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  • LF412CDR图
  • 深圳市正纳电子有限公司

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     该会员已使用本站13年以上
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  • 深圳市芯球通科技有限公司

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  • 深圳市正信鑫科技有限公司

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  • 深圳市欧昇科技有限公司

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  • LF412CDR图
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  • LF412CDR
  • 数量5300 
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  • LF412CDRG4图
  • 深圳市科雨电子有限公司

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  • LF412CDRG4
  • 数量2500 
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  • 数量10000 
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  • 深圳市科雨电子有限公司

     该会员已使用本站9年以上
  • LF412CDR
  • 数量75350 
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  • 上海磐岳电子有限公司

     该会员已使用本站11年以上
  • LF412CDR
  • 数量12500 
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  • 封装 
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  • 深圳市得捷芯城科技有限公司

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  • LF412CDR
  • 数量24548 
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  • 数量6890000 
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产品型号LF412CDR的概述

LF412CDR芯片概述 LF412CDR是一款由国家半导体公司(National Semiconductor)推出的高性能双运算放大器,它在音频、信号处理以及其他需要高精度和低噪声操作的应用中表现出色。该芯片的设计目标是提供高增益、高带宽、低失真和较高的输入阻抗,以便在多种电子电路中广泛应用。LF412CDR运算放大器适用于各种放大、积分、滤波和比较电路,因而被许多工程师和设计师所青睐。 LF412CDR详细参数 LF412CDR的详细技术参数如下: 1. 电源电压范围:±3V至±15V或单电源5V至30V。 2. 增益带宽积:1MHz(典型值)。 3. 输入失调电压:最小值为1mV,最大可达5mV(在典型条件下)。 4. 输入阻抗:超过2MΩ,提供较高的输入灵敏度。 5. 输出电流:高达50mA,这使其能驱动负载而无需外部放大。 6. 噪声性能:低噪声设计,有效减少信号干扰。 7....

产品型号LF412CDR的Datasheet PDF文件预览

ꢀꢁ ꢂꢃ ꢄꢅ  
ꢆꢇꢈ ꢀ ꢉ ꢁ ꢊꢋꢌꢍ ꢎꢏꢇꢋ ꢐ ꢏꢊꢑ ꢈꢋ ꢍꢐ ꢎꢈꢀ ꢈꢒ ꢏ ꢀꢍ ꢁꢍ ꢊꢑ  
SLOS010B − MARCH 1987 − REVISED AUGUST 1994  
D OR P PACKAGE  
(TOP VIEW)  
D
D
D
D
D
D
D
Low Input Bias Current . . . 50 pA Typ  
Low Input Noise Current  
0.01 pA/Hz Typ  
Low Supply Current . . . 4.5 mA Typ  
1OUT  
1IN −  
1IN+  
1
2
3
4
8
7
6
5
V
CC+  
2OUT  
2IN−  
2IN+  
12  
High Input impedance . . . 10 Typ  
V
CC−  
Internally Trimmed Offset Voltage  
Wide Gain Bandwidth . . . 3 MHz Typ  
High Slew Rate . . . 13 V/µs Typ  
description  
This device is a low-cost, high-speed, JFET-input operational amplifier with very low input offset voltage and  
a specified maximum input offset voltage drift. It requires low supply current yet maintains a large gain bandwidth  
product and a fast slew rate. In addition, the matched high-voltage JFET input provides very low input bias and  
offset currents.  
The LF412C can be used in applications such as high-speed integrators, digital-to-analog converters,  
sample-and-hold circuits, and many other circuits.  
The LF412C is characterized for operation from 0°C to 70°C.  
symbol (each amplifier)  
IN −  
OUT  
+
IN +  
AVAILABLE OPTIONS  
PACKAGE  
V
IO  
max  
T
A
SMALL OUTLINE  
(D)  
PLASTIC DIP  
(P)  
AT 25°C  
0°C to 70°C  
3 mV  
LF412CD  
LF412CP  
The D packages are available taped and reeled. Add the suffix R to the  
device type (ie., LF412CDR).  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage, V  
Supply voltage, V  
Differential input voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 V  
CC+  
CC−  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V  
ID  
Input voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V  
I
Duration of output short circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited  
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW  
Operating temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C  
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
NOTE 1: Unless otherwise specified, the absolute maximum negative input voltage is equal to the negative power supply voltage.  
ꢋꢞ  
Copyright 1994, Texas Instruments Incorporated  
ꢚ ꢞ ꢛ ꢚꢓ ꢔꢨ ꢖꢕ ꢙ ꢡꢡ ꢟꢙ ꢗ ꢙ ꢘ ꢞ ꢚ ꢞ ꢗ ꢛ ꢣ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃꢄ ꢅ  
ꢆ ꢇꢈꢀ ꢉ ꢁ ꢊꢋꢌꢍ ꢎ ꢏꢇ ꢋ ꢐ ꢏꢊ ꢑꢈꢋꢍ ꢐ ꢎꢈ ꢀ ꢈꢒ ꢏ ꢀꢍ ꢁ ꢍꢊꢑ  
SLOS010B − MARCH 1987 − REVISED AUGUST 1994  
recommended operating conditions  
MIN  
3.5  
MAX  
18  
UNIT  
V
Supply voltage, V  
Supply voltage, V  
CC +  
CC −  
3.5  
18  
V
electrical characteristics over operating free-air temperature range, V  
specified)  
= 15 V (unless otherwise  
CC  
PARAMETER  
Input offset voltage  
TEST CONDITIONS  
T
MIN  
TYP  
MAX  
UNIT  
A
V
IO  
V
V
= 0,  
R
= 10 kΩ  
= 10 kΩ  
25°C  
1
3
mV  
IC  
S
S
Average temperature coefficient of input offset  
voltage  
20  
α
VIO  
= 0,  
R
10  
25  
µV/°C  
IC  
25°C  
70°C  
25°C  
70°C  
100  
4
pA  
nA  
pA  
nA  
§
I
IO  
V
= 0  
= 0  
Input offset current  
IC  
IC  
50  
200  
8
§
I
IB  
V
Input bias current  
11.5  
to  
14.5  
V
V
Common-mode input voltage range  
11  
V
ICR  
Maximum peak output voltage swing  
Large-signal differential voltage  
R
= 10 kΩ  
12  
25  
15  
13.5  
200  
200  
V
OM  
L
25°C  
A
VD  
V
T
=
10 V,  
R
= 2 kΩ  
V/mV  
O
L
Full range  
12  
10  
r
Input resistance  
= 25°C  
i
A
CMRR  
Common-mode rejection ratio  
Supply-voltage rejection ratio  
Supply current  
R
10 kΩ  
70  
70  
100  
100  
4.5  
dB  
dB  
mA  
S
k
See Note 2  
SVR  
I
6.8  
CC  
§
Full range is 0°C to 70°C.  
At least 90% of the devices meet this limit for α  
Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive. Pulse techniques  
must be used that will maintain the junction temperatures as close to the ambient temperature as possible.  
.
VIO  
NOTE 2: Supply-voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously.  
operating characteristics, V  
= 15 V, T = 25°C  
A
CC  
PARAMETER  
Crosstalk attenuation  
TEST CONDITIONS  
MIN  
TYP  
120  
13  
MAX  
UNIT  
dB  
V
/V  
f = 1 kHz  
O1 O2  
SR  
Slew rate  
8
V/µs  
B
V
Unity-gain bandwidth  
Equivalent input noise voltage  
Equivalent input noise current  
2.7  
3
MHz  
1
f = 1 kHz,  
f = 1 kHz  
R
= 20 Ω  
18  
nV/Hz  
pA/Hz  
n
S
I
n
0.01  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2007  
PACKAGING INFORMATION  
Orderable Device  
LF412CD  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
8
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
LF412CDE4  
LF412CDG4  
LF412CDR  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
D
D
D
D
D
P
P
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
LF412CDRE4  
LF412CDRG4  
LF412CP  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
LF412CPE4  
50  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
TAPE AND REEL BOX INFORMATION  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
(mm)  
LF412CDR  
D
8
SITE 27  
330  
12  
6.4  
5.2  
2.1  
8
12  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
LF412CDR  
D
8
SITE 27  
342.9  
336.6  
20.64  
Pack Materials-Page 2  
MECHANICAL DATA  
MPDI001A – JANUARY 1995 – REVISED JUNE 1999  
P (R-PDIP-T8)  
PLASTIC DUAL-IN-LINE  
0.400 (10,60)  
0.355 (9,02)  
8
5
0.260 (6,60)  
0.240 (6,10)  
1
4
0.070 (1,78) MAX  
0.325 (8,26)  
0.300 (7,62)  
0.020 (0,51) MIN  
0.015 (0,38)  
Gage Plane  
0.200 (5,08) MAX  
Seating Plane  
0.010 (0,25) NOM  
0.125 (3,18) MIN  
0.100 (2,54)  
0.021 (0,53)  
0.430 (10,92)  
MAX  
0.010 (0,25)  
M
0.015 (0,38)  
4040082/D 05/98  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-001  
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
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Copyright © 2007, Texas Instruments Incorporated  
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