欢迎访问ic37.com |
会员登录 免费注册
发布采购
所在地: 型号: 精确
  • 批量询价
  •  
  • 供应商
  • 型号
  • 数量
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
  •  
  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • MCP1826T-ADJE/DC
  • 数量-
  • 厂家-
  • 封装-
  • 批号-
  • -
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931、62106431、62104891、62104791 QQ:857273081QQ:1594462451
更多
  • MCP1826T-ADJE/DC图
  • 集好芯城

     该会员已使用本站13年以上
  • MCP1826T-ADJE/DC 现货库存
  • 数量27928 
  • 厂家Microchip(微芯) 
  • 封装 
  • 批号22+ 
  • 原装原厂现货
  • QQ:3008092965QQ:3008092965 复制
    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • MCP1826T-ADJE/DC图
  • 深圳市宗天技术开发有限公司

     该会员已使用本站10年以上
  • MCP1826T-ADJE/DC 现货库存
  • 数量8000 
  • 厂家MIC(昌福) 
  • 封装 
  • 批号22+ 
  • 宗天技术 原装现货/假一赔十
  • QQ:444961496QQ:444961496 复制
    QQ:2824256784QQ:2824256784 复制
  • 0755-88601327 QQ:444961496QQ:2824256784
  • MCP1826T-ADJE/DC图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • MCP1826T-ADJE/DC 现货库存
  • 数量54200 
  • 厂家MICROCHIP 
  • 封装SOT-223 
  • 批号新年份 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:1435424310QQ:1435424310 复制
  • 0755-84507451 QQ:1435424310
  • MCP1826T-ADJE/DC图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • MCP1826T-ADJE/DC 现货库存
  • 数量54200 
  • 厂家MICROCHIP 
  • 封装SOT-223 
  • 批号新批次 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:2881512844QQ:2881512844 复制
  • 075584507705 QQ:2881512844
  • MCP1826T-ADJE/DC图
  • 深圳市拓森弘电子有限公司

     该会员已使用本站1年以上
  • MCP1826T-ADJE/DC
  • 数量8900 
  • 厂家SOT223-5 
  • 封装MICROCHIP 
  • 批号20+ 
  • 全新原装正品,库存现货实报
  • QQ:1300774727QQ:1300774727 复制
  • 13714410484 QQ:1300774727
  • MCP1826T-ADJE/DC图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • MCP1826T-ADJE/DC
  • 数量13880 
  • 厂家MICROCHIP/美国微芯 
  • 封装SOT-223-6 
  • 批号21+ 
  • 公司只售原装 支持实单
  • QQ:2881495751QQ:2881495751 复制
  • 0755-88917743 QQ:2881495751
  • MCP1826T-ADJE/DC图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • MCP1826T-ADJE/DC
  • 数量85000 
  • 厂家MICROCHIP/微芯 
  • 封装SOT223-5 
  • 批号23+ 
  • 真实库存全新原装正品!代理此型号
  • QQ:2881495753QQ:2881495753 复制
  • 0755-23605827 QQ:2881495753
  • MCP1826T-ADJE/DC图
  • 深圳市龙腾新业科技有限公司

     该会员已使用本站17年以上
  • MCP1826T-ADJE/DC
  • 数量16566 
  • 厂家MICROCHIP/微芯 
  • 封装SOT223-5 
  • 批号24+ 
  • 原装原厂 现货现卖
  • QQ:562765057QQ:562765057 复制
    QQ:370820820QQ:370820820 复制
  • 0755-84509636 QQ:562765057QQ:370820820
  • MCP1826T-ADJE/DC图
  • 深圳市中利达电子科技有限公司

     该会员已使用本站11年以上
  • MCP1826T-ADJE/DC
  • 数量10000 
  • 厂家MICROCHIP 
  • 封装SOT-223 
  • 批号24+ 
  • 原装进口现货 假一罚十
  • QQ:1902134819QQ:1902134819 复制
    QQ:2881689472QQ:2881689472 复制
  • 0755-13686833545 QQ:1902134819QQ:2881689472
  • MCP1826T-ADJE/DC图
  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
  • MCP1826T-ADJE/DC
  • 数量3800 
  • 厂家MICROCHIP 
  • 封装SOT-223-6 
  • 批号24+ 
  • 授权分销 现货热卖
  • QQ:1950791264QQ:1950791264 复制
    QQ:2216987084QQ:2216987084 复制
  • 0755-83222787 QQ:1950791264QQ:2216987084
  • MCP1826T-ADJE/DC图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • MCP1826T-ADJE/DC
  • 数量3412 
  • 厂家MROCHIP/微芯 
  • 封装NA/ 
  • 批号23+ 
  • 原装现货,当天可交货,原型号开票
  • QQ:3007977934QQ:3007977934 复制
    QQ:3007947087QQ:3007947087 复制
  • 0755-82546830 QQ:3007977934QQ:3007947087
  • MCP1826T-ADJE/DC图
  • 集好芯城

     该会员已使用本站13年以上
  • MCP1826T-ADJE/DC
  • 数量16566 
  • 厂家MICROCHIP/微芯 
  • 封装SOT223-5 
  • 批号最新批次 
  • 原装原厂 现货现卖
  • QQ:3008092965QQ:3008092965 复制
    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • MCP1826T-ADJE/DC图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • MCP1826T-ADJE/DC
  • 数量19759 
  • 厂家Microchip Technology 
  • 封装SOT-223(5 引线 + 接片) 
  • 批号23+ 
  • 全新原装正品现货热卖
  • QQ:2885348339QQ:2885348339 复制
    QQ:2885348317QQ:2885348317 复制
  • 0755-82519391 QQ:2885348339QQ:2885348317
  • MCP1826T-ADJE/DC图
  • 深圳市宏世佳电子科技有限公司

     该会员已使用本站13年以上
  • MCP1826T-ADJE/DC
  • 数量3577 
  • 厂家Microchip 
  • 封装SOT-223-6 
  • 批号2023+ 
  • 全新原厂原装产品、公司现货销售
  • QQ:2881894392QQ:2881894392 复制
    QQ:2881894393QQ:2881894393 复制
  • 0755-82556029 QQ:2881894392QQ:2881894393
  • MCP1826T-ADJE/DC图
  • 深圳市拓亿芯电子有限公司

     该会员已使用本站12年以上
  • MCP1826T-ADJE/DC
  • 数量15000 
  • 厂家
  • 封装NA 
  • 批号23+ 
  • 代理原装现货价格优势
  • QQ:2103443489QQ:2103443489 复制
    QQ:2924695115QQ:2924695115 复制
  • 0755-82702619 QQ:2103443489QQ:2924695115
  • MCP1826T-ADJE/DC图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • MCP1826T-ADJE/DC
  • 数量11307 
  • 厂家Microchip(微芯) 
  • 封装SOT223-5 
  • 批号23+ 
  • 原厂可订货,技术支持,直接渠道。可签保供合同
  • QQ:3007947087QQ:3007947087 复制
    QQ:3007947087QQ:3007947087 复制
  • 0755-83061789 QQ:3007947087QQ:3007947087
  • MCP1826T-ADJE/DC图
  • 深圳市硅诺电子科技有限公司

     该会员已使用本站8年以上
  • MCP1826T-ADJE/DC
  • 数量49946 
  • 厂家MIC 
  • 封装SOT223-5 
  • 批号17+ 
  • 原厂指定分销商,有意请来电或QQ洽谈
  • QQ:1091796029QQ:1091796029 复制
    QQ:916896414QQ:916896414 复制
  • 0755-82772151 QQ:1091796029QQ:916896414
  • MCP1826T-ADJE/DC图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • MCP1826T-ADJE/DC
  • 数量11530 
  • 厂家Microchip Technology 
  • 封装SOT-223(5引線 + 接頭) 
  • 批号23+ 
  • 全新原装现货热卖
  • QQ:2885348317QQ:2885348317 复制
    QQ:2885348339QQ:2885348339 复制
  • 0755-83209630 QQ:2885348317QQ:2885348339
  • MCP1826T-ADJE/DC图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • MCP1826T-ADJE/DC
  • 数量48248 
  • 厂家Microchip 
  • 封装SOT223-5 
  • 批号2023+ 
  • 绝对原装正品现货,全新深圳原装进口现货
  • QQ:364510898QQ:364510898 复制
    QQ:515102657QQ:515102657 复制
  • 0755-83777708“进口原装正品专供” QQ:364510898QQ:515102657
  • MCP1826T-ADJE/DC图
  • 深圳市宏捷佳电子科技有限公司

     该会员已使用本站12年以上
  • MCP1826T-ADJE/DC
  • 数量15300 
  • 厂家Microchip Technology 
  • 封装SOT-223-6 
  • 批号24+ 
  • 只做原装★真实库存★含13点增值税票!
  • QQ:2353549508QQ:2353549508 复制
    QQ:2885134615QQ:2885134615 复制
  • 0755-83201583 QQ:2353549508QQ:2885134615
  • MCP1826T-ADJE/DC图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • MCP1826T-ADJE/DC
  • 数量8800 
  • 厂家MICROCHIP/微芯 
  • 封装SOT223 
  • 批号新年份 
  • 羿芯诚只做原装,原厂渠道,价格优势可谈!
  • QQ:2853992132QQ:2853992132 复制
  • 0755-82570683 QQ:2853992132
  • MCP1826T-ADJE/DC图
  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • MCP1826T-ADJE/DC
  • 数量9328 
  • 厂家MICROCHIP-微芯 
  • 封装SOT-223-5 
  • 批号▉▉:2年内 
  • ▉▉¥5.4元一有问必回一有长期订货一备货HK仓库
  • QQ:43871025QQ:43871025 复制
  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • MCP1826T-ADJE/DC图
  • 深圳市华芯盛世科技有限公司

     该会员已使用本站13年以上
  • MCP1826T-ADJE/DC
  • 数量865000 
  • 厂家MICROCHIP/微芯 
  • 封装SOT223-5 
  • 批号最新批号 
  • 一级代理,原装特价现货!
  • QQ:2881475757QQ:2881475757 复制
  • 0755-83225692 QQ:2881475757
  • MCP1826T-ADJE/DC图
  • 深圳市凯信扬科技有限公司

     该会员已使用本站7年以上
  • MCP1826T-ADJE/DC
  • 数量8962 
  • 厂家MICROCHIP/微芯 
  • 封装SOT-223 
  • 批号21+ 
  • 保证原装进口,现货库存,特价处理
  • QQ:872328909QQ:872328909 复制
  • 0755-82518059 QQ:872328909
  • MCP1826T-ADJE/DC图
  • 深圳市芯捷微半导体有限公司

     该会员已使用本站1年以上
  • MCP1826T-ADJE/DC
  • 数量35601 
  • 厂家MICROCHIP/微芯 
  • 封装SOT223-5 
  • 批号23+ 
  • 芯捷微原厂原装正品热卖
  • QQ:3004285388QQ:3004285388 复制
  • 16625139831 QQ:3004285388
  • MCP1826T-ADJE/DC图
  • 上海磐岳电子有限公司

     该会员已使用本站11年以上
  • MCP1826T-ADJE/DC
  • 数量5800 
  • 厂家MICROCHIP 
  • 封装SOT-223-5 
  • 批号2024+ 
  • 全新原装现货,杜绝假货。
  • QQ:3003653665QQ:3003653665 复制
    QQ:1325513291QQ:1325513291 复制
  • 021-60341766 QQ:3003653665QQ:1325513291
  • MCP1826T-ADJE/DC图
  • 深圳市中杰盛科技有限公司

     该会员已使用本站14年以上
  • MCP1826T-ADJE/DC
  • 数量9532 
  • 厂家Microchip 
  • 封装SOT-223 
  • 批号24+ 
  • 绝对【★★★】有货
  • QQ:409801605QQ:409801605 复制
  • 0755-22968359 QQ:409801605
  • MCP1826T-ADJE/DC图
  • 深圳市英德州科技有限公司

     该会员已使用本站2年以上
  • MCP1826T-ADJE/DC
  • 数量32000 
  • 厂家Microchip(微芯) 
  • 封装SOT-223-6 
  • 批号2年内 
  • 原厂渠道 长期供应
  • QQ:2355734291QQ:2355734291 复制
  • -0755-88604592 QQ:2355734291
  • MCP1826T-ADJE/DC图
  • 昂富(深圳)电子科技有限公司

     该会员已使用本站4年以上
  • MCP1826T-ADJE/DC
  • 数量54200 
  • 厂家MICROCHIP 
  • 封装SOT-223 
  • 批号24+ 
  • 一站式BOM配单,短缺料找现货,怕受骗,就找昂富电子.
  • QQ:GTY82dX7
  • 0755-23611557【陈妙华 QQ:GTY82dX7
  • MCP1826T-ADJE/DC图
  • 深圳市珩瑞科技有限公司

     该会员已使用本站2年以上
  • MCP1826T-ADJE/DC
  • 数量54200 
  • 厂家MICROCHIP 
  • 封装SOT-223 
  • 批号21+ 
  • ███全新原装正品,支持实单
  • QQ:2938238007QQ:2938238007 复制
    QQ:1840507767QQ:1840507767 复制
  • -0755-82578309 QQ:2938238007QQ:1840507767
  • MCP1826T-ADJE/DC图
  • 深圳市宗天技术开发有限公司

     该会员已使用本站10年以上
  • MCP1826T-ADJE/DC
  • 数量30 
  • 厂家MICROCHIP/微芯 
  • 封装SOT223-5 
  • 批号21+ 
  • 宗天技术 原装现货/假一赔十
  • QQ:444961496QQ:444961496 复制
    QQ:2824256784QQ:2824256784 复制
  • 0755-88601327 QQ:444961496QQ:2824256784
  • MCP1826T-ADJE/DC图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • MCP1826T-ADJE/DC
  • 数量300 
  • 厂家MIC 
  • 封装SOT223-5 
  • 批号21+ 
  • 羿芯诚只做原装 原厂渠道 价格优势
  • QQ:2881498351QQ:2881498351 复制
  • 0755-22968581 QQ:2881498351
  • MCP1826T-ADJE/DC图
  • 北京奥芯威电子技术有限公司

     该会员已使用本站17年以上
  • MCP1826T-ADJE/DC
  • 数量4000 
  • 厂家MICROCHIP 
  • 封装05L SOT-223 
  • 批号24+ 
  • 原厂订货速度快价格优
  • QQ:1148653051QQ:1148653051 复制
    QQ:9528334QQ:9528334 复制
  • 10-82621962 QQ:1148653051QQ:9528334
  • MCP1826T-ADJE/DC图
  • 深圳市湘达电子有限公司

     该会员已使用本站10年以上
  • MCP1826T-ADJE/DC
  • 数量6600 
  • 厂家MICROCHIP/微芯 
  • 封装05LSOT-223 
  • 批号2019+ 
  • 绝对全新原装现货,欢迎来电查询
  • QQ:215672808QQ:215672808 复制
  • 0755-83229772 QQ:215672808
  • MCP1826T-ADJE/DC图
  • 深圳市华来深电子有限公司

     该会员已使用本站13年以上
  • MCP1826T-ADJE/DC
  • 数量8560 
  • 厂家MICROCH 
  • 封装SOT-223 
  • 批号17+ 
  • 受权代理!全新原装现货特价热卖!
  • QQ:1258645397QQ:1258645397 复制
    QQ:876098337QQ:876098337 复制
  • 0755-83238902 QQ:1258645397QQ:876098337
  • MCP1826T-ADJE/DC图
  • 深圳市思诺康科技有限公司

     该会员已使用本站16年以上
  • MCP1826T-ADJE/DC
  • 数量1427 
  • 厂家Microchip Technology 
  • 封装SOT-223-6 
  • 批号23+ 
  • IC-电源管理线性稳压器
  • QQ:2881281130QQ:2881281130 复制
    QQ:2881281133QQ:2881281133 复制
  • 0755-83286481 QQ:2881281130QQ:2881281133
  • MCP1826T-ADJE/DC图
  • 深圳市芯柏然科技有限公司

     该会员已使用本站7年以上
  • MCP1826T-ADJE/DC
  • 数量54200 
  • 厂家MICROCHIP 
  • 封装SOT-223 
  • 批号21+ 
  • 新到现货、一手货源、当天发货、价格低于市场
  • QQ:287673858QQ:287673858 复制
  • 0755-82533534 QQ:287673858
  • MCP1826T-ADJE/DC图
  • 深圳市勤思达科技有限公司

     该会员已使用本站14年以上
  • MCP1826T-ADJE/DC
  • 数量18900 
  • 厂家MICROCHIP/微芯 
  • 封装5SOT-223TR 
  • 批号2019+ 
  • 全新原装正品 现货库存 闪电发货 欢迎咨询
  • QQ:2881239443QQ:2881239443 复制
  • 0755-83268779 QQ:2881239443
  • MCP1826T-ADJE/DC图
  • 深圳市亿智腾科技有限公司

     该会员已使用本站8年以上
  • MCP1826T-ADJE/DC
  • 数量16258 
  • 厂家MICROCHIP 
  • 封装SOT223 
  • 批号1636+ 
  • 全新原装现货★★特价供应★★。★★特价★★假一赔十,工厂客户可放款
  • QQ:799387964QQ:799387964 复制
    QQ:2777237833QQ:2777237833 复制
  • 0755-82566711 QQ:799387964QQ:2777237833
  • MCP1826T-ADJE/DC图
  • 万三科技(深圳)有限公司

     该会员已使用本站2年以上
  • MCP1826T-ADJE/DC
  • 数量660000 
  • 厂家Microchip Technology 
  • 封装原厂原装 
  • 批号23+ 
  • 支持实单/只做原装
  • QQ:3008961398QQ:3008961398 复制
  • 0755-21006672 QQ:3008961398
  • MCP1826T-ADJE/DC图
  • 深圳市隆鑫创展电子有限公司

     该会员已使用本站15年以上
  • MCP1826T-ADJE/DC
  • 数量30000 
  • 厂家TI 
  • 封装SOT23 
  • 批号2022+ 
  • 电子元器件一站式配套服务QQ:122350038
  • QQ:2355878626QQ:2355878626 复制
    QQ:2850299242QQ:2850299242 复制
  • 0755-82812278 QQ:2355878626QQ:2850299242
  • MCP1826T-ADJE/DC图
  • 万三科技(深圳)有限公司

     该会员已使用本站2年以上
  • MCP1826T-ADJE/DC
  • 数量6500000 
  • 厂家微芯 
  • 封装原厂原装 
  • 批号22+ 
  • 万三科技 秉承原装 实单可议
  • QQ:3008961396QQ:3008961396 复制
  • 0755-21008751 QQ:3008961396

产品型号MCP1826T-ADJE/DC的概述

芯片 MCP1826T-ADJE/DC 概述 MCP1826T-ADJE/DC 是一款高度集成的低压降(LDO)线性稳压器,适用于各种电子设备中,尤其是在那些对电源管理要求较为敏感的应用场合。这款芯片由Microchip Technology Inc. 制造,专为满足高功率快速响应需求而设计,具有稳定性好和低噪声的特点。 MCP1826T-ADJE/DC 的工作输入电压范围广,适用于从电池供电到高效能电源管理等多种应用。该芯片不仅提供高达 1.0A 的输出电流,还具备低速率的静态电流,能够在常见供电场合下显著延长设备的电池寿命。此外,它的输出电压调整范围广泛,可以根据用户的需求进行调节。 芯片 MCP1826T-ADJE/DC 的详细参数 在技术参数方面,MCP1826T-ADJE/DC 的主要规格包括: - 输入电压范围:2.2V至20V - 输出电压范围:可调(1.2V至12V),...

产品型号MCP1826T-ADJE/ET的Datasheet PDF文件预览

MCP1826/MCP1826S  
1000 mA, Low Voltage, Low Quiescent Current  
LDO Regulator  
Features  
Description  
• 1000 mA Output Current Capability  
The MCP1826/MCP1826S is a 1000 mA Low Dropout  
(LDO) linear regulator that provides high current and  
low output voltages. The MCP1826 comes in a fixed or  
adjustable output voltage version, with an output  
voltage range of 0.8V to 5.0V. The 1000 mA output cur-  
rent capability, combined with the low output voltage  
capability, make the MCP1826 a good choice for new  
sub-1.8V output voltage LDO applications that have  
high current demands. The MCP1826S is a 3-pin fixed  
voltage version.  
• Input Operating Voltage Range: 2.3V to 6.0V  
• Adjustable Output Voltage Range: 0.8V to 5.0V  
(MCP1826 only)  
• Standard Fixed Output Voltages:  
- 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V  
• Other Fixed Output Voltage Options Available  
Upon Request  
• Low Dropout Voltage: 250 mV Typical at 1000 mA  
• Typical Output Voltage Tolerance: 0.5%  
• Stable with 1.0 µF Ceramic Output Capacitor  
• Fast response to Load Transients  
The MCP1826/MCP1826S is stable using ceramic  
output capacitors that inherently provide lower output  
noise and reduce the size and cost of the entire  
regulator solution. Only 1 µF of output capacitance is  
needed to stabilize the LDO.  
• Low Supply Current: 120 µA (typ)  
• Low Shutdown Supply Current: 0.1 µA (typ)  
(MCP1826 only)  
Using CMOS construction, the quiescent current  
consumed by the MCP1826/MCP1826S is typically  
less than 120 µA over the entire input voltage range,  
making it attractive for portable computing applications  
that demand high output current. The MCP1826  
versions have a Shutdown (SHDN) pin. When shut  
down, the quiescent current is reduced to less than  
0.1 µA.  
• Fixed Delay on Power Good Output  
(MCP1826 only)  
• Short Circuit Current Limiting and  
Overtemperature Protection  
• TO-263-5 (DDPAK-5), TO-220-5, SOT-223-5  
Package Options (MCP1826).  
• TO-263-3 (DDPAK-3), TO-220-3, SOT-223-3  
Package Options (MCP1826S).  
On the MCP1826 fixed output versions the scaled-  
down output voltage is internally monitored and a  
power good (PWRGD) output is provided when the  
output is within 92% of regulation (typical). The  
PWRGD delay is internally fixed at 200 µs (typical).  
Applications  
• High-Speed Driver Chipset Power  
• Networking Backplane Cards  
• Notebook Computers  
The overtemperature and short circuit current-limiting  
provide additional protection for the LDO during system  
fault conditions.  
• Network Interface Cards  
• Palmtop Computers  
• 2.5V to 1.XV Regulators  
© 2007 Microchip Technology Inc.  
DS22057A-page 1  
MCP1826/MCP1826S  
Package Types  
MCP1826  
MCP1826S  
DDPAK-5  
TO-220-5  
Fixed/Adjustable  
DDPAK-3  
TO-220-3  
1
2
3
1
2
3
1
2 3 4 5  
1 2 3 4 5  
SOT-223-5  
SOT-223-3  
6
4
2
1
3
1
2
4
3
5
Pin  
Pin  
Fixed  
Adjustable  
1
2
3
4
VIN  
1
2
3
4
5
6
SHDN  
VIN  
SHDN  
VIN  
GND (TAB)  
VOUT  
GND (TAB)  
VOUT  
GND (TAB)  
VOUT  
GND (TAB)  
PWRGD  
GND (TAB)  
ADJ  
GND (TAB)  
DS22057A-page 2  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
Typical Application  
MCP1826 Fixed Output Voltage  
PWRGD  
R1  
100 kΩ  
On  
SHDN  
VIN  
Off  
1
VOUT = 1.8V @ 1000 mA  
VOUT  
VIN = 2.3V to 2.8V  
GND  
C1  
C2  
1 µF  
4.7 µF  
MCP1826 Adjustable Output Voltage  
VADJ  
R2  
20 kΩ  
R1  
40 kΩ  
On  
SHDN  
VIN  
Off  
1
VOUT = 1.2V @ 1000 mA  
VOUT  
VIN = 2.3V to 2.8V  
C1  
4.7 µF  
C2  
1 µF  
GND  
© 2007 Microchip Technology Inc.  
DS22057A-page 3  
MCP1826/MCP1826S  
Functional Block Diagram - Adjustable Output  
PMOS  
VIN  
VOUT  
Undervoltage  
Lock Out  
(UVLO)  
ISNS  
Cf  
Rf  
SHDN  
ADJ/SENSE  
+
Driver w/limit  
and SHDN  
EA  
Overtemperature  
Sensing  
SHDN  
VREF  
V
IN  
Reference  
SHDN  
Soft-Start  
Comp  
TDELAY  
GND  
92% of VREF  
DS22057A-page 4  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
Functional Block Diagram - Fixed Output (3-Pin)  
PMOS  
VIN  
VOUT  
Undervoltage  
Lock Out  
Sense  
(UVLO)  
ISNS  
Cf  
Rf  
SHDN  
+
Driver w/limit  
and SHDN  
EA  
Overtemperature  
Sensing  
SHDN  
VREF  
V
IN  
Reference  
SHDN  
Soft-Start  
Comp  
TDELAY  
GND  
92% of VREF  
© 2007 Microchip Technology Inc.  
DS22057A-page 5  
MCP1826/MCP1826S  
Functional Block Diagram - Fixed Output (5-Pin)  
PMOS  
VIN  
VOUT  
Undervoltage  
Lock Out  
Sense  
(UVLO)  
ISNS  
Cf  
Rf  
SHDN  
+
Driver w/limit  
and SHDN  
EA  
Overtemperature  
Sensing  
SHDN  
VREF  
V
IN  
Reference  
SHDN  
Soft-Start  
PWRGD  
TDELAY  
Comp  
GND  
92% of VREF  
DS22057A-page 6  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
† Notice: Stresses above those listed under “Maximum Rat-  
ings” may cause permanent damage to the device. This is a  
stress rating only and functional operation of the device at  
those or any other conditions above those indicated in the  
operational listings of this specification is not implied. Expo-  
sure to maximum rating conditions for extended periods may  
affect device reliability.  
1.0  
ELECTRICAL  
CHARACTERISTICS  
Absolute Maximum Ratings †  
VIN....................................................................................6.5V  
Maximum Voltage on Any Pin .. (GND – 0.3V) to (VDD + 0.3)V  
Maximum Power Dissipation......... Internally-Limited (Note 6)  
Output Short Circuit Duration................................Continuous  
Storage temperature .....................................-65°C to +150°C  
Maximum Junction Temperature, TJ ...........................+150°C  
ESD protection on all pins (HBM/MM) ........... ≥ 4 kV; 300V  
AC/DC CHARACTERISTICS  
Electrical Specifications: Unless otherwise noted, VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, VR=1.8V for Adjustable Output,  
OUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.  
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C  
I
Parameters  
Sym  
Min  
Typ  
Max  
Units  
Conditions  
Input Operating Voltage  
Input Quiescent Current  
VIN  
Iq  
2.3  
6.0  
V
Note 1  
120  
0.1  
220  
µA  
IL = 0 mA, VOUT = 0.8V to  
5.0V  
Input Quiescent Current for  
SHDN Mode  
ISHDN  
IOUT  
1000  
3
µA  
mA  
%/V  
%
SHDN = GND  
Maximum Output Current  
VIN = 2.3V to 6.0V  
V
R = 0.8V to 5.0V, Note 1  
Line Regulation  
ΔVOUT  
(VOUT x ΔVIN  
/
±0.05  
±0.5  
2.2  
±0.20  
1.0  
(Note 1) VIN 6V  
)
Load Regulation  
ΔVOUT/VOUT  
-1.0  
IOUT = 1 mA to 1000 mA,  
(Note 4)  
Output Short Circuit Current  
IOUT_SC  
A
RLOAD < 0.1Ω, Peak Current  
Adjust Pin Characteristics (Adjustable Output Only)  
Adjust Pin Reference Voltage  
VADJ  
0.402  
0.410  
0.418  
V
VIN = 2.3V to VIN = 6.0V,  
I
OUT = 1 mA  
Adjust Pin Leakage Current  
IADJ  
-10  
±0.01  
40  
+10  
nA  
VIN = 6.0V, VADJ = 0V to 6V  
Adjust Temperature Coefficient  
TCVOUT  
ppm/°C Note 3  
Fixed-Output Characteristics (Fixed Output Only)  
Voltage Regulation VOUT  
VR - 2.5% VR ±0.5% VR + 2.5%  
V
Note 2  
Note 1: The minimum VIN must meet two conditions: VIN 2.3V and VIN VOUT(MAX) + VDROPOUT(MAX).  
2: VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output  
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.  
3: TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the  
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.  
4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is  
tested over a load range from 1 mA to the maximum specified output current.  
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its  
nominal value that was measured with an input voltage of VIN = VOUT(MAX) + VDROPOUT(MAX)  
.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction  
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power  
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained  
junction temperatures above 150°C can impact device reliability.  
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the  
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the  
ambient temperature is not significant.  
© 2007 Microchip Technology Inc.  
DS22057A-page 7  
MCP1826/MCP1826S  
AC/DC CHARACTERISTICS (CONTINUED)  
Electrical Specifications: Unless otherwise noted, VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, VR=1.8V for Adjustable Output,  
I
OUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.  
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C  
Parameters  
Sym  
Min  
Typ  
Max  
400  
Units  
Conditions  
Dropout Characteristics  
Dropout Voltage  
VDROPOUT  
250  
mV  
Note 5, IOUT = 1000 mA,  
V
IN(MIN) = 2.3V  
Power Good Characteristics  
PWRGD Input Voltage Operat-  
ing Range  
VPWRGD_VIN  
1.0  
6.0  
V
TA = +25°C  
1.2  
6.0  
TA = -40°C to +125°C  
For VIN < 2.3V, ISINK = 100 µA  
PWRGD Threshold Voltage  
VPWRGD_TH  
%VOUT Falling Edge  
VOUT < 2.5V Fixed,  
OUT = Adj.  
(Referenced to VOUT  
)
89  
92  
95  
V
90  
1.0  
92  
2.0  
0.2  
94  
3.0  
0.4  
VOUT >= 2.5V Fixed  
PWRGD Threshold Hysteresis  
PWRGD Output Voltage Low  
VPWRGD_HYS  
VPWRGD_L  
%VOUT  
V
IPWRGD SINK = 1.2 mA,  
ADJ = 0V  
PWRGD Leakage  
PWRGD  
_
1
nA  
µs  
VPWRGD = VIN = 6.0V  
Rising Edge  
LK  
PWRGD Time Delay  
TPG  
125  
RPULLUP = 10 kΩ  
Detect Threshold to PWRGD  
Active Time Delay  
TVDET-PWRGD  
200  
µs  
VOUT = VPWRGD_TH + 20 mV  
to VPWRGD_TH - 20 mV  
Shutdown Input  
Logic High Input  
VSHDN-HIGH  
VSHDN-LOW  
SHDNILK  
45  
15  
%VIN  
%VIN  
µA  
VIN = 2.3V to 6.0V  
VIN = 2.3V to 6.0V  
Logic Low Input  
SHDN Input Leakage Current  
-0.1  
±0.001  
+0.1  
VIN = 6V, SHDN =VIN  
SHDN = GND  
,
AC Performance  
Output Delay From SHDN  
TOR  
eN  
100  
2.0  
µs  
SHDN = GND to VIN  
V
OUT = GND to 95% VR  
µV/Hz IOUT = 200 mA, f = 1 kHz,  
OUT = 10 µF (X7R Ceramic),  
OUT = 2.5V  
Output Noise  
C
V
Note 1: The minimum VIN must meet two conditions: VIN 2.3V and VIN VOUT(MAX) + VDROPOUT(MAX).  
2: VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output  
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.  
3: TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the  
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.  
4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is  
tested over a load range from 1 mA to the maximum specified output current.  
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its  
nominal value that was measured with an input voltage of VIN = VOUT(MAX) + VDROPOUT(MAX)  
.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction  
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power  
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained  
junction temperatures above 150°C can impact device reliability.  
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the  
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the  
ambient temperature is not significant.  
DS22057A-page 8  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
AC/DC CHARACTERISTICS (CONTINUED)  
Electrical Specifications: Unless otherwise noted, VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, VR=1.8V for Adjustable Output,  
OUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.  
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C  
I
Parameters  
Sym  
Min  
Typ  
Max  
Units  
Conditions  
Power Supply Ripple Rejection  
Ratio  
PSRR  
60  
dB  
f = 100 Hz, COUT = 4.7 µF,  
I
OUT = 100 µA,  
INAC = 100 mV pk-pk,  
IN = 0 µF  
V
C
Thermal Shutdown Temperature  
Thermal Shutdown Hysteresis  
TSD  
150  
10  
°C  
°C  
IOUT = 100 µA, VOUT = 1.8V,  
IN = 2.8V  
V
ΔTSD  
IOUT = 100 µA, VOUT = 1.8V,  
IN = 2.8V  
V
Note 1: The minimum VIN must meet two conditions: VIN 2.3V and VIN VOUT(MAX) + VDROPOUT(MAX).  
2: VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output  
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.  
3: TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the  
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.  
4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is  
tested over a load range from 1 mA to the maximum specified output current.  
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its  
nominal value that was measured with an input voltage of VIN = VOUT(MAX) + VDROPOUT(MAX)  
.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction  
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power  
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained  
junction temperatures above 150°C can impact device reliability.  
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the  
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the  
ambient temperature is not significant.  
TEMPERATURE SPECIFICATIONS  
Parameters  
Temperature Ranges  
Sym  
Min  
Typ  
Max  
Units  
Conditions  
Operating Junction Temperature Range  
Maximum Junction Temperature  
Storage Temperature Range  
TJ  
TJ  
TA  
-40  
+125  
+150  
+150  
°C  
°C  
°C  
Steady State  
Transient  
-65  
Thermal Package Resistances  
Thermal Resistance, 3L-DDPAK  
θJA  
θJC  
θJA  
θJC  
θJA  
θJC  
θJA  
θJC  
θJA  
θJC  
θJA  
θJC  
31.4  
3.0  
°C/W 4-Layer JC51 Standard  
Board  
°C/W  
Thermal Resistance, 3L-TO-220  
Thermal Resistance, 3L-SOT-223  
Thermal Resistance, 5L-DDPAK  
Thermal Resistance, 5L-TO-220  
Thermal Resistance, 5L-SOT-223  
29.4  
2.0  
°C/W 4-Layer JC51 Standard  
Board  
°C/W  
62  
°C/W EIA/JEDEC JESD51-751-7  
4 Layer Board  
15.0  
31.2  
3.0  
°C/W  
°C/W 4-Layer JC51 Standard  
Board  
°C/W  
29.3  
2.0  
°C/W 4-Layer JC51 Standard  
Board  
°C/W  
62  
°C/W EIA/JEDEC JESD51-751-7  
4 Layer Board  
15.0  
°C/W  
© 2007 Microchip Technology Inc.  
DS22057A-page 9  
MCP1826/MCP1826S  
2.0  
TYPICAL PERFORMANCE CURVES  
Note:  
The graphs and tables provided following this note are a statistical summary based on a limited number of  
samples and are provided for informational purposes only. The performance characteristics listed herein  
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified  
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.  
Note: Unless otherwise indicated, COUT = 4.7 µF Ceramic (X7R), CIN = 4.7 µF Ceramic (X7R), IOUT = 1 mA,  
Temperature = +25°C, VIN = VOUT + 0.6V, Fixed output.  
0.10  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
140  
130  
120  
110  
100  
90  
VOUT = 1.2V Adj  
OUT = 0 mA  
IOUT = 1 mA  
VOUT = 1.2V Adj  
VIN = 2.3V to 6.0V  
I
IOUT = 100 mA  
130°C  
130°C  
IOUT = 50 mA  
+90°C  
+90°C  
+25°C  
+25°C  
IOUT = 250 mA  
0°C  
-45°C  
IOUT = 1000 mA  
80  
-45  
-20  
5
30  
55  
80  
105  
130  
2
3
4
Input Voltage (V)  
5
6
Temperature (°C)  
FIGURE 2-1:  
Quiescent Current vs. Input  
FIGURE 2-4:  
Line Regulation vs.  
Voltage (Adjustable Version).  
Temperature (Adjustable Version).  
0.15  
180  
170  
160  
IOUT = 1.0 mA to 1000 mA  
VOUT = 1.2V Adj  
VOUT = 3.3V  
0.10  
0.05  
150  
VOUT = 1.8V  
VOUT = 5.0V  
VIN = 5.0V  
140  
0.00  
VIN = 3.3V  
VOUT = 0.8V  
130  
120  
-0.05  
-0.10  
-0.15  
110  
100  
VIN = 2.3V  
0
250  
500  
Load Current (mA)  
750  
1000  
-45  
-20  
5
30  
55  
80  
105  
130  
Temperature (°C)  
FIGURE 2-2:  
Ground Current vs. Load  
FIGURE 2-5:  
Load Regulation vs.  
Current (Adjustable Version).  
Temperature (Adjustable Version).  
140  
0.411  
VOUT = 1.2V  
OUT = 1.0 mA  
VOUT = 1.2V Adj  
OUT = 0 mA  
135  
130  
125  
120  
115  
110  
105  
100  
95  
VIN = 6.0V  
VIN = 5.0V  
I
I
0.410  
0.409  
0.408  
0.407  
0.406  
VIN = 5.0V  
VIN = 2.3V  
VIN = 5.0V  
VIN = 4.0V  
VIN = 3.0V  
30  
VIN = 2.3V  
5
90  
85  
-45  
-20  
55  
80  
105  
130  
-45  
-20  
5
30  
55  
80  
105 130  
Temperature (°C)  
Temperature (°C)  
FIGURE 2-3:  
Quiescent Current vs.  
FIGURE 2-6:  
Adjust Pin Voltage vs.  
Junction Temperature (Adjustable Version).  
Temperature (Adjustable Version).  
DS22057A-page 10  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
Note: Unless otherwise indicated, COUT = 4.7 µF Ceramic (X7R), CIN = 4.7 µF Ceramic (X7R), IOUT = 1 mA,  
Temperature = +25°C, VIN = VOUT + 0.6V, Fixed output.  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
150  
140  
130  
120  
110  
100  
90  
VOUT = 0.8V  
IOUT = 0 mA  
VOUT = 5.0V Adj  
+130°C  
+90°C  
VOUT = 2.5V Adj  
+25°C  
0°C  
-45°C  
0
200  
400  
600  
800  
1000  
2
3
4
5
6
Load Current (mA)  
Input Voltage (V)  
FIGURE 2-7:  
Dropout Voltage vs. Load  
FIGURE 2-10:  
Quiescent Current vs. Input  
Current (Adjustable Version).  
Voltage.  
0.34  
0.31  
150  
140  
IOUT = 1.0A  
VOUT = 2.5V  
IOUT = 0 mA  
130  
+130°C  
VOUT = 5.0V Adj  
0.28  
+90°C  
120  
110  
100  
90  
+25°C  
C  
0.25  
VOUT = 2.5V Adj  
-45°C  
0.22  
0.19  
80  
-45  
-20  
5
30  
55  
80  
105  
130  
3
3.5  
4
4.5  
5
5.5  
6
Temperature (°C)  
Input Voltage (V)  
FIGURE 2-8:  
Dropout Voltage vs.  
FIGURE 2-11:  
Quiescent Current vs. Input  
Temperature (Adjustable Version).  
Voltage.  
170.0000  
VOUT = 2.5V  
200  
VIN = 2.3V for VR=0.8V  
VIN = 3.9V for VR=3.3V  
IOUT= 0 mA  
160.0000  
150.0000  
140.0000  
130.0000  
120.0000  
110.0000  
100.0000  
180  
160  
140  
120  
100  
80  
VIN = 6.0V  
VOUT=3.3V  
VOUT=0.8V  
VIN = 5.0V  
VIN = 3.9V  
VIN = 3.1V  
60  
-45 -20  
5
30  
55  
80 105 130  
0
250  
500  
Load Current (mA)  
750  
1000  
Temperature (°C)  
FIGURE 2-9:  
Power Good (PWRGD)  
FIGURE 2-12:  
Ground Current vs. Load  
Time Delay vs. Temperature.  
Current.  
© 2007 Microchip Technology Inc.  
DS22057A-page 11  
MCP1826/MCP1826S  
Note: Unless otherwise indicated, COUT = 4.7 µF Ceramic (X7R), CIN = 4.7 µF Ceramic (X7R), IOUT = 1 mA,  
Temperature = +25°C, VIN = VOUT + 0.6V, Fixed output.  
130  
125  
120  
115  
110  
105  
100  
95  
0.040  
0.035  
0.030  
0.025  
0.020  
0.015  
VR = 2.5V  
IN = 3.1 to 6.0V  
IOUT = 0 mA  
V
IOUT = 1 mA  
IOUT = 50 mA  
IOUT = 250 mA  
VOUT = 2.5V  
IOUT = 1000 mA  
VOUT = 0.8V  
IOUT = 500 mA  
90  
-45  
-20  
5
30  
55  
80  
105  
130  
-45  
-20  
5
30  
55  
80  
105  
130  
Temperature (°C)  
Temperature (°C)  
FIGURE 2-13:  
Quiescent Current vs.  
FIGURE 2-16:  
Line Regulation vs.  
Temperature.  
Temperature.  
0.50  
0.40  
0.30  
0.20  
0.10  
0.00  
-0.10  
-0.20  
-0.30  
VR = 0.8V  
VOUT = 0.8V  
IN = 2.3V  
IOUT = 1 mA to 1000 mA  
V
VIN = 4.0V  
0.30  
0.20  
0.10  
0.00  
VIN = 6.0V  
VIN = 5.0V  
VIN = 3.0V  
VIN = 2.3V  
-45  
-20  
5
30  
55  
80  
105  
130  
-45  
-20  
5
30  
55  
80  
105  
130  
Temperature (°C)  
Temperature (°C)  
FIGURE 2-14:  
I
vs. Temperature.  
FIGURE 2-17:  
Temperature (V  
Load Regulation vs.  
< 2.5V Fixed).  
SHDN  
OUT  
0.10  
0.00  
-0.05  
-0.10  
-0.15  
-0.20  
-0.25  
-0.30  
-0.35  
-0.40  
VOUT = 0.8V  
IOUT = 1 mA  
IOUT = 1 mA to 1000 mA  
VIN = 2.3V to 6.0V  
0.08  
0.06  
0.04  
0.02  
0.00  
VOUT = 2.5V  
IOUT = 50 mA  
IOUT = 100 mA  
VOUT = 5.0V  
IOUT = 1A  
IOUT = 500mA  
-45  
-20  
5
30  
55  
80  
105  
130  
-45  
-20  
5
30  
55  
80  
105  
130  
Temperature (°C)  
Temperature (°C)  
FIGURE 2-15:  
Temperature.  
Line Regulation vs.  
FIGURE 2-18:  
Temperature (V  
Load Regulation vs.  
2.5V Fixed).  
OUT  
DS22057A-page 12  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
Note: Unless otherwise indicated, COUT = 4.7 µF Ceramic (X7R), CIN = 4.7 µF Ceramic (X7R), IOUT = 1 mA,  
Temperature = +25°C, VIN = VOUT + 0.6V, Fixed output.  
0.30  
10.000  
VR=0.8V, VIN=2.3V  
VR=3.3V, VIN=4.1V  
COUT=1 μF ceramic X7R  
CIN=10 μF ceramic  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
VOUT = 2.5V  
1.000  
0.100  
0.010  
IOUT=200 mA  
VOUT = 5.0V  
0
200  
400  
600  
800  
1000  
0.01  
0.1  
1
10  
100  
1000  
Frequency (kHz)  
Load Current (mA)  
FIGURE 2-19:  
Dropout Voltage vs. Load  
FIGURE 2-22:  
Output Noise Voltage  
Current.  
Density vs. Frequency.  
0.34  
0.32  
0.30  
0.28  
0.26  
0.24  
0.22  
0.20  
0
-10  
-20  
-30  
-40  
IOUT = 1000 mA  
VOUT = 2.5V  
VR=1.2V Adj  
C
OUT=10 μF ceramic X7R  
-50  
-60  
-70  
-80  
VOUT = 5.0V  
VIN=3.1V  
C
IN=0 μF  
I
OUT=10 mA  
-45  
-20  
5
30  
55  
80  
105  
130  
0.01  
0.1  
1
10  
100  
1000  
Frequency (kHz)  
Temperature (°C)  
FIGURE 2-20:  
Dropout Voltage vs.  
FIGURE 2-23:  
Power Supply Ripple  
Temperature.  
Rejection (PSRR) vs. Frequency (Adjustable).  
0
-10  
-20  
-30  
2.00  
1.80  
1.60  
1.40  
1.20  
1.00  
0.80  
0.60  
0.40  
0.20  
0.00  
0
VOUT = 0.8V  
-40  
VR=3.3V Fixed  
C
V
C
I
OUT=22 μF ceramic X7R  
IN=3.9V  
IN=0 μF  
OUT=10 mA  
-50  
-60  
-70  
-80  
1
2
3
4
5
6
0.01  
0.1  
1
10  
100  
1000  
Input Voltage (V)  
Frequency (kHz)  
FIGURE 2-21:  
Short Circuit Current vs.  
FIGURE 2-24:  
Power Supply Ripple  
Input Voltage.  
Rejection (PSRR) vs. Frequency.  
© 2007 Microchip Technology Inc.  
DS22057A-page 13  
MCP1826/MCP1826S  
.Note: Unless otherwise indicated, COUT = 4.7 µF Ceramic (X7R), CIN = 4.7 µF Ceramic (X7R), IOUT = 1 mA,  
Temperature = +25°C, VIN = VOUT + 0.6V, Fixed output.  
FIGURE 2-25:  
2.5V (Adj.) Startup from V .  
FIGURE 2-28:  
Dynamic Line Response.  
IN  
FIGURE 2-26:  
2.5V (Adj.) Startup from  
FIGURE 2-29:  
Dynamic Load Response  
Shutdown.  
(10 mA to 1000 mA).  
FIGURE 2-27:  
Timing.  
Power Good (PWRGD)  
FIGURE 2-30:  
(100 mA to 1000 mA).  
Dynamic Load Response  
DS22057A-page 14  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
3.0  
PIN DESCRIPTION  
The descriptions of the pins are listed in Table 3-1.  
TABLE 3-1:  
PIN FUNCTION TABLE  
3-Pin Fixed  
Output  
5-Pin Fixed  
Output  
Adjustable  
Output  
Name  
Description  
1
2
1
2
SHDN  
VIN  
Shutdown Control Input (active-low)  
Input Voltage Supply  
1
2
3
3
GND  
VOUT  
PWRGD  
ADJ  
Ground  
3
4
4
Regulated Output Voltage  
Power Good Output  
5
5
Voltage Adjust/Sense Input  
Exposed Pad of the Package (ground potential)  
Exposed Pad Exposed Pad Exposed Pad  
EP  
3.1  
Shutdown Control Input (SHDN)  
3.5  
Power Good Output (PWRGD)  
The SHDN input is used to turn the LDO output voltage  
on and off. When the SHDN input is at a logic-high  
level, the LDO output voltage is enabled. When the  
SHDN input is pulled to a logic-low level, the LDO  
output voltage is disabled. When the SHDN input is  
pulled low, the PWRGD output also goes low and the  
LDO enters a low quiescent current shutdown state  
where the typical quiescent current is 0.1 µA.  
The PWRGD output is an open-drain output used to  
indicate when the LDO output voltage is within 92%  
(typically) of its nominal regulation value. The PWRGD  
threshold has a typical hysteresis value of 2%. The  
PWRGD output is delayed by 200 µs (typical) from the  
time the LDO output is within 92% + 3% (max hystere-  
sis) of the regulated output value on power-up. This  
delay time is internally fixed.  
3.2  
Input Voltage Supply (VIN)  
3.6  
Output Voltage Adjust Input (ADJ)  
Connect the unregulated or regulated input voltage  
source to VIN. If the input voltage source is located  
several inches away from the LDO, or the input source  
is a battery, it is recommended that an input capacitor  
be used. A typical input capacitance value of 1 µF to  
10 µF should be sufficient for most applications.  
For adjustable applications, the output voltage is  
connected to the ADJ input through a resistor divider  
that sets the output voltage regulation value. This  
provides the user the capability to set the output  
voltage to any value they desire within the 0.8V to 5.0V  
range of the device.  
3.7  
Exposed Pad (EP)  
3.3  
Ground (GND)  
The DDPAK and TO-220 package have an exposed tab  
on the package. A heat sink may may be mount to the  
tab to aid in the removal of heat from the package  
during operation. The exposed tab is at the ground  
potential of the LDO.  
Connect the GND pin of the LDO to a quiet circuit  
ground. This will help the LDO power supply rejection  
ratio and noise performance. The ground pin of the  
LDO only conducts the quiescent current of the LDO  
(typically 120 µA), so a heavy trace is not required.  
For applications have switching or noisy inputs tie the  
GND pin to the return of the output capacitor. Ground  
planes help lower inductance and voltage spikes  
caused by fast transient load currents and are  
recommended for applications that are subjected to  
fast load transients.  
3.4  
Regulated Output Voltage (VOUT)  
The VOUT pin is the regulated output voltage of the  
LDO. A minimum output capacitance of 1.0 µF is  
required for LDO stability. The MCP1826/MCP1826S is  
stable with ceramic, tantalum and aluminum-electro-  
lytic capacitors. See Section 4.3 “Output Capacitor”  
for output capacitor selection guidance.  
© 2007 Microchip Technology Inc.  
DS22057A-page 15  
MCP1826/MCP1826S  
EQUATION 4-2:  
R1 = R2  
4.0  
DEVICE OVERVIEW  
VOUT VADJ  
--------------------------------  
VADJ  
The MCP1826/MCP1826S is a high output current,  
Low Dropout (LDO) voltage regulator. The low dropout  
voltage of 300 mV typical at 1000 mA of current makes  
it ideal for battery-powered applications. Unlike other  
high output current LDOs, the MCP1826/MCP1826S  
only draws a maximum of 220 µA of quiescent current.  
The MCP1826 has a shutdown control input and a  
power good output.  
Where:  
VOUT  
VADJ  
=
=
LDO Output Voltage  
ADJ Pin Voltage  
(typically 0.41V)  
4.2  
Output Current and Current  
Limiting  
4.1  
LDO Output Voltage  
The 5-pin MCP1826 LDO is available with either a fixed  
output voltage or an adjustable output voltage. The  
output voltage range is 0.8V to 5.0V for both versions.  
The 3-pin MCP1826S LDO is available as a fixed  
voltage device.  
The MCP1826/MCP1826S LDO is tested and ensured  
to supply a minimum of 1000 mA of output current. The  
MCP1826/MCP1826S has no minimum output load, so  
the output load current can go to 0 mA and the LDO will  
continue to regulate the output voltage to within  
tolerance.  
4.1.1  
ADJUST INPUT  
The MCP1826/MCP1826S also incorporates an output  
current limit. If the output voltage falls below 0.7V due  
to an overload condition (usually represents a shorted  
load condition), the output current is limited to 2.2A  
(typical). If the overload condition is a soft overload, the  
MCP1826/MCP1826S will supply higher load currents  
of up to 2.5A. The MCP1826/MCP1826S should not be  
operated in this condition continuously as it may result  
in failure of the device. However, this does allow for  
device usage in applications that have higher pulsed  
load currents having an average output current value of  
1000 mA or less.  
The adjustable version of the MCP1826 uses the ADJ  
pin (pin 5) to get the output voltage feedback for output  
voltage regulation. This allows the user to set the  
output voltage of the device with two external resistors.  
The nominal voltage for ADJ is 0.41V.  
Figure 4-1 shows the adjustable version of the  
MCP1826. Resistors R1 and R2 form the resistor  
divider network necessary to set the output voltage.  
With this configuration, the equation for setting VOUT is:  
EQUATION 4-1:  
Output overload conditions may also result in an over-  
temperature shutdown of the device. If the junction  
temperature rises above 150°C, the LDO will shut  
down the output voltage. See Section 4.8 “Overtem-  
perature Protection” for more information on  
overtemperature shutdown.  
R1 + R2  
------------------  
VOUT = VADJ  
R2  
Where:  
VOUT  
VADJ  
=
=
LDO Output Voltage  
ADJ Pin Voltage  
(typically 0.41V)  
4.3  
Output Capacitor  
The MCP1826/MCP1826S requires a minimum output  
capacitance of 1 µF for output voltage stability. Ceramic  
capacitors are recommended because of their size,  
cost and environmental robustness qualities.  
MCP1826-ADJ  
V
OUT  
On  
R
1
C2  
1 µF  
1
3
2 4  
5
Off  
SHDN  
Aluminum-electrolytic and tantalum capacitors can be  
used on the LDO output as well. The Equivalent Series  
Resistance (ESR) of the electrolytic output capacitor  
must be no greater than 1 ohm. The output capacitor  
should be located as close to the LDO output as is  
practical. Ceramic materials X7R and X5R have low  
temperature coefficients and are well within the  
acceptable ESR range required. A typical 1 µF X7R  
0805 capacitor has an ESR of 50 milli-ohms.  
ADJ  
V
IN  
C
R
1
2
GND  
4.7 µF  
FIGURE 4-1:  
Typical adjustable output  
voltage application circuit.  
The allowable resistance value range for resistor R2 is  
from 10 kΩ to 200 kΩ. Solving the equation for R1  
yields the following equation:  
Larger LDO output capacitors can be used with the  
MCP1826/MCP1826S  
to  
improve  
dynamic  
performance and power supply ripple rejection  
performance. A maximum of 22 µF is recommended.  
Aluminum-electrolytic capacitors are not recom-  
mended for low-temperature applications of 25°C.  
DS22057A-page 16  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
4.4  
Input Capacitor  
Low input source impedance is necessary for the LDO  
output to operate properly. When operating from  
batteries, or in applications with long lead length  
(> 10 inches) between the input source and the LDO,  
some input capacitance is recommended. A minimum  
of 1.0 µF to 4.7 µF is recommended for most  
applications.  
V
PWRGD_TH  
V
OUT  
T
PG  
V
OH  
T
VDET_PWRGD  
For applications that have output step load  
requirements, the input capacitance of the LDO is very  
important. The input capacitance provides the LDO  
with a good local low-impedance source to pull the  
transient currents from in order to respond quickly to  
the output load step. For good step response  
performance, the input capacitor should be of  
equivalent (or higher) value than the output capacitor.  
The capacitor should be placed as close to the input of  
the LDO, as is practical. Larger input capacitors will  
also help reduce any high-frequency noise on the input  
and output of the LDO and reduce the effects of any  
inductance that exists between the input source  
voltage and the input capacitance of the LDO.  
PWRGD  
V
OL  
FIGURE 4-2:  
Power Good Timing.  
V
IN  
T
OR  
70 µs  
30 µs  
SHDN  
4.5  
Power Good Output (PWRGD)  
T
PG  
The PWRGD output is used to indicate when the output  
voltage of the LDO is within 92% (typical value, see  
Section 1.0 “Electrical Characteristics” for Minimum  
and Maximum specifications) of its nominal regulation  
value.  
V
OUT  
As the output voltage of the LDO rises, the PWRGD  
output will be held low until the output voltage has  
exceeded the power good threshold plus the hysteresis  
value. Once this threshold has been exceeded, the  
power good time delay is started (shown as TPG in the  
Electrical Characteristics table). The power good time  
delay is fixed at 200 µs (typical). After the time delay  
period, the PWRGD output will go high, indicating that  
the output voltage is stable and within regulation limits.  
PWRGD  
FIGURE 4-3:  
Shutdown.  
Power Good Timing from  
If the output voltage of the LDO falls below the power  
good threshold, the power good output will transition  
low. The power good circuitry has a 170 µs delay when  
detecting a falling output voltage, which helps to  
increase noise immunity of the power good output and  
avoid false triggering of the power good output during  
fast output transients. See Figure 4-2 for power good  
timing characteristics.  
4.6  
Shutdown Input (SHDN)  
The SHDN input is an active-low input signal that turns  
the LDO on and off. The SHDN threshold is a  
percentage of the input voltage. The typical value of  
this shutdown threshold is 30% of VIN, with minimum  
and maximum limits over the entire operating  
temperature range of 45% and 15%, respectively.  
When the LDO is put into Shutdown mode using the  
SHDN input, the power good output is pulled low  
immediately, indicating that the output voltage will be  
out of regulation. The timing diagram for the power  
good output when using the shutdown input is shown in  
Figure 4-3.  
The SHDN input will ignore low-going pulses (pulses  
meant to shut down the LDO) that are up to 400 ns in  
pulse width. If the shutdown input is pulled low for more  
than 400 ns, the LDO will enter Shutdown mode. This  
small bit of filtering helps to reject any system noise  
spikes on the shutdown input signal.  
The power good output is an open-drain output that can  
be pulled up to any voltage that is equal to or less than  
the LDO input voltage. This output is capable of sinking  
1.2 mA (VPWRGD < 0.4V maximum).  
On the rising edge of the SHDN input, the shutdown  
circuitry has a 30 µs delay before allowing the LDO  
output to turn on. This delay helps to reject any false  
turn-on signals or noise on the SHDN input signal. After  
© 2007 Microchip Technology Inc.  
DS22057A-page 17  
MCP1826/MCP1826S  
the 30 µs delay, the LDO output enters its soft-start  
period as it rises from 0V to its final regulation value. If  
the SHDN input signal is pulled low during the 30 µs  
delay period, the timer will be reset and the delay time  
will start over again on the next rising edge of the  
SHDN input. The total time from the SHDN input going  
high (turn-on) to the LDO output being in regulation is  
typically 100 µs. See Figure 4-4 for a timing diagram of  
the SHDN input.  
4.7  
Dropout Voltage and Undervoltage  
Lockout  
Dropout voltage is defined as the input-to-output  
voltage differential at which the output voltage drops  
2% below the nominal value that was measured with a  
VR  
+ 0.5V differential applied. The MCP1826/  
MCP1826S LDO has a very low dropout voltage  
specification of 300 mV (typical) at 1000 mA of output  
current. See Section 1.0 “Electrical Characteristics”  
for maximum dropout voltage specifications.  
T
OR  
The MCP1826/MCP1826S LDO operates across an  
input voltage range of 2.3V to 6.0V and incorporates  
input Undervoltage Lockout (UVLO) circuitry that keeps  
the LDO output voltage off until the input voltage  
reaches a minimum of 2.00V (typical) on the rising  
edge of the input voltage. As the input voltage falls, the  
LDO output will remain on until the input voltage level  
reaches 1.82V (typical).  
400 ns (typ)  
70 µs  
30 µs  
SHDN  
Since the MCP1826/MCP1826S LDO undervoltage  
lockout activates at 1.82V as the input voltage is falling,  
the dropout voltage specification does not apply for  
output voltages that are less than 1.8V.  
V
OUT  
FIGURE 4-4:  
Shutdown Input Timing  
Diagram.  
For high-current applications, voltage drops across the  
PCB traces must be taken into account. The trace  
resistances can cause significant voltage drops  
between the input voltage source and the LDO. For  
applications with input voltages near 2.3V, these PCB  
trace voltage drops can sometimes lower the input  
voltage enough to trigger  
undervoltage lockout.  
a shutdown due to  
4.8  
Overtemperature Protection  
The MCP1826/MCP1826S LDO has temperature-  
sensing circuitry to prevent the junction temperature  
from exceeding approximately 150°C. If the LDO  
junction temperature does reach 150°C, the LDO  
output will be turned off until the junction temperature  
cools to approximately 140°C, at which point the LDO  
output will automatically resume normal operation. If  
the internal power dissipation continues to be  
excessive, the device will again shut off. The junction  
temperature of the die is a function of power dissipa-  
tion, ambient temperature and package thermal  
resistance. See Section 5.0 “Application Circuits/  
Issues” for more information on LDO power  
dissipation and junction temperature.  
DS22057A-page 18  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
In addition to the LDO pass element power dissipation,  
there is power dissipation within the MCP1826/  
MCP1826S as a result of quiescent or ground current.  
The power dissipation as a result of the ground current  
can be calculated using the following equation:  
5.0  
5.1  
APPLICATION CIRCUITS/  
ISSUES  
Typical Application  
The MCP1826/MCP1826S is used for applications that  
require high LDO output current and a power good  
output.  
EQUATION 5-2:  
PI(GND) = VIN(MAX) × IVIN  
Where:  
V
= 2.5V @ 1000 mA  
OUT  
R
PI(GND  
=
Power dissipation due to the  
quiescent current of the LDO  
MCP1826-2.5  
On  
1
C
1
3
2 4  
5
2
10 kΩ  
Off  
VIN(MAX)  
IVIN  
=
=
Maximum input voltage  
SHDN  
10 µF  
Current flowing in the VIN pin  
with no LDO output current  
(LDO quiescent current)  
V
IN  
3.3V  
C
1
4.7 µF  
PWRGD  
GND  
The total power dissipated within the MCP1826/  
MCP1826S is the sum of the power dissipated in the  
LDO pass device and the P(IGND) term. Because of the  
CMOS construction, the typical IGND for the MCP1826/  
MCP1826S is 120 µA. Operating at a maximum VIN of  
3.465V results in a power dissipation of 0.12 milli-Watts  
for a 2.5V output. For most applications, this is small  
compared to the LDO pass device power dissipation  
and can be neglected.  
FIGURE 5-1:  
Typical Application Circuit.  
5.1.1  
APPLICATION CONDITIONS  
Package Type = TO-220-5  
Input Voltage Range = 3.3V ± 5%  
IN maximum = 3.465V  
IN minimum = 3.135V  
VDROPOUT (max) = 0.350V  
OUT (typical) = 2.5V  
OUT = 1000 mA maximum  
V
V
The maximum continuous operating junction  
temperature specified for the MCP1826/MCP1826S is  
+125°C. To estimate the internal junction temperature  
of the MCP1826/MCP1826S, the total internal power  
dissipation is multiplied by the thermal resistance from  
junction to ambient (RθJA) of the device. The thermal  
resistance from junction to ambient for the TO-220-5  
package is estimated at 29.3°C/W.  
V
I
PDISS (typical) = 0.965W  
Temperature Rise = 28.27°C  
5.2  
Power Calculations  
EQUATION 5-3:  
TJ(MAX) = PTOTAL × RθJA + TAMAX  
5.2.1  
POWER DISSIPATION  
The internal power dissipation within the MCP1826/  
MCP1826S is a function of input voltage, output  
voltage, output current and quiescent current.  
Equation 5-1 can be used to calculate the internal  
power dissipation for the LDO.  
TJ(MAX) = Maximum continuous junction  
temperature  
PTOTAL = Total device power dissipation  
RθJA = Thermal resistance from junction to  
ambient  
EQUATION 5-1:  
TAMAX = Maximum ambient temperature  
PLDO = (VIN(MAX)) VOUT(MIN)) × IOUT(MAX))  
Where:  
PLDO  
=
LDO Pass device internal  
power dissipation  
VIN(MAX)  
=
=
Maximum input voltage  
VOUT(MIN)  
LDO minimum output voltage  
© 2007 Microchip Technology Inc.  
DS22057A-page 19  
MCP1826/MCP1826S  
The maximum power dissipation capability for a  
package can be calculated given the junction-to-  
ambient thermal resistance and the maximum ambient  
temperature for the application. Equation 5-4 can be  
used to determine the package maximum internal  
power dissipation.  
5.3  
Typical Application  
Internal power dissipation, junction temperature rise,  
junction temperature and maximum power dissipation  
is calculated in the following example. The power  
dissipation as a result of ground current is small  
enough to be neglected.  
EQUATION 5-4:  
5.3.1  
POWER DISSIPATION EXAMPLE  
(TJ(MAX) TA(MAX)  
)
PD(MAX) = ---------------------------------------------------  
RθJA  
Package  
Package Type = TO-220-5  
PD(MAX) = Maximum device power dissipation  
Input Voltage  
TJ(MAX) = maximum continuous junction  
temperature  
V
IN = 3.3V ± 5%  
LDO Output Voltage and Current  
TA(MAX) = maximum ambient temperature  
V
OUT = 2.5V  
RθJA = Thermal resistance from junction-to-  
I
OUT = 1000 mA  
ambient  
Maximum Ambient Temperature  
A(MAX) = 60°C  
Internal Power Dissipation  
T
EQUATION 5-5:  
TJ(RISE) = PD(MAX) × RθJA  
PLDO(MAX) = (VIN(MAX) – VOUT(MIN)) x IOUT(MAX)  
PLDO = ((3.3V x 1.05) – (2.5V x 0.975))  
x 1000 mA  
TJ(RISE) = Rise in device junction temperature  
over the ambient temperature  
PLDO = 1.028 Watts  
PD(MAX) = Maximum device power dissipation  
RθJA = Thermal resistance from junction-to-  
5.3.1.1  
Device Junction Temperature Rise  
ambient  
The internal junction temperature rise is a function of  
internal power dissipation and the thermal resistance  
from junction-to-ambient for the application. The  
thermal resistance from junction-to-ambient (RθJA) is  
derived from EIA/JEDEC standards for measuring  
thermal resistance. The EIA/JEDEC specification is  
JESD51. The standard describes the test method and  
board specifications for measuring the thermal  
resistance from junction to ambient. The actual thermal  
EQUATION 5-6:  
TJ = TJ(RISE) + TA  
TJ = Junction temperature  
TJ(RISE) = Rise in device junction temperature  
over the ambient temperature  
TA = Ambient temperature  
resistance for a particular application can vary  
depending on many factors such as copper area and  
thickness. Refer to AN792, “A Method to Determine  
How Much Power a SOT23 Can Dissipate in an Appli-  
cation” (DS00792), for more information regarding this  
subject.  
TJ(RISE) = PTOTAL x RθJA  
TJRISE = 1.028 W x 29.3°C/W  
TJRISE = 30.12°C  
DS22057A-page 20  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
5.3.1.2  
Junction Temperature Estimate  
To estimate the internal junction temperature, the  
calculated temperature rise is added to the ambient or  
offset temperature. For this example, the worst-case  
junction temperature is estimated below:  
TJ = TJRISE + TA(MAX)  
TJ = 30.12°C + 60.0°C  
TJ = 90.12°C  
5.3.1.3  
Maximum Package Power  
Dissipation at 60°C Ambient  
Temperature  
TO-220-5 (29.3° C/W RθJA):  
P
D(MAX) = (125°C – 60°C) / 29.3°C/W  
D(MAX) = 2.218W  
P
DDPAK-5 (31.2°C/Watt RθJA):  
P
D(MAX) = (125°C – 60°C)/ 31.2°C/W  
D(MAX) = 2.083W  
P
From this table, you can see the difference in maximum  
allowable power dissipation between the TO-220-5  
package and the DDPAK-5 package.  
© 2007 Microchip Technology Inc.  
DS22057A-page 21  
MCP1826/MCP1826S  
6.0  
6.1  
PACKAGING INFORMATION  
Package Marking Information  
3-Lead DDPAK (MCP1826S)  
Example:  
XXXXXXXXX  
XXXXXXXXX  
YYWWNNN  
MCP1826S  
0.8EEB^
0730256  
e
3
1
2
3
1
2
3
3-Lead SOT-223 (MCP1826S)  
Example:  
XXXXXXX  
1826S08  
XXXYYWW  
EDB0730  
NNN  
256  
3-Lead TO-220 (MCP1826S)  
Example:  
MCP1826S  
12EAB^  
0730256  
XXXXXXXXX  
XXXXXXXXX  
YYWWNNN  
e3  
1
2
3
1
2
3
Legend: XX...X Customer-specific information  
Y
YY  
WW  
NNN  
Year code (last digit of calendar year)  
Year code (last 2 digits of calendar year)  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
e
3
Pb-free JEDEC designator for Matte Tin (Sn)  
*
This package is Pb-free. The Pb-free JEDEC designator (  
can be found on the outer packaging for this package.  
)
e3  
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line, thus limiting the number of available  
characters for customer-specific information.  
DS22057A-page 22  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
Package Marking Information (Continued)  
5-Lead DDPAK (MCP1826)  
Example:  
MCP1826  
XXXXXXXXX  
XXXXXXXXX  
YYWWNNN  
1.0EET^  
e3  
0730256  
1 2 3 4 5  
1 2 3 4 5  
5-Lead SOT-223 (MCP1826)  
Example:  
XXXXXXX  
1826-08  
XXXYYWW  
EDC0730  
NNN  
256  
5-Lead TO-220 (MCP1826)  
Example:  
MCP1826  
e3  
08EAT^
0730256  
XXXXXXXXX  
XXXXXXXXX  
YYWWNNN  
1 2 3 4 5  
1 2 3 4 5  
Legend: XX...X Customer-specific information  
Y
YY  
WW  
NNN  
Year code (last digit of calendar year)  
Year code (last 2 digits of calendar year)  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
e
3
Pb-free JEDEC designator for Matte Tin (Sn)  
*
This package is Pb-free. The Pb-free JEDEC designator (  
can be found on the outer packaging for this package.  
)
e3  
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line, thus limiting the number of available  
characters for customer-specific information.  
© 2007 Microchip Technology Inc.  
DS22057A-page 23  
MCP1826/MCP1826S  
DS22057A-page 24  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
© 2007 Microchip Technology Inc.  
DS22057A-page 25  
MCP1826/MCP1826S  
DS22057A-page 26  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
© 2007 Microchip Technology Inc.  
DS22057A-page 27  
MCP1826/MCP1826S  
DS22057A-page 28  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
© 2007 Microchip Technology Inc.  
DS22057A-page 29  
MCP1826/MCP1826S  
NOTES:  
DS22057A-page 30  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
APPENDIX A: REVISION HISTORY  
Revision A (August 2007)  
• Original Release of this Document.  
© 2007 Microchip Technology Inc.  
DS22057A-page 31  
MCP1826/MCP1826S  
NOTES:  
DS22057A-page 32  
© 2007 Microchip Technology Inc.  
MCP1826/MCP1826S  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
Examples:  
PART NO.  
Device  
XX  
X
X
X/  
XX  
a)  
b)  
c)  
d)  
e)  
f)  
MCP1826-0802E/XX: 0.8V LDO Regulator  
Output Feature Tolerance Temp. Package  
Voltage  
MCP1826-1002E/XX: 1.0V LDO Regulator  
MCP1826-1202E/XX: 1.2V LDO Regulator  
MCP1826-1802E/XX 1.8V LDO Regulator  
MCP1826-2502EXX: 25V LDO Regulator  
MCP1826-3002E/XX: 3.0V LDO Regulator  
MCP1826-3302E/XX 3.3V LDO Regulator  
MCP1826-5002E/XX: 5.0V LDO Regulator  
MCP1826-ADJE/XX: ADJ LDO Regulator  
Code  
Device:  
MCP1826: 1000 mA Low Dropout Regulator  
MCP1826T: 1000 mA Low Dropout Regulator  
Tape and Reel  
MCP1826S: 1000 mA Low Dropout Regulator  
MCP1826ST: 1000 mA Low Dropout Regulator  
Tape and Reel  
g)  
h)  
i)  
a)  
b)  
c)  
d)  
e)  
f)  
MCP1826S-0802E/XX:0.8V LDO Regulator  
MCP1826S-1002E/XX:1.0V LDO Regulator  
MCP1826S-1202E/XX 1.2V LDO Regulator  
MCP1826S-1802E/XX 1.8V LDO Regulator  
MCP1826S-2502E/XX 2.5V LDO Regulator  
MCP1826S-2502E/XX 3.0V LDO Regulator  
MCP1826S-3302E/XX 3.3V LDO Regulator  
MCP1826S-5002E/XX 5.0V LDO Regulator  
Output Voltage *:  
08  
12  
18  
25  
30  
33  
50  
=
=
=
=
=
=
=
0.8V “Standard”  
1.2V “Standard”  
1.8V “Standard”  
2.5V “Standard”  
3.0V “Standard”  
3.3V “Standard”  
5.0V “Standard”  
ADJ = Adjustable Output Voltage ** (MCP1826 only)  
g)  
h)  
*Contact factory for other output voltage options  
** When ADJ is used, the “extra feature code” and  
“tolerance” columns do not apply. Refer to examples.  
XX = AB for 3LD TO-220 package  
= AT for 5LD TO-220 package  
= DB for 3LD SOT-223 package  
= DC for 5LD SOT-223 package  
= EB for 3LD DDPAK package  
= ET for 5LD DDPAK package  
Extra Feature Code:  
Tolerance:  
0
2
E
=
=
=
Fixed  
2.0% (Standard)  
-40°C to +125°C  
Temperature:  
Package Type:  
AB  
AT  
DB  
DC  
EB  
ET  
=
=
=
=
=
=
Plastic Transistor Outline, TO-220, 3-lead  
Plastic Transistor Outline, TO-220, 5-lead  
Plastic Transistor Outline, SOT-223, 3-lead  
Plastic Transistor Outline, SOT-223, 5-lead  
Plastic, DDPAK, 3-lead  
Plastic, DDPAK, 5-lead  
Note: ADJ (Adjustable) only available in 5-lead version.  
© 2007 Microchip Technology Inc.  
DS22057A-page 33  
MCP1826/MCP1826S  
NOTES:  
DS22057A-page 34  
© 2007 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
WARRANTIES OF ANY KIND WHETHER EXPRESS OR  
IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
QUALITY, PERFORMANCE, MERCHANTABILITY OR  
FITNESS FOR PURPOSE. Microchip disclaims all liability  
arising from this information and its use. Use of Microchip  
devices in life support and/or safety applications is entirely at  
the buyer’s risk, and the buyer agrees to defend, indemnify and  
hold harmless Microchip from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are  
conveyed, implicitly or otherwise, under any Microchip  
intellectual property rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, Accuron,  
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,  
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are  
registered trademarks of Microchip Technology Incorporated  
in the U.S.A. and other countries.  
AmpLab, FilterLab, Linear Active Thermistor, Migratable  
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The  
Embedded Control Solutions Company are registered  
trademarks of Microchip Technology Incorporated in the  
U.S.A.  
Analog-for-the-Digital Age, Application Maestro, CodeGuard,  
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,  
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,  
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,  
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,  
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,  
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select  
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,  
WiperLock and ZENA are trademarks of Microchip  
Technology Incorporated in the U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2007, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received ISO/TS-16949:2002 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
© 2007 Microchip Technology Inc.  
DS22057A-page 35  
WORLDWIDE SALES AND SERVICE  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
Asia Pacific Office  
Suites 3707-14, 37th Floor  
Tower 6, The Gateway  
Harbour City, Kowloon  
Hong Kong  
Tel: 852-2401-1200  
Fax: 852-2401-3431  
India - Bangalore  
Tel: 91-80-4182-8400  
Fax: 91-80-4182-8422  
Austria - Wels  
Tel: 43-7242-2244-39  
Fax: 43-7242-2244-393  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support:  
http://support.microchip.com  
Web Address:  
www.microchip.com  
Denmark - Copenhagen  
Tel: 45-4450-2828  
Fax: 45-4485-2829  
India - New Delhi  
Tel: 91-11-4160-8631  
Fax: 91-11-4160-8632  
France - Paris  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
India - Pune  
Tel: 91-20-2566-1512  
Fax: 91-20-2566-1513  
Australia - Sydney  
Tel: 61-2-9868-6733  
Fax: 61-2-9868-6755  
Atlanta  
Duluth, GA  
Tel: 678-957-9614  
Fax: 678-957-1455  
Germany - Munich  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Japan - Yokohama  
Tel: 81-45-471- 6166  
Fax: 81-45-471-6122  
China - Beijing  
Tel: 86-10-8528-2100  
Fax: 86-10-8528-2104  
Italy - Milan  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
Korea - Daegu  
Tel: 82-53-744-4301  
Fax: 82-53-744-4302  
Boston  
China - Chengdu  
Tel: 86-28-8665-5511  
Fax: 86-28-8665-7889  
Westborough, MA  
Tel: 774-760-0087  
Fax: 774-760-0088  
Netherlands - Drunen  
Tel: 31-416-690399  
Fax: 31-416-690340  
Korea - Seoul  
China - Fuzhou  
Tel: 86-591-8750-3506  
Fax: 86-591-8750-3521  
Tel: 82-2-554-7200  
Fax: 82-2-558-5932 or  
82-2-558-5934  
Chicago  
Itasca, IL  
Tel: 630-285-0071  
Fax: 630-285-0075  
Spain - Madrid  
Tel: 34-91-708-08-90  
Fax: 34-91-708-08-91  
China - Hong Kong SAR  
Tel: 852-2401-1200  
Fax: 852-2401-3431  
Malaysia - Penang  
Tel: 60-4-646-8870  
Fax: 60-4-646-5086  
Dallas  
Addison, TX  
Tel: 972-818-7423  
Fax: 972-818-2924  
UK - Wokingham  
Tel: 44-118-921-5869  
Fax: 44-118-921-5820  
China - Qingdao  
Tel: 86-532-8502-7355  
Fax: 86-532-8502-7205  
Philippines - Manila  
Tel: 63-2-634-9065  
Fax: 63-2-634-9069  
Detroit  
Farmington Hills, MI  
Tel: 248-538-2250  
Fax: 248-538-2260  
China - Shanghai  
Tel: 86-21-5407-5533  
Fax: 86-21-5407-5066  
Singapore  
Tel: 65-6334-8870  
Fax: 65-6334-8850  
Kokomo  
Kokomo, IN  
Tel: 765-864-8360  
Fax: 765-864-8387  
China - Shenyang  
Tel: 86-24-2334-2829  
Fax: 86-24-2334-2393  
Taiwan - Hsin Chu  
Tel: 886-3-572-9526  
Fax: 886-3-572-6459  
China - Shenzhen  
Tel: 86-755-8203-2660  
Fax: 86-755-8203-1760  
Taiwan - Kaohsiung  
Tel: 886-7-536-4818  
Fax: 886-7-536-4803  
Los Angeles  
Mission Viejo, CA  
Tel: 949-462-9523  
Fax: 949-462-9608  
China - Shunde  
Tel: 86-757-2839-5507  
Fax: 86-757-2839-5571  
Taiwan - Taipei  
Tel: 886-2-2500-6610  
Fax: 886-2-2508-0102  
Santa Clara  
Santa Clara, CA  
Tel: 408-961-6444  
Fax: 408-961-6445  
China - Wuhan  
Tel: 86-27-5980-5300  
Fax: 86-27-5980-5118  
Thailand - Bangkok  
Tel: 66-2-694-1351  
Fax: 66-2-694-1350  
Toronto  
Mississauga, Ontario,  
Canada  
Tel: 905-673-0699  
Fax: 905-673-6509  
China - Xian  
Tel: 86-29-8833-7252  
Fax: 86-29-8833-7256  
06/25/07  
DS22057A-page 36  
© 2007 Microchip Technology Inc.  
配单直通车
MCP1826T-ADJE/ET产品参数
型号:MCP1826T-ADJE/ET
是否无铅:不含铅
是否Rohs认证:符合
生命周期:Active
IHS 制造商:MICROCHIP TECHNOLOGY INC
零件包装代码:D2PAK
包装说明:LEAD FREE, PLASTIC, TO-263, D2PAK-5
针数:4
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:14 weeks
风险等级:0.84
Samacsys Confidence:4
Samacsys Status:Released
Samacsys PartID:258984
Samacsys Pin Count:6
Samacsys Part Category:Integrated Circuit
Samacsys Package Category:Other
Samacsys Footprint Name:MCP1826T-ADJE/ET-2
Samacsys Released Date:2019-12-05 10:37:36
Is Samacsys:N
可调性:ADJUSTABLE
最大回动电压 1:0.4 V
标称回动电压 1:0.25 V
JESD-30 代码:R-PSSO-G5
JESD-609代码:e3
长度:10.16 mm
最大电网调整率 (%/V):0.2
最大负载调整率 (%):1%
湿度敏感等级:1
功能数量:1
输出次数:1
端子数量:5
工作温度TJ-Max:125 °C
工作温度TJ-Min:-40 °C
最大输出电流 1:1 A
最大输出电压 1:5 V
最小输出电压 1:0.8 V
封装主体材料:PLASTIC/EPOXY
封装代码:TO-263
封装等效代码:SMSIP5H,.6,67TB
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
包装方法:TAPE AND REEL
峰值回流温度(摄氏度):245
认证状态:Not Qualified
调节器类型:ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度:5.08 mm
子类别:Other Regulators
表面贴装:YES
技术:CMOS
端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING
端子节距:1.7 mm
端子位置:SINGLE
处于峰值回流温度下的最长时间:40
宽度:9.017 mm
Base Number Matches:1
  •  
  • 供货商
  • 型号 *
  • 数量*
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
批量询价选中的记录已选中0条,每次最多15条。
 复制成功!