LTC5586
pin FuncTions
RFA (Pin 2): 50Ω switched RF input. The pin should
be DC-blocked with coupling capacitor; 1000pF is
recommended.
IFQM, IFQP, IFIP, IFIM (Pins 15, 16, 25, 26): IF amplifier
output pins. The current used by the output amplifiers
is set by a resistance of 25Ω to 200Ω from each pin to
ground and the VCM control voltage.
TEMP (Pin 3): Temperature monitoring diode. The diode
to ground at this pin can be used to measure the die
temperature. A forward bias current of 100µA can be
used into this pin and the forward voltage drop can be
measured as a function of die temperature.
CSB (Pin 17): Chip Select Bar. When CSB is low, the serial
interface is enabled. It can be driven with 1.2V to 3.3V
logic levels.
VCC (Pin 18): Positive supply pin. This pin should be
bypassed with a 1000pF and 4.7µF capacitor to ground.
RFSW (Pin 4): RF channel select. The state of the RF
switch is the logical AND of the RFSW pin and the RFSW
register value. (See Appendix). This pin should not be left
floating. Either tie high or low.
LOP, LOM (Pins 19, 20): LO inputs. External matching
is not needed. Can be driven 50Ω single-ended or 100Ω
differentially. The LO pins should be DC-blocked with cou-
pling capacitor; 1000pF is recommended. When driven
single-ended, the unused pin should be terminated with
50Ω in series with the DC-blocking capacitor.
VCCN (Pin 5): Positive Supply Pin. This pin must be tied
to the VCC pin.
VCM (Pin 6): IF amplifier common-mode output voltage
adjust. Source resistance should be 1kΩ or lower. If this
pin is left unconnected, it will internally self-bias to 0.9V.
SDO (Pin 21): Serial Data Output. This output can accom-
modate logic levels from 1.2V to 3.3V. During read-mode,
data is read out MSB first.
RFB (Pin 7): 50Ω switched RF input. The pin should
be DC-blocked with coupling capacitor; 1000pF is
recommended.
SDI (Pins 22): Serial Data Input. Data is clocked MSB first
into the mode-control registers on the rising edge of SCK.
SDI can be driven with 1.2V to 3.3V logic levels.
MQP, MQM, MIM, MIP (Pins 9, 10, 31, 32): Mixer dif-
ferential output pins. When connected to the amplifier
SCK (Pin 23): Serial Clock Input. SDI can be driven with
1.2V to 3.3V logic levels.
input pins, the DC bias point is V – 1.4V for each pin. A
CC
low-pass filter is typically used between the MQM(P) or
MIM(P) pins and the AQM(P) or AIM(P) pins to suppress
the high frequency mixing products. See the Applications
section for more information.
OVDD (Pin 24): Positive digital interface supply pin. This
pin sets the logic levels for the digital interface. 1.2V to
3.3V can be used. This pin should be bypassed with a
1µF capacitor to ground. The VCC supply must be applied
before the OVDD supply to prevent damage to the ESD
diodes.
DNC (Pins 11, 14, 27, 30): DO NOT CONNECT. No con-
nection should be made to these pins.
AQM, AQP, AIP, AIM (Pins 12, 13, 28, 29): Amplifier
GND (Pins 1, 8, Exposed Pad Pin 33): Ground. These
pins must be soldered to the circuit board RF ground
plane. The backside exposed pad ground connection
should have a low-inductance connection and good ther-
mal contact to the printed circuit board ground plane
using many through-hole vias. See layout information.
differential input pins. When connected to the mixer out-
put pins, the DC bias point is V – 1.4V for each pin. A
CC
low-pass filter is typically used between the AQM(P) or
AIM(P) pins and the MQM(P) or MIM(P) pins to suppress
the high frequency mixing products. See the Applications
section for more information.
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For more information www.linear.com/LTC5586