欢迎访问ic37.com |
会员登录 免费注册
发布采购
所在地: 型号: 精确
  • 批量询价
  •  
  • 供应商
  • 型号
  • 数量
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
  •  
  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • LE87402MQCT
  • 数量-
  • 厂家-
  • 封装-
  • 批号-
  • -
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931、62106431、62104891、62104791 QQ:857273081QQ:1594462451
更多
  • LE87402MQCT图
  • 集好芯城

     该会员已使用本站13年以上
  • LE87402MQCT
  • 数量1068 
  • 厂家Microchip Technology 
  • 封装 
  • 批号最新批次 
  • 原厂原装公司现货
  • QQ:3008092965QQ:3008092965 复制
    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • LE87402MQCT图
  • 深圳市宏捷佳电子科技有限公司

     该会员已使用本站12年以上
  • LE87402MQCT
  • 数量15300 
  • 厂家Microchip Technology 
  • 封装28-VQFN 裸露焊盘 
  • 批号24+ 
  • 只做原装★真实库存★含13点增值税票!
  • QQ:2353549508QQ:2353549508 复制
    QQ:2885134615QQ:2885134615 复制
  • 0755-83201583 QQ:2353549508QQ:2885134615
  • LE87402MQCT图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • LE87402MQCT
  • 数量9328 
  • 厂家MICROSEMI-美高森美 
  • 封装QFN-28 
  • 批号▉▉:2年内 
  • ▉▉¥11.1元一有问必回一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • LE87402MQCT图
  • 昂富(深圳)电子科技有限公司

     该会员已使用本站4年以上
  • LE87402MQCT
  • 数量37228 
  • 厂家MICROCHIP/微芯 
  • 封装VQFN 
  • 批号23+ 
  • 一站式BOM配单,短缺料找现货,怕受骗,就找昂富电子.
  • QQ:GTY82dX7
  • 0755-23611557【陈妙华 QQ:GTY82dX7
  • LE87402MQCT图
  • 深圳市毅创腾电子科技有限公司

     该会员已使用本站16年以上
  • LE87402MQCT
  • 数量8177 
  • 厂家MICROCHIP 
  • 封装QFN28 
  • 批号22+ 
  • ★只做原装★正品现货★原盒原标★
  • QQ:2355507168QQ:2355507168 复制
    QQ:2355507169QQ:2355507169 复制
  • 86-755-83219286 QQ:2355507168QQ:2355507169
  • LE87402MQCT图
  • 深圳市宏世佳电子科技有限公司

     该会员已使用本站13年以上
  • LE87402MQCT
  • 数量3365 
  • 厂家Microchip 
  • 封装28-VQFN 裸露焊盘 
  • 批号2023+ 
  • 全新原厂原装产品、公司现货销售
  • QQ:2881894392QQ:2881894392 复制
    QQ:2881894393QQ:2881894393 复制
  • 0755-82556029 QQ:2881894392QQ:2881894393
  • LE87402MQCT图
  • 深圳市思诺康科技有限公司

     该会员已使用本站16年以上
  • LE87402MQCT
  • 数量1000 
  • 厂家Microchip Technology 
  • 封装28-VQFN 
  • 批号23+ 
  • IC-接口芯片驱动器、接收器、收发器
  • QQ:2881281130QQ:2881281130 复制
    QQ:2881281133QQ:2881281133 复制
  • 0755-83286481 QQ:2881281130QQ:2881281133
  • LE87402MQCT图
  • 深圳市中利达电子科技有限公司

     该会员已使用本站11年以上
  • LE87402MQCT
  • 数量10000 
  • 厂家MICROCHIP 
  • 封装QFN28 
  • 批号24+ 
  • 原装进口现货 假一罚十
  • QQ:1902134819QQ:1902134819 复制
    QQ:2881689472QQ:2881689472 复制
  • 0755-13686833545 QQ:1902134819QQ:2881689472
  • LE87402MQCT图
  • 深圳市隆鑫创展电子有限公司

     该会员已使用本站15年以上
  • LE87402MQCT
  • 数量30000 
  • 厂家IR 
  • 封装TO-262 
  • 批号2022+ 
  • 电子元器件一站式配套服务QQ:122350038
  • QQ:2355878626QQ:2355878626 复制
    QQ:2850299242QQ:2850299242 复制
  • 0755-82812278 QQ:2355878626QQ:2850299242
  • LE87402MQCT图
  • 深圳市科雨电子有限公司

     该会员已使用本站9年以上
  • LE87402MQCT
  • 数量3000 
  • 厂家MICROSEMI 
  • 封装QFN-28 
  • 批号24+ 
  • ★体验愉快问购元件!!就找我吧!单价:31元
  • QQ:1415691092QQ:1415691092 复制
  • 133-5299-5145(微信同号) QQ:1415691092
  • LE87402MQCT图
  • 深圳市瑞天芯科技有限公司

     该会员已使用本站7年以上
  • LE87402MQCT
  • 数量20000 
  • 厂家MICROSEMI 
  • 封装QFN 
  • 批号22+ 
  • 深圳现货库存,保证原装正品
  • QQ:1940213521QQ:1940213521 复制
  • 15973558688 QQ:1940213521
  • LE87402MQCT图
  • 深圳市创思克科技有限公司

     该会员已使用本站2年以上
  • LE87402MQCT
  • 数量8000 
  • 厂家MICROCHIP/微芯 
  • 封装 
  • 批号21+ 
  • 全新原装原厂实力挺实单欢迎来撩
  • QQ:1092793871QQ:1092793871 复制
  • -0755-88910020 QQ:1092793871
  • LE87402MQCT图
  • 深圳市一线半导体有限公司

     该会员已使用本站11年以上
  • LE87402MQCT
  • 数量4629 
  • 厂家Microchip Technology 
  • 封装 
  • 批号 
  • 全新原装部分现货其他订货
  • QQ:2881493920QQ:2881493920 复制
    QQ:2881493921QQ:2881493921 复制
  • 0755-88608801多线 QQ:2881493920QQ:2881493921

产品型号LE87402MQCT的概述

芯片LE87402MQCT概述 LE87402MQCT是一款高性能的集成电路芯片,主要应用于无线通信和数据传输领域。这款芯片结合了先进的无线传输技术和微处理器控制能力,为各种通信设备提供高级别的信号处理能力。由于其良好的工作稳定性和较低的功耗,LE87402MQCT在市场上得到了广泛的关注和应用。 芯片LE87402MQCT的详细参数 LE87402MQCT的参数包括: 1. 工作电压:适用于2.7V至5.5V的宽电压范围,使其能够在多种不同的电源环境中工作。 2. 功耗:待机功耗低至10µA,工作功耗在100mA以下,这使得它非常适合电池供电的设备。 3. 工作温度范围:-40°C至85°C的广泛工作温度范围,确保在恶劣环境下的可靠性。 4. 频率范围:支持2.4GHz至2.5GHz的工作频率,适合Wi-Fi和蓝牙等无线通信标准。 5. 数据传输速率:最大可达1Mbps,满足高速数据...

产品型号LE87402MQCT的Datasheet PDF文件预览

Le87402  
Datasheet  
PLC Dual Channel Line Driver BD870 Series  
May 2018  
PLC Dual Channel Line Driver BD870 Series  
Contents  
1 Revision History ............................................................................................................................. 1  
1.1 Revision 8.0 ........................................................................................................................................ 1  
1.2 Revision 7.0 ........................................................................................................................................ 1  
1.3 Revision 6.0 ........................................................................................................................................ 1  
1.4 Revision 5.0 ........................................................................................................................................ 1  
1.5 Revision 4.0 ........................................................................................................................................ 1  
1.6 Revision 3.0 ........................................................................................................................................ 1  
1.7 Revision 2.0 ........................................................................................................................................ 1  
1.8 Revision 1.0 ........................................................................................................................................ 2  
2 Product Overview .......................................................................................................................... 3  
2.1 Features .............................................................................................................................................. 4  
2.2 Applications ........................................................................................................................................ 4  
3 Functional Descriptions ................................................................................................................. 5  
3.1 Operation States ................................................................................................................................. 5  
3.2 Class GH Operation ............................................................................................................................. 5  
3.3 Boost Capacitor .................................................................................................................................. 6  
3.4 Operation Without Boosting .............................................................................................................. 6  
4 Electrical Specifications .................................................................................................................. 8  
4.1 Thermal Resistance ............................................................................................................................ 9  
4.2 Operating Ranges ............................................................................................................................... 9  
4.3 Test Circuit ........................................................................................................................................ 10  
4.4 Performance Characteristics ............................................................................................................ 10  
5 Pin Descriptions ........................................................................................................................... 13  
6 Package Information .................................................................................................................... 15  
6.1 Package Assembly ............................................................................................................................ 15  
7 Design Considerations ................................................................................................................. 17  
7.1 Internal Reference Current ............................................................................................................... 17  
7.2 Input Considerations ........................................................................................................................ 17  
7.3 Output Driving Considerations ......................................................................................................... 17  
7.4 Power Supplies and Component Placement .................................................................................... 18  
8 Ordering Information ................................................................................................................... 19  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
PLC Dual Channel Line Driver BD870 Series  
1
Revision History  
The revision history describes the changes that were implemented in the document. The changes are  
listed by revision, starting with the most current publication.  
1.1  
1.2  
Revision 8.0  
Revision 8.0 was published in May 2018. The format of this document was updated to the latest  
template.  
Revision 7.0  
Revision 7.0 was published in November 2015. The following is a summary of changes done in revision  
7.0 of this document.  
Added package thermal information in Electrical Specifications (see page 8).  
Content in Class GH Operation (see page 5) is re-written for clarity.  
1.3  
1.4  
Revision 6.0  
Revision 6.0 was published in February 2014. The following is a summary of changes done in revision 6.0  
of this document.  
Edited the figure, 28-pin QFN Physical Dimensions (see page 15) to show all information.  
Title of Figure 2 (see page 6) is corrected to read GH operation.  
Revision 5.0  
Revision 5.0 was published in November 2013. The following is a summary of changes done in revision  
5.0 of this document.  
Updated RoHS statement in the section, Ordering Information (see page 19).  
Usable VS supply voltage range is increased in Operating Ranges (see page 9).  
Defined RREF in the section, ELectrical Specifications (see page 8).  
Added a new section, Internal Reference Current (see page 17).  
1.5  
Revision 4.0  
Revision 4.0 was published in June 2013. The following is a summary of changes done in revision 4.0 of  
this document.  
Updated the section, Class GH Operation (see page 5).  
Updated the table, Pin Descriptions (see page 14).  
Added the section, Performance Characteristics (see page 10).  
1.6  
1.7  
Revision 3.0  
Revision 3.0 was published in April 2013. Tape and Reel diagram is added in, 28-pin QFN Physical  
Dimensions (see page 15).  
Revision 2.0  
Revision 2.0 was published in January 2013. The following is a summary of changes done in revision 2.0  
of this document.  
Changed descriptions of Class H to Class GH operations in Product Overview (see page 3).  
Updated the Le87402 Block Diagram (see page 3).  
Edited the table, Operating Ranges (see page 9).  
Updated the figure, Basic Test Circuit (see page 10).  
Updated figure, Typical Application Circuit - Channel A/B (see page 18).  
Added descriptions of GH Operations (see page 5).  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
1
 
 
 
 
 
 
 
 
PLC Dual Channel Line Driver BD870 Series  
1.8  
Revision 1.0  
Revision 1.0 was published in November 2013. It was the first publication of this document.  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
2
 
PLC Dual Channel Line Driver BD870 Series  
2
Product Overview  
Le87402 is a dual-channel line driver designed to work in home plug alliance HPAV2 systems, G.HN and  
MOCA. Each channel can be enabled independently; allowing multiple-in, multiple-out (MIMO) or single-  
in, single-out (SISO) operations. The Le87402 can drive a line impedance of 100 Ω down to 12 Ω through  
a proper transformer and delivers superior performance with power efficiency using Class GH operation.  
The following figure shows the block diagram of Le87402  
Figure 1 • Le87402 Block Diagram  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
3
 
 
PLC Dual Channel Line Driver BD870 Series  
2.1  
Features  
Le87402 has the following important features.  
Designed for HPAV2 standard  
MIMO or SISO operation  
Dual channel architecture  
28-pin, 4 × 5 mm QFN package  
Low power operation  
Class GH operation  
Supports HPAV2 power save mode  
Independent channel enable/disable control  
Capable of driving line impedance between 12 Ω to 100 Ω  
Operations to 86 MHz  
10 V to 12 V operation  
2.2  
Applications  
The following applications use Le87402.  
Power line communications  
Home networking  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
4
 
 
PLC Dual Channel Line Driver BD870 Series  
3
Functional Descriptions  
The following sections describe functionalities of Le87402.  
3.1  
Operation States  
Operation state control is depicted in the following table. For active operation, each channel will either  
be in enable state (power-up mode) or disable state (power-down mode). A standby state (long-term  
sleep mode) is also provided. EN1 and EN2 independently control each channel’s power mode as  
follows:  
EN1 = 0, channel A/B in power-down mode; EN1 = 1, channel A/B in power-up mode  
EN2 = 0, channel C/D in power-down mode; EN2 = 1, channel C/D in power-up mode  
C0 and C1 control state selection and their setting applies to both channels. A setting of C0 = C1 = 0  
overrides EN1/2 and places both channels in standby state. Standby is the default state when power is  
initially supplied.  
Table 1 • Operation State Control  
EN1 or EN2  
C1  
1
C0  
1
Device State  
Mode  
1
1
1
X
0
0
0
Enable Full Power  
Enable 90% Power  
Enable 80% Power  
Standby  
Power-up  
0
1
1
0
0
0
Sleep  
1
1
Disable  
Power-down  
1
0
0
1
Note: X = Do not care.  
3.2  
Class GH Operation  
The device operates and drives signals using a low-voltage supply. The device includes circuitry that  
stores voltage on external boost capacitors. When the capacitors are switched on, the supply to the  
output of the drive amplifiers is increased; as if a high supply in Class G operation is switched on , similar  
to a Class H operation, thereby avoiding saturation and any associated distortion. The GH operation is  
shown in the following figure. VS is the external low-voltage supply. When BSTEN is low, external boost  
capacitors CBSD and CBSS are charged up, each to about half of the VS potential. When BSTEN is high,  
the supplies to the drive amplifiers of the output stage are boosted to the charged value. The timing  
diagram is shown in Timing Diagram for Class-H Operation (see page 7).  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
5
 
 
 
PLC Dual Channel Line Driver BD870 Series  
Figure 2 • Class GH Operation  
3.3  
3.4  
Boost Capacitor  
The minimum value for the boost capacitors (CBSD and CBSS) is dependent on the amplitude statistics  
of the transmitted waveform. There is no maximum value for the boost capacitor.  
Operation Without Boosting  
The device may be used in an application that does not require the boosting supply function. When  
operating the device without boosting, the following actions are allowed.  
Externally, tie VBPI pin to VS and VBNI pin to GND. This enables a wider VOUT range at the same VS  
voltage.  
External boosting capacitors, CBSD and CBSS, can be removed.  
VS can be increased beyond the operating ranges shown in Operating Ranges (see page 9), but  
must remain within the absolute maximum ratings shown in Absolute Maximum Ratings (see page  
9).  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
6
 
 
 
PLC Dual Channel Line Driver BD870 Series  
Figure 3 • Timing Diagram for Class GH Operation  
Notes on Class GH Operation:  
VS is the voltage supply to the chip and must meet operating range restrictions listed in Operating  
Ranges (see page 9).  
VBPI and VBNI function as supply rails to the line driver amplifiers. When BSTEN is low, VBPI = VS -  
Vdiode and VBNI = GND + Vdiode where Vdiode is about 1 V. When BSTEN is high, VBPI and VBNI are  
boosted beyond the chip supply rails through external boosting capacitors.  
VPth and VNth mark the VOUT range limit while BSTEN is low, as shown in preceding figure. VOUT  
exceeds the thresholds if BSTEN is set high with an adequate warning time before the event. A 100  
ns warning time is shown in preceding figure.  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
7
 
PLC Dual Channel Line Driver BD870 Series  
4
Electrical Specifications  
The following sections provide the available electrical specifications for Le87402. The following table  
gives the device parameters, conditions, and the limits.  
VS = 12 V, RREF = 75 kΩ, and if not specified, the device is in enable full power state using the basic test  
circuit. Typical conditions are: TA = 25 °C. Minimum/Maximum parameters: TA = 0 °C to 85 °C.  
Table 2 • Electrical Specifications  
Parameter  
Condition  
Minimum  
Typical  
Maximum  
Unit  
mA  
Supply Current  
IVS (per channel)  
Quiescent, VINA/B and VINC/D  
floating  
– Enable full power state  
– Enable 90% power state  
– Enable 80% power state  
– Enable 80% power state  
– Disable state  
40  
36  
32  
57  
73  
66  
59  
51  
46  
VS = 10 V, RREF = 130 kΩ  
42  
mA  
mA  
mA  
0.7  
0.4  
1.0  
0.65  
1.4  
1.0  
Standby state (per device)  
Control Input (C0/1, EN1/2, BSTEN) Characteristics  
Internal 50 kΩ pull-down on all control inputs  
VIH  
1.2  
3.6  
0.6  
120  
20  
V
VIL  
–0.3  
V
IIH  
75  
10  
µA  
µA  
IIL  
Channel Input (VINA/B, VINC/D) Characteristics  
Input offset voltage  
–35  
13  
35  
18  
mV  
kΩ  
Differential input impedance  
VINA – VINB – VINC – VIND  
15  
Channel Output (VOUTA/B, VOUTC/D) Characteristics  
Output voltage  
Boosting1  
12.5  
8
VPK  
VPK  
mA  
Ω
Not boosting, BSTEN = 0  
RLoad = 10 Ω  
Output current  
600  
560  
Disabled output impedance1  
Channel Dynamic Characteristics  
Voltage gain  
Differential  
VOUT/VIN at 1 MHz  
–3 dB  
5.5  
6.5  
95  
15  
7.5  
V/V  
Bandwidth1  
MHz  
Input referred noise1  
Differential  
nV  
/√Hz  
MTPR1  
Pload = 40 mW  
–62  
–32  
dBc  
dBc  
0.5 MHz to 30 MHz  
30 MHz to 86 MHz  
Enable time1  
Between disable and any power-  
up state  
500  
500  
ns  
ns  
Disable time1  
Boost Characteristics  
BSTEN warning time1  
Time from BSTEN to VOUT  
crossing threshold  
100  
ns  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
8
 
PLC Dual Channel Line Driver BD870 Series  
Thermal Shutdown  
Thermal shutdown temperature1  
170  
°C  
Note: 1. Guaranteed by design and device characterization.  
Absolute Maximum Ratings  
Stresses above the values listed in the following table can cause permanent device failure. Functionality  
at or above these limits is not implied. Exposure to absolute maximum ratings for extended periods can  
affect device reliability. The following table shows the absolute maximum ratings of Le87402.  
Table 3 • Absolute Maximum Ratings  
Parameter  
Value  
Storage temperature  
–65 °C ≤ TA ≤ 150 °C  
– 40 °C ≤ TJ ≤ 150 °C1  
– 0.3 V to 16 V  
VS to GND  
Operating junction temperature  
VS to GND  
Driver inputs VINA/B/C/D  
Control inputs C0/1, EN1/2, BSTEN with respect to GND  
Continuous driver output current  
– 0.3 V to 4 V  
200 mArms  
1.7 W  
Maximum device power dissipation, continuous 2 – TA = 85 °C, PD  
Junction to ambient thermal resistance (2,3), ΘJA  
Junction to board thermal resistance 2, ΘJB  
Junction to case bottom (exposed pad) thermal resistance, ΘJC(BOTTOM)  
29.7 °C/W  
13.1 °C/W  
3.7 °C/W  
Junction-to-top characterization parameter2, ΨJT  
ESD immunity (human body model)  
ESD immunity (charge device model)  
Notes:  
0.3 °C/W  
JESD22 Class 2 compliant  
JESD22 Class IV compliant  
1. Continuous operation above 145°C junction temperature may degrade  
long term reliability of the device.  
2. See the following section.  
3. No air flow.  
4.1  
4.2  
Thermal Resistance  
The thermal performance of a thermally enhanced package is assured through optimized printed circuit  
board layout. Specified performance requires that the exposed thermal pad is soldered to an exposed  
copper surface of same size, which, in turn, conducts heat through multiple vials to larger internal  
copper planes.  
Operating Ranges  
Microsemi guarantees the performance of this device over 0 °C to 85 °C temperature range by  
conducting electrical characterization and a single insertion production test coupled with periodic  
sampling. These procedures comply with the Telcordia GR-357-CORE generic requirements for assuring  
the reliability of components used in telecommunications equipment.  
Table 4 • Operating Ranges  
Ambient temperature  
VS with respect to GND  
0 °C to 85 °C  
10 V to 12 V, +/- 5%  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
9
 
 
 
 
PLC Dual Channel Line Driver BD870 Series  
MIMO operation has the same device specification as SISO operation. The difference is that more power  
is delivered to the line in SISO operation.  
4.3  
Test Circuit  
The following figure shows the basic test circuit.  
Figure 4 • Basic Test Circuit  
4.4  
Performance Characteristics  
The following graphs show typical device performance characteristics using the Basic Test Circuit (see  
page 10). Plotted performance is representative of either of the channels. Differential Gain (see page  
11) plots device gain performance versus frequency. Supply Power Versus Load Power (see page 11)  
plots line driver power to the load; with one channel operating in the full power state and loaded with  
40 Ω. Disabled Output Impedance Applications (see page 12) plots output impedance versus frequency  
in the disabled state.  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
10  
 
 
 
PLC Dual Channel Line Driver BD870 Series  
Figure 5 • Differential Gain  
Figure 6 • Supply Power Versus Load Power  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
11  
 
 
PLC Dual Channel Line Driver BD870 Series  
Figure 7 • Disabled Output Impedance Applications  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
12  
 
PLC Dual Channel Line Driver BD870 Series  
5
Pin Descriptions  
The following figure shows the pin diagram for Le87402.  
Figure 8 • Le87402 Pin Diagram  
Note: 1. Pin 1 is marked for orientation.  
2. The device incorporates an exposed die pad on the underside of its package. The pad acts as a heat  
sink and must be connected to a copper plane through thermal vials for proper heat dissipation. It is  
electrically isolated and may be connected to GND.  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
13  
 
PLC Dual Channel Line Driver BD870 Series  
The following table lists the pin name, corresponding pin number, type, and the descriptions.  
Table 5 • Pin Descriptions  
Pin Name  
IREF  
Pin #  
Type  
Description  
1
Input  
Device internal reference current. Connect resistor RREF to GND  
Channel A and B enable/disable control  
Channel C and D enable/disable control  
Amplifier A input  
EN1  
26  
Input  
EN2  
11  
Input  
VINA  
VINB  
2
Input  
3
Input  
Amplifier B input  
VINC  
6
Input  
Amplifier C input  
VIND  
VOUTA  
VOUTB  
VOUTC  
VOUTD  
C0, C1  
VBPO  
VBPI  
7
Input  
Amplifier D input  
27  
Output  
Output  
Output  
Output  
Inputs  
Output  
Input  
Amplifier A input  
25  
Amplifier B input  
12  
Amplifier C input  
10  
Amplifier D input  
28,9  
23  
Sets operation state when channel is enabled  
Connect a capacitor to VBPI  
Connects to V S through an internal diode  
Power supply  
21  
VS  
18,19,20  
4,5,13,17  
16  
Power  
Ground  
Input  
GND  
Low noise analog ground  
Connects to GND through an internal diode  
Connects a capacitor to VBNI  
Boost enable  
VBNI  
VBNO  
BSTEN  
NC  
14  
Output  
Input  
24  
8,15,22  
NA  
No connect  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
14  
 
PLC Dual Channel Line Driver BD870 Series  
6
Package Information  
The following figure shows the outline drawing of the LE87402 device.  
Figure 9 • 28-pin QFN Physical Dimensions  
Note: Packages may have mold tooling markings on the surface. These markings have no impact on the  
form, fit or function of the device. Markings vary with the mold tool used in manufacturing.  
6.1  
Package Assembly  
The green package devices are assembled with enhanced, environmental compatible lead-free, halogen-  
free, and antimony-free materials. The leads possess a matte-tin plating which is compatible with  
conventional board assembly processes or newer lead-free board assembly processes.  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
15  
 
 
 
PLC Dual Channel Line Driver BD870 Series  
Refer to IPC/JEDEC J-Std-020 for recommended peak soldering temperature and solder reflow  
temperature profile.  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
16  
PLC Dual Channel Line Driver BD870 Series  
7
Design Considerations  
The Le87402 integrates two sets of high-power line driver amplifiers. The amplifiers are designed for  
low distortion for signals up to 86 MHz. A typical application interface circuit (for one channel) is shown  
in Typical Application Circuit (see page 18). The amplifiers have identical positive gain connections with  
common-mode rejection. Any DC input errors are duplicated and create common-mode rather than  
differential line errors.  
7.1  
Internal Reference Current  
Resistor RREF sets the internal reference current for both channels of the Le87402 device. The standard  
value for RREF is 75 kΩ, this value was used for all specifications in this data sheet. Increasing the value of  
RREF not only reduces device power dissipation but also lowers the available drive bandwidth. Do not  
exceed an RREF value above 130 kΩ.  
7.2  
7.3  
Input Considerations  
The driving source impedance should be less than 100 nH to avoid any ringing or oscillation.  
Output Driving Considerations  
The internal metallization is designed to drive 200 mArms sinusoidal current and there is no current  
limit mechanism. Driving lines without a series resistor is not recommended. If a DC current path exists  
between the two outputs, a DC current can flow through the outputs. To avoid DC current flow, the  
most effective solution is to place DC blocking capacitors in series with the output as shown in the  
following figure.  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
17  
 
 
 
 
PLC Dual Channel Line Driver BD870 Series  
7.4  
Power Supplies and Component Placement  
The power supplies should be well bypassed; with decoupling placed close to the Le87402. The  
following figure shows the typical application circuit for Le87402.  
Figure 10 • Typical Application Circuit - Channel A/B  
Note: In this figure only one channel of the two channel device is shown.  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
18  
 
 
PLC Dual Channel Line Driver BD870 Series  
8
Ordering Information  
The following list shows the ordering part numbers to be used while ordering Le87402.  
Le87402MQC 28-pin QFN Green Pkg. Tray  
Le87402MQCT 28-pin QFN Green Pkg. Tape and Reel  
Note: The preceding ordering part number is for ordering the tape and reel packing system.  
The green package is halogen free and meets RoHS 2 directive 2011/65/EU of the European Council to  
minimize the environmental impact of electrical equipment.  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
19  
 
PLC Dual Channel Line Driver BD870 Series  
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services  
for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The  
products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with  
mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and  
complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data  
and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any  
products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the  
entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights,  
licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this  
document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products  
and services at any time without notice.  
Microsemi Corporate Headquarters  
One Enterprise, Aliso Viejo,  
CA 92656 USA  
Within the USA: +1 (800) 713-4113  
Outside the USA: +1 (949) 380-6100  
Fax: +1 (949) 215-4996  
Email: sales.support@microsemi.com  
www.microsemi.com  
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense,  
communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated  
circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's  
standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions; security technologies  
and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.  
Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www.microsemi.com.  
© 2018 Microsemi Corporation. All rights reserved. Microsemi and the  
Microsemi logo are trademarks of Microsemi Corporation. All other  
trademarks and service marks are the property of their respective owners.  
PD-000267194  
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0  
20  
配单直通车
LE87402MQCT产品参数
型号:LE87402MQCT
生命周期:Active
包装说明:HVQCCN,
Reach Compliance Code:compliant
Factory Lead Time:10 weeks
风险等级:5.71
差分输出:NO
驱动器位数:4
输入特性:STANDARD
接口集成电路类型:LINE DRIVER
接口标准:GENERAL PURPOSE
JESD-30 代码:R-XQCC-N28
长度:5 mm
功能数量:4
端子数量:28
最高工作温度:85 °C
最低工作温度:
封装主体材料:UNSPECIFIED
封装代码:HVQCCN
封装形状:RECTANGULAR
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
座面最大高度:1 mm
最大供电电压:12.6 V
最小供电电压:9.5 V
标称供电电压:10 V
表面贴装:YES
温度等级:OTHER
端子形式:NO LEAD
端子节距:0.5 mm
端子位置:QUAD
宽度:4 mm
Base Number Matches:1
  •  
  • 供货商
  • 型号 *
  • 数量*
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
批量询价选中的记录已选中0条,每次最多15条。
 复制成功!