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产品型号MC78LC30HT1G的概述

MC78LC30HT1G概述 MC78LC30HT1G是一款由ON Semiconductor公司制造的线性电压稳压器,广泛应用于各种电子设备中。这款芯片在电压调节领域表现出色,能够提供稳定的输出电压并保证较低的噪声特性,使其成为许多电子设计中的理想选择。其注重了电源管理的高效率及稳定性,适合集成在微控制器、传感器、无线设备及更多电子产品中。 MC78LC30HT1G的输入电压范围为29V,输出电压为固定的3.3V。该芯片的输出电流可达1.5A,满足大部分业界需求。其引脚设计简单,易于集成,使得开发者在设计电路时能够减少空间的占用,同时也便于后期的维护和替换。芯片的工作温度范围宽广,从-40℃到+125℃,使之能在多种环境下稼动。 详细参数 下面是MC78LC30HT1G的详细技术参数: - 输入电压范围:4.5V到29V - 输出电压:固定输出3.3V - 输出电流:最大1.5A -...

产品型号MC78LC30HT1G的Datasheet PDF文件预览

MC78LC00 Series  
Micropower Voltage  
Regulator  
The MC78LC00 series of fixed output low dropout linear regulators  
are designed for handheld communication equipment and portable  
battery powered applications which require low quiescent current. The  
MC78LC00 series features an ultra−low quiescent current of 1.1 mA.  
Each device contains a voltage reference unit, an error amplifier, a  
PMOS power transistor, and resistors for setting output voltage.  
The MC78LC00 has been designed to be used with low cost ceramic  
capacitors and requires a minimum output capacitor of 0.1 mF. The  
device is housed in the micro−miniature Thin SOT23−5 surface mount  
package and SOT−89, 3 pin. Standard voltage versions are 1.5, 1.8,  
2.5, 2.7, 2.8, 3.0, 3.3, 4.0, and 5.0 V. Other voltages are available in  
100 mV steps.  
http://onsemi.com  
MARKING DIAGRAMS AND  
PIN CONNECTIONS  
THIN SOT23−5  
NTR SUFFIX  
CASE 483  
GND  
1
2
5
4
N/C  
N/C  
V
in  
Features  
5
V
out  
3
Low Quiescent Current of 1.1 mA Typical  
Excellent Line and Load Regulation  
1
(Top View)  
Maximum Operating Voltage of 12 V  
Low Output Voltage Option  
High Accuracy Output Voltage of 2.5%  
Industrial Temperature Range of −40°C to 85°C  
Two Surface Mount Packages (SOT−89, 3 Pin, or SOT−23, 5 Pin)  
Pb−Free Packages are Available  
SOT−89  
H SUFFIX  
CASE 1213  
1
2
3
GND  
V
in  
Tab  
TAB  
V
out  
Typical Applications  
1
(Top View)  
Battery Powered Instruments  
Hand−Held Instruments  
Camcorders and Cameras  
(Tab is connected to Pin 2)  
xxx = Version  
A
Y
W
G
= Assembly Location  
= Year  
= Work Week  
= Pb−Free Package  
2
3
(Note: Microdot may be in either location)  
V
in  
V
O
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 10 of this data sheet.  
V
ref  
1
GND  
This device contains 8 active transistors.  
Figure 1. Representative Block Diagram  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 9  
MC78LC00/D  
MC78LC00 Series  
PIN FUNCTION DESCRIPTION  
Pin No.  
Pin Name  
Description  
1
2
GND  
Power supply ground  
V
in  
Positive power supply input voltage  
Regulated Output  
3
4
5
V
out  
N/C  
No Internal Connection  
No Internal Connection  
N/C  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
V
Input Voltage  
V
in  
12  
Output Voltage  
V
out  
−0.3 to V +0.3  
V
in  
Power Dissipation and Thermal Characteristics  
Case 483−01 (Thin SOT23−5) NTR Suffix  
Power Dissipation @ T = 85°C  
P
140  
280  
mW  
°C/W  
A
D
Thermal Resistance, Junction−to−Ambient  
Case 1213 (SOT−89) H Suffix  
R
q
JA  
Power Dissipation @ T = 25°C  
P
300  
333  
mW  
°C/W  
A
D
Thermal Resistance, Junction−to−Ambient  
Operating Junction Temperature  
Operating Ambient Temperature  
Storage Temperature  
R
q
JA  
T
+125  
−40 to +85  
−55 to +150  
10  
°C  
°C  
J
T
A
T
stg  
°C  
Lead Soldering Temperature @ 260°C  
T
sec  
solder  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
http://onsemi.com  
2
MC78LC00 Series  
ELECTRICAL CHARACTERISTICS (V = V  
+ 1.0 V, C = 1.0 mF, C = 1.0 mF, T = 25°C, unless otherwise noted.) (Note 5)  
in  
out(nom.)  
in  
out  
J
NTR SUFFIX  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Output Voltage (TA = 25°C, Iout = 1.0 mA)  
Vout  
V
1.5 V  
1.8 V  
2.5 V  
2.7 V  
2.8 V  
3.0 V  
3.3 V  
4.0 V  
5.0 V  
1.455  
1.746  
2.425  
2.646  
2.744  
2.94  
3.234  
3.9  
4.90  
1.5  
1.8  
2.5  
2.7  
2.8  
3.0  
3.3  
4.0  
5.0  
1.545  
1.854  
2.575  
2.754  
2.856  
3.06  
3.366  
4.1  
5.10  
Output Voltage (TA = −40°C to 85°C)  
Vout  
V
1.5 V  
1.8 V  
2.5 V  
2.7 V  
2.8 V  
3.0 V  
3.3 V  
4.0 V  
5.0 V  
1.455  
1.746  
2.425  
2.619  
2.716  
2.910  
3.201  
3.9  
1.5  
1.8  
2.5  
2.7  
2.8  
3.0  
3.3  
4.0  
5.0  
1.545  
1.854  
2.575  
2.781  
2.884  
3.09  
3.399  
4.1  
5.10  
4.90  
Line Regulation (Vin = V  
+ 1.0 V to 12 V, Iout = 1.0 mA)  
Regline  
Regload  
0.05  
40  
0.2  
60  
%/V  
mV  
mA  
O(nom.)  
Load Regulation (Iout = 1.0 mA to 10 mA)  
Output Current (Note 6)  
I
out  
1.5 V, 1.8 V (V = 4.0 V)  
2.5 V, 2.7 V, 2.8 V, 3.0 V (V = 5.0 V)  
35  
50  
50  
80  
80  
50  
80  
80  
80  
100  
in  
in  
3.3 V (V = 6.0 V)  
in  
4.0 V (V = 7.0 V)  
in  
5.0 V (V = 8.0 V)  
in  
Dropout Voltage (I = 1.0 mA, Measured at V −3.0%)  
V −V  
in out  
mV  
out  
out  
1.5 V  
35  
30  
30  
30  
70  
60  
53  
38  
1.6 V−3.2 V  
3.3 V−3.9 V  
4.0 V−5.0 V  
Quiescent Current (I = 1.0 mA to I  
)
O(nom.)  
IQ  
1.1  
"100  
89  
3.6  
mA  
out  
Output Voltage Temperature Coefficient  
Output Noise Voltage (f = 1.0 kHz to 100 kHz)  
T
c
ppm/°C  
mVrms  
Vn  
1. This device series contains ESD protection and exceeds the following tests:  
Human Body Model 2000 V per MIL−STD−883, Method 3015  
Machine Model Method 200 V  
2. Latch up capability (85°C) "100 mA  
3. Maximum package power dissipation limits must be observed.  
T
* T  
J(max)  
A
PD +  
R
qJA  
4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.  
5. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.  
6. Output Current is measured when V = V − 3% where V = V at I = 0 mA.  
out  
O1  
O1  
out  
out  
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3
 
MC78LC00 Series  
ELECTRICAL CHARACTERISTICS (V = V  
+ 1.0 V, C = 1.0 mF, C = 1.0 mF, T = 25°C, unless otherwise noted.) (Note 11)  
in  
out(nom.)  
in  
out  
J
HT SUFFIX  
Characteristic  
Output Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
V
30HT1 Suffix (V = 5.0 V)  
2.950  
3.218  
3.900  
4.875  
3.0  
3.3  
4.0  
5.0  
3.075  
3.382  
4.100  
5.125  
in  
33HT1 Suffix (V = 5.0 V)  
in  
40HT1 Suffix (V = 6.0 V)  
in  
50HT1 Suffix (V = 7.0 V)  
in  
Line Regulation  
Reg  
0.05  
0.2  
%/V  
mV  
line  
V
in  
= [V + 1.0] V to 10 V, I = 1.0 mA  
O O  
Load Regulation (I = 1.0 to 10 mA)  
Reg  
load  
O
30HT1 Suffix (V = 5.0 V)  
40  
40  
50  
60  
60  
60  
70  
90  
in  
33HT1 Suffix (V = 6.0 V)  
in  
40HT1 Suffix (V = 7.0 V)  
in  
50HT1 Suffix (V = 8.0 V)  
in  
Output Current (Note 12)  
I
mA  
mV  
O
30HT1 Suffix (V = 5.0 V)  
35  
35  
45  
55  
50  
50  
65  
80  
in  
33HT1 Suffix (V = 6.0 V)  
in  
40HT1 Suffix (V = 7.0 V)  
in  
50HT1 Suffix (V = 8.0 V)  
in  
Dropout Voltage  
V
in  
− V  
O
30HT1 Suffix (I = 1.0 mA)  
40  
35  
25  
25  
60  
53  
38  
38  
O
33HT1 Suffix (I = 1.0 mA)  
O
40HT1 Suffix (I = 1.0 mA)  
O
50HT1 Suffix (I = 1.0 mA)  
O
Quiescent Current  
I
mA  
CC  
30HT1 Suffix (V = 5.0 V)  
33HT1 Suffix (V = 5.0 V)  
40HT1 Suffix (V = 6.0 V)  
50HT1 Suffix (V = 7.0 V)  
1.1  
1.1  
1.2  
1.3  
3.3  
3.3  
3.6  
3.9  
in  
in  
in  
in  
Output Voltage Temperature Coefficient  
T
100  
ppm/°C  
C
7. This device series contains ESD protection and exceeds the following tests:  
Human Body Model 2000 V per MIL−STD−883, Method 3015  
Machine Model Method 200 V  
8. Latch up capability (85°C) "100 mA  
9. Maximum package power dissipation limits must be observed.  
T
* T  
J(max)  
A
PD +  
R
qJA  
10.Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.  
11. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.  
12.Output Current is measured when V = V − 3% where V = V at I = 0 mA.  
out  
O1  
O1  
out  
out  
DEFINITIONS  
Load Regulation  
The change in output voltage for a change in output current  
at a constant temperature.  
difference between the input current (measured through the  
LDO input pin) and the output current.  
Line Regulation  
Dropout Voltage  
The change in output voltage for a change in input voltage.  
The measurement is made under conditions of low dissipation  
or by using pulse technique such that the average chip  
temperature is not significantly affected.  
The input/output differential at which the regulator output  
no longer maintains regulation against further reductions in  
input voltage. Measured when the output drops 3% below its  
nominal. The junction temperature, load current, and  
minimum input supply requirements affect the dropout level.  
Line Transient Response  
Typical over and undershoot response when input voltage is  
excited with a given slope.  
Maximum Power Dissipation  
The maximum total dissipation for which the regulator will  
operate within its specifications.  
Maximum Package Power Dissipation  
The maximum power package dissipation is the power  
dissipation level at which the junction temperature reaches its  
maximum operating value, i.e. 125°C. Depending on the  
ambient power dissipation and thus the maximum available  
output current.  
Quiescent Current  
The quiescent current is the current which flows through the  
ground when the LDO operates without a load on its output:  
internal IC operation, bias, etc. When the LDO becomes  
loaded, this term is called the Ground current. It is actually the  
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4
 
MC78LC00 Series  
3.2  
3.1  
3
3.2  
T = 25°C  
A
NTR Series  
I
= 1.0 mA  
O
3.0  
2.8  
2.6  
I
= 1 mA  
2.9  
2.8  
2.7  
2.6  
2.5  
2.4  
2.3  
2.2  
O
I
= 10 mA  
O
I
= 5.0 mA  
O
I
= 5 mA  
O
2.4  
2.2  
MC78LC30HT1  
3.3  
I
= 10 mA  
O
T = 25°C  
A
2.5  
2.7  
2.9  
3.1  
3.3  
3.5  
2.5  
2.7  
2.9  
3.1  
3.5  
V , Input Voltage (V)  
in  
V , Input Voltage (V)  
in  
Figure 2. Output Voltage versus Input Voltage  
Figure 3. Output Voltage versus Input Voltage  
3.05  
3
3.2  
3.1  
NTR Series  
−40°C  
2.95  
2.9  
T = −30°C  
A
80°C  
3.0  
2.9  
2.85  
2.8  
T = 25°C  
A
2.75  
2.7  
25°C  
2.8  
2.7  
0
MC78LC30HT1  
T = 80°C  
A
2.65  
2.6  
120  
0
20  
40  
60  
80  
100  
120  
0
20  
40  
60  
80  
100  
I , Output Current (mA)  
O
I , Output Current (mA)  
O
Figure 4. Output Voltage versus Output Current  
Figure 5. Output Voltage versus Output Current  
2
1.8  
1.6  
1.4  
1.2  
1
2.0  
MC78LC30NTR  
T = 25°C  
A
1.6  
1.2  
0.8  
0.6  
0.4  
0.2  
0
0.8  
0.4  
0
MC78LC30HT1  
T = 25°C  
A
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
I , Output Current (mA)  
O
I , Output Current (mA)  
O
Figure 6. Dropout Voltage versus Output Current  
Figure 7. Dropout Voltage versus Output Current  
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5
MC78LC00 Series  
3.1  
3.06  
3.02  
2.98  
3.10  
V
= 5.0 V  
= 10 mA  
in  
MC78LC30NTR  
= 4.0 V  
I
O
V
in  
3.06  
3.02  
I
= 10 mA  
O
2.98  
2.94  
2.90  
MC78LC30HT1  
2.94  
2.9  
−40  
−20  
0
20  
40  
60  
80  
−40  
−20  
0
20  
40  
60  
80  
T , Ambient Temperature (°C)  
A
T , Ambient Temperature (°C)  
A
Figure 8. Output Voltage versus Temperature  
Figure 9. Output Voltage versus Temperature  
1.4  
1.3  
1.4  
T = 25°C  
A
MC78LC30NTR  
T = 25°C  
A
1.3  
1.2  
I
= 0 mA  
O
1.2  
1.1  
1
1.1  
1.0  
MC78LC30HT1  
0.9  
0.8  
0.9  
0.8  
3
4
5
6
7
8
9
10  
11  
12  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10  
V , Input Voltage (V)  
in  
V , Input Voltage (V)  
in  
Figure 10. Quiescent Current versus Input Voltage  
Figure 11. Quiescent Current versus Input Voltage  
1.75  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
V
in  
= 5.0 V  
MC78LC30NTR  
= 4.0 V  
V
in  
1.5  
1.25  
1
I
= 0 mA  
O
0.75  
0.5  
MC78LC30HT1  
−20  
0
20  
40  
60  
80  
−40  
−20  
0
20  
40  
60  
80  
T , Ambient Temperature (°C)  
A
T , Ambient Temperature (°C)  
A
Figure 12. Quiescent Current versus Temperature  
Figure 13. Quiescent Current versus Temperature  
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6
MC78LC00 Series  
0.8  
0.7  
0.8  
0.7  
HT1 Series  
NTR Series  
I
= 10 mA  
O
0.6  
0.5  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.4  
0.3  
0.2  
0.1  
0
I
= 1.0 mA  
1.0  
O
0
2.0  
3.0  
4.0  
5.0  
6.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
V , Set Output Voltage (V)  
O
V , Set Output Voltage (V)  
O
Figure 15. Dropout Voltage versus  
Set Output Voltage  
Figure 14. Dropout Voltage versus Set Output Voltage  
8.0  
7.5  
6.0  
NTR Series  
5.0  
Input Voltage  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
300  
V
= 4.5 V to 5.5 V  
= 3.0 V  
R = 3 k  
L
in  
200  
100  
0
V
out  
C
out  
= 0.1 mF  
HT1 Series  
Output Voltage  
C
= 0.1 mF  
= 1.0 mA  
−100  
−200  
O
I
O
4.0  
−300  
0
2.0  
4.0  
6.0  
0
0.5  
1.0  
1.5  
2.0  
2.5  
t, Time (ms)  
Time (mS)  
Figure 16. Line Transient  
Figure 17. Line Transient Response  
1.5  
3.5  
NTR Series  
NTR Series  
50 mA  
T = 25°C  
A
T = 25°C  
A
O
3.0  
2.5  
1.0  
0.8  
0.6  
I
= 0 mA  
200 mA  
2.0  
1.5  
50 mA  
100 mA  
I
= 50 mA  
0.4  
0.2  
O
1.0  
0.5  
100 mA  
200 mA  
200 mA  
0
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
0
0.5  
1.0  
1.5  
2.0  
2.5  
V , Input Voltage (V)  
in  
V , Input Voltage (V)  
in  
Figure 18. Output Voltage versus Input Voltage  
Figure 19. Ground Current versus Input Voltage  
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7
MC78LC00 Series  
APPLICATIONS INFORMATION  
Thermal  
A typical application circuit for the MC78LC00 series is  
shown in Figure 20.  
As power across the MC78LC00 increases, it might  
become necessary to provide some thermal relief. The  
maximum power dissipation supported by the device is  
dependent upon board design and layout. Mounting pad  
configuration on the PCB, the board material, and also the  
ambient temperature effect the rate of temperature rise for  
the part. This is stating that when the MC78LC00 has good  
thermal conductivity through the PCB, the junction  
temperature will be relatively low with high power  
dissipation applications.  
Input Decoupling (C1)  
A 0.1 mF capacitor either ceramic or tantalum is  
recommended and should be connected close to the  
MC78LC00 package. Higher values and lower ESR will  
improve the overall line transient response.  
Output Decoupling (C2)  
The MC78LC00 is a stable component and does not  
require any specific Equivalent Series Resistance (ESR) or  
a minimum output current. Capacitors exhibiting ESRs  
ranging from a few mW up to 3.0 W can thus safely be used.  
The minimum decoupling value is 0.1 mF and can be  
augmented to fulfill stringent load transient requirements.  
The regulator accepts ceramic chip capacitors as well as  
tantalum devices. Larger values improve noise rejection and  
load regulation transient response.  
The maximum dissipation the package can handle is  
given by:  
T
* T  
A
J(max)  
R
PD +  
qJA  
If junction temperature is not allowed above the  
maximum 125°C, then the MC78LC00NTR can dissipate  
up to 357 mW @ 25°C.  
The power dissipated by the MC78LC00NTR can be  
calculated from the following equation:  
Hints  
Please be sure the Vin and GND lines are sufficiently  
wide. When the impedance of these lines is high, there is a  
chance to pick up noise or cause the regulator to  
malfunction.  
Set external components, especially the output capacitor,  
as close as possible to the circuit, and make leads as short as  
possible.  
[
]
[
]
* I  
P
tot  
+ V * I  
(I ) ) V * V  
in gnd out  
in out out  
or  
)
*
I
P
V
tot  
I
out out  
) I  
V
+
inMAX  
gnd  
out  
If an 80 mA output current is needed then the ground  
current from the data sheet is 1.1 mA. For an  
MC78LC30NTR (3.0 V), the maximum input voltage will  
then be 7.4 V.  
Battery or  
Unregulated  
Voltage  
+
C1  
+
V
out  
C2  
Figure 20. Basic Application Circuit for NTR Suffixes  
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8
 
MC78LC00 Series  
MJD32C  
0.033 mF  
MC78LC00  
1
2
3
V
in  
V
O
MC78LC00  
2
3
100  
V
V
O
in  
R1  
C2  
1
I
CC  
C1  
GND  
R2  
0.1 mF  
GND  
0.1 mF  
GND  
Figure 21. Current Boost Circuit  
Figure 22. Adjustable VO  
MJD32C  
R2  
Q1  
Q2  
0.033 mF  
MMBT2907  
ALT1  
2
3
V
in  
V
O
MC78LC00  
R1  
1
0.1 mF  
0.1 mF  
GND  
GND  
Figure 23. Current Boost Circuit with  
Overcurrent Limit Circuit  
V
V
) V  
R2  
R1  
BE2  
R2  
BE1  
BE2  
O(Reg) ǒ1 ) Ǔ ) I  
V
+ V  
R2  
I
[
)
O
CC  
O(short circuit)  
R1  
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9
MC78LC00 Series  
ORDERING INFORMATION  
Nominal  
Output Voltage  
Device  
MC78LC15NTR  
Marking  
Package  
Shipping  
1.5  
1.5  
LAG  
Thin SOT23−5  
MC78LC15NTRG  
Thin SOT23−5  
(Pb−Free)  
LAG  
LAH  
LAH  
LAI  
MC78LC18NTR  
1.8  
1.8  
Thin SOT23−5  
MC78LC18NTRG  
Thin SOT23−5  
(Pb−Free)  
MC78LC25NTR  
2.5  
2.5  
Thin SOT23−5  
MC78LC25NTRG  
Thin SOT23−5  
(Pb−Free)  
LAI  
MC78LC27NTR  
2.7  
2.7  
LAJ  
LAJ  
LAK  
LAK  
LAL  
LAL  
LAM  
LAM  
LEC  
LEC  
LAN  
LAN  
0C  
Thin SOT23−5  
MC78LC27NTRG  
Thin SOT23−5  
(Pb−Free)  
MC78LC28NTR  
2.8  
2.8  
Thin SOT23−5  
3000 Units/7Tape & Reel  
MC78LC28NTRG  
Thin SOT23−5  
(Pb−Free)  
MC78LC30NTR  
3.0  
3.0  
Thin SOT23−5  
MC78LC30NTRG  
Thin SOT23−5  
(Pb−Free)  
MC78LC33NTR  
3.3  
3.3  
Thin SOT23−5  
MC78LC33NTRG  
Thin SOT23−5  
(Pb−Free)  
MC78LC40NTR  
4.0  
4.0  
Thin SOT23−5  
MC78LC40NTRG  
Thin SOT23−5  
(Pb−Free)  
MC78LC50NTR  
5.0  
5.0  
Thin SOT23−5  
MC78LC50NTRG  
Thin SOT23−5  
(Pb−Free)  
MC78LC30HT1  
3.0  
3.0  
SOT−89  
MC78LC30HT1G  
SOT−89  
(Pb−Free)  
0C  
MC78LC33HT1  
3.3  
3.3  
3C  
SOT−89  
MC78LC33HT1G  
SOT−89  
(Pb−Free)  
3C  
1000 Units Tape & Reel  
MC78LC40HT1  
4.0  
4.0  
0D  
SOT−89  
MC78LC40HT1G  
SOT−89  
(Pb−Free)  
0D  
MC78LC50HT1  
5.0  
5.0  
0E  
SOT−89  
SOT−89  
(Pb−Free)  
MC78LC50HT1G  
0E  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.  
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10  
MC78LC00 Series  
PACKAGE DIMENSIONS  
THIN SOT23−5  
NTR SUFFIX  
PLASTIC PACKAGE  
CASE 483−02  
ISSUE E  
NOTES:  
D
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. MAXIMUM LEAD THICKNESS INCLUDES  
LEAD FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS  
OF BASE MATERIAL.  
4. A AND B DIMENSIONS DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
5
4
3
B
C
S
1
2
L
G
A
MILLIMETERS  
INCHES  
MIN MAX  
0.1142 0.1220  
DIM  
A
B
C
D
G
H
J
K
L
MIN  
2.90  
1.30  
0.90  
0.25  
0.85  
0.013  
0.10  
0.20  
1.25  
0
MAX  
3.10  
J
1.70 0.0512 0.0669  
1.10 0.0354 0.0433  
0.50 0.0098 0.0197  
1.05 0.0335 0.0413  
0.100 0.0005 0.0040  
0.26 0.0040 0.0102  
0.60 0.0079 0.0236  
1.55 0.0493 0.0610  
0.05 (0.002)  
H
M
K
M
S
10  
0
10  
_
_
_
_
2.50  
3.00 0.0985 0.1181  
SOLDERING FOOTPRINT*  
1.9  
0.074  
0.95  
0.037  
2.4  
0.094  
1.0  
0.039  
0.7  
0.028  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
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11  
MC78LC00 Series  
PACKAGE DIMENSIONS  
SOT−89  
H SUFFIX  
PLASTIC PACKAGE  
CASE 1213−02  
ISSUE C  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETERS  
3. 1213−01 OBSOLETE, NEW STANDARD 1213−02.  
−A−  
C
J
F
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
4.60  
2.60  
1.60  
0.57  
0.52  
1.83  
MAX  
0.181  
0.102  
0.063  
0.022  
0.020  
0.072  
−B−  
A
B
C
D
E
F
4.40  
2.40  
1.40  
0.37  
0.32  
1.50  
0.173  
0.094  
0.055  
0.015  
0.013  
0.059  
L
K
D
SEATING  
PLANE  
−T−  
G
H
J
1.50 BSC  
3.00 BSC  
0.30 0.50  
−−− 0.031  
4.25  
0.059 BSC  
M
S
S
0.10  
T B  
T B  
A
0.118 BSC  
0.012  
0.020  
−−−  
E
2 PL  
K
L
0.80  
−−−  
G
−−− 0.167  
M
S
S
A
0.10  
H
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