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产品型号LM2653MTCX-ADJ的概述

LM2653MTCX-ADJ芯片概述 LM2653MTCX-ADJ是一款高度集成的降压型开关电源调整器，广泛应用于不断增长的数码电子产品领域。作为德州仪器（Texas Instruments）公司推出的降压芯片，LM2653MTCX-ADJ具有高效能、低静态电流及多种保护功能。例如，它集成了过流保护和过热保护，使得其在设计时能够有效地保障电路的安全性。其主要功能是将输入的直流电压转换为所需的输出电压，适用于各种不同的电压应用。LM2653MTCX-ADJ的工作电压范围为4.5V至25V，能够提供高达3A的输出电流，满足多种中高功率应用的需求。在节能和功率管理日益受到重视的今天，LM2653MTCX-ADJ因其较低的功耗和高效率而受到青睐。 LM2653MTCX-ADJ详细参数 LM2653MTCX-ADJ的主要参数包含以下几点： 1. 输入电压范围：4.5V到25V 2. 输出电压：...

产品型号LM2653MTCX-ADJ的Datasheet PDF文件预览

LM2653

www.ti.com

SNVS050E –NOVEMBER 1999–REVISED APRIL 2013

LM2653 1.5A High Efficiency Synchronous Switching Regulator

Check for Samples: LM2653

FEATURES

DESCRIPTION

The LM2653 switching regulator provides high

efficient power conversion over a 100:1 load range

(1.5A to 15 mA). This feature makes the LM2653 an

ideal fit in battery-powered applications.

•

Efficiency up to 97%

4V to 14V Input Voltage Range

1.5V to 5.0V Adjustable Output Voltage

0.1Ω Switch On Resistance

Synchronous rectification is used to achieve up to

97% efficiency. At light loads, the LM2653 enters a

low power hysteretic or “sleep” mode to keep the

efficiency high. In many applications, the efficiency

still exceeds 80% at 15 mA load. A shutdown pin is

available to disable the LM2653 and reduce the

supply current to 7µA.

300 kHz Fixed Frequency Internal Oscillator

7 μA Shutdown Current

Patented Current Sensing for Current Mode

Control

•

Input Undervoltage Lockout

Output Overvoltage Shutdown Protection

Output Undervoltage Shutdown Protection

Adjustable Soft-Start

All the power, control, and drive functions are

integrated within the ICs. The ICs contain patented

current sensing circuity for current mode control. This

feature eliminates the external current sensing

resistor required by other current-mode DC-DC

converters.

Adjustable PGOOD Delay

Current Limit and Thermal Shutdown

The ICs have a 300 kHz fixed frequency internal

oscillator. The high oscillator frequency allows the

use of extremely small, low profile components.

APPLICATIONS

•

Webpad

Personal Digital Assistants (PDAs)

Computer Peripherals

Protection features include thermal shutdown, input

undervoltage lockout, adjustable soft-start, cycle by

cycle current limit, output overvoltage and

undervoltage protections.

Battery-Powered Devices

Notebook Computer Video Supply

Handheld Scanners

GXM I/O and Core Voltage

High Efficiency 5V Conversion

Typical Application

Efficiency vs Load Current

(V_IN= 5V, V_OUT= 3.3V)

Figure 1.

Figure 2.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM2653

SNVS050E –NOVEMBER 1999–REVISED APRIL 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings^(1)(2)(3)

Input Voltage

15V

PGOOD Pin Voltage

Feedback Pin Voltage

Power Dissipation (T_A=25°C)

Junction Temperature Range

Storage Temperature Range

Lead Temperature

−0.4V ≤ V_FB≤ 5V

893 mW

(4)

−40°C ≤ T_J≤ +125°C

−65°C to +150°C

215°C

PW Package

Vapor Phase (60 sec.)

Infrared (15 sec.)

220°C

Maximum Junction Temperature

ESD Susceptibility

150°C

(3)

Human Body Model

1 kV

(1) Absolute Maxmum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but device parameter specifications may not be specified under these conditions. For

specified specifications and test conditions, see Electrical Characteristics.

(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.

(4) The maximum allowable power dissipation is calculated by using P_DMAX= (T_JMAX− T_A)/θ_JA, where T_JMAXis the maximum junction

temperature, T_Ais the ambient temperature, and θ_JAis the junction-to-ambient thermal resistance of the specified package. The 893

mW rating results from using 150°C, 25°C, and 140°C/W for T_JMAX, T_A, and θ_JArespectively. A θ_JAof 140°C/W represents the worst-

case condition of no heat sinking of the 16-pin TSSOP package. Heat sinking allows the safe dissipation of more power. The Absolute

Maximum power dissipation must be derated by 7.14 mW per °C above 25°C ambient. The LM2653 actively limits its junction

temperatures to about 165°C.

Operating Ratings⁽¹⁾

Supply Voltage

4V ≤ V_IN≤ 14V

(1) Absolute Maxmum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but device parameter specifications may not be specified under these conditions. For

specified specifications and test conditions, see Electrical Characteristics.

Electrical Characteristics

Specifications with standard typeface are for T_J= 25°C, and those in boldface type apply over full Operating Temperature

Range. V_IN= 10V unless otherwise specified.

(1)

(2)

Symbol

V_FB

Parameter

Conditions

Typical

Limit

Units

Feedback Voltage

I_LOAD= 900 mA

1.238

1.200

1.263

V(min)

V(max)

V_OUT

Output Voltage Line

Regulation

V_IN= 4V to 12V

I_LOAD= 900 mA

0.2

1.3

0.3

3.8

210

2.0

Output Voltage Load

Regulation

I_LOAD= 10 mA to 1.5A

V_IN= 5V

Output Voltage Load

Regulation

I_LOAD= 200 mA to 1.5A

V_IN= 5V

V_INUV

V_{UV_HYST}

I_CL

V_INUndervoltage Lockout

Threshold Voltage

Rising Edge

3.95

V(max)

Hysteresis for the Input

Undervoltage Lockout

Switch Current Limit

V_IN= 5V

V_OUT= 2.5V

1.55

2.60

A(min)

A(max)

I_SM

Sleep Mode Threshold Current V_IN= 5V, V_OUT= 2.5V

100

(1) All limits specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits

are 100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control

(SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).

(2) Typical numbers are at 25°C and represent the most likely norm.

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Electrical Characteristics (continued)

Specifications with standard typeface are for T_J= 25°C, and those in boldface type apply over full Operating Temperature

Range. V_IN= 10V unless otherwise specified.

(1)

(2)

Symbol

V_HYST

Parameter

Conditions

Typical

Limit

Units

Sleep Mode Feedback Voltage

Hysteresis

I_Q

Quiescent Current

1.7

2.0

mA(max)

I_QSD

Quiescent Current in

Shutdown Mode

Shutdown Pin Pulled Low

I_SWITCH= 1A

μA

μA(max)

12/20

R_DS(ON)

R_SW(ON)

High-Side or Low-Side

MOSFET ON Resistance

mΩ

mΩ (max)

130

High-Side or Low-Side Switch I_SWITCH= 1A

On Resistance (MOSFET ON

Resistance + Bonding Wire

Resitstance)

110

mΩ

I_L

Switch Leakage

Current—High Side

130

6.75

Switch Leakge Current—Low

Side

V_BOOT

Bootstrap Regulator Voltage

I_BOOT= 1 mA

6.45/6.40

6.95/7.00

V(min)

V(max)

G_M

Error Amplifier

1250

μmho

Transconductance

A_V

Error Amplifier Voltage Gain

100

I_{EA_SOURCE}

Error Amplifier Source

Current

V_IN= 3.6V, V_FB= 1.17V, V_COMP= 2V

V_IN= 3.6V, V_FB= 1.31V, V_COMP= 2V

V_IN= 4V, V_FB= 1.17V

μA

25/15

μA(min)

I_{EA_SINK}

V_EAH

Error Amplifier Sink Current

μA

μA(min)

Error Amplifier Output Swing

Upper Limit

2.70

1.25

2.50/2.40

1.35/1.50

V(min)

V_EAL

Error Amplifier Output Swing

Lower Limit

V_IN= 4V, V_FB= 1.31V

V(max)

V_D

Body Diode Voltage

Oscillator Frequency

I_DIODE= 1.5A

F_OSC

Measured at Switch Pin

V_IN= 4V

300

kHz

kHz(min)

kHz(max)

280/255

330/345

D_MAX

I_SS

Maximum Duty Cycle

Soft-Start Current

V_IN= 4V

%(min)

Voltage at the SS Pin = 1.4V

μA

μA(min)

μA(max)

V_OUTUV

V_OUTUndervoltage Lockout

Threshold Voltage

%V_OUT

%V_OUT(min)

%V_OUT(max)

Hysteresis for V_OUTUV

%V_OUT

V_OUTOV

V_OUTOvervoltage Lockout

Threshold Voltage

108

%V_OUT

%V_OUT(min)

%V_OUT(max)

106

114

Hysteresis for V_OUTOV

%V_OUT

I_LDELAY―

SOURCE

LDELAY Pin Source Current

μA

I_PGOOD―SINK

PGOOD Pin Sink Current

V_PGOOD= 0.4V

mA(max)

I_{PGOOD―LEAKA}PGOOD Pin Leakage Current V_PGOOD= 5V

I_SHUTDOWN

Shutdown Pin Current

Shutdown Pin Pulled Low

2.2

μA

0.8/0.5

3.7/4.0

μA(min)

μA(max)

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Electrical Characteristics (continued)

Specifications with standard typeface are for T_J= 25°C, and those in boldface type apply over full Operating Temperature

Range. V_IN= 10V unless otherwise specified.

(1)

(2)

Symbol

Parameter

Conditions

Typical

Limit

Units

V_SHUTDOWN

Shutdown Pin Threshold

Voltage

Rising Edge

0.6

0.3

0.9

V(min)

V(max)

T_SD

Thermal Shutdown

Temperature

165

°C

T_{SD_HYST}

Thermal Shutdown Hysteresis

Temperature

°C

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Typical Performance Characteristics

Efficiency vs Load Current (V_IN= 5V, V_OUT= 2.5V)

l_Qvs V_IN

Figure 3.

Figure 4.

I_QSDvs Input Voltage

I_QSDvs Junction Temperature

Figure 5.

Figure 6.

Frequency vs Junction Temperature

R_SW(ON)vs Input Voltage

Figure 7.

Figure 8.

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Typical Performance Characteristics (continued)

R_SW(ON)vs Junction Temperature

Current Limit vs Input Voltage (V_OUT= 2.5V)

Figure 9.

Figure 10.

Current Limit vs Junction Temperature (V_OUT= 2.5V)

Reference Voltage vs Junction Temperature

Figure 11.

Figure 12.

Sleep Mode Threshold vs Output Voltage (V_IN= 5V)

Figure 13.

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SNVS050E –NOVEMBER 1999–REVISED APRIL 2013

CONNECTION DIAGRAM

Figure 14. 16-Lead TSSOP (PW)

See Package Number PW0016A

PIN DESCRIPTIONS

1-2

3-5

Name

Function

Switched-node connection, which is connected with the source of the internal high-side MOSFET.

Main power supply input pin. Connected to the drain of the high-side MOSFET.

Bootstrap capacitor connection for high-side gate drive.

V_IN

V_CB

AV_IN

SD(SS)

Input voltage for control and driver circuits.

Shutdown and Soft-start control pin. Pulling this pin below 0.3V shuts off the regulator. A capacitor

connected from this pin to ground provides a control ramp of the input current. Do not drive this pin

with an external source or erroneous operation may result.

Output voltage feedback input. Connected to the output voltage.

COMP

PGOOD

Compensation network connection. Connected to the output of the voltage error amplifier.

A constant monitor on the output voltage. PGOOD will go low if the output voltage exceeds 110% or

goes below 80% of its nominal.

LDELAY

A capacitor between this pin to ground sets the delay from the output voltage reaches 80% of its

nominal to when the undervoltage latch protection is enabled and PGOOD pin goes low.

AGND

PGND

Low-noise analog ground.

Power ground.

14-16

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Block Diagram

Figure 15.

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SNVS050E –NOVEMBER 1999–REVISED APRIL 2013

OPERATION

The LM2653 operates in a constant frequency (300 kHz), current-mode PWM for moderate to heavy loads; and it

automatically switches to hysteretic mode for light loads. In hysteretic mode, the switching frequency is reduced

to keep the efficiency high.

MAIN OPERATION

When the load current is higher than the sleep mode threshold, the part is always operating in PWM mode. At

the beginning of each switching cycle, the high-side switch is turned on, the current from the high-side switch is

sensed and compared with the output of the error amplifier (COMP pin). When the sensed current reaches the

COMP pin voltage level, the high-side switch is turned off; after 40 ns (deadtime), the low-side switch is turned

on. At the end of the switching cycle, the low-side switch is turned off; and the same cycle repeats.

The current of the top switch is sensed by a patented internal circuitry. This unique technique gets rid of the

external sense resistor, saves cost and size, and improves noise immunity of the sensed current. A feedforward

from the input voltage is added to reduce the variation of the current limit over the input voltage range.

When the load current decreases below the sleep mode theshold, the output voltage will rise slightly, this rise is

sensed by the hysteretic mode comparator which makes the part go into the hysteretic mode with both the high

and low side switches off. The output voltage starts to drop until it hits the low threshold of the hysteretic

comparator, and the part immediately goes back to the PWM operation. The output voltage keeps increasing

until it reaches the top hysteretic threshold, then both the high and low side switches turn off again, and th same

cycle repeats.

PROTECTIONS

The cycle-by-cycle current limit circuitry turns off the high-side MOSFET whenever the current in MOSFET

reaches 2A. A second level current limit is accomplished by the undervoltage protection: if the load pulls the

output voltage down below 80% of its nominal value, the undervoltage latch protection will wait for a period of

time (set by the capacitor at the LDELAY pin, see LDELAY CAPACITOR for more information). If the output

voltage is still below 80% of its nominal after the waiting period, the latch protection will be enabled. In the latch

protection mode, the low-side MOSFET is on and the high-side MOSFET is off. The latch protection will also be

enabled immediately whenever the output voltage exceeds the overvoltage threshold (110% of its nominal). Both

protections are disabled during start-up.(See SOFT-START CAPACITOR and LDELAY CAPACITOR for more

information.) Toggling the input supply voltage or the shutdown pin can reset the device from the latched

protection mode.

PGOOD FLAG

The PGOOD flag goes low whenever the overvoltage or undervoltage latch protection is enabled.

Design Procedure

This section presents guidelines for selecting external components.

INPUT CAPACITOR

A low ESR aluminum, tantalum, or ceramic capacitor is needed between the input pin and power ground. This

capacitor prevents large voltage transients from appearing at the input. The capacitor is selected based on the

RMS current and voltage requirements. The RMS current is given by:

(1)

The RMS current reaches its maximum (I_OUT/2) when V_INequals 2V_OUT. For an aluminum or ceramic capacitor,

the voltage rating should be at least 25% higher than the maximum input voltage. If a tantalum capacitor is used,

the voltage rating required is about twice the maximum input voltage. The tantalum capacitor should be surge

current tested by the manufacturer to prevent shorted by the inrush current. It is also recommended to put a

small ceramic capacitor (0.1 μF) between the input pin and ground pin to reduce high frequency spikes.

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INDUCTOR

The most critical parameters for the inductor are the inductance, peak current and the DC resistance. The

inductance is related to the peak-to-peak inductor ripple current, the input and the output voltages:

(2)

A higher value of ripple current reduces inductance, but increases the conductance loss, core loss, current stress

for the inductor and switch devices. It also requires a bigger output capacitor for the same output voltage ripple

requirement. A reasonable value is setting the ripple current to be 30% of the DC output current. Since the ripple

current increases with the input voltage, the maximum input voltage is always used to determine the inductance.

The DC resistance of the inductor is a key parameter for the efficiency. Lower DC resistance is available with a

bigger winding area. A good tradeoff between the efficiency and the core size is letting the inductor copper loss

equal 2% of the output power.

OUTPUT CAPACITOR

The selection of C_OUTis driven by the maximum allowable output voltage ripple. The output ripple in the constant

frequency, PWM mode is approximated by:

(3)

The ESR term usually plays the dominant role in determining the voltage ripple. A low ESR aluminum electrolytic

or tantalum capacitor (such as Nichicon PL series, Sanyo OS-CON, Sprague 593D, 594D, AVX TPS, and CDE

polymer aluminum) is recommended. An electrolytic capacitor is not recommended for temperatures below

−25°C since its ESR rises dramatically at cold temperature. A tantalum capacitor has a much better ESR

specification at cold temperature and is preferred for low temperature applications.

The output voltage ripple in constant frequency mode has to be less than the sleep mode voltage hysteresis to

avoid entering the sleep mode at full load:

V_RIPPLE< 20mV * V_OUT/V_FB

(4)

BOOST CAPACITOR

A 0.1 μF ceramic capacitor is recommended for the boost capacitor. The typical voltage across the boost

capacitor is 6.7V.

SOFT-START CAPACITOR

A soft-start capacitor is used to provide the soft-start feature. When the input voltage is first applied, or when the

SD(SS) pin is allowed to go high, the soft-start capacitor is charged by a current source (approximately 2 μA).

When the SD(SS) pin voltage reaches 0.6V (shutdown threshold), the internal regulator circuitry starts to

operate. The current charging the soft-start capacitor increases from 2 μA to approximately 10 μA. With the

SD(SS) pin voltage between 0.6V and 1.3V, the level of the current limit is zero, which means the output voltage

is still zero. When the SD(SS) pin voltage increases beyond 1.3V, the current limit starts to increase. The switch

duty cycle, which is controlled by the level of the current limit, starts with narrow pulses and gradually gets wider.

At the same time, the output voltage of the converter increases towards the nominal value, which brings down

the output voltage of the error amplifier. When the output of the error amplifier is less than the current limit

voltage, it takes over the control of the duty cycle. The converter enters the normal current-mode PWM

operation. The SD(SS) pin voltage is eventually charged up to about 2V.

The soft-start time can be estimated as:

T_SS= C_SS* 0.6V/2 μA + C_SS* (2V−0.6V)/10 μA

(5)

During start-up, the internal circuit is monitoring the soft-start voltage. When the softstart voltage reaches 2V, the

undervoltage and overvoltage protections are enabled.

If the output voltage doesn't rise above 80% of the normal value before the soft-start reaches 2V. The

undervoltage protection will kick in and shut the device down. You can avoid this by either increasing the value of

the soft-start capacitor, or using a LDELAY capacitor.

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LDELAY CAPACITOR

As mentioned in the Operation section, the LDELAY capacitor sets the time delay between the output voltage

goes below 80% of its nominal value and the undervoltage latch protection is enabled.

Charging the CDELAY by a 5 μA current source up to 2V sets the delay time. Therefore, T_DELAY= C_DELAY

2V/5μA.

The undervoltage protection is disabled by tying the LDELAY pin to the ground.

R₁and R₂(PROGRAMMING OUTPUT VOLTAGE)

Use the following formula to select the appropriate resistor values:

V_OUT= V_REF(1 + R₁/R₂)

where

•

V_REF= 1.238V

(6)

Select resistors between 10kΩ and 100kΩ. (1% or higher accuracy metal film resistors for R₁and R₂.)

COMPENSATION COMPONENTS

In the control to output transfer function, the first pole F_p1can be estimated as 1/(2πR_OUTC_OUT); The ESR zero

F_z1of the output capacitor is 1/(2πESRC_OUT); Also, there is a high frequency pole F_p2in the range of 45kHz to

150kHz:

F_p2= F_s/(πn(1−D))

where

•

D = V_OUT/V_IN

n = 1+0.348L/(V_IN−V_OUT) (L is in µHs and V_INand V_OUTin volts)

(7)

The total loop gain G is approximately 500/I_OUTwhere I_OUTis in amperes.

A Gm amplifier is used inside the LM2653. The output resistor R_oof the Gm amplifier is about 80kΩ. C_c1and R_C

together with R_ogive a lag compensation to roll off the gain:

F_pc1= 1/(2πC_c1(R_o+R_c)), F_zc1= 1/2πC_c1R_c.

(8)

In some applications, the ESR zero F_z1cannot be cancelled by F_p2. Then, C_c2is needed to introduce F_pc2to

cancel the ESR zero, F_p2= 1/(2πC_c2R_o‖R_c).

The rule of thumb is to have more than 45° phase margin at the crossover frequency (G=1).

If C_OUTis higher than 68µF, C_c1= 2.2nF, and R_c= 15KΩ are good choices for most applications. If the ESR zero

is too low to be cancelled by F_p2, add C_c2.

If the transient response to a step load is important, choose R_Cto be higher than 10kΩ.

EXTERNAL SCHOTTKY DIODE

A Schottky diode D₁is recommended to prevent the intrinsic body diode of the low-side MOSFET from

conducting during the deadtime in PWM operation and hysteretic mode when both MOSFETs are off. If the body

diode turns on, there is extra power dissipation in the body diode because of the reverse-recovery current and

higher forward voltage; the high-side MOSFET also has more switching loss since the negative diode reverse-

recovery current appears as the high-side MOSFET turn-on current in addition to the load current. These losses

degrade the efficiency by 1-2%. The improved efficiency and noise immunity with the Schottky diode become

more obvious with increasing input voltage and load current.

The breakdown voltage rating of D₁is preferred to be 25% higher than the maximum input voltage. Since D₁is

only on for a short period of time, the average current rating for D₁only requires being higher than 30% of the

maximum output current. It is important to place D₁very close to the drain and source of the low-side MOSFET,

extra parasitic inductance in the parallel loop will slow the turn-on of D₁and direct the current through the body

diode of the low-side MOSFET.

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PCB Layout Considerations

Layout is critical to reduce noises and ensure specified performance. The important guidelines are listed as

follows:

1. Minimize the parasitic inductance in the loop of input capacitors and the internal MOSFETs by connecting the

input capacitors to V_INand PGND pins with short and wide traces. This is important because the rapidly

switching current, together with wiring inductance can generate large voltage spikes that may result in noise

problems.

2. Minimize the trace from the center of the output resistor divider to the FB pin and keep it away from noise

sources to avoid noise pick up. For applications require tight regulation at the output, a dedicated sense

trace (separated from the power trace) is recommended to connect the top of the resistor divider to the

output.

3. If the Schottky diode D₁is used, minimize the traces connecting D₁to SW and PGND pins.

Figure 16. Schematic for the Typical Board Layout

Typical PC Board Layout: (2X Size)

Figure 17. Component Placement Guide

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Figure 18. Component Side PC Board Layout

Figure 19. Solder Side PC Board Layout

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REVISION HISTORY

Changes from Revision D (April 2013) to Revision E

Page

•

Changed layout of National Data Sheet to TI format .......................................................................................................... 13

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PACKAGE OPTION ADDENDUM

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1-Nov-2013

PACKAGING INFORMATION

Orderable Device

LM2653MTC-ADJ

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

NRND

TSSOP

TBD

Call TI

CU SN

Call TI

2653MT

C-ADJ

LM2653MTC-ADJ/NOPB

LM2653MTCX-ADJ/NOPB

ACTIVE

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

-40 to 125

2653MT

C-ADJ

2500

Green (RoHS

& no Sb/Br)

-40 to 125

2653MT

C-ADJ

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

⁽⁶⁾Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

1-Nov-2013

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

23-Sep-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

LM2653MTCX-ADJ/NOPB TSSOP

2500

330.0

12.4

6.95

8.3

1.6

8.0

12.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

23-Sep-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

TSSOP PW 16

SPQ

Length (mm) Width (mm) Height (mm)

367.0 367.0 35.0

LM2653MTCX-ADJ/NOPB

2500

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

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concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

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which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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www.ti.com/audio

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LM2653MTCX-ADJ产品参数

型号:	LM2653MTCX-ADJ
是否Rohs认证：	不符合
生命周期：	Transferred
包装说明：	TSSOP-16
Reach Compliance Code：	not_compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	5.16
模拟集成电路 - 其他类型：	SWITCHING REGULATOR
控制模式：	CURRENT-MODE
控制技术：	PULSE WIDTH MODULATION
最大输入电压：	14 V
最小输入电压：	4 V
标称输入电压：	10 V
JESD-30 代码：	R-PDSO-G16
JESD-609代码：	e0
长度：	5 mm
湿度敏感等级：	1
功能数量：	1
端子数量：	16
最高工作温度：	125 °C
最低工作温度：	-40 °C
最大输出电流：	2.6 A
封装主体材料：	PLASTIC/EPOXY
封装代码：	TSSOP
封装等效代码：	TSSOP16,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：	260
认证状态：	Not Qualified
座面最大高度：	1.2 mm
子类别：	Switching Regulator or Controllers
表面贴装：	YES
切换器配置：	SINGLE
最大切换频率：	345 kHz
技术：	CMOS
温度等级：	AUTOMOTIVE
端子面层：	Tin/Lead (Sn/Pb)
端子形式：	GULL WING
端子节距：	0.65 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	40
宽度：	4.4 mm
Base Number Matches：	1

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