Surface Mount Polyethylene Naphthalate (PEN) Film Capacitor
LDE, Unencapsulated Stacked Chip, Size 1206 – 6054, 50 – 1,000 VDC (Automotive Grade)
Production process basic suggestions
In case of:
Typical cause
Typical solution
landing area dimensions
see landing areas suggestions, page 17
solder paste quality
see solder paste suggestions, page 17
set the dispensing solder paste machine properly
set the pick and place machine properly
seeꢀreflowꢀrecommendations,ꢀpageꢀ14
not-uniform solder paste thickness
on the landing areas
wrong position of the capacitor
on the landing areas
no solder joint on one
end termination
thermalꢀprofileꢀtemperature
bad temperature distribution
checkꢀtheꢀreflowꢀovenꢀtemperatureꢀ
inꢀtheꢀreflowꢀoven
distribution and variations
landing area dimensions
solder paste quality
see landing areas suggestions, page 17
see solder paste suggestions, page 17
no solder paste on the landing areas
thermalꢀprofileꢀtemperature
set the dispensing solder paste machine properly
seeꢀreflowꢀrecommendations,ꢀpageꢀ14
no solder joint on both
end termination
bad temperature distribution
checkꢀtheꢀreflowꢀovenꢀtemperatureꢀ
inꢀtheꢀreflowꢀoven
distribution and variations
oxidated end terminations
tooꢀlongꢀtimeꢀoverꢀ217°C
see moisture recommendations, page 15
seeꢀreflowꢀrecommendations,ꢀpageꢀ14
too long time within Tmax and Tmax−5°C
too high temperature ramp rate
capacitor damaged by a soldering iron
tooꢀlongꢀtimeꢀoverꢀ217°C
seeꢀreflowꢀrecommendations,ꢀpageꢀ14
capacitor's body
mechanical deformation
seeꢀreflowꢀrecommendations,ꢀpageꢀ14
see manual soldering recommendations, page 16
seeꢀreflowꢀrecommendations,ꢀpageꢀ14
too long time within Tmax and Tmax−5°C
too high temperature ramp rate
capacitor damaged by a soldering iron
capacitor damaged by a soldering iron
seeꢀreflowꢀrecommendations,ꢀpageꢀ14
capacitance drop (up to 20%)
capacitance drop (over 20%)
seeꢀreflowꢀrecommendations,ꢀpageꢀ14
see manual soldering recommendations, page 16
see manual soldering recommendations, page 16
Note: small fissures on the capacitor’s cutting surface are actually slight detachments of two adjacent metallized film layers and have to be considered
only as an aesthetic issue related to the SMD Film Capacitors’ manufacturing process and technology.
Therefore, small fissures on SMD Film Capacitors are not comparable to cracks on SMD Ceramics.
Fissures do not influence in anyway SMD Film Capacitors’ reliability.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
F3078_LDE • 4/9/2018 18