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产品型号LMH6739的Datasheet PDF文件预览

November 2004

LMH6739

Very Wideband, Low Distortion Triple Video Buffer

General Description

Features

n 750 MHz −3 dB small signal bandwidth (A_V= +1)

n −85 dBc 3^rdharmonic distortion (20 MHz)

The LMH6739 is a very wideband, DC coupled monolithic

programmable gain buffer designed specifically for ultra high

resolution video systems as well as wide dynamic range

systems requiring exceptional signal fidelity. Benefiting from

National’s current feedback architecture, the LMH6739 of-

fers gains of −1, 1 and 2. At a gain of +2 the LMH6739

supports ultra high resolution video systems with a 400 MHz

2 V_PP3 dB Bandwidth. With 12-bit distortion level through 30

n 2.3 nV/

n 3300 V/µs slew rate

n 32 mA supply current (10.6 mA per op amp)

n 90 mA linear output current

n 0.02/0.01 Diff. Gain / Diff. Phase (R_L= 150Ω)

n 2mA shutdown current

input noise voltage

MHz (R_L= 100Ω), 2.3nV/

LMH6739 is the ideal driver or buffer for high speed flash A/D

input referred noise, the

and D/A converters. Wide dynamic range systems such as Applications

radar and communication receivers requiring a wideband

amplifier offering exceptional signal purity will find the

LMH6739’s low input referred noise and low harmonic dis-

tortion make it an attractive solution. The LMH6739 is avail-

able in a space saving SSOP package.

n RGB video driver

n High resolution projectors

n Flash A/D driver

n D/A transimpedance buffer

n Wide dynamic range IF amp

n Radar/communication receivers

n DDS post-amps

n Wideband inverting summer

n Line driver

Connection Diagram

16-Pin SSOP

20104110

Top View

Ordering Information

Package

Part Number

LMH6739MQ

LMH6739MQX

Package Marking

Transport Media

NSC Drawing

95 Units/Rail

16-pin SSOP

LH6739MQ

MQA16

2.5k Units Tape and Reel

™

VIP10 is a trademark of National Semiconductor Corporation.

DS201041

www.national.com

Absolute Maximum Ratings (Note 1)

ESD Tolerance (Note 4)

Human Body Model

2000V

200V

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Machine Model

Storage Temperature Range

−65˚C to +150˚C

Supply Voltage (V⁺- V^–)

I_OUT

13.2V

(Note 3)

Operating Ratings (Note 1)

Common Mode Input Voltage

Maximum Junction Temperature

Storage Temperature Range

Soldering Information

V_CC

Operating Temperature Range

Supply Voltage (V⁺- V^–)

Thermal Resistance

Package

−40˚C

+85˚C

+150˚C

12V

−65˚C to +150˚C

(θ_JC

)

(θ_JA)

Infrared or Convection (20 sec.)

Wave Soldering (10 sec.)

235˚C

260˚C

16-Pin SSOP

36˚C/W

120˚C/W

Electrical Characteristics (Note 2)

A_V= +2, V_CC

5V, R_L= 100Ω; unless otherwise specified.

Parameter Conditions

Symbol

Min

Typ

Max

Units

Frequency Domain Performance

UGBW

SSBW

LSBW

-3 dB Bandwidth

Unity Gain, V_OUT= 200 mV_PP

V_OUT= 200 mV_PP

V_OUT= 2 V_PP

750

480

400

150

1.0

MHz

0.1 dB Bandwidth

Rolloff

V_OUT= 2 V_PP

MHz

GFR2

300 MHz, V_OUT= 2 V_PP

Time Domain Response

TRS

TRL

Rise and Fall Time

2V Step

0.9

1.7

(10% to 90%)

5V Step

Slew Rate

5V Step

3300

V/µs

t_s

Settling Time to 0.1%

Enable Time

2V Step

t_e

From Disable = rising edge.

From Disable = falling edge.

7.3

t_d

Disable Time

4.5

Distortion

HD2L

HD2

HD2H

HD3L

HD3

HD3H

2^ndHarmonic Distortion

3^rdHarmonic Distortion

2 V_PP, 5 MHz

2 V_PP, 20 MHz

2 V_PP, 50 MHz

2 V_PP, 5 MHz

2 V_PP, 20 MHz

2 V_PP, 50 MHz

−80

−71

−55

−90

−85

−65

dBc

Equivalent Input Noise

V_N

Non-Inverting Voltage

1 MHz

2.3

nV/

I_CN

N_CN

Inverting Current

pA/

Non-Inverting Current

Video Performance

Differential Gain

Differential Phase

4.43 MHz, R_L= 150Ω

.02

.01

degree

Static, DC Performance

V_OSInput Offset Voltage (Note 6)

0.5

−8

−2

2.5

4.5

I_BN

Input Bias Current (Note 6)

Non-Inverting

Inverting

−16

µV

−21

I_BI

µA

PSRR

Power Supply Rejection Ratio

(Note 6)

48.5

www.national.com

Electrical Characteristics (Note 2) (Continued)

A_V= +2, V_CC

5V, R_L= 100Ω; unless otherwise specified.

Parameter Conditions

Symbol

Min

Typ

Max

Units

CMRR

Common Mode Rejection Ratio

(Note 6)

I_CC

Supply Current (Note 6)

All three amps Enabled, No

Load

Supply Current Disabled V⁺

Supply Current Disabled V⁻

Internal Feedback & Gain Set

Resistor Value

R_L

1.9

1.1

2.2

1.3

525

Ω

∞

375

450

∞

Gain Error

R_L

0.2

1.1

Miscellaneous Performance

R_IN

C_IN

R_IN

−

Non-Inverting Input Resistance

Non-Inverting Input Capacitance

Inverting Input Impedance

1000

kΩ

Ω

Output impedance of input

buffer.

R_O

V_O

Output Impedance

0.05

3.5

Ω

Output Voltage Range (Note 6)

R_L= 100Ω

3.25

3.1

3.65

3.5

1.9

1.7

∞

R_L

3.8

2.0

CMIR

I_O

Common Mode Input Range

(Note 6)

CMRR 40 dB

Linear Output Current (Note 3)

(Note 6)

V_IN= 0V, V_OUT

30 mV

I_SC

Short Circuit Current (Note 5)

V_IN= 2V Output Shorted to

Ground

160

I_IH

Disable Pin Bias Current High

Disable Pin Bias Current Low

Voltage for Disable

Disable Pin = V⁺

Disable Pin = 0V

Disable Pin ≤ V_DMAX

Disable Pin ≥ V_DMIN

µA

I_IL

−350

V_DMAX

V_DMIM

0.8

Voltage for Enable

2.0

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables.

Note 2: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of

the device such that T = T . No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self heating where T

T .

See Applications Section for information on temperature de-rating of this device. Min/Max ratings are based on product characterization and simulation. Individual

parameters are tested as noted.

Note 3: The maximum output current (I

) is determined by device power dissipation limitations. See the Power Dissipation section of the Application Section for

OUT

more details.

Note 4: Human body model: 1.5 kΩ in series with 100 pF. Machine model: 0Ω in series with 200 pF.

Note 5: Short circuit current should be limited in duration to no more than 10 seconds. See the Power Dissipation section of the Application Section for more details.

Note 6: Parameter 100% production tested at 25˚ C.

www.national.com

Typical Performance Characteristics A_V= +2, V_CC

5V, R_L= 100Ω; unless otherwise specified).

Large Signal Frequency Response

Small Signal Frequency Response

20104131

20104132

Frequency Response vs. V_OUT

Frequency Response vs. Supply Voltage

20104101

20104116

Pulse Response

Frequency Response vs. Capacitive Load

20104122

20104114

www.national.com

Typical Performance Characteristics A_V= +2, V_CC

5V, R_L= 100Ω; unless otherwise

specified). (Continued)

Series Output Resistance vs. Capacitive Load

Open Loop Gain and Phase

20104126

20104119

Distortion vs. Frequency

10 MHz HD vs. Output Level

20104135

20104134

Distortion vs. Supply Voltage

CMRR vs. Frequency

20104111

20104118

www.national.com

Typical Performance Characteristics A_V= +2, V_CC

5V, R_L= 100Ω; unless otherwise

specified). (Continued)

PSRR vs. Frequency

Closed Loop Output Impedance |Z|

20104104

20104121

Disable Timing

DC Errors vs. Temperature

20104124

20104112

Crosstalk vs. Frequency

20104133

www.national.com

Application Section

GENERAL INFORMATION

The LMH6739 is a high speed current feedback Program-

mable Gain Buffer (PGB), optimized for very high speed and

low distortion. With its internal feedback and gain-setting

resistors the LMH6739 offers excellent AC performance

while simplifying board layout and minimizing the affects of

layout related parasitic components. The LMH6739 has no

internal ground reference so single or split supply configura-

tions are both equally useful.

SETTING THE CLOSED LOOP GAIN

The LMH6739 is a current feedback amplifier with on-chip

R_F= R_G= 450Ω. As such it can be configured with an A_V

+2, A_V= +1, or an A_V= −1 by connecting pins 3 and 4 as

described in the chart below.

20104105

GAIN A_V

INPUT CONNECTIONS

Non-Inverting (Pin 3) Inverting (Pin 4)

FIGURE 1. Recommended Non-Inverting Gain Circuit,

Gain = +2

−1 V/V

Ground

Input Signal

NC (Open)

Ground

+1 V/V

+2 V/V

Input Signal

The gain of the LMH6739 is accurate to 1% and stable over

temperature. The internal gain setting resistors, R_Fand R_G,

match very well. However, over process and temperature

their absolute value will change. Using external resistors in

series with R_Gto change the gain will result in poor gain

accuracy over temperature and from part to part.

20104130

20104108

FIGURE 4. Correction for Unity Gain Peaking

FIGURE 2. Recommended Non-Inverting Gain Circuit,

Gain +1

20104103

20104129

FIGURE 3. Recommended Inverting Gain Circuit,

Gain = –1

FIGURE 5. Frequency Response for Circuit in Figure 4

www.national.com

Application Section (Continued)

UNITY GAIN COMPENSATION

With a current feedback PGB like the LMH6739, the feed-

back resistor is a compromise between the value needed for

stability at unity gain and the optimized value used at a gain

of two. The result of this compromise is substantial peaking

at unity gain. If this peaking is undesirable a simple RC filter

at the input of the buffer will smooth the frequency response

shown as Figure 4. Figure 5 shows the results of a simple

filter placed on the non-inverting input. See Figure 6 and

Figure 7 for another method for reducing unity gain peaking.

20104138

FIGURE 8. Decoupling Capacitive Loads

DRIVING CAPACITIVE LOADS

Capacitive output loading applications will benefit from the

use of a series output resistor R_OUT. Figure 8 shows the use

of a series output resistor, R_OUT, to stabilize the amplifier

output under capacitive loading. Capacitive loads of 5 to 120

pF are the most critical, causing ringing, frequency response

peaking and possible oscillation. The charts “Suggested

R_OUTvs. Cap Load” give a recommended value for selecting

a series output resistor for mitigating capacitive loads. The

values suggested in the charts are selected for .5 dB or less

of peaking in the frequency response. This gives a good

compromise between settling time and bandwidth. For appli-

cations where maximum frequency response is needed and

some peaking is tolerable, the value of R_OUTcan be reduced

slightly from the recommended values.

20104107

LAYOUT CONSIDERATIONS

Whenever questions about layout arise, use the evaluation

board as a guide. The LMH730275 is the evaluation board

supplied with samples of the LMH6739.

FIGURE 6. Alternate Unity Gain Compensation

To reduce parasitic capacitances ground and power planes

should be removed near the input and output pins. Compo-

nents in the feedback loop should be placed as close to the

device as possible. For long signal paths controlled imped-

ance lines should be used, along with impedance matching

elements at both ends.

Bypass capacitors should be placed as close to the device

as possible. Bypass capacitors from each rail to ground are

applied in pairs. The larger electrolytic bypass capacitors

can be located farther from the device, the smaller ceramic

capacitors should be placed as close to the device as pos-

sible. The LMH6739 has multiple power and ground pins for

enhanced supply bypassing. Every pin should ideally have a

separate bypass capacitor. Sharing bypass capacitors may

slightly degrade second order harmonic performance, espe-

cially if the supply traces are thin and /or long. In Figure 1

and Figure 2 C_SSis optional, but is recommended for best

second harmonic distortion. Another option to using C_SSis to

use pairs of .01 µF and .1 µF ceramic capacitors for each

supply bypass.

20104137

FIGURE 7. Frequency Response for Circuit in Figure 6

VIDEO PERFORMANCE

The LMH6739 has been designed to provide excellent per-

formance with production quality video signals in a wide

variety of formats such as HDTV and High Resolution VGA.

NTSC and PAL performance is nearly flawless. Best perfor-

mance will be obtained with back terminated loads. The back

termination reduces reflections from the transmission line

and effectively masks transmission line and other parasitic

capacitances from the amplifier output stage. Figure 4

www.national.com

add-on heat-sink can be added to the SSOP-16 package, or

alternatively, additional board metal (copper) area can be

utilized as heat-sink.

Application Section (Continued)

shows a typical configuration for driving a 75Ω Cable. The

amplifier is configured for a gain of two to make up for the 6

An effective way to reduce the junction temperature for the

SSOP-16 package (and other plastic packages) is to use the

copper board area to conduct heat. With no enhancement

the major heat flow path in this package is from the die

through the metal lead frame (inside the package) and onto

the surrounding copper through the interconnecting leads.

Since high frequency performance requires limited metal

near the device pins the best way to use board copper to

remove heat is through the bottom of the package. A gap

filler with high thermal conductivity can be used to conduct

heat from the bottom of the package to copper on the circuit

board. Vias to a ground or power plane on the back side of

the circuit board will provide additional heat dissipation. A

combination of front side copper and vias to the back side

can be combined as well.

dB of loss in R_OUT

Follow these steps to determine the maximum power dissi-

pation for the LMH6739:

1. Calculate the quiescent (no-load) power: P_AMP= I_CC

(V_S) V_S= V⁺-V⁻

2. Calculate the RMS power dissipated in the output stage:

_D(rms) = rms ((V_S- V_OUT)*I_OUT) where V_OUTand I_OUT

20104102

are the voltage and current across the external load and

V_Sis the total supply current

FIGURE 9. Maximum Power Dissipation

POWER DISSIPATION

3. Calculate the total RMS power: P_T= P_AMP+P_D

The maximum power that the LMH6739 package can dissi-

pate at a given temperature can be derived with the following

equation (See Figure 9):

P_MAX= (150^o– T_AMB)/ θ_JA, where T_AMB= Ambient tempera-

ture (˚C) and θ_JA= Thermal resistance, from junction to

ambient, for a given package (˚C/W). For the SSOP package

θ_JAis 120˚C/W.

The LMH6739 is optimized for maximum speed and perfor-

mance in the small form factor of the standard SSOP-16

package. To achieve its high level of performance, the

LMH6739 consumes an appreciable amount of quiescent

current which cannot be neglected when considering the

total package power dissipation limit. The quiescent current

contributes to about 40˚ C rise in junction temperature when

no additional heat sink is used (V_S

= 5V, all 3 channels on).

ESD PROTECTION

Therefore, it is easy to see the need for proper precautions

to be taken in order to make sure the junction temperature’s

absolute maximum rating of 150˚C is not violated.

The LMH6739 is protected against electrostatic discharge

(ESD) on all pins. The LMH6739 will survive 2000V Human

Body model and 200V Machine model events.

To ensure maximum output drive and highest performance,

thermal shutdown is not provided. Therefore, it is of utmost

importance to make sure that the T_JMAXis never exceeded

due to the overall power dissipation (all 3 channels).

Under closed loop operation the ESD diodes have no effect

on circuit performance. There are occasions, however, when

the ESD diodes will be evident. If the LMH6739 is driven by

a large signal while the device is powered down the ESD

diodes will conduct.

With the LMH6739 used in a back-terminated 75Ω RGB

analog video system (with 2 V_PPoutput voltage), the total

power dissipation is around 435 mW of which 340 mW is due

to the quiescent device dissipation (output black level at 0V).

With no additional heat sink used, that puts the junction

temperature to about 140˚ C when operated at 85˚C ambi-

ent.

The current that flows through the ESD diodes will either exit

the chip through the supply pins or will flow through the

device, hence it is possible to power up a chip with a large

signal applied to the input pins. Shorting the power pins to

each other will prevent the chip from being powered up

through the input.

To reduce the junction temperature many options are avail-

able. Forced air cooling is the easiest option. An external

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Physical Dimensions inches (millimeters)

unless otherwise noted

16-Pin SSOP

NS Package Number MQA16

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves

the right at any time without notice to change said circuitry and specifications.

For the most current product information visit us at www.national.com.

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS

WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR

CORPORATION. As used herein:

1. Life support devices or systems are devices or systems

which, (a) are intended for surgical implant into the body, or

(b) support or sustain life, and whose failure to perform when

properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to result

in a significant injury to the user.

2. A critical component is any component of a life support

device or system whose failure to perform can be reasonably

expected to cause the failure of the life support device or

system, or to affect its safety or effectiveness.

BANNED SUBSTANCE COMPLIANCE

National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship

Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned

Substances’’ as defined in CSP-9-111S2.

National Semiconductor

Americas Customer

Support Center

National Semiconductor

Europe Customer Support Center

Fax: +49 (0) 180-530 85 86

National Semiconductor

Asia Pacific Customer

Support Center

National Semiconductor

Japan Customer Support Center

Fax: 81-3-5639-7507

Email: new.feedback@nsc.com

Tel: 1-800-272-9959

Email: europe.support@nsc.com

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Email: jpn.feedback@nsc.com

Tel: 81-3-5639-7560

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LMH6739MQ产品参数

型号:	LMH6739MQ
是否Rohs认证：	不符合
生命周期：	Transferred
包装说明：	SSOP-16
Reach Compliance Code：	not_compliant
ECCN代码：	EAR99
HTS代码：	8542.33.00.01
风险等级：	5.09
标称带宽：	750000 kHz
商用集成电路类型：	VIDEO AMPLIFIER
JESD-30 代码：	R-PDSO-G16
JESD-609代码：	e0
长度：	4.9 mm
湿度敏感等级：	1
信道数量：	1
功能数量：	3
端子数量：	16
最高工作温度：	85 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	SSOP
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）：	260
认证状态：	Not Qualified
座面最大高度：	1.7272 mm
最大供电电压 (Vsup)：	6 V
最小供电电压 (Vsup)：	4 V
表面贴装：	YES
温度等级：	INDUSTRIAL
端子面层：	Tin/Lead (Sn/Pb)
端子形式：	GULL WING
端子节距：	0.635 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	40
宽度：	3.9 mm
Base Number Matches：	1

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