Glass Passivated Bridge Rectifiers
MB2S-G Thru. MB10S-G
Reverse Voltage: 200 to 1000 Volts
Forward Current: 0.8 Amp
RoHS Device
MBS
Features
0.276 (7.00)MAX
0.031 (0.84)
0.019 (0.50)
-Ideal for printed circuit board
-High temperature soldering guaranteed:
+
-
260°C / 10 seconds /9.5mm
Lead length at 5 lbs.,(2.3kg) tension.
0.157 (4.00)
0.142 (3.60)
0.053 (1.53)
0.037 (0.95)
Mechanical data
-Case: Molded plastic.
-Lead: Solder plated.
-Polarity: As marked.
0.102 (2.60)
0.087 (2.20)
0.014 (0.35)
0.006 (0.15)
0.008 (0.20)max
0.083 (2.12)
0.043 (1.10)
0.106 (2.70)
0.090 (2.30)
-Weight:0.13 gram(approx.).
0.053 (1.53)
0.037 (0.95)
0.118(3.00)MAX
0.193 (4.90)
0.177 (4.50)
Dimensions in inches and (millimeters)
Maximum Rating And Electrical Characteristics
Rating at TA=25°C, unless otherwise noted.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Symbol
Parameter
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
MB2S-G MB4S-G MB6S-G MB8S-G MB10S-G Unit
VRRM
200
400
600
800
1000
V
VRMS
VDC
140
200
280
400
420
600
560
800
700
V
V
1000
Maximum DC Blocking Voltage
Maximum Average Forward
Recurrent Current
I(AV)
IFSM
0.8
A
A
Peak Forward Surge Current, 8.3mS Single
Half Sine-wave, Superimposed On Rated Load
(JEDEC Method)
35
Maximum Instantaneous Forward Voltage at 0.4A
VF
IR
1.0
V
@TJ=25°C
5.0
500
70
Maximum DC Reverse Current
Rated DC Blocking Voltage per leg
mA
@TJ=125°C
(Note 1)
Typical Thermal Resistance
(Note 2)
RθJA
RθJL
°C/W
20
Operating Temperature Range
Storage Temperature Range
-55 to +150
-55 to +150
°C
°C
TJ
TSTG
Notes: 1. On aluminum suvstrate P.C.B. with an area of 0.8x0.8”(20x20mm) mounted on 0.05x0.05”(1.3x1.3mm) solder pad.
2.On glass epoxy P.C.B. mounted on 0.05x0.05”(1.3x1.3mm) pads.
REV: A
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QW-BBR73
Comchip Technology CO., LTD.