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产品型号LM2612BBPX的Datasheet PDF文件预览

May 2002  
LM2612  
400mA Sub-miniature, Programmable, Step-Down DC-DC  
Converter for Ultra Low-Voltage Circuits  
General Description  
Key Specifications  
n Operates from a single LiION cell (2.8V to 5.5V)  
n Pin programmable output voltage (1.05V, 1.3V, 1.5V and  
1.8V)  
The LM2612 step-down DC-DC converter is optimized for  
powering ultra-low voltage circuits from a single Lithium-Ion  
cell. It provides up to 400mA (300mA for B grade), over an  
input voltage range of 2.8V to 5.5V. Pin programmable out-  
put voltages of 1.05V, 1.3V, 1.5V or 1.8V allow adjustment  
for MPU voltage options without board redesign or external  
feedback resistors.  
n 400mA maximum load capability (300mA for B grade)  
±
n
2% PWM mode DC output voltage precision  
n 2mV typ PWM mode output voltage ripple  
n 150 µA typ PFM mode quiescent current  
n 0.1µA typ shutdown mode current  
n Internal synchronous rectification for high PWM mode  
efficiency (91% at 2.8VIN, 1.8VOUT  
n 600kHz PWM mode switching frequency  
n SYNC input for PWM mode frequency synchronization  
from 500kHz to 1MHz  
The device has three pin-selectable modes for maximizing  
battery life in mobile phones and similar portable applica-  
tions. Low-noise PWM mode offers 600kHz fixed-frequency  
operation to reduce interference in RF and data acquisition  
applications during full-power operation. In PWM mode, in-  
ternal synchronous rectification provides high efficiency  
(91% typ. at 1.8VOUT). A SYNC input allows synchronizing  
the switching frequency in a range of 500kHz to 1MHz to  
)
avoid noise from intermodulation with system frequencies. Features  
Low-current hysteretic PFM mode reduces quiescent current  
n Sub-miniature 10-pin micro SMD package  
to 150 µA (typ.) during system standby. Shutdown mode  
turns the device off and reduces battery consumption to  
0.1µA (typ.). Additional features include soft start and current  
overload protection.  
n Only three tiny surface-mount external components  
required  
n Uses small ceramic capacitors.  
n Internal soft start  
n Current overload protection  
n No external compensation required  
The LM2612 is available in a 10 pin micro SMD packge. This  
package uses National’s wafer level chip-scale micro SMD  
technology and offers the smallest possible size. Only three  
small external surface-mount components, an inductor and  
two ceramic capacitors are required.  
Applications  
n Mobile Phones  
n Hand-Held Radios  
n Battery Powered Devices  
Typical Application Circuit  
20007102  
© 2002 National Semiconductor Corporation  
DS200071  
www.national.com  
Connection Diagrams  
micro SMD package  
20007104  
20007105  
TOP VIEW  
BOTTOM VIEW  
Ordering Information  
Order Number  
Package Type  
NSC Package  
Drawing  
Supplied As  
10-Pin micro SMD  
LM2612ABP  
250 Units, Tape and Reel  
250 Units, Tape and Reel  
3000 Units, Tape and Reel  
3000 Units, Tape and Reel  
LM2612BBP  
10-bump Wafer Level Chip Scale  
(micro SMD)  
BPA10VWB  
LM2612ABPX  
LM2612BBPX  
Pin Description  
Pin Number(*)  
Pin Name  
Function  
A1  
B1  
C1  
D1  
FB  
Feedback Analog Input. Connect to the output at the output filter capacitor (Figure 1)  
Output Voltage Control Inputs. Set the output voltage using these digital inputs (see Table  
1). The output defaults to 1.5V if these pins are unconnected.  
VID1  
VID0  
SYNC/MODE Synchronization Input. Use this digital input for frequency selection or modulation control.  
Set:  
SYNC/MODE = high for low-noise 600kHz PWM mode  
SYNC/MODE = low for low-current PFM mode  
SYNC/MODE = a 500kHz - 1MHz external clock for synchronization to an external clock in  
PWM mode. See Synchronization and Operating Modes in the Device Information section.  
D2  
EN  
Enable Input. Set this CMOS Schmitt trigger digital input high to VDD for normal  
operation. For shutdown, set low to SGND. Set EN low during power-up and other low  
supply voltage conditions. (See Shutdown Mode in the Device Information section.)  
Power Ground  
D3  
C3  
PGND  
SW  
Switching Node connection to the internal PFET switch and NFET synchronous rectifier.  
Connect to an inductor with a saturation current rating that exceeds the 850mA max  
Switch Peak Current Limit specification of the LM2612 (Figure 1)  
Power Supply Input to the internal PFET switch. Connect to the input filter capacitor  
(Figure 1).  
B3  
A3  
A2  
PVIN  
VDD  
Analog Supply Input. If board layout is not optimum, an optional 0.1µF ceramic capacitor  
is suggested (Figure 1)  
SGND  
Analog and Control Ground  
(*) note the pin numbering scheme for the MicroSMD package was revised in April, 2002 to comform to JEDEC standard. Only the pin numbers were revised. No  
changes to the physical location of the inputs/outputs were made. For reference purpose, the obsolete numbering has FB as pin 1, VID1 as pin 2, VID0 as pin 3,  
SYNC as pin 4, EN as pin 5, PGND as pin 6, SW as pin 7, PVIN as pin 8, VDD as pin 9 and SGND as pin 10.  
www.national.com  
2
Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Lead temperature  
(Soldering, 10 sec.)  
260˚C  
Junction Temperature (Note 2)  
Minimum ESD Rating  
Human body model, C = 100pF, R =  
1.5 kΩ  
−25˚C to 125˚C  
PVIN, VDD, to SGND  
PGND to SGND  
EN, SYNC/MODE, VID0, VID1 to  
SGND  
−0.2V to +6V  
±
2.5kV  
−0.2V to +0.2V  
Thermal Resistance (θJA  
)
LM2612ABP & LM2612BBP (Note 3)  
170˚C/W  
−0.2V to +6V  
(GND −0.2V) to  
(VDD +0.2V)  
FB, SW  
Storage Temperature Range  
−45˚C to +150˚C  
Electrical Characteristics  
Specifications with standard typeface are for TA = TJ = 25˚C, and those in bold face type apply over the full Operating Tem-  
perature Range (TA = TJ = −25˚C to +85˚C). Unless otherwise specified, PVIN = VDD = EN = SYNC = 3.6V, VID0 = VID1 =  
0V.  
Symbol  
VIN  
Parameter  
Input Voltage Range (Note  
5)  
Conditions  
PVIN = VDD = VID1 = VIN  
VID0 = 0V  
Min  
Typ  
Max  
Units  
,
2.8  
5.5  
V
VID0 = VIN, VID1 = VIN  
VID0 = VIN, VID1 = 0V  
VID0 = 0V, VID1 = 0V  
VID0 = 0V, VID1 = VIN  
1.00  
1.274  
1.470  
1.764  
1.05  
1.30  
1.50  
1.8  
1.10  
1.326  
1.530  
1.836  
Feedback Voltage  
(Note 6)  
VFB  
V
VHYST  
PFM Comparator Hysteresis PFM Mode (SYNC = 0V)  
Voltage  
(Note 7)  
16  
mV  
µA  
ISHDN  
IQ1  
Shutdown Supply Current  
DC Bias Current into VDD  
(VOUT set to 1.5V)  
EN = 0V  
0.1  
3
No-Load, PFM mode  
(SYNC/MODE = 0V)  
No-Load, PWM mode  
150  
185  
µA  
IQ2  
555  
370  
330  
0.5  
725  
500  
500  
(SYNC/MODE = VIN  
)
RDSON (P)  
RDSON (N)  
RDSON , TC  
Ilim  
Pin-Pin Resistance for P  
FET  
LM2612ABP & LM2612BBP  
mΩ  
mΩ  
%/C  
mA  
Pin-Pin Resistance for N  
FET  
LM2612ABP & LM2612BBP  
FET Resistance  
Temperature Coefficient  
Switch Peak Current Limit  
(Note 8)  
LM2612ABP  
LM2612BBP  
VDD = 3.6V  
510  
400  
690  
690  
850  
980  
VEN_H  
EN Positive Going  
Threshold Voltage  
(Note 8)  
2.54  
2.00  
2.85  
V
V
VEN_L  
EN Negative Going  
Threshold Voltage  
(Note 8)  
VDD = 3.6V  
1.70  
VSYNC_H  
VSYNC_L  
VID_H  
SYNC/MODE Positive  
Going Threshold Voltage  
SYNC/MODE Negative  
Going Threshold Voltage  
VID0, VID1 Positive Going  
Threshold Voltage  
VID0, VID1 Negative Going  
Threshold Voltage  
0.95  
0.9  
1.3  
1.2  
V
V
V
V
0.4  
0.4  
0.92  
0.83  
VID_L  
3
www.national.com  
Electrical Characteristics (Continued)  
Specifications with standard typeface are for TA = TJ = 25˚C, and those in bold face type apply over the full Operating Tem-  
perature Range (TA = TJ = −25˚C to +85˚C). Unless otherwise specified, PVIN = VDD = EN = SYNC = 3.6V, VID0 = VID1 =  
0V.  
Symbol  
IVID  
Parameter  
VID1, VID0 Pull Down  
Current  
Conditions  
Min  
Typ  
Max  
Units  
VID1, VID0 = 3.6V  
1.8  
µA  
fsync  
SYNC/MODE Clock  
Frequency Range  
(Note 10)  
500  
1000  
kHz  
kHz  
FOSC  
Internal Oscillator  
Frequency  
LM2612ABP, PWM Mode  
(SYNC = VIN)  
468  
450  
600  
600  
200  
732  
750  
LM2612BBP, PWM Mode  
(SYNC = VIN)  
Tmin  
Minimum ON-Time of P FET  
Switch in PWM Mode  
ns  
Load Transient Response in Circuit of Figure 1  
±
25  
mV  
PWM Mode  
IOUT = 20mA to 200mA Step  
Line Transient Response in  
PFM Mode  
Circuit of Figure 1  
VIN = 3.0V to 3.6V Step  
tr = tp = 10 µs  
±
3
mV  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended  
to be functional, but parameter specifications may not be guaranteed. For guaranteed specifications and associated test conditions, see the Min and Max limits and  
Conditions in the Electrical Characteristics table. Electrical Characteristics table limits are guaranteed by production testing, design or correlation using standard  
Statistical Quality Control methods. Typical (Typ) specifications are mean or average values from characterization at 25C and are not guaranteed.  
Note 2: In PWM mode, Thermal shutdown will occur if the junction temperature exceeds the 150˚C maximum junction temperature of the device.  
Note 3: Thermal resistance specified with 2 layer PCB(0.5/0.5 oz. cu).  
Note 4: Thermal resistance specified with 3 layer PCB (2/1/1 oz. cu) and 12 vias 0.33mm diameter (see Application Note AN-1187).  
Note 5: The LM2612 is designed for cell phone applications where turn-on after power-up is controlled by the system processor and internal UVLO (Under Voltage  
LockOut) circuitry is unecessary. The LM2612 has no UVLO circuitry and should be kept in shutdown by holding the EN pin low until the input voltage exceeds 2.8V.  
Although the LM2612 exhibited safe behavior during pre-production evaluation while enabled at low input voltages, this is not guaranteed.  
Note 6: The feedback voltage is trimmed at the 1.5V output setting. The other output voltages result from the pin selection of the internal DAC’s divider ratios. The  
±
precision for the feedback voltages is 2%, except for the 1.05V setting, which is 5%. Contact the Portable Power Applications group at National Semiconductor,  
if trimming at other voltages is desired.  
Note 7: : The hysteresis voltage is the minimum voltage swing on FB that causes the internal feedback and control circuitry to turn the internal PFET switch on and  
then off, during PFM mode.  
Note 8: Current limit is built-in, fixed, and not adjustable. If the current limit is reached while the output is pulled below about 0.7V, the internal PFET switch turns  
off for 2.5 µs to allow the inductor current to diminish.  
Note 9: EN is a CMOS Schmitt trigger digital input with logic thresholds that scale with the supply voltage at the VDD pin. The nominal logic thresholds are  
approximately 0.71VDD and 0.55VDD for the high and low thresholds respectively.  
Note 10: SYNC driven with an external clock switching between V and GND. When an external clock is present at SYNC, the IC is forced to PWM mode at the  
IN  
external clock frequency. The LM2612 synchronizes to the rising edge of the external clock.  
www.national.com  
4
Typical Operating Characteristics  
LM2612ABP, Circuit of Figure 1, VIN = 3.6V, TA = 25˚C,  
L1 = 10 µH, unless otherwise noted.  
Quiescent Supply Current vs Temperature  
Quiescent Supply Current vs Supply Voltage  
20007106  
20007107  
Shutdown Quiescent Current vs Temperature  
Output Voltage vs Temperature (PWM Mode)  
20007108  
20007109  
Output Voltage vs Supply Voltage  
(VOUT = 1.8V, PWM Mode)  
Output Voltage vs Temperature (PFM Mode)  
20007110  
20007111  
5
www.national.com  
Typical Operating Characteristics LM2612ABP, Circuit of Figure 1, VIN = 3.6V, TA = 25˚C, L1 = 10  
µH, unless otherwise noted. (Continued)  
Output Voltage vs Supply Voltage  
(VOUT = 1.8V, PFM Mode)  
Output Voltage vs Supply Voltage  
(VOUT = 1.5V, PWM Mode)  
20007112  
20007114  
20007116  
20007113  
20007115  
20007117  
Output Voltage vs Supply Voltage  
(VOUT = 1.5V, PFM Mode)  
Output Voltage vs Supply Voltage  
(VOUT = 1.3V, PWM Mode)  
Output Voltage vs Supply Voltage  
(VOUT = 1.3V, PFM Mode)  
Output Voltage vs Supply Voltage  
(VOUT = 1.05V, PWM Mode)  
www.national.com  
6
Typical Operating Characteristics LM2612ABP, Circuit of Figure 1, VIN = 3.6V, TA = 25˚C, L1 = 10  
µH, unless otherwise noted. (Continued)  
Output Voltage vs Supply Voltage  
(VOUT = 1.05V, PFM Mode)  
Output Voltage vs Output Current  
(VOUT = 1.8V, PWM Mode)  
20007119  
20007118  
Output Voltage vs Output Current  
(VOUT = 1.8V, PFM Mode)  
Output Voltage vs Output Current  
(VOUT = 1.5V, PWM Mode)  
20007120  
20007121  
Output Voltage vs Output Current  
(VOUT = 1.5V, PFM Modee)  
Output Voltage vs Output Current  
(VOUT = 1.3V, PWM Mode)  
20007122  
20007123  
7
www.national.com  
Typical Operating Characteristics LM2612ABP, Circuit of Figure 1, VIN = 3.6V, TA = 25˚C, L1 = 10  
µH, unless otherwise noted. (Continued)  
Output Voltage vs Output Current  
(VOUT = 1.3V, PFM Mode)  
Output Voltage vs Output Current  
(VOUT = 1.05V, PWM Mode, With Diode)  
20007124  
20007125  
Output Voltage vs Output Current  
Efficiency vs Output Current  
(VOUT = 1.05V, PFM Mode, With Diode)  
(VOUT = 1.8V, PWM Mode, With Diode)  
20007126  
20007127  
Efficiency vs Output Current  
Efficiency vs Output Current  
(VOUT = 1.8V, PFM Mode, With Diode)  
(VOUT = 1.5V, PWM Mode, With Diode)  
20007128  
20007129  
www.national.com  
8
Typical Operating Characteristics LM2612ABP, Circuit of Figure 1, VIN = 3.6V, TA = 25˚C, L1 = 10  
µH, unless otherwise noted. (Continued)  
Efficiency vs Output Current  
Efficiency vs Output Current  
(VOUT = 1.5V, PFM Mode, With Diode)  
(VOUT = 1.3V, PWM Mode, With Diode)  
20007130  
20007131  
Efficiency vs Output Current  
(VOUT = 1.3V, PFM Mode)  
Efficiency vs Output Current  
(VOUT = 1.05V, PWM Mode)  
20007132  
20007133  
Efficiency vs Output Current  
Efficiency vs Output Current  
(VOUT = 1.05V, PFM Mode, With Diode)  
(VOUT = 1.8V, PWM Mode,No Diode)  
20007135  
20007134  
9
www.national.com  
Typical Operating Characteristics LM2612ABP, Circuit of Figure 1, VIN = 3.6V, TA = 25˚C, L1 = 10  
µH, unless otherwise noted. (Continued)  
Efficiency vs Output Current  
(VOUT = 1.8V, PFM Mode, No Diode)  
Switching Frquency vs Temperature  
(PWM Mode)  
20007136  
20007139  
Load Transient Response (PWM Mode)  
Load Transient Response (PFM Mode)  
20007141  
20007146  
A: INDUCTOR CURRENT, 500mA/div  
B: SW PIN, 5V/div  
C: V , 50mV/div, AC COUPLED  
A: INDUCTOR CURRENT, 500mA/div  
B: SW PIN, 5V/div  
C: V , 50mV/div, AC COUPLED  
OUT  
OUT  
D: LOAD, 20mA to 200mA, 200mA/div  
D: LOAD, 10mA to 100mA, 100mA/div  
Shutdown Response (PWM Mode)  
Shutdown Response (PFM Mode)  
20007140  
20007145  
A: INDUCTOR CURRENT, 500mA/div  
B: SW PIN, 2V/div  
A: INDUCTOR CURRENT, 500mA/div  
B: SW PIN, 2V/div  
C: V  
, 1V/div  
C: V  
, 1V/div  
OUT  
OUT  
D: EN, 5V/div  
D: EN, 5V/div  
www.national.com  
10  
Typical Operating Characteristics LM2612ABP, Circuit of Figure 1, VIN = 3.6V, TA = 25˚C, L1 = 10  
µH, unless otherwise noted. (Continued)  
PWM to PFM Response  
Line Transient Response (PWM Mode)  
20007144  
20007149  
A: INDUCTOR CURRENT, 500mA/div  
B: SW PIN, 2V/div  
C: V , 50mV/div, AC COUPLED  
A: SUPPLY VOLTAGE, 500mV/div, AC COUPLED  
B: SW PIN, 5V/div  
C: V , 10mV/div, AC COUPLED  
OUT  
OUT  
D: SYNC/MODE, 5V/div  
L
= 22 µH  
1
11  
www.national.com  
current to 150µA typ to maximize battery life. Shutdown  
mode turns the device off and reduces battery consumption  
to 0.1µA (typ.).  
Device Information  
The LM2612 is a simple, step-down DC-DC converter opti-  
mized for powering low-voltage CPUs or DSPs in cell  
phones and other miniature battery powered devices. It pro-  
vides pin-selectable output voltages of 1.05V, 1.3V, 1.5V or  
1.8V from a single 2.8V to 5.5V LiION battery cell. It is  
designed for a maximum load capability of 400mA (300mA  
for B grade).  
The LM2612 offers good performance and a full set of fea-  
tures. It is based on  
a current-mode switching buck  
architecture for cycle-by-cycle current limiting. DC PWM  
±
mode output voltage precision is 2% for most output volt-  
±
ages and 3% for 1.05V. The SYNC/MODE input accepts an  
external clock between 500kHz and 1MHz. The output volt-  
age selection pins eliminate external feedback resistors.  
Additional features include soft-start, current overload pro-  
tection, over-voltage protection and thermal overload protec-  
tion.  
The device has all three of the pin-selectable operating  
modes required for cell phones and other complex portable  
devices. Such applications typically spend a small portion of  
their time operating at full power. During full power operation,  
synchronized or fixed-frequency PWM mode offers full out-  
put current capability while minimizing interference to sensi-  
tive IF and data acquisition circuits. PWM mode uses syn-  
chronous rectification for high efficiency: typically 91% for a  
100mA load with 1.8V output, 2.8V input. These applications  
spend the remainder of their time in low-current standby  
operation or shutdown to conserve battery power. During  
standby operation, hysteretic PFM mode reduces quiescent  
The LM2612 is constructed using a chip-scale 10-pin micro  
SMD package. The micro SMD package offers the smallest  
possible size for space critical applications, such as cell  
phones. Required external components are only a small  
10uH inductor, and tiny 10uF and 22uF ceramic capacitors  
for reduced board area.  
20007103  
FIGURE 1. Typical Operating Circuit  
transferred back into the circuit and depleted, the inductor  
current ramps down with a slope of VOUT/L. If the inductor  
current reaches zero before the next cycle, the synchronous  
rectifier is turned off to prevent current reversal. The output  
filter capacitor stores charge when the inductor current is  
high, and releases it when low, smoothing the voltage across  
the load.  
Circuit Operation  
Referring to Figure 1, Figure 2, and Figure 3 the LM2612  
operates as follows: During the first part of each switching  
cycle, the control block in the LM2612 turns on the internal  
PFET switch. This allows current to flow from the input  
through the inductor to the output filter capacitor and load.  
The inductor limits the current to a ramp with a slope of (VIN  
-VOUT)/L, by storing energy in a magnetic field. During the  
second part of each cycle, the controller turns the PFET  
switch off, blocking current flow from the input, and then  
turns the NFET synchronous rectifier on. In response, the  
inductor’s magnetic field collapses, generating a voltage that  
forces current from ground through the synchronous rectifier  
to the output filter capacitor and load. As the stored energy is  
The output voltage is regulated by modulating the PFET  
switch on-time to control the average current sent to the  
load. The effect is identical to sending a duty-cycle modu-  
lated rectangular wave formed by the switch and synchro-  
nous rectifier to a low-pass filter created by the inductor and  
output filter capacitor. The output voltage is equal to the  
average voltage at the SW pin.  
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12  
Circuit Operation (Continued)  
20007101  
FIGURE 2. Simplified Functional Diagram  
the PWM comparator resets the flip-flop and turns off the  
PFET switch, ending the first part of the cycle. The NFET  
synchronous rectifier turns on until the next clock pulse or  
the inductor current ramps to zero. If an increase in load  
pulls the output voltage down, the error amplifier output  
increases, which allows the inductor current to ramp higher  
before the comparator turns off the PFET switch. This in-  
creases the average current sent to the output and adjusts  
for the increase in the load.  
PWM Operation  
The LM2612 can be set to current-mode PWM operation by  
connecting the SYNC/MODE pin to VDD. While in PWM  
(Pulse Width Modulation) mode, the output voltage is regu-  
lated by switching at a constant frequency and then modu-  
lating the energy per cycle to control power to the load.  
Energy per cycle is set by modulating the PFET switch  
on-time pulse-width to control the peak inductor current. This  
is done by controlling the PFET switch using a flip-flop driven  
by an oscillator and a comparator that compares a ramp  
from the current-sense amplifier with an error signal from a  
voltage-feedback error amplifier. At the beginning of each  
cycle, the oscillator sets the flip-flop and turns on the PFET  
switch, causing the inductor current to ramp up. When the  
current sense signal ramps past the error amplifier signal,  
Before going to the PWM comparator, the current sense  
signal is summed with a slope compensation ramp from the  
oscillator for stability of the current feedback loop. During the  
second part of the cycle, a zero crossing detector turns off  
the NFET synchronous rectifier if the inductor current ramps  
to zero.  
13  
www.national.com  
PWM Operation (Continued)  
PWM Mode Switching Waveform  
PFM Mode Switching Waveform  
20007143  
20007142  
A: INDUCTOR CURRENT, 500mA/div  
A: INDUCTOR CURRENT, 500mA/div  
B: SW PIN, 2V/div  
C: V , 50mV/div, AC COUPLED  
B: SW PIN, 2V/div  
C: V  
, 10mV/div, AC COUPLED  
OUT  
OUT  
FIGURE 3. Typical Circuit Waveforms in (a) PWM Mode and (b) PFM Mode  
50mA for precise regulation and reduced current consump-  
tion when the system is in standby.The LM2612 has an  
over-voltage protection feature that may activate if the de-  
PFM Operation  
Connecting the SYNC/MODE pin to SGND sets the LM2612  
to hysteretic PFM operation. While in PFM (Pulse Frequency  
Modulation) mode, the output voltage is regulated by switch-  
ing with a discrete energy per cycle and then modulating the  
cycle rate, or frequency, to control power to the load. This is  
done by using an error comparator to sense the output  
voltage and control the PFET switch. The device waits as the  
load discharges the output filter capacitor, until the output  
voltage drops below the lower threshold of the PFM error-  
comparator. Then the error comparator initiates a cycle by  
turning on the PFET switch. This allows current to flow from  
the input, through the inductor to the output, charging the  
output filter capacitor. The PFET switch is turned off when  
the output voltage rises above the regulation threshold of the  
PFM error comparator. After the PFET switch turns off, the  
output voltage rises a little higher as the inductor transfers  
stored energy to the output capacitor by pushing current into  
the output cacitor. Thus, the output voltage ripple in PFM  
mode is proportional to the hysteresis of the error compara-  
tor and the inductor current.  
<
vice is left in PWM mode under low-load conditions ( 50mA)  
to prevent the output voltage from rising too high. See Ov-  
ervoltage Protection, for more information.  
Select modes with the SYNC/MODE pin using a signal with  
a slew rate faster than 5V/100µs. Use a comparator Schmitt  
trigger or logic gate to drive the SYNC/MODE pin. Do not  
leave the pin floating of allow it to linger between logic levels.  
These measures will prevent output voltage errors that could  
otherwise occur in response to an indeterminate logic state.  
Ensure a minimum load to keep the output voltage in regu-  
lation when switching modes frequently. The minimum load  
requirement varies depending on the mode change fre-  
quency. A typical load of 8µA is required when modes are  
changed at 100 ms intervals, 85µA for 10 ms and 800µA for  
1 ms.  
Frequency Synchronization  
(SYNC/MODE Pin)  
The SYNC/MODE input can also be used for frequency  
synchronization. To synchronize the LM2612 to an external  
clock, supply a digital signal to the SYNC/MODE pin with a  
voltage swing exceeding 0.4V to 1.3V. During synchroniza-  
tion, the LM2612 initiates cycles on the rising edge of the  
clock. When synchronized to an external clock, it operates in  
In PFM mode, the device only switches as needed to service  
the load. This lowers current consumption by reducing power  
consumed during the switching action in the circuit due to  
transition losses in the internal MOSFETs, gate drive cur-  
rents, eddy current losses in the inductor, etc. It also im-  
proves light-load voltage regulation. During the second part  
of the cycle, the intrinsic body diode of the NFET synchro-  
nous rectifier conducts until the inductor current ramps to  
zero. The LM2612 does not turn on the synchronous rectifier  
while in PFM mode.  
PWM mode. The device can synchronize to  
a 50%  
duty-cycle clock over frequencies from 500kHz to 1MHz.  
Use the following waveform and duty-cycle guidelines when  
applying an external clock to the SYNC/MODE pin. Each  
clock cycle should have high and low periods between 1.3µs  
and 200ns and a duty cycle between 30% and 70%. The  
total clock period should be 2µs or less. Clock under/  
overshoot should be less than 100mV below GND or above  
Operating Mode Selection  
(SYNC/MODE Pin)  
The SYNC/MODE digital input pin is used to select between  
PWM or PFM operating modes. Set SYNC/MODE high  
(above 1.3V) for 600kHz PWM operation when the system is  
active and the load is above 50mA. Set SYNC/MODE low  
(below 0.4V) to select PFM mode when the load is less than  
V
DD. When applying noisy clock signals, especially sharp  
edged signals from a long cable during evaluation, terminate  
the cable at its characteristic impedance; add an RC filter to  
the SYNC pin, if necessary, to soften the slew rate and  
www.national.com  
14  
designed to conduct through it’s intrinsic body diode during  
transient intervals before it turns on, eliminating the need for  
an external diode.  
Frequency Synchronization  
(SYNC/MODE Pin) (Continued)  
Synchronous rectification is disabled and the NFET con-  
ducts through it’s body diode during the second part of each  
cycle while in PFM mode to reduce quiescent current asso-  
ciated with the synchronous rectifier’s control circuitry. The  
synchronous rectifier may also remain off in PWM mode  
when duty cycles are short due to high input-output voltage  
differentials or light loads, when there is insufficient time for  
the synchronous rectifier to activate. The body diode of the  
NFET is also used under these conditions. To increase effi-  
ciency in PFM or short duty-cycle PWM conditions, place an  
external Schottky diode from PGND to SW. Contact the  
Portable Power applications group at National Semiconduc-  
tor, if interested in a device with synchronous rectification in  
PFM mode.  
over/undershoot. Note that sharp edged signals from a pulse  
or function generator can develop under/overshoot as high  
as 10V at the end of an improperly terminated cable.  
Drive the SYNC/MODE pin using a signal with a slew rate  
faster than 5V/100µs. Use a comparator Schmitt trigger or  
logic gate to drive the SYNC/MODE pin. Do not leave the pin  
floating of allow it to linger between logic levels. These  
measures will prevent output voltage errors that could oth-  
erwise occur in response to an indeterminate logic state.  
Overvoltage Protection  
The LM2612 has an over-voltage comparator that prevents  
the output voltage from rising too high when the device is left  
in PWM mode under low-load conditions. Otherwise, the  
output voltage could rise out of regulation from the minimum  
energy transferred per cycle due to the 200ns minimum  
on-time of the PFET switch while in PWM mode. When the  
output voltage rises by 30mV over its regulation threshold,  
the OVP comparator inhibits PWM operation to skip pulses  
until the output voltage returns to the regulation threshold. In  
over voltage protection, output voltage and ripple increase  
slightly.  
Current Limiting  
A current limit feature allows the LM2612 to protect itself and  
external components during overload conditions. Current  
limiting is implemented using an independent internal com-  
parator that trips at 850mA max, (980mA for B grade de-  
vices). In PWM mode, cycle-by-cycle current limiting is nor-  
mally used. If an excessive load pulls the output voltage  
down to approximately 0.7V, then the device switches to a  
timed current limit mode. In timed current limit mode the  
internal P-FET switch is turned off after the current compara-  
tor trips and the beginning of the next cycle is inhibited for  
2.5µs to force the instantaneous inductor current to ramp  
down to a safe value. PFM mode also uses timed current  
limit operation. The synchronous rectifier is off in timed cur-  
rent limit mode. Timed current limit prevents the loss of  
current control seen in some products when the output volt-  
age is pulled low in serious overload conditions.  
Shutdown Mode  
Setting the EN digital input pin low to SGND places the  
LM2612 in a 0.1uA (typ) shutdown mode. During shutdown,  
the PFET switch, NFET synchronous rectifier, reference,  
control and bias of the LM2612 are turned off. Setting EN  
high to VDD enables normal operation. While turning on, soft  
start is activated. EN is a CMOS Schmitt trigger digital input  
with thresholds that scale with the input voltage at VDD. The  
nominal logic thresholds are approximately 0.71VDD and  
0.55VDD for the high and low thresholds respectively. Drive  
EN using CMOS logic referenced to the supply voltage at the  
VDD pin of the LM2612.  
Current Limiting and PWM Mode  
Transient Response  
Considerations  
EN must be set low to turn off the LM2612 during power-up  
and undervoltage conditions when the supply is less than the  
2.8V minimum operating voltage. The LM2612 is designed  
for mobile phones and similar applications where power  
sequencing is determined by the system controller and in-  
ternal UVLO (Under Voltage LockOut) circuitry is unneces-  
sary. The LM2612 has no UVLO circuitry. Although the  
LM2612 exhibited safe behavior during pre-production  
evaluation while enabled at low input voltages, this is not  
guaranteed.  
The LM2612 was designed for fast response to moderate  
load steps. Harsh transient conditions during loads above  
300mA can cause the inductor current to swing up to the  
850mA current limit, resulting in PWM mode jitter or instabil-  
ity from activation of the current limit comparator. To avoid  
this jitter or instability, do not power-up or start the LM2612  
into a full load (loads near or above 400mA). Do not change  
operating modes or output voltages when operating at a full  
load. Avoid extremely sharp and wide-ranging load steps to  
<
>
full load, such as from 30mA to 350mA.  
Internal Synchronous Rectification  
Pin Selectable Output Voltage  
While in PWM mode, the LM2612 uses an internal NFET as  
a synchronous rectifier to improve efficiency by reducing  
rectifier forward voltage drop and associated power loss. In  
general, synchronous rectification provides a significant im-  
provement in efficiency whenever the output voltage is rela-  
tively low compared to the voltage drop across an ordinary  
rectifier diode.  
The LM2612 features pin-selectable output voltage to elimi-  
nate the need for external feedback resistors. The output  
can be set to 1.05V, 1.3V, 1.5V or 1.8V by configuring the  
VID0 and VID1 pins. See Setting the Output Voltage in the  
Application Information section for further details.  
Under moderate and heavy loads, the internal NFET syn-  
chronous rectifier is turned on during the inductor current  
down-slope in the second part of each cycle. The synchro-  
nous rectifier is turned off prior to the next cycle, or when the  
inductor current ramps near zero at light loads. The NFET is  
Soft-Start  
The LM2612 has soft start to reduce current inrush during  
power-up and startup. This reduces stress on the LM2612  
and external components. It also reduces startup transients  
on the power source.  
15  
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TABLE 1. VID0 and VID1 Output Voltage Selection  
Settings  
Soft-Start (Continued)  
Soft start is implemented by ramping up the internal refer-  
ence in the LM2612 to gradually increase the output voltage.  
The reference ramps up in about 400µs. When powering up  
in PWM mode, soft start may take an additional 200us to  
allow time for the error amplifier compensation network to  
charge.  
VOUT (V)  
Logic Level  
VID0 VID1  
1.8  
1.5  
0
1
0
N.C.  
1
0
N.C.  
0
1.5  
1.3  
Thermal Overload Protection  
1.05  
1
1
The LM2612 has a thermal overload protection function that  
operates to protect itself from short-term misuse and over-  
load conditions. When the junction temperature exceeds  
about 155˚C, the device initiates a soft-start cycle which is  
completed after the temperature drops below 130˚C. Pro-  
longed operation in thermal overload conditions may dam-  
age the device and is considered bad practice.  
VID0 and VID1 are digital inputs. They may be set high by  
connecting to VDD or low by connecting to SGND. Option-  
ally, VID0 and VID1 may be driven by digital gates that  
provide over 1.2V for a high state and less than 0.4V for a  
low state to ensure valid logic levels. The VID0 and VID1  
inputs each have an internal 1.8 µA pull-down that pulls them  
low for a default 1.5V output, when left unconnected. Leav-  
ing these pins open is acceptable, but setting the pins high or  
low is recommended.  
Application Information  
Setting The Output Voltage  
Inductor Selection  
The LM2612 features pin-selectable output voltage to elimi-  
nate the need for external feedback resistors. Select an  
output voltage of 1.05V, 1.3V, 1.5V or 1.8V by configuring the  
VID0 and VID1 pins, as directed in Table 1.  
A 10µH inductor with a saturation current rating over 850mA  
(980mA for B grade) is recommended for most applications.  
The inductor’s resistance should be less than 0.3for good  
efficiency. Table 2 lists suggested inductors and suppliers.  
TABLE 2. Suggested Inductors and Their Suppliers  
Vendor Phone  
Coilcraft 847-639-6400  
Model  
DO1608C-103  
DO1606T-103  
UP1B-100  
FAX  
847-639-1469  
Coilcraft  
Coiltronics  
Coiltronics  
Panasonic  
Panasonic  
Pulse Engineering  
Sumida  
561-241-7876  
714-373-7366  
561-241-9339  
714-373-7323  
UP0.4CB-100  
ELL6GM100M  
ELL6PM100M  
P1174.103T  
858-674-8100  
847-956-0666  
858-674-8262  
847-956-0702  
CDRH5D18-100  
CDRH4D28-100  
CDC5D23-100  
NP05D B100M  
NP04S B100N  
SLF6025T-100M1R0  
SLF6020T-100MR90  
A918CY-100M  
A915AY-100M  
Sumida  
Sumida  
Taiyo Yuden  
Taiyo Yuden  
TDK  
847-925-0888  
847-803-6100  
847-297-0070  
847-925-0899  
847-803-6296  
847-699-7864  
TDK  
Toko  
Toko  
For low-cost applications, an unshielded bobbin inductor is  
suggested. For noise critical applications, a toroidal or  
shielded-bobbin inductor should be used. A good practice is  
to lay out the board with overlapping footprints of both types  
for design flexibility. This allows substitution of a low-noise  
toroidal inductor, in the event that noise from low-cost bobbin  
models is unacceptable.  
the inductor looses it’s ability to limit current through the  
PFET switch to a ramp and allows the switch current to  
increase rapidly. This can cause poor efficiency, regulation  
errors or stress to DC-DC converters like the LM2612. Satu-  
ration occurs when the magnetic flux density from current  
through the windings of the inductor exceeds what the in-  
ductor’s core material can support with energy storage in a  
corresponding magnetic field.  
The saturation current rating is the current level beyond  
which an inductor looses it’s inductance. Beyond this rating,  
TABLE 3. Suggested Capacitors and Their Suppliers  
Model  
22µF, X7R or X5R Ceramic Capacitor for C2 (Output Filter Capacitor)  
C3225X5RIA226M 1210 TDK  
Size  
Vendor  
Phone  
FAX  
847-803-6100  
847-803-6296  
www.national.com  
16  
Application Information (Continued)  
TABLE 3. Suggested Capacitors and Their Suppliers (Continued)  
Model  
Size  
1210  
1210  
1210  
Vendor  
Phone  
FAX  
JMK325BJ226MM  
ECJ4YB0J226M  
GRM42-2X5R226K6.3  
Taiyo-Yuden  
Panasonic  
muRata  
847-925-0888  
714-373-7366  
404-436-1300  
847-925-0899  
714-373-7323  
404-436-3030  
10µF, 6.3V, X7R or X5R Ceramic Capacitor for C1 (Input Filter Capacitor)  
C2012X5R0J106M  
JMK212BJ106MG  
0805  
0805  
TDK  
847-803-6100  
847-925-0888  
847-803-6296  
847-925-0899  
Taiyo  
Yuden  
Panasonic  
muRata  
ECJ3YB0J106K  
1206  
0805  
714-373-7366  
404-436-1400  
714-373-7323  
404-436-3030  
GRM40X5R106K6.3  
Capacitor Selection  
poor practice. Sufficient thermal design should be done to  
keep the device below the specified 125˚C maximum oper-  
ating junction temperature.  
Use a 10µF, 6.3V, X7R or X5R ceramic input filter capacitor  
and a 22uF, X7R or X5R ceramic output filter capacitor.  
These provide an optimal balance between small size, cost,  
reliability and performance. Do not use Y5V ceramic capaci-  
tors. Table 3 lists suggested capacitors and suppliers.  
Micro SMD Package Assembly and Use  
Use of the micro SMD package requires specialized board  
layout, precision mounting and careful reflow techniques, as  
detailed in National Semiconductor Application Note  
AN-1112. Refer to the section Surface Mount Technology  
(SMT) Assembly Considerations. For best results in assem-  
bly, alignment ordinals on the PC board should be used to  
facilitate placement of the device. Since micro SMD packag-  
ing is a new technology, all layouts and assembly means  
must be thoroughly tested prior to production. In particular,  
proper placement, solder reflow and resistance to thermal  
cycling must be verified.  
A 10µF ceramic capacitor can be used for the output filter  
capacitor for smaller size in applications where the  
worst-case transient load step is less than 200mA. Use of a  
10µF output capacitor trades off smaller size for an increase  
in output voltage ripple, and undershoot during line and load  
transient response.  
The input filter capacitor supplies current to the PFET switch  
of the LM2612 in the first part of each cycle and reduces  
voltage ripple imposed on the input power source. The out-  
put filter capacitor smoothes out current flow from the induc-  
tor to the load, helps maintain a steady output voltage during  
transient load changes and reduces output voltage ripple.  
These capacitors must be selected with sufficient capaci-  
tance and sufficiently low ESR to perform these functions.  
The 10-Bump package used for the LM2612 has 170micron  
solder balls and requires 6.7mil (6.7/1000 in.) pads for  
mounting on the circuit board. The trace to each pad should  
enter the pad with a 90˚ entry angle to prevent debris from  
being caught in deep corners. Initially, the trace to each pad  
should be 6 mil wide, for a section 6 mil long or longer, as a  
thermal relief. Then each trace should neck up to its optimal  
width over a span of 11 mils or more, so that the taper  
extends beyond the edge of the package. The important  
criterion is symmetry. This ensures the solder bumps on the  
LM2612 re-flow evenly and that the device solders level to  
the board. In particular, special attention must be paid to the  
pads for bumps 6-9. Because PVIN and PGND are typically  
connected to large copper planes, inadequate thermal reliefs  
can result in late or inadequate reflow of these bumps.  
The ESR, or equivalent series resistance, of the filter capaci-  
tors is a major factor in voltage ripple. The contribution from  
ESR to voltage ripple is around 75-95% for most electrolytic  
capacitors and considerably less for ceramic capacitors. The  
remainder of the ripple is from charge storage due to capaci-  
tance.  
Diode Selection  
An optional Schottky diode (D1 in Figure 1) can be added to  
increase efficiency in PFM mode and light-load PWM mode.  
This may be desired in applications where increased effi-  
ciency for improving operational battery life takes prece-  
dence over increased system size associated with the  
Schottky diode. Typically, use of an external schottky diode  
increases PFM mode efficiency from 72.7% to 85.0% (20  
mA load, VOUT = 1.8V, VIN = 3.6V). See the efficiency curves  
in the Typical Operating Characteristics.  
The pad style used with micro SMD package must be the  
NSMD (non-solder mask defined) type. This means that the  
solder-mask opening is larger than the pad size or 9.7mils  
for the LM2612. This prevents a lip that otherwise forms if  
the solder-mask and pad overlap. This lip can hold the  
device off the surface of the board and interfere with mount-  
ing. See Applications Note AN-1112 for specific instructions.  
Use a Schottky diode with a current rating higher than  
850mA, such as an MBRM140T3. Use of a device rated for  
30V or more reduces diode reverse leakage in high tempera-  
ture applications.  
The micro SMD package is optimized for the smallest pos-  
sible size in applications with red or infra-red opaque cases.  
Because the micro SMD package lacks the plastic encapsu-  
lation characteristic of larger devices, it is vulnerable to light.  
Back-side metalization and/or epoxy coating, along with  
front-side shading by the printed circuit board, reduce this  
sensitivity. However, the package has exposed die edges. In  
particular, micro SMD devices are sensitive to light in the red  
and Infrared range shining on the package’s exposed die  
edges.  
Thermal Design  
The LM2612 has a thermal overload protection feature  
which activates when the junction temperature exceeds  
around 155˚C, until the device cools to 130˚C. However,  
running the device this hot continually may damage it and is  
17  
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loop. In the second part of each cycle, current is pulled  
up from ground, through the LM2612 by the inductor, to  
the output filter capacitor and then back through ground,  
forming a second current loop. Routing these loops so  
the current curls in the same direction prevents mag-  
netic field reversal between the two part-cycles and  
reduces radiated noise.  
Application Information (Continued)  
Do not use or power-up the LM2612 while subjecting it to  
high intensity red or infrared light, otherwise degraded, un-  
predictable or erratic operation may result. Examples of light  
sources with high red or infrared content include the sun and  
halogen lamps. Package the circuit in a case opaque to red  
or infrared light.  
4. Connect the ground pins of the LM2612 and filter ca-  
pacitors together using generous component-side cop-  
per fill as a pseudo-ground plane. Then, connect this to  
the ground-plane (if one is used) with several vias. This  
reduces ground-plane noise by preventing the switching  
currents from circulating through the ground plane. It  
also reduces ground bounce at the LM2612 by giving it  
a low-impedance ground connection.  
Board Layout Considerations  
PC board layout is an important part of DC-DC converter  
design. Poor board layout can disrupt the performance of a  
DC-DC converter and surrounding circuitry by contributing to  
EMI, ground bounce, and resistive voltage loss in the traces.  
These can send erroneous signals to the DC-DC converter  
IC, resulting in poor regulation or instability. Poor layout can  
also result in reflow problems leading to poor solder joints  
between the micro SMD package and board pads. Poor  
solder joints can result in erratic or degraded performance.  
5. Use wide traces between the power components and for  
power connections to the DC-DC converter circuit. This  
reduces voltage errors caused by resistive losses across  
the traces.  
Good layout for the LM2612 can be implemented by follow-  
ing a few simple design rules:  
6. Route noise sensitive traces, such as the voltage feed-  
back path, away from noisy traces between the power  
components. The voltage feedback trace must remain  
close to the LM2612 circuit and should be direct but  
should be routed away from to noisy components. This  
reduces EMI radiated onto the DC-DC converter’s own  
voltage feedback trace.  
1. Place the LM2612 on 6.7mil pads for micro SMD pack-  
age. As a thermal relief, connect to each pad with a 6mil  
wide trace (micro SMD), 6mils long or longer, then in-  
crementally increase each trace to its optimal width over  
a span so that the taper extends beyond the edge of the  
package. The important criterion is symmetry to ensure  
re-flow occurs evenly (see Micro SMD Package Assem-  
bly and Use).  
7. Place noise sensitive circuitry, such as radio IF blocks,  
away from the DC-DC converter, CMOS digital blocks  
and  
other  
noisy  
circuitry.  
Interference  
with  
2. Place the LM2612, inductor and filter capacitors close  
together and make the traces short. The traces between  
these components carry relatively high switching cur-  
rents and act as antennas. Following this rule reduces  
radiated noise. Place the capacitors and inductor within  
0.2in (5mm) of the LM2612.  
noise-sensitive circuitry in the system can be reduced  
through distance.  
In mobile phones, for example, a common practice is to  
place the DC-DC converter on one corner of the board,  
arrange the CMOS digital circuitry around it (since this also  
generates noise), and then place sensitive preamplifiers and  
IF stages on the diagonally opposing corner. Often, the  
sensitive circuitry is shielded with a metal pan and power to  
it is post-regulated to reduce conducted noise, using  
low-dropout linear regulators, such as the LP2966.  
3. Arrange the components so that the switching current  
loops curl in the same direction. During the first part of  
each cycle, current flows from the input filter capacitor,  
through the LM2612 and inductor to the output filter  
capacitor and back through ground, forming a current  
www.national.com  
18  
Physical Dimensions inches (millimeters)  
unless otherwise noted  
10-Bump micro SMD Package  
NS Package Number BPA10  
The dimensions for X1, X2 and X3 are as given:  
X1 = 1.996 +/− 0.030mm  
X2 = 2.504 +/− 0.030mm  
X3 = 0.850 +/− 0.1mm  
NOTES: UNLESS OTHERWISE SPECIFIED  
1. EPOXY COATING  
2. 63Sn/37Pb EUTECTIC BUMP  
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.  
4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTER  
CLOCKWISE.  
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS  
PACKAGE HEIGHT.  
6.NO JEDEC REGISTRATION AS OF SEPT. 2000.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
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配单直通车
LM2612BBPX产品参数
型号:LM2612BBPX
生命周期:Obsolete
IHS 制造商:TEXAS INSTRUMENTS INC
零件包装代码:BGA
包装说明:VFBGA,
针数:10
Reach Compliance Code:unknown
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.84
其他特性:ALSO VOUT=(1.3, 1.5, 1.8 VOLT);PFM TECHNIQUE ALSO USED
模拟集成电路 - 其他类型:SWITCHING REGULATOR
控制模式:CURRENT-MODE
控制技术:PULSE WIDTH MODULATION
最大输入电压:5.5 V
最小输入电压:2.8 V
标称输入电压:3.6 V
JESD-30 代码:R-PBGA-B10
长度:2.504 mm
功能数量:1
端子数量:10
最高工作温度:85 °C
最低工作温度:-25 °C
最大输出电流:0.98 A
标称输出电压:1.05 V
封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA
封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
座面最大高度:0.85 mm
表面贴装:YES
切换器配置:BUCK
最大切换频率:1000 kHz
温度等级:OTHER
端子形式:BALL
端子节距:0.5 mm
端子位置:BOTTOM
宽度:1.996 mm
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