turning off the MOSFET after the signal goes through  
several logic circuits. At the same time, Coff at the Toff pin is dis-  
charged by the internal MOS switch, and when the Comp1 invert-  
ing input (linked to the Toff pin) voltage becomes lower than 2 V,  
Comp1 output is inverted and it sets the RS latch. This turns off  
the MOS switch and initiates the charging process of Coff by Roff.  
Coff voltage (Toff pin) increases by it and when its voltage reaches  
3 V, Comp1 output becomes high and it turns on the MOSFET  
(point B in figure 5). The Blank Pulse circuit creates periods that  
mask surge or ringing noise, from turn off edge to just after the  
turn on edge, for securing proper PWM operation.  
Gate Driver  
Logic  
RS  
GND  
Figure 4. Current Control Circuit  
VRef  
VSen  
Comp2  
OUT  
I
ON  
Comp2  
Valid  
Invalid  
Valid  
I
OFF  
VBB  
OUT  
LED  
L
I
on  
I
off  
I
on  
I
off  
Di  
VToff  
Comp1  
-IN  
Comp1  
OUT  
I
LED  
V
REF  
V
SENSE  
t
off  
SENSE  
GND  
ON  
OFF  
ON  
OFF  
OUT  
R
V
SENSE  
S
Toff  
A
B
(A)  
(B)  
Figure 3. Output current control circuit  
Figure 5. Current Control Circuit Timing Chart  
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48102.002  
LC5200 Series  
LED Drivers  
MOSFET on or off, therefore, the circuit in figure 6, panel C  
also works to adjust the output current by the external signal. In  
this application, when the external small signal MOSFET turns  
on, LC5200 stops an output pulse.  
LED Current Setting and Dimming  
Output current level can be set using two alternative methods:  
Internal PWM Control. The LC5200 series provides fixed off-  
time PWM current control operation, allowing implementation  
of an LED constant-current control circuit with only a small  
quantity of external components.  
External PWM Control. In this method of control, the LC5200  
allows direct on/off control of the MOSFET, for synchroniz-  
ing PWM operation among LED arrays or for other reasons.  
With this method, a pull-up shunt is connected from the REF  
pin to the regulator output as shown figure 7. The capacitor and  
resistor are removed from the TOFF pin, and instead the PWM  
signal is input to the TOFF pin. Note that for this method, the  
internal peak current control is disabled; therefore, it requires  
an external current control circuit for constant current opera-  
tion. However, overcurrent protection is still in active to protect  
the LC5200 and LEDs from excessive current. The TOFF pin  
threshold has hysteresis characteristics: from < 2 V to MOSFET  
off, and from > 3 V to MOSFET on. Therefore, use 5 V CMOS  
compatible input for the control.  
The output current is calculated by the formula below:  
IO = VREF / RS  
Based on this formula, there are two methods of LED current  
control available:  
Analog control, varying the REF pin voltage as shown in  
figure 6, panel A)  
PWM integrated control, inputting external PWM signal  
through a low pass filter (LPF) and connecting the output to the  
REF pin (figure 6, panel B)  
In either method, the TOFF pin voltage is used to turn the  
REG  
REG  
R
C
R
C
LC5200  
LC5200  
OFF  
OFF  
R
R
OFF  
OFF  
1
TOFF  
REF  
TOFF  
REF  
LPF  
PWM  
SENSE  
SENSE  
GND  
GND  
R
LPF  
2
R
R
S
S
C
LPF  
(A) Analog control  
(B) Integrated PWM control  
REG  
R
LC5200  
OFF  
OFF  
R
R
1
Internal PWM Truth Table  
TOFF  
REF  
MOSFET  
C
SENSE  
PWM  
OUT  
GND  
Low  
Low (ON)  
High (OFF)  
2
R
PWM  
S
High  
z100 Hz  
(C) External signal on TOFF pin  
Figure 6. Implementations of internal PWM control  
REG  
LC5200  
REF  
TOFF  
PWM  
External PWM Truth Table  
SENSE  
GND  
TOFF  
OUT  
Low < 2 V  
High > 3 V  
High (OFF)  
Low (ON)  
RS  
Figure 7. Implementation of external PWM control  
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48102.002  
LC5200 Series  
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for the REF pin. This way, LED current follows the AC voltage  
shape and improves the power factor. In case the REF voltage  
fluctuates widely, place a clamp diode in parallel with R2 to pro-  
tect the REF pin. In that case, the REF voltage becomes distorted  
(lower waveform in figure 8) and could cause the power factor to  
decrease.  
About TRIAC Dimming Control (Phase Control)  
Commonly used TRIAC dimmers are designed for mainly resis-  
tive loads and they require TRIAC holding current for proper  
phase controls. LC5200 series does not respond to this type of  
dimmers because it does not have function to create the holding  
current during phase off period.  
Figure 9 shows actual waveforms of the operation. Panel A shows  
operation with fixed REF pin voltage, and panel B shows opera-  
tion with AC proportional REF pin voltage. For both operations,  
there is no AC rectification capacitor used. The yellow wave-  
form is the AC input current, and the black waveform is a 2 kHz  
low pass filtered waveform. In panel B, the current forms a sine  
Power Factor Improvement  
Making the LED current proportional to the AC input voltage  
improves the power factor, and it can be realized using LC5200  
series REF pin function. Figure 8 shows the application circuit.  
There is no AC rectification capacitor, and R2 and R3 divide the  
AC voltage to create a proportional low voltage as the AC voltage waveform, which means the power factor is improved.  
PF improved  
vBB  
VBB  
vBB  
R3  
Optional  
clamp diode  
LC5200  
REF  
vREF  
GND  
VF  
R2  
vRef  
PF loss with clamping  
R2  
vRef  
vBB  
R2 R3  
Figure 8. Power factor improvement circuit  
VBB  
VBB  
IAC after  
2 kHz LPF  
IAC after  
2 kHz LPF  
ILED  
ILED  
Fixed VREF, PF = 49.1%  
AC proportional voltage, PF = 82.9%  
Figure 9. Power factor improvement operating waveforms: 100 VAC, 5 white LEDs in series, average LED current 0.5 A; black trace: AC input current IAC  
after 2 kHz low pass filter = 500 mA/ div.; red trace: IAC after 2 kHz low pass filter = 200 mA/ div.  
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48102.002  
LC5200 Series  
LED Drivers  
Thermal Design  
150  
100  
50  
D
P
×
2
7
=
a
-
j
T
Δ
D
P
×
0
6
=
c
-
j
T
Δ
0
0
0.5  
1
1.5  
2
PD[W]  
MOSFET On Voltage versus Drain Current  
2  
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48102.002  
LC5200 Series  
LED Drivers  
WARNING These devices are designed to be operated at lethal voltages and energy levels. Circuit designs  
thatembodythesecomponentsmustconformwithapplicablesafetyrequirements. Precautionsmustbe  
takentopreventaccidentalcontactwithpower-linepotentials. Donotconnectgroundedtestequipment.  
The use of an isolation transformer is recommended during circuit development and breadboarding.  
Because reliability can be affected adversely by improper storage  
Heatsink Mounting Method  
environments and handling methods, please observe the following  
cautions.  
Cautions for Storage  
Torque When Tightening Mounting Screws. Thermal resistance  
increases when tightening torque is low, and radiation effects are  
decreased. When the torque is too high, the screw can strip, the  
heatsink can be deformed, and distortion can arise in the product frame.  
To avoid these problems, observe the recommended tightening torques  
for this product package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7  
to 9 kgf•cm).  
Ensure that storage conditions comply with the standard  
temperature (5°C to 35°C) and the standard relative humidity  
(around 40 to 75%); avoid storage locations that experience  
extreme changes in temperature or humidity.  
Avoid locations where dust or harmful gases are present and  
avoid direct sunlight.  
Reinspect for rust on leads and solderability of products that have  
been stored for a long time.  
Diameter of Heatsink Hole: < 4 mm. The deection of the press mold  
when making the hole may cause the case material to crack at the joint  
with the heatsink. Please pay special attention for this effect.  
Cautions for Testing and Handling  
Soldering  
When tests are carried out during inspection testing and other  
standard test periods, protect the products from power surges  
from the testing device, shorts between adjacent products, and  
shorts to the heatsink.  
When soldering the products, please be sure to minimize the  
working time, within the following limits:  
260±5°C 10 s  
Remarks About Using Silicone Grease with a Heatsink  
350±5°C 3 s  
When silicone grease is used in mounting this product on a  
heatsink, it shall be applied evenly and thinly. If more silicone  
grease than required is applied, it may produce stress.  
Soldering iron should be at a distance of at least 1.5 mm from the  
body of the products  
Coat the back surface of the product and both surfaces of the  
insulating plate to improve heat transfer between the product and  
the heatsink.  
Electrostatic Discharge  
When handling the products, operator must be grounded.  
Grounded wrist straps worn should have at least 1 Mof  
resistance to ground to prevent shock hazard.  
Volatile-type silicone greases may permeate the product and  
produce cracks after long periods of time, resulting in reduced  
heat radiation effect, and possibly shortening the lifetime of the  
product.  
Workbenches where the products are handled should be  
grounded and be provided with conductive table and floor mats.  
Our recommended silicone greases for heat radiation purposes,  
which will not cause any adverse effect on the product life, are  
indicated below:  
When using measuring equipment such as a curve tracer, the  
equipment should be grounded.  
When soldering the products, the head of soldering irons or the  
solder bath must be grounded in other to prevent leak voltages  
generated by them from being applied to the products.  
Type  
G746  
Suppliers  
Shin-Etsu Chemical Co., Ltd.  
Momentive Performance Materials  
Dow Corning Toray Silicone Co., Ltd.  
The products should always be stored and transported in our  
shipping containers or conductive containers, or be wrapped in  
aluminum foil.  
YG6260  
SC102  
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48102.002  
LC5200 Series  
LED Drivers  
Package Drawing, DIP-7 (DIP-8)  
x yz  
S
K D  
{ |} ~  
Dimensions in MM  
Terminal treatment: Ni plating and solder plating (Pb-free)  
Marking  
Position  
Contents  
Indication  
The last digit of the year  
0 to 9  
The Month  
1 to 9,O,N,D  
1 to 3  
The Week  
Sanken Registration Number  
alphanumeric characters  
Appearance: The body shall be clean and shall not bear any stain, rust or flaw.  
Marking: The type number and lot number shall be clearly marked by laser so that cannot be erased easily.  
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48102.002  
LC5200 Series  
LED Drivers  
Packing Specifications  
Minimum type of packing: Stick  
Capacity:50pcs per stick  
Dimensions in millimeters  
Direction of parts insertion  
Plugs with tab  
Plugs without tab  
50 pcs  
Packing style  
Stick Packing 2 (Outer Box)  
Capacity:4 inner boxes per outer box  
(Maximum quantity of Products:10,000 pcs.)  
Stick Packing 1 (Inner box)  
Capacity:50 Sticks per box  
Dimensions in millimeters  
Dimensions in millimeters  
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LC5200 Series  
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Application and operation examples described in this document are quoted for the  
sole purpose of reference for the use of the products herein and neither Sanken  
nor Allegro can assume any responsibility for any infringement of industrial  
property rights, intellectual property rights or any other rights of Sanken or any  
third party which may result from its use.  
Cautions and Warnings  
Terminal connection  
When using the products herein, the applicability and suitability of such products  
for the intended purpose shall be reviewed at the user’s responsibility.  
To avoid malfunction, terminals of this IC should not be left open.  
Although Sanken undertakes to enhance the quality and reliability of its products,  
the occurrence of failure and defect of semiconductor products at a certain rate is  
inevitable.  
Operation of the protection circuit  
(OCP,TSD)  
Users of Sanken products are requested to take, at their own risk, preventative  
measures including safety design of the equipment or systems against any  
possible injury, death, fires or damages to the society due to device failure or  
malfunction.  
This product has two protection circuits (OCP and TSD). These protection circuits  
work by detecting excessive applied to the driver. Therefore, these function are  
not able to protect if the power exceeds the tolerance of the driver.  
Handling  
Sanken products listed in this document are designed and intended for the use  
as components in general purpose electronic equipment or apparatus (home  
appliances, office equipment, telecommunication equipment, measuring  
equipment, etc.).  
When static electricity is a problem, care should be taken to properly control  
the room humidity, especially in the winter when static electricity is most  
troublesome.  
When considering the use of Sanken products in the applications where higher  
reliability is required (transportation equipment and its control systems, traffic  
signal control systems or equipment, fire/crime alarm systems, various safety  
devices, etc.), please contact your nearest Sanken or Allegro sales representative  
to discuss and obtain written confirmation of your spec ifications.  
IC  
Care should be taken with device leads and with assembly sequence to avoid  
applying static charges to IC leads. PC board pins should be shorted together to  
keep them at the same potential to avoid this kind of trouble.  
The use of Sanken products without the written consent of Sanken in the  
applications where extremely high reliability is required (aerospace equipment,  
nuclear power control systems, life support systems, etc.) is strictly prohibited.  
Cautions for Storage  
Ensure that storage conditions comply with the standard temperature (5°C to  
35°C) and the standard relative humidity (approximately 40% to 75%) and avoid  
storage locations that experience extreme changes in temperature or humidity.  
Anti radioactive ray design is not considered for the products listed herein.  
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48102.002  
LC5200 Series  
LED Drivers  
The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.  
Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit im-  
provements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this  
publication is current before placing any order.  
When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users  
responsibility.  
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products  
at a certain rate is inevitable.  
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems  
against any possible injury, death, fires or damages to society due to device failure or malfunction.  
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus  
(home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation  
hardness assurance (e.g., aerospace equipment) is not supported.  
When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems  
or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written  
confirmation of your specifications.  
The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equip-  
ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.  
The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are  
given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property  
rights, or any other rights of Sanken or Allegro or any third party that may result from its use.  
Anti radioactive ray design is not considered for the products listed herein.  
Copyright © 2009 Allegro MicroSystems, Inc.  
This datasheet is based on Sanken datasheet SSE-23014  
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配单直通车
LC5210D产品参数
型号:LC5210D
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Obsolete
IHS 制造商:SANKEN ELECTRIC CO LTD
包装说明:,
Reach Compliance Code:unknown
风险等级:5.81
峰值回流温度(摄氏度):NOT SPECIFIED
处于峰值回流温度下的最长时间:NOT SPECIFIED
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