Absolute Maximum Ratings (Note 7)
Lead Temperature (Soldering, 10 sec.)
Hermetic Package
300˚C
260˚C
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Plastic Package
Soldering Information
Dual-In-Line Package
Soldering (10 sec.)
Supply Voltage
20V
500 mW
10 mA
Power Dissipation (Note 2)
Differential Input Current (Note 3)
Input Voltage (Note 4)
Output Short-Circuit Duration
Operating Temperature Range
LM118
260˚C
Small Outline Package
Vapor Phase (60 sec.)
Infrared (15 sec.)
15V
215˚C
220˚C
Continuous
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering
surface mount devices.
−55˚C to +125˚C
−25˚C to +85˚C
0˚C to +70˚C
LM218
LM318
ESD Tolerance (Note 8)
2000V
Storage Temperature Range
−65˚C to +150˚C
Electrical Characteristics (Note 5)
Parameter
Conditions
LM118/LM218
LM318
Typ
4
Units
Min
Typ
2
Max
4
Min
Max
10
Input Offset Voltage
TA = 25˚C
TA = 25˚C
TA = 25˚C
TA = 25˚C
TA = 25˚C
TA = 25˚C, VS
mV
nA
Input Offset Current
Input Bias Current
Input Resistance
6
50
30
200
500
120
3
250
150
3
nA
1
0.5
25
50
MΩ
mA
Supply Current
5
8
5
10
Large Signal Voltage Gain
=
15V
50
50
200
200
V/mV
VOUT
=
10V, RL ≥ 2 kΩ
Slew Rate
TA = 25˚C, VS
(Note 6)
=
=
15V, AV = 1
15V
70
15
70
15
V/µs
Small Signal Bandwidth
Input Offset Voltage
Input Offset Current
Input Bias Current
TA = 25˚C, VS
MHz
mV
6
15
100
500
7
300
750
nA
nA
Supply Current
TA = 125˚C
4.5
13
mA
Large Signal Voltage Gain
VS
=
15V, VOUT
=
10V
25
20
V/mV
RL ≥ 2 kΩ
Output Voltage Swing
VS
VS
=
=
15V, RL = 2 kΩ
12
11.5
80
12
11.5
70
13
V
V
Input Voltage Range
15V
Common-Mode Rejection Ratio
Supply Voltage Rejection Ratio
100
80
100
80
dB
dB
70
65
Note 2: The maximum junction temperature of the LM118 is 150˚C, the LM218 is 110˚C, and the LM318 is 110˚C. For operating at elevated temperatures, devices
in the H08 package must be derated based on a thermal resistance of 160˚C/W, junction to ambient, or 20˚C/W, junction to case. The thermal resistance of the
dual-in-line package is 100˚C/W, junction to ambient.
Note 3: The inputs are shunted with back-to-back diodes for overvoltage protection. Therefore, excessive current will flow if a differential input voltage in excess of
1V is applied between the inputs unless some limiting resistance is used.
Note 4: For supply voltages less than 15V, the absolute maximum input voltage is equal to the supply voltage.
Note 5: These specifications apply for 5V ≤ V
≤
20V and −55˚C ≤ T ≤ +125˚C (LM118), −25˚C ≤ T ≤ +85˚C (LM218), and 0˚C ≤ T ≤ +70˚C (LM318). Also,
A A A
S
power supplies must be bypassed with 0.1 µF disc capacitors.
Note 6: Slew rate is tested with V 15V. The LM118 is in a unity-gain non-inverting configuration. V is stepped from −7.5V to +7.5V and vice versa. The slew
=
S
IN
rates between −5.0V and +5.0V and vice versa are tested and guaranteed to exceed 50V/µs.
Note 7: Refer to RETS118X for LM118H and LM118J military specifications.
Note 8: Human body model, 1.5 kΩ in series with 100 pF.
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