LT1886
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APPLICATIO S I FOR ATIO
Input Considerations
the efficiency of the PC board as a heat sink. The PCB
material can be very effective at transmitting heat between
the pad area attached to the V– pin and a ground or power
plane layer. Copper board stiffeners and plated through-
holes can also be used to spread the heat generated by the
device. Table 1 lists the thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with 2oz copper.
This data can be used as a rough guideline in estimating
thermal resistance. The thermal resistance for each appli-
cation will be affected by thermal interactions with other
components as well as board size and shape.
The inputs of the LT1886 are an NPN differential pair
protected by back-to-back diodes (see the Simplified
Schematic). There are no series protection resistors
onboard which would degrade the input voltage noise. If
theinputscanhaveavoltagedifferenceofmorethan0.7V,
the input current should be limited to less than 10mA with
externalresistance(usuallythefeedbackresistororsource
resistor).EachinputalsohastwoESDclampdiodes—one
to each supply. If an input drive exceeds the supply, limit
the current with an external resistor to less than 10mA.
TheLT1886designisatrueoperationalamplifierwithhigh
impedance inputs and low input bias currents. The input
offset current is a factor of ten lower than the input bias
current. To minimize offsets due to input bias currents,
match the equivalent DC resistance seen by both inputs.
The low input noise current can significantly reduce total
noisecomparedtoacurrentfeedbackamplifier, especially
for higher source resistances.
Table 1. Fused 8-Lead SO Package
COPPER AREA (2oz)
TOPSIDE
TOTAL
COPPER AREA
BACKSIDE
2500 sq. mm
2500 sq. mm
2500 sq. mm
2500 sq. mm
1000 sq. mm
600 sq. mm
300 sq. mm
100 sq. mm
0 sq. mm
θJA
2500 sq. mm
1000 sq. mm
600 sq. mm
180 sq. mm
180 sq. mm
180 sq. mm
180 sq. mm
180 sq. mm
180 sq. mm
5000 sq. mm
3500 sq. mm
3100 sq. mm
2680 sq. mm
1180 sq. mm
780 sq. mm
480 sq. mm
280 sq. mm
180 sq. mm
80°C/W
°
92 C/W
°
96 C/W
°
98 C/W
°
112 C/W
°
116 C/W
Layout and Passive Components
°
118 C/W
With a gain bandwidth product of 700MHz the LT1886
requires attention to detail in order to extract maximum
performance. Use a ground plane, short lead lengths and
a combination of RF-quality supply bypass capacitors
(i.e., 470pF and 0.1µF). As the primary applications have
high drive current, use low ESR supply bypass capacitors
(1µF to 10µF). For best distortion performance with high
drive current a capacitor with the shortest possible trace
lengths should be placed between Pins 4 and 8. The
optimum location for this capacitor is on the back side of
thePCboard. TheDSLdriverdemoboard(DC304)forthis
partusesaTaiyoYuden10µFceramic(TMK432BJ106MM).
°
120 C/W
°
122 C/W
Calculating Junction Temperature
The junction temperature can be calculated from the
equation:
TJ = (PD)(θJA) + TA
TJ = Junction Temperature
TA = Ambient Temperature
PD = Device Dissipation
The parallel combination of the feedback resistor and gain
setting resistor on the inverting input can combine with
the input capacitance to form a pole which can cause
frequency peaking. In general, use feedback resistors of
1kΩ or less.
θJA = Thermal Resistance (Junction-to-Ambient)
As an example, calculate the junction temperature for the
circuitinFigure1assumingan85°Cambienttemperature.
The device dissipation can be found by measuring the
supply currents, calculating the total dissipation and then
subtracting the dissipation in the load.
Thermal Issues
The LT1886 enhanced θJA SO-8 package has the V– pin
fusedtotheleadframe.Thisthermalconnectionincreases
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